Electronic equipment shell, preparation method thereof and electronic equipment
阅读说明:本技术 电子设备的外壳及其制备方法、电子设备 (Electronic equipment shell, preparation method thereof and electronic equipment ) 是由 苏子鹏 于 2019-10-31 设计创作,主要内容包括:本发明公开一种电子设备的外壳制备方法,其包括:对透光基板进行加工,以使得透光基板形成基板主体和分别设置在基板主体两侧的两个第一侧板,两个第一侧板与基板主体为一体式结构;在基板主体上划分出屏幕盖板、两个第二侧板和后盖板,两个第二侧板分别连接在屏幕盖板的两个侧边缘上,两个第一侧板分别连接在屏幕盖板的两个端边缘上;将基板主体折弯以形成筒状结构件;采用熔接工艺将基板主体对接的边缘熔接;分别将两个第一侧板折弯;通过熔接工艺连接两个第一侧板与筒状结构件的相对应的端口边缘。本发明公开一种电子设备的外壳及电子设备。上述方案能解决目前的电子设备的外壳存在防水防尘性能及外观性能不佳的问题。(The invention discloses a method for preparing a shell of electronic equipment, which comprises the following steps: processing the light-transmitting substrate to enable the light-transmitting substrate to form a substrate main body and two first side plates which are respectively arranged on two sides of the substrate main body, wherein the two first side plates and the substrate main body are of an integrated structure; a screen cover plate, two second side plates and a rear cover plate are divided on the substrate main body, the two second side plates are respectively connected to two side edges of the screen cover plate, and the two first side plates are respectively connected to two end edges of the screen cover plate; bending the substrate main body to form a cylindrical structural member; welding the butted edges of the substrate main bodies by adopting a welding process; respectively bending the two first side plates; and connecting the two first side plates with the corresponding port edges of the cylindrical structural member through a welding process. The invention discloses a shell of electronic equipment and the electronic equipment. Above-mentioned scheme can solve present electronic equipment's shell and have waterproof dustproof performance and the not good problem of outward appearance performance.)
1. A method for preparing a housing of an electronic device, comprising:
processing a light-transmitting substrate (100) to enable the light-transmitting substrate (100) to form a substrate main body (110) and two first side plates (120) respectively arranged on two sides of the substrate main body (110), wherein the two first side plates (120) and the substrate main body (110) are of an integrated structure;
a screen cover plate (111), two second side plates (112) and a rear cover plate (113) are divided on the base plate main body (110), the two second side plates (112) are respectively connected to two side edges of the screen cover plate (111), and the two first side plates (120) are respectively connected to two end edges of the screen cover plate (111);
bending the substrate main body (110) to form a cylindrical structural member;
welding the butted edges of the substrate bodies (110) using a welding process;
bending the two first side plates (120) respectively;
connecting the two first side plates (120) with the corresponding port edges of the cylindrical structural member by a welding process.
2. A method for preparing a housing according to claim 1, wherein processing the light-transmissive substrate (100) comprises:
and processing the light-transmitting substrate (100) in a cutting mode.
3. The housing preparation method according to claim 1, wherein dividing the back cover plate (113) on the substrate main body (110) comprises:
the rear cover plate (113) is divided from the base plate main body (110), so that the rear cover plate (113) comprises two rear cover plates (1131), the two rear cover plates (1131) are respectively connected to two edges of the second side plate (112) which are distributed in a back-to-back mode, and the edge of the second side plate (112) which is deviated from the corresponding rear cover plate (1131) is a welding edge.
4. The method of manufacturing a housing according to claim 1, wherein bending the substrate body (110) to form a cylindrical structure comprises:
and bending the substrate main body (110) into the cylindrical structural part by adopting a hot-pressing bending process.
5. A housing for an electronic device, characterized in that the housing is manufactured by a housing manufacturing method according to any one of claims 1 to 4.
6. The housing according to claim 5, wherein the rear cover panel (113) comprises two rear cover panels (1131), the two rear cover panels (1131) are respectively connected to two edges of the two second side panels (112) which are opposite to each other, the edge of the rear cover panel (1131) facing away from the corresponding second side panel (112) is a welding edge, and the welding edges of the two rear cover panels (1131) are mutually adaptive slopes (A) and are connected in a welding manner.
7. The housing of claim 1, further comprising: a light shielding layer provided on inner side surfaces of the two second side plates (112), the two first side plates (120), and the rear cover plate (113).
8. The shell according to claim 7, wherein the light shielding layer comprises a PET film attached to the inner side surface, and a silk screen light shielding layer is arranged on the surface of the PET film facing the inner side surface; or, the shading layer is an ink layer.
9. The housing according to claim 1, wherein the light-transmissive substrate (100) is a glass substrate.
10. An electronic device, characterized in that it comprises a housing according to any one of claims 5-9.
Technical Field
The invention relates to the technical field of manufacturing of shells of electronic equipment, in particular to a shell of electronic equipment, a preparation method of the shell and the electronic equipment.
Background
With the increase of user demands, the performance of electronic devices (e.g., mobile phones, tablet computers) is continuously optimized, wherein the more prominent behavior is as follows: the appearance performance of electronic devices is becoming more and more excellent. This greatly improves the visual performance of the electronic device.
The visible part of the present electronic device mainly includes a screen cover, a middle frame and a back cover, that is, the screen cover, the middle frame and the back cover together form the appearance surface of the electronic device. In the existing electronic equipment, a screen cover plate, a middle frame and a rear cover plate are manufactured respectively and then assembled together in the whole assembly process of the electronic equipment. In consideration of production errors and assembly errors, gaps exist between the screen cover plate and the middle frame and between the middle frame and the rear cover plate, and the gaps easily cause dust and liquid to invade into the electronic equipment, so that the dustproof and waterproof performance of the electronic equipment is poor. Meanwhile, the presence of the gap may affect the appearance of the electronic device. Therefore, the problems of poor dustproof and waterproof performance and poor appearance performance of the conventional electronic equipment still exist.
Disclosure of Invention
The invention discloses a method for preparing a shell of electronic equipment, which aims to solve the problems of poor waterproof and dustproof performance and poor appearance performance of the shell of the conventional electronic equipment.
In order to solve the problems, the invention adopts the following technical scheme:
a method of making a housing for an electronic device, comprising:
processing a light-transmitting substrate to enable the light-transmitting substrate to form a substrate main body and two first side plates which are respectively arranged on two sides of the substrate main body, wherein the two first side plates and the substrate main body are of an integrated structure;
dividing a screen cover plate, two second side plates and a rear cover plate on the substrate main body, wherein the two second side plates are respectively connected to two side edges of the screen cover plate, and the two first side plates are respectively connected to two end edges of the screen cover plate;
bending the substrate main body to form a cylindrical structural part;
welding the butted edges of the substrate main bodies by adopting a welding process;
respectively bending the two first side plates;
and connecting the two first side plates with the port edges of the corresponding cylindrical structural member through a welding process.
A shell of an electronic device is prepared by the shell preparation method.
An electronic device comprising a housing as described above.
The technical scheme adopted by the invention can achieve the following beneficial effects:
according to the method for manufacturing the shell of the electronic equipment, the whole transparent substrate is adopted to form the screen cover plate, the two second side plates, the rear cover plate and the two first side plates through processing and area division, and then the screen cover plate, the two second side plates, the rear cover plate and the two first side plates are sequentially bent and welded to obtain the totally enclosed shell.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of a light-transmitting substrate according to an embodiment of the disclosure;
FIG. 2 is a schematic structural diagram of a processed transparent substrate;
fig. 3 is a schematic structural view of a screen cover plate, two second side plates and a rear cover plate divided on a substrate main body;
FIG. 4 is a schematic view of the structure of FIG. 3 from another perspective;
FIGS. 5-7 are schematic structural views illustrating bending of a substrate body to form a cylindrical structural member;
FIGS. 8-9 are front and rear schematic views, respectively, of edge fusion joining of substrate bodies using a fusion process;
FIG. 10 is a schematic view of a partial explosion with only the last first side panel left unfused;
fig. 11 is a schematic structural view of a molded housing.
Description of reference numerals:
100-light-transmitting substrate, 110-substrate main body, 111-screen cover plate, 112-second side plate, 113-rear cover plate, 1131-rear cover plate, A-inclined surface, 120-first side plate,
200-hot pressing bending equipment,
300-fusion apparatus.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1 to 11, an embodiment of the invention discloses a method for manufacturing a housing of an electronic device, where the disclosed housing of the electronic device is applied to the electronic device. The disclosed shell preparation method comprises:
s101, processing the
In this step, the
S102, dividing the
In this step, the substrate
S103, bending the
This step can be performed by mechanical bending, so as to bend and deform the
And S104, welding the butted edges of the substrate
This step welds the butted edges of the substrate
And S105, respectively bending the two
Referring to fig. 10 and 11, in this step, the two
And S106, connecting the two
Similarly, in this step, the
During assembly of a particular electronic device, the last
In the method for manufacturing the shell of the electronic device, a whole
In the embodiment of the present invention, in S101, the processing the light-transmitting
In S103, the substrate
In S102, the
In a more preferred embodiment, as shown in fig. 3 to 7, dividing the
In order to facilitate the welding of the two
As is known, the housing of the electronic device is a peripheral protective member of the electronic device, and also has a shielding function to prevent parts of the electronic device mounted in the housing from being exposed. Based on this, the method for preparing the housing disclosed by the embodiment of the invention further comprises the following steps: light shielding layers are provided on the inner side surfaces of the two
Based on the shell preparation method of the electronic equipment disclosed by the embodiment of the invention, the embodiment of the invention discloses a shell of the electronic equipment, and the disclosed shell is prepared by the shell preparation method disclosed by the embodiment.
In the related housing, the
The housing disclosed in the embodiment of the present invention may further include a light shielding layer disposed on inner side surfaces of the two
Based on the shell of the electronic equipment disclosed by the embodiment of the invention, the embodiment of the invention discloses the electronic equipment, and the disclosed electronic equipment comprises the shell disclosed by the embodiment.
The electronic device disclosed in the embodiment of the present invention may be an electronic device such as a mobile phone, a tablet computer, an electronic book reader, a game machine, a wearable device (e.g., a smart watch), and the specific type of the electronic device is not limited in the embodiment of the present invention.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
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