阅读说明：本技术 一种带通道结构的双层板及其真空电子束加工方法 (double-layer plate with channel structure and vacuum electron beam processing method thereof ) 是由 刘奋成 陈悦 夏春 黄春平 李春雨 于 2019-09-23 设计创作，主要内容包括：本发明公开一种带通道结构的双层板及其真空电子束加工方法,涉及带通道结构的双层板技术领域；本发明中将厚度0.1至10mm的合金板材根据设定间隙装配组合在一起；将装配好的双层板结构送至真空电子束的真空室内；抽真空至真空度优于7×10<Sup>-4</Sup>Pa；进行电子束表面聚焦或散焦,编辑加工路径和参数,并设置电子束加工参数到合适范围；按照预定程序,在指定部位进行双层板间带通道结构的电子束加工,加工期间保证上面板熔透、下面板有一定熔深,两板间隙处由上面板熔化金属流下并与下面板接触形成通道结构；加工完毕后静置10至30分钟,给真空室充气,取出双层板。本发明利用高真空电子束加工大熔深特点,可实现不同厚度、不同间隙的带通道结构双层板的快速加工。(the invention discloses a double-layer plate with a channel structure and a vacuum electron beam processing method thereof, relating to the technical field of double-layer plates with channel structures; according to the invention, alloy plates with the thickness of 0.1-10 mm are assembled and combined together according to a set gap; the assembled double-layer plate structure is sent into a vacuum chamber of a vacuum electron beam; vacuumizing to a vacuum degree better than 7 x 10 ‑4 pa; focusing or defocusing the surface of the electron beam, editing a processing path and parameters, and setting the processing parameters of the electron beam to a proper range; according to a preset program, carrying out electron beam processing with a channel structure between the double-layer plates at a specified position, ensuring that the upper plate is completely melted and the lower plate has certain melting depth during processing, and forming the channel structure at the gap between the two plates by the molten metal of the upper plate flowing down and contacting with the lower plate; and standing for 10-30 minutes after the processing is finished, inflating the vacuum chamber, and taking out the double-layer plate. The invention utilizes the characteristic of large fusion depth of high vacuum electron beam processing, and can realize the rapid processing of double-layer plates with different thicknesses and different gaps and with channel structures.)

1. the utility model provides a take channel structure's double-deck board which characterized in that: the upper panel and the lower panel are connected together through the channel structures.

2. The double-layer plate with a channel structure according to claim 1, wherein: the upper panel and the lower panel are made of metal plates.

3. The double-layer plate with a channel structure according to claim 2, wherein: the upper panel and the lower panel are the same in thickness or different in thickness, and the upper panel and the lower panel are made of the same or different metal plates.

4. the double-layer plate with a channel structure according to claim 3, wherein: the height of the channel structure is controlled by the height of the gap between the upper and lower panels.

5. a vacuum electron beam processing method of a double-layer plate with a channel structure is characterized in that: the method comprises the following steps:

(1) Cleaning and polishing the surfaces of the upper panel and the lower panel to ensure that the surfaces are smooth and flat without foreign matters;

(2) according to the actual needs or the requirements of manufacture, the upper panel and the lower panel are clamped and fixed at a specified gap;

(3) placing the upper panel and the lower panel which are clamped and fixed on a vacuum chamber workbench of electron beam processing equipment and fixing;

(4) Closing the bin door of the vacuum chamber and vacuumizing;

(5) Focusing or defocusing the surface of the electron beam, editing a processing path and parameters, and setting the processing parameters of the electron beam to a proper range;

(6) according to a preset program, processing an electron beam of a channel structure between the upper panel and the lower panel at a designated position;

(7) Standing for 10-30 minutes after the processing is finished, fully cooling the double-layer plate, inflating the vacuum chamber and taking out;

(8) and cutting the redundant metal on the surface of the upper panel to ensure that the surface of the double-layer panel is flat and free of defects.

6. The vacuum electron beam processing method of a double-layer plate with a channel structure according to claim 5, wherein: in the step (4), the vacuum degree is pumped to be better than 7 multiplied by 10 in the vacuum chamber^-4Pa。

7. The vacuum electron beam processing method of a double-layer plate with a channel structure according to claim 5, wherein: in the step (6), during the processing, the upper panel is ensured to be completely melted, the lower panel is partially melted, and the gap between the upper panel and the lower panel is formed into a channel structure by the molten metal of the upper panel flowing down and contacting with the lower panel.

Technical Field

The invention relates to the technical field of double-layer plates with channel structures, in particular to a double-layer plate with a channel structure and a vacuum electron beam processing method thereof.

background

The double-layer plate structure has light weight, so that the carrying capacity of the aircraft can be increased, the maneuvering performance is improved, the range is increased, and the consumption of fuel oil or propellant is reduced, thereby meeting the economic requirement of the aircraft manufacturing industry. The double-layer plate structure with the cooling structure inherits the advantages, and is widely applied to the fields of aerospace, transportation, architectural decoration, military defense and the like due to small density, high rigidity, impact resistance, good channel structure sealing performance and good heat insulation performance.

Currently, the traditional manufacturing method of the double-plate structure includes: the double-layer plate structure parts are assembled by welding, riveting, screwing and other connecting modes, and the double-layer plate structure parts have the main defects of large number of parts, high assembly difficulty and poor reliability, and bring much inconvenience to the manufacture of modern military and civil aircrafts. Two common double-layer plate structures exist, one is that a panel and a core body are connected together through glue joint to prepare a double-layer plate, the defects of easy degumming, bulging and unrepairable property exist, and the application of the double-layer plate is also often limited by an adhesive. In addition, for a thin plate structure with the thickness less than 0.5mm, the brazing has the defects that the brazing material is corroded by the base material and the brazing material is difficult to preset.

the superplastic forming (SPF) technology of the double-layer plate structure has been a research hotspot in the aerospace industry for a long time abroad, and the technology is not developed and matured at home and does not enter into a substantial large-scale production stage. However, the research on the double-layer plate with the channel structure is less, and the reported method is only a method for preparing the double-layer plate by growing channels on one side of the plate by an additive manufacturing technology and then connecting the upper plate and the lower plate together by using a transition liquid phase connection technology. The method has the advantages of complex process, large deformation of the plate in the preparation process, low processing precision and low processing efficiency. The vacuum electron beam processing method for directly preparing the double-layer plate with the channel structure by using the vacuum electron beam method has no research on relevant aspects at present.

The process technology is used as a manufacturing technology in the field of aviation manufacturing engineering, and has the main advantages that: the double-layer plate has good forming performance and functions of cooling and conveying fluid of the double-layer plate, and the formed double-layer plate structure is a multifunctional structural member difficult to manufacture by the conventional process, so that more degrees of freedom are provided for design, the integration of the structure is realized, the purposes of reducing weight and saving cost are achieved, a new way is provided for processing and manufacturing the double-layer plate, and a new field is opened up for the manufacturing technology of the double-layer plate in aerospace manufacturing engineering.

disclosure of Invention

The invention aims to provide a double-layer plate with a channel structure and a vacuum electron beam processing method thereof aiming at the technical limitation of the existing double-layer plate with the channel structure.

In order to achieve the purpose, the invention provides the following scheme: the invention provides a double-layer plate with a channel structure, which comprises an upper panel and a lower panel, wherein a gap is reserved between the upper panel and the lower panel, the channel structure is formed in the gap, and the upper panel and the lower panel are connected together through the channel structure.

Preferably, the upper panel and the lower panel are made of metal plates.

Preferably, the upper panel and the lower panel have the same or different thicknesses, and the upper panel and the lower panel are made of the same or different metal plates.

preferably, the height of the channel structure is controlled by the height of the gap between the upper and lower panels.

The invention also discloses a vacuum electron beam processing method of the double-layer plate with the channel structure, which comprises the following steps:

(1) Cleaning and polishing the surfaces of the upper panel and the lower panel to ensure that the surfaces are smooth and flat without foreign matters;

(2) According to the actual needs or the requirements of manufacture, the upper panel and the lower panel are clamped and fixed at a specified gap;

(3) placing the upper panel and the lower panel which are clamped and fixed on a vacuum chamber workbench of electron beam processing equipment and fixing;

(4) Closing the bin door of the vacuum chamber and vacuumizing;

(5) Focusing or defocusing the surface of the electron beam, editing a processing path and parameters, and setting the processing parameters of the electron beam to a proper range;

(6) According to a preset program, processing an electron beam of a channel structure between the upper panel and the lower panel at a designated position;

(7) Standing for 10-30 minutes after the processing is finished, fully cooling the double-layer plate, inflating the vacuum chamber and taking out;

(8) and cutting the redundant metal on the surface of the upper panel to ensure that the surface of the double-layer panel is flat and free of defects.

Preferably, in the step (4), the vacuum degree is better than 7X 10 after the vacuum chamber is vacuumized^-4Pa。

Preferably, in the step (6), during the processing, the upper panel is ensured to be melted through, the lower panel is ensured to be partially melted deep, and the gap between the upper panel and the lower panel is formed by the channel structure formed by the molten metal of the upper panel flowing down and contacting with the lower panel.

compared with the prior art, the invention has the following technical effects:

according to the invention, the structure with the channel is directly prepared between the upper panel and the lower panel by a vacuum electron beam method, and the characteristic of large fusion depth in high-vacuum electron beam processing is utilized, so that the rapid processing of the structure with the channel between double-layer panels with different thicknesses and different gaps can be realized; on one hand, the channel structure between the upper panel and the lower panel can be quickly and efficiently prepared, on the other hand, the upper panel and the lower panel can be connected through the channel structure, namely, the channel wall is processed while the upper panel and the lower panel are connected, and the method has the advantages of simple process, labor hour saving, low processing cost and the like.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic structural view of a double-layer plate with a channel structure according to the present invention;

FIG. 2 is a schematic cross-sectional view of a channel wall of a double-layer plate with a channel structure according to the present invention with a 1.0mm gap;

FIG. 3 is a schematic longitudinal sectional view of the channel wall when a 1.0mm gap is formed between the double-layer plates with the channel structure according to the present invention;

FIG. 4 is a schematic cross-sectional view of the channel wall of a double-layer plate with a channel structure according to the present invention with a gap of 0.8 mm;

FIG. 5 is a longitudinal sectional view of the channel wall when a double-layer plate with a channel structure of the present invention is provided with a 0.8mm gap;

FIG. 6 is a flowchart of the vacuum electron beam processing method of the double-layer plate with a channel structure according to the present invention.

Detailed Description

the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

the invention aims to provide a double-layer plate with a channel structure and a vacuum electron beam processing method thereof aiming at the technical limitation of the existing double-layer plate with the channel structure.

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.