阅读说明：本技术 一种芯片的高效切割方法 (Efficient cutting method for chip ) 是由 张祥波 胡诚 于 2019-09-25 设计创作，主要内容包括：本发明涉及一种芯片的高效切割方法,包括将基板的表面洗净,并在切割区域贴满双面UV膜；将待切割芯片置于基板上,使得待切割芯片通过双面UV膜固定于切割区域内；将基板置于切割机工作台上,并沿着待切割芯片上的切割辅助线对其进行切割至完全切断；将基板从切割机工作台上取下并洗净吹干；对基板进行光照,使得双面UV膜失去粘性,并逐一取下切割后的单颗芯片。本发明通过在基板上设置双面UV膜,可将待切割的芯片固定于基板上,保证在切割时芯片的位置相对固定,并在切割完成后通过光照使得双面UV膜失去粘性,直接取下单颗芯片,无需再通过化学溶剂进行清洗,缩短了切割工艺的周期,提高了切割效率,并可保证切割精度和切割质量。(The invention relates to a high-efficiency cutting method of a chip, which comprises the steps of cleaning the surface of a substrate, and sticking a double-sided UV film on a cutting area; placing the chip to be cut on the substrate, so that the chip to be cut is fixed in a cutting area through the double-sided UV film; placing the substrate on a workbench of a cutting machine, and cutting the substrate along a cutting auxiliary line on a chip to be cut until the substrate is completely cut off; taking the substrate off the worktable of the cutting machine, cleaning and drying; and (4) illuminating the substrate to make the double-sided UV film lose viscosity, and taking down the cut single chips one by one. According to the invention, the double-sided UV film is arranged on the substrate, so that the chip to be cut can be fixed on the substrate, the relative fixation of the position of the chip during cutting is ensured, the double-sided UV film loses viscosity through illumination after the cutting is finished, a single chip is directly taken down, cleaning through a chemical solvent is not needed, the period of a cutting process is shortened, the cutting efficiency is improved, and the cutting precision and the cutting quality can be ensured.)

1. A high-efficiency cutting method of a chip is characterized by comprising the following steps:

step 1: cleaning the surface of the substrate, and sticking a double-sided UV film on a pre-selected cutting area;

step 2: placing a chip to be cut on a substrate with a double-sided UV film pasted thereon, so that the chip to be cut is fixed in a cutting area on the substrate through the double-sided UV film;

and step 3: placing the substrate fixed with the chip to be cut on a worktable of a cutting machine, and cutting the substrate along a preset cutting auxiliary line on the chip to be cut until the substrate is completely cut off to form a plurality of independent single chips;

and 4, step 4: taking the substrate and the cut single chips which are independent from each other down from a worktable of a cutting machine, cleaning and drying;

and 5: and illuminating the substrate and the cut single chips which are independent from each other to make the double-sided UV film lose viscosity, and taking down the cut single chips one by one.

2. The method for efficiently cutting the chip according to claim 1, wherein the substrate is made of PVC.

3. The method for efficiently dicing a chip according to claim 2, wherein in the step 1, the surface of the substrate is cleaned with alcohol and wiped with a dust-free cloth.

4. The method for efficiently cutting the chip according to claim 1, wherein in the step 2, the chip to be cut is placed on the substrate with the double-sided UV film attached thereon, so that the double-sided UV film completely covers the lower surface of the chip to be cut.

5. The method for efficiently cutting the chip according to claim 1, wherein in the step 3, the cutting depth of the chip to be cut is greater than or equal to the thickness of the chip.

6. The method as claimed in claim 1, wherein in step 4, the substrate and the plurality of independent single chips are placed in clean water, brushed tightly by a soft brush, and then dried.

7. The method as claimed in claim 1, wherein the energy density of light irradiation in step 5 is 100-800MJ/cm²。

8. The method for high-efficiency cutting of chips as claimed in any one of claims 1 to 7, wherein in the step 5, the substrate and the plurality of independent single chips after cutting are placed in an aging oven for heating at 50-70 ℃ for 0.5-2min while irradiating with light.

Technical Field

The invention relates to the technical field of chip cutting, in particular to a high-efficiency chip cutting method.

Background

In the past, three operators in China all increase the construction investment in the aspect of access networks, and particularly, under the large-scale construction wave of FTTx, the large-scale optical distribution system equipment is collected. The total purchase of three operators, as a core component in optical distribution system equipment, has been kept increasing rapidly in these years.

With the enhancement of the collecting strength of operators and the increase of the purchasing quantity, the prices of the optical splitter and the components thereof are bound to be gradually reduced. On the premise of ensuring the quality of the telecommunication-grade product, the improvement of the production efficiency is an important link to be considered by an optical splitter manufacturer.

In the traditional cutting method, the chip is adhered to common glass by using paraffin for cutting, and a chemical solvent is used for cleaning in ultrasonic after cutting, so that the period is long, the method is low in efficiency, and the chemical solvent can corrode the chip, influence the quality, stability and service life of the chip.

Disclosure of Invention

The technical problem to be solved by the present invention is to provide a method for efficiently cutting a chip, aiming at the defects of the prior art.

The technical scheme for solving the technical problems is as follows: a high-efficiency cutting method of a chip comprises the following steps:

step 1: cleaning the surface of the substrate, and sticking a double-sided UV film on a pre-selected cutting area;

step 2: placing a substrate of a chip to be cut on the substrate with the double-sided UV film pasted thereon, so that the chip to be cut is fixed in a cutting area on the substrate through the double-sided UV film;

and step 3: placing the chip to be cut on a worktable of a cutting machine, and cutting the chip to be cut along a preset cutting auxiliary line on the chip to be cut until the chip is completely cut off to form a plurality of independent single chips;

and 4, step 4: taking down the substrate and the cut single chips which are independent from each other from a workbench of the cutting machine, cleaning and drying;

and 5: and illuminating the substrate and the cut single chips which are independent from each other to make the double-sided UV film lose viscosity, and taking down the cut single chips one by one.

The invention has the beneficial effects that: according to the efficient cutting method of the chip, the double-sided UV film is arranged on the substrate, the chip to be cut can be fixed on the substrate, the position of the chip is relatively fixed during cutting, the double-sided UV film is melted by heating after the cutting is finished, the single chip is directly taken down, cleaning through a chemical solvent is not needed, the period of a cutting process is greatly shortened, the cutting efficiency is improved, and the cutting precision and the cutting quality can be guaranteed.

On the basis of the technical scheme, the invention can be further improved as follows:

further: the base plate is made of PVC materials.

The beneficial effects of the further scheme are as follows: adopt the base plate of PVC material, can make things convenient for the cutting machine to cut off completely when the cutting on the one hand to can not injure cutting machine blade, on the other hand, the base plate stability and the heat resistance of PVC material are better, can not basically deform when heating in the ageing oven, and can not influence its life yet.

Further: in the step 1, the surface of the substrate is cleaned with alcohol and wiped with a dust-free cloth.

The beneficial effects of the further scheme are as follows: through adopting alcohol to wash basically, can effectively get rid of the impurity on substrate surface, guarantee the surface of two-sided UV membrane and base plate is closely laminated to it is insecure to avoid having the foreign matter to lead to follow-up two-sided UV membrane to bond with base plate and chip on the base plate.

Further: in the step 2, when the chip to be cut is placed on the substrate with the double-sided UV film pasted thereon, the double-sided UV film completely covers the lower surface of the chip to be cut.

The beneficial effects of the further scheme are as follows: the lower surfaces of the chips to be cut are completely covered by the double-sided UV film, so that the plurality of independent single chips can be prevented from falling off the substrate after cutting.

Further: in the step 3, the cutting depth of the chip to be cut is greater than or equal to the thickness of the chip to be cut.

The beneficial effects of the further scheme are as follows: the chip to be cut can be completely cut off conveniently by controlling the cutting depth to be more than or equal to the thickness of the chip to be cut, so that a plurality of independent single chips are formed.

Further: and 4, placing the substrate and the cut single chips which are independent from each other into clear water, brushing and tightly drying the substrate and the cut single chips by using a soft brush, and drying the substrate by blowing.

The beneficial effects of the further scheme are as follows: the cut single chips which are independent from each other are placed in clear water for cleaning, so that scraps and residues generated during chip surface cutting can be removed, and the single chips taken down after subsequent re-illumination are clean and pollution-free.

Further: in the step 5, the energy density of the illumination is 100-800MJ/cm²。

The beneficial effects of the further scheme are as follows: by controlling the energy density of illumination, the double-sided UV film can rapidly lose viscosity, so that the cut single chip can be taken down from the substrate smoothly.

Further: in the step 5, the substrate and the cut single chips which are independent of each other are placed in an aging box to be heated at the temperature of 50-70 ℃ for 0.5-2min while illumination is carried out.

The beneficial effects of the further scheme are as follows: through heating in step when illumination, can will wash the moisture that remains on the chip after the evaporation fast, guarantee the quality and the job stabilization nature of chip.

Drawings

FIG. 1 is a schematic diagram of the efficient cutting principle of the chip of the present invention;

FIG. 2 is a schematic flow chart of a method for efficiently cutting a chip according to the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. base plate, 2, two-sided UV membrane, 3, the chip of waiting to cut.

Detailed Description

The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.

As shown in fig. 1 and 2, a method for efficiently cutting a chip includes the following steps:

step 1: cleaning the surface of a substrate 1, and sticking a double-sided UV film 2 in a pre-selected cutting area;

step 2: placing a chip 3 to be cut on a substrate 1 with a double-sided UV film 2 attached, so that the chip 3 to be cut is fixed in a cutting area on the substrate 1 through the double-sided UV film 2;

and step 3: placing the substrate 1 fixed with the chip 3 to be cut on a worktable of a cutting machine, and cutting the substrate along a preset cutting auxiliary line on the chip 3 to be cut until the substrate is completely cut off to form a plurality of independent single chips;

and 4, step 4: taking the substrate 1 and a plurality of independent single chips from a worktable of a cutting machine after cutting, and cleaning and drying;

and 5: and illuminating the substrate and the cut single chips which are independent from each other to make the double-sided UV film lose viscosity, and taking down the cut single chips one by one.

According to the efficient chip cutting method, the double-sided UV film 2 is arranged on the substrate 1, the chip to be cut can be fixed on the substrate 1, the position of the chip is relatively fixed during cutting, the double-sided UV film 2 is melted by heating after the cutting is finished, a single chip is directly taken down, cleaning through a chemical solvent is not needed, the period of a cutting process is greatly shortened, the cutting efficiency is improved, and the cutting precision and the cutting quality can be guaranteed.

In one or more embodiments of the present invention, the substrate 1 is made of PVC. Adopt the base plate 1 of PVC material, on the one hand can make things convenient for the cutting machine to cut off completely when the cutting to can not injure the cutting machine blade, on the other hand, 1 stability of base plate and the heat resistance of PVC material are better, and also can not influence its life.

In one or more embodiments of the present invention, in step 1, the surface of the substrate 1 is cleaned with alcohol and wiped with a dust-free cloth. Through adopting alcohol to it is right basically to wash, can effectively get rid of the impurity on base plate 1 surface, guarantee the tight laminating in surface of two-sided UV membrane 2 and base plate 1 to it leads to follow-up two-sided UV membrane 2 and base plate and chip bonding insecure to avoid having the foreign matter on the base plate 1.

Preferably, in one or more embodiments provided by the present invention, in the step 2, when the chip 3 to be cut is placed on the substrate 1 to which the double-sided UV film 2 is attached, the double-sided UV film 2 completely covers the lower surface of the chip 3 to be cut. The lower surface of the chip 3 to be cut is completely covered by the double-sided UV film 2, so that a plurality of independent single chips can be prevented from falling off from the substrate after cutting.

In the invention, the double-sided UV film adopts a 50# PET UV visbreaking adhesive protective film, which comprises a PET film (50 μm), double-sided acrylic adhesive (20 μm) and a PET release film (50 μm), and the physical properties of the double-sided UV film are shown in the following table:

the protective film has stronger viscosity before resisting high temperature irradiation and ultraviolet rays, and the viscosity is greatly reduced after the ultraviolet rays are irradiated, so the protective film can be easily peeled and cut; the preservation temperature is 23 ℃ and the relative humidity is 55%, and if the paint is stored in an environment with the temperature of more than 60 ℃ for a long time, the adhesive force is greatly reduced.

Preferably, in one or more embodiments provided by the present invention, in step 3, the cutting depth of the chip 3 to be cut is greater than or equal to the thickness thereof. By controlling the cutting depth to be more than or equal to the thickness of the chip 3 to be cut, the chip 3 to be cut can be conveniently and completely cut off, so that a plurality of independent single chips are formed.

In order to ensure the cutting efficiency and the cutting safety, the chip is directly cut off along the cutting auxiliary line during cutting, but the substrate 1 is damaged sometimes due to errors caused by cutting precision control during actual cutting, and the substrate 1 is made of PVC material, so the substrate is basically unaffected, but basically too deep cannot be damaged as much as possible during cutting, on one hand, unnecessary abrasion of a blade of a cutting machine is caused, on the other hand, the structural strength of the substrate 1 is damaged, and the service life of the substrate is influenced.

In one or more embodiments of the present invention, in step 4, the substrate 1 and the cut single chips are placed in clean water, and are brushed and dried by a soft brush. The cut single chips which are independent from each other are placed in clear water for cleaning, so that scraps and residues generated during chip surface cutting can be removed, and the single chip taken down after subsequent illumination is clean and pollution-free.

Preferably, in one or more embodiments provided by the present invention, in the step 5, the energy density of the illumination is 100-². Through the control of the energy density of illumination, the double-sided UV film can lose the viscosity rapidly, so that the cut single chip can be taken down smoothly from the substrate.

Preferably, in one or more embodiments provided by the present invention, in step 5, while performing light irradiation, the substrate and the cut single chips independent of each other are placed in an aging oven to be heated, the heating temperature range is 50 to 70 ℃, and the heating time is 0.5 to 2 min. Through heating in step when illumination, can leave the moisture rapid evaporation who remains on the chip behind the information, guarantee the quality and the job stabilization nature of chip. In practice, the heating time is preferably 1 min.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.