阅读说明：本技术 研磨液供应设备及供应方法 (Polishing slurry supply apparatus and method ) 是由 彭名君 于 2019-10-17 设计创作，主要内容包括：本发明提供了一种研磨液供应设备,包括第一压力罐、第二压力罐、阀箱、第一连接管和第二连接管,所述第一压力罐上侧设有第一研磨液进入口和第一压力调节阀。采用可封闭的所述第一压力罐和所述第二压力罐来供应研磨液,且通过所述第一压力调节阀来调节所述第一压力罐内的压力,通过所述第二压力调节阀来调节所述第二压力罐内气压,通过气压做动力源,以使研磨液在所述第一压力罐和所述第二压力罐之间流动,无需气动泵或电动泵的使用,降低了成本,气压做动力源使得研磨液流速均一,保证了研磨液研磨的均一性。本发明还提供了一种所述研磨液供应设备用于实现研磨液供应的研磨液供应方法。(the invention provides grinding fluid supply equipment which comprises a first pressure tank, a second pressure tank, a valve box, a first connecting pipe and a second connecting pipe, wherein a first grinding fluid inlet and a first pressure regulating valve are arranged on the upper side of the first pressure tank. The first pressure tank and the second pressure tank which can be closed are adopted to supply grinding fluid, the pressure in the first pressure tank is adjusted through the first pressure adjusting valve, the air pressure in the second pressure tank is adjusted through the second pressure adjusting valve, and the air pressure is used as a power source, so that the grinding fluid flows between the first pressure tank and the second pressure tank, a pneumatic pump or an electric pump is not needed, the cost is reduced, the air pressure is used as a power source, the flow rate of the grinding fluid is uniform, and the grinding uniformity of the grinding fluid is ensured. The invention also provides a grinding fluid supply method for supplying the grinding fluid by the grinding fluid supply equipment.)

1. The grinding fluid supply equipment is characterized by comprising a first pressure tank, a second pressure tank, a valve box, a first connecting pipe and a second connecting pipe, the first pressure tank is connected with the valve box through the first connecting pipe, the first connecting pipe is provided with a first pneumatic valve, the second pressure tank is connected with the valve box through the second connecting pipe, the valve box is provided with a grinding equipment connecting pipe, the grinding equipment connecting pipe is connected with the grinding equipment, a second pneumatic valve is arranged on the second connecting pipe, a first grinding fluid inlet and a first pressure regulating valve are arranged on the upper side of the first pressure tank, a first high liquid level sensor and a first low liquid level sensor are arranged on the inner side wall of the first pressure tank, and a second grinding fluid inlet and a second pressure regulating valve are arranged on the upper side of the second pressure tank, and a second high liquid level sensor and a second low liquid level sensor are arranged on the inner side wall of the second pressure tank.

2. the polishing slurry supply apparatus according to claim 1, wherein the first pressure tank and the second pressure tank are identical in shape and size.

3. The polishing slurry supply apparatus according to claim 1, wherein the first pressure tank and the second pressure tank are on the same horizontal plane.

4. The slurry supply apparatus according to claim 2 or 3, wherein the first high level sensor and the second high level sensor are on the same horizontal plane.

5. The slurry supply apparatus according to claim 2 or 3, wherein the first low level sensor and the second low level sensor are on the same horizontal plane.

6. the polishing liquid supply apparatus according to claim 1, wherein said first connection pipe is connected to a lower side of said first pressure tank.

7. The polishing slurry supply apparatus according to claim 1, wherein the second connection pipe is connected to a lower side of the second pressure tank.

8. The slurry supply apparatus according to claim 1, wherein a first slurry injection valve is provided on the first slurry inlet port.

9. The slurry supply apparatus according to claim 1, wherein a second slurry injection valve is provided on the second slurry inlet port.

10. A method for supplying a polishing slurry, comprising the steps of:

S1: closing the first pneumatic valve and the second pneumatic valve, and then injecting grinding fluid into the first pressure tank in a normal pressure state through the first grinding fluid inlet until the liquid level of the grinding fluid in the first pressure tank reaches the detection position of the first high liquid level sensor;

s2: pressurizing the first pressure tank to a high-pressure state through a first pressure regulating valve to be used as a supply tank, simultaneously pressurizing the second pressure tank to a low-pressure state through a second pressure regulating valve to be used as a recovery tank, and then opening the first pneumatic valve and the second pneumatic valve so as to enable grinding fluid to flow from the first pressure tank to the second pressure tank through a first connecting pipe, a valve box and a second connecting pipe in sequence until the liquid level of the grinding fluid in the first pressure tank reaches the detection position of a first low liquid level sensor, wherein the grinding fluid also enters grinding equipment through a grinding equipment connecting pipe when flowing through the valve box;

S3: depressurizing the first pressure tank to a low pressure state as a recovery tank by the first pressure regulating valve, and then closing the second pneumatic valve;

S4: the second pressure tank is depressurized to a normal pressure state through the second pressure regulating valve, and then grinding fluid is injected into the second pressure tank through the second grinding fluid inlet until the liquid level of the grinding fluid in the second pressure tank reaches the detection position of a second high liquid level sensor;

S5: pressurizing the second pressure tank to a low pressure state by the second pressure regulating valve and then opening the second pneumatic valve;

S6: and the second pressure tank is pressurized to a high-pressure state through the second pressure regulating valve to serve as a supply tank, so that the grinding fluid flows from the second pressure tank to the first pressure tank through the second connecting pipe, the valve box and the first connecting pipe in sequence until the liquid level of the grinding fluid in the second pressure tank reaches the detection position of the second low liquid level sensor, wherein the grinding fluid flows into the grinding equipment through the grinding equipment connecting pipe when flowing through the valve box.

11. The slurry supply method according to claim 10, further comprising the steps of:

S7: depressurizing the second pressure tank to a low pressure state as a recovery tank through the second pressure regulating valve, and then closing the first pneumatic valve;

s8: depressurizing the first pressure tank to a normal pressure state through the first pressure regulating valve, and then injecting grinding fluid into the first pressure tank through the first grinding fluid inlet until the liquid level of the grinding fluid in the first pressure tank reaches the detection position of the first high liquid level sensor;

s9: pressurizing the first pressure tank to a low pressure state by the first pressure regulating valve and then opening the first pneumatic valve;

s10: and the first pressure tank is pressurized to a high-pressure state through the first pressure regulating valve to serve as a supply tank, so that the grinding fluid flows from the first pressure tank to the second pressure tank through the first connecting pipe, the valve box and the second connecting pipe in sequence until the liquid level of the grinding fluid in the first pressure tank reaches the detection position of the first low liquid level sensor, wherein the grinding fluid flows through the valve box and then enters grinding equipment through the grinding equipment connecting pipe.

12. The polishing slurry supply method according to claim 10 or 11, wherein the steps S3 to S10 are repeatedly performed to circulate the polishing slurry between the first pressure tank and the second pressure tank.

Technical Field

The invention relates to the technical field of grinding, in particular to grinding fluid supply equipment and a supply method.

Background

the slurry is a suspension in which solid particles are present, and the slurry cannot be left for a long time in the supply system in order to prevent agglomeration of the solid particles. As shown in fig. 3, the conventional slurry supply system uses a pneumatic pump and an electric pump as power sources to draw the slurry from the supply tank and return the slurry to the supply tank through a section of circulation pipeline, so as to keep the slurry flowing.

the supply pressure of the pneumatic pump is not stable, and the output pressure curve is in a fluctuation type, so that the difficulty of controlling the flow of the grinding equipment is increased, and the uniformity of grinding can be influenced due to the uneven grinding flow rate; in order to make the output pressure as stable as possible, devices such as a shock absorber and a back pressure valve are also required to be added to a pipeline of the pneumatic pump, and the unit price cost of the shock absorber, the back pressure valve and the pneumatic pump is high; the pneumatic pump is repeatedly run and rubs, can lead to the accessory loss in the pneumatic pump cavity, and the pneumatic pump then needs regular replacement, further increased the input cost.

The unit price of the electric pump is expensive, and the one-time investment cost is high; the electric pump also needs an additional controller, so that the failure probability of equipment is increased; the high speed operation of the electric pump causes the temperature of the slurry to rise.

In addition, in the conventional supply system, the supply tank is not sealed, and in order to maintain the humidity of the polishing liquid, hardware such as a humidifier needs to be added, which increases the investment cost of the equipment.

Therefore, there is a need for a new slurry supply apparatus and method to solve the above-mentioned problems in the prior art.

Disclosure of Invention

The invention aims to provide a grinding fluid supply device and a supply method, which avoid the problems of high cost, uneven grinding flow rate and extrusion and friction of a pump to the grinding fluid.

In order to achieve the above object, the slurry supply apparatus of the present invention includes a first pressure tank, a second pressure tank, a valve housing, a first connection pipe and a second connection pipe, the first pressure tank is connected with the valve box through the first connecting pipe, the first connecting pipe is provided with a first pneumatic valve, the second pressure tank is connected with the valve box through the second connecting pipe, the valve box is provided with a grinding equipment connecting pipe, the grinding equipment connecting pipe is connected with the grinding equipment, a second pneumatic valve is arranged on the second connecting pipe, a first grinding fluid inlet and a first pressure regulating valve are arranged on the upper side of the first pressure tank, a first high liquid level sensor and a first low liquid level sensor are arranged on the inner side wall of the first pressure tank, and a second grinding fluid inlet and a second pressure regulating valve are arranged on the upper side of the second pressure tank, and a second high liquid level sensor and a second low liquid level sensor are arranged on the inner side wall of the second pressure tank.

The invention has the beneficial effects that: the first pressure tank and the second pressure tank which can be closed are adopted to supply grinding fluid, the air pressure in the first pressure tank is adjusted through the first pressure adjusting valve, the air pressure in the second pressure tank is adjusted through the second pressure adjusting valve, and the air pressure is used as a power source, so that the grinding fluid flows between the first pressure tank and the second pressure tank, and then enters the grinding equipment through the grinding equipment connecting pipe when the grinding fluid flows through the valve box, a pneumatic pump or an electric pump is not needed, the cost is reduced, the air pressure is used as the power source, the flow rate of the grinding fluid is uniform, and the grinding uniformity of the grinding fluid is ensured.

Preferably, the first pressure tank and the second pressure tank are identical in shape and size. The beneficial effects are that: the amounts of the polishing liquid that can be stored in the first pressure tank and the second pressure tank can be made the same.

Preferably, the first pressure tank and the second pressure tank are on the same horizontal plane. The beneficial effects are that: the grinding fluid in the first pressure tank and the grinding fluid in the second pressure tank are prevented from being influenced by gravity, and the grinding fluid is enabled to flow under the action of air pressure in the first pressure tank and the second pressure tank.

further preferably, the first high level sensor and the second high level sensor are on the same horizontal plane. The beneficial effects are that: and ensuring that the grinding fluid amounts detected by the first high liquid level sensor and the second high liquid level sensor are the same.

further preferably, the first low level sensor and the second low level sensor are on the same horizontal plane. The beneficial effects are that: and ensuring that the grinding fluid amounts detected by the first low liquid level sensor and the second low liquid level sensor are the same.

Preferably, the first connection pipe is connected to a lower side of the first pressure tank. The beneficial effects are that: the grinding fluid in the first pressure tank can flow out conveniently.

Preferably, the second connection pipe is connected to a lower side of the second pressure tank. The beneficial effects are that: the grinding fluid in the second pressure tank can flow out conveniently.

Preferably, a first grinding fluid injection valve is arranged on the first grinding fluid inlet. The beneficial effects are that: facilitating sealing of the first pressure tank to enable generation of air pressure within the first pressure tank.

preferably, a second grinding fluid injection valve is arranged on the second grinding fluid inlet. The beneficial effects are that: facilitating sealing of the second pressure tank to enable generation of air pressure within the second pressure tank.

The invention also provides a grinding fluid supply method, which comprises the following steps:

S1: closing the first pneumatic valve and the second pneumatic valve, and then injecting grinding fluid into the first pressure tank in a normal pressure state through the first grinding fluid inlet until the liquid level of the grinding fluid in the first pressure tank reaches the detection position of the first high liquid level sensor;

S2: pressurizing the first pressure tank to a high-pressure state through a first pressure regulating valve to be used as a supply tank, simultaneously pressurizing the second pressure tank to a low-pressure state through a second pressure regulating valve to be used as a recovery tank, and then opening the first pneumatic valve and the second pneumatic valve so as to enable grinding fluid to flow from the first pressure tank to the second pressure tank through a first connecting pipe, a valve box and a second connecting pipe in sequence until the liquid level of the grinding fluid in the first pressure tank reaches the detection position of a first low liquid level sensor, wherein the grinding fluid also enters grinding equipment through a grinding equipment connecting pipe when flowing through the valve box;

S3: depressurizing the first pressure tank to a low pressure state as a recovery tank by the first pressure regulating valve, and then closing the second pneumatic valve;

S4: the second pressure tank is depressurized to a normal pressure state through the second pressure regulating valve, and then grinding fluid is injected into the second pressure tank through the second grinding fluid inlet until the liquid level of the grinding fluid in the second pressure tank reaches the detection position of a second high liquid level sensor;

s5: pressurizing the second pressure tank to a low pressure state by the second pressure regulating valve and then opening the second pneumatic valve;

s6: and the second pressure tank is pressurized to a high-pressure state through the second pressure regulating valve to serve as a supply tank, so that the grinding fluid flows from the second pressure tank to the first pressure tank through the second connecting pipe, the valve box and the first connecting pipe in sequence until the liquid level of the grinding fluid in the second pressure tank reaches the detection position of the second low liquid level sensor, wherein the grinding fluid flows into the grinding equipment through the grinding equipment connecting pipe when flowing through the valve box.

the grinding fluid supply method has the beneficial effects that: the grinding fluid is supplied to the first pressure tank and the second pressure tank which can be closed, the first pressure regulating valve is used for regulating the first pressure tank to be in a high-pressure state or a low-pressure state, the second pressure regulating valve is used for regulating the second pressure tank to be in a high-pressure state or a low-pressure state, and the power source is made through air pressure so that the grinding fluid flows between the first pressure tank and the second pressure tank without using a pneumatic pump or an electric pump, the cost is reduced, the power source is made through air pressure so that the flow rate of the grinding fluid is uniform, and the grinding uniformity of the grinding fluid is ensured.

further preferably, the slurry supply method further includes the steps of:

S7: depressurizing the second pressure tank to a low pressure state as a recovery tank through the second pressure regulating valve, and then closing the first pneumatic valve;

S8: depressurizing the first pressure tank to a normal pressure state through the first pressure regulating valve, and then injecting grinding fluid into the first pressure tank through the first grinding fluid inlet until the liquid level of the grinding fluid in the first pressure tank reaches the detection position of the first high liquid level sensor;

s9: pressurizing the first pressure tank to a low pressure state by the first pressure regulating valve and then opening the first pneumatic valve;

S10: and the first pressure tank is pressurized to a high-pressure state through the first pressure regulating valve to serve as a supply tank, so that the grinding fluid flows from the first pressure tank to the second pressure tank through the first connecting pipe, the valve box and the second connecting pipe in sequence until the liquid level of the grinding fluid in the first pressure tank reaches the detection position of the first low liquid level sensor, wherein the grinding fluid flows through the valve box and then enters grinding equipment through the grinding equipment connecting pipe. The beneficial effects are that: the grinding fluid flows through the pressure difference, a pneumatic pump or an electric pump is not needed, the cost is reduced, and the flow rate of the grinding fluid can be uniform.

further preferably, the steps S3 to S10 are repeatedly performed to circulate the slurry between the first pressure tank and the second pressure tank. The beneficial effects are that: the circulation flow ensures a stable supply of the slurry.

Drawings

FIG. 1 is a schematic view of a polishing slurry supply apparatus according to the present invention;

FIG. 2 is a flow chart of a method of supplying polishing slurry according to the present invention;

FIG. 3 is a block diagram of a prior art slurry supply system.

Detailed Description

in order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and similar words are intended to mean that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items.

in view of the problems of the prior art, the embodiment of the present invention provides a slurry supply apparatus, and the slurry supply apparatus 10 includes a first pressure tank 11, a second pressure tank 12, a valve housing 13, a first connection pipe 14, and a second connection pipe 15. The first pressure tank 11 passes through first connecting pipe 14 with the valve box 13 is connected, be equipped with first pneumatic valve 141 on the first connecting pipe 14, the second pressure tank 12 passes through the second connecting pipe 15 with the valve box 13 is connected, be equipped with second pneumatic valve 151 on the second connecting pipe 15, be equipped with grinding device connecting pipe 16 on the valve box 13, grinding device connecting pipe 16 is connected with grinding device 17. First pressure tank 11 upside is equipped with first lapping liquid inlet 111 and first pressure regulating valve 112, be equipped with first high level sensor 113 and first low level sensor 114 on the first pressure tank 11 inside wall, second pressure tank 12 upside is equipped with second lapping liquid inlet 121 and second pressure regulating valve 122, be equipped with the high level sensor 123 of second and the low level sensor 124 of second on the second pressure tank 12 inside wall. The valve housing 13 and the grinding device 16 are prior art and will not be described in detail here.

in some embodiments of the invention, the first and second pneumatic valves are one of pneumatic V-adjust ball valves, pneumatic O-block ball valves, torque cylinder ball valves, solenoid diaphragm valves, or pneumatic diameter stroke diaphragm valves.

In some embodiments of the invention, the first pressure tank and the second pressure tank are the same in shape and size.

In some preferred embodiments of the present invention, the lowest point of the lower surface of the first pressure tank and the lowest point of the lower surface of the second pressure tank are on the same horizontal plane.

In some embodiments of the invention, the level at which the lowest point of the first high level sensor is located is above the level at which the highest point of the first low level sensor is located.

In some embodiments of the invention, the level at which the lowest point of the second high level sensor is located is above the level at which the highest point of the second low level sensor is located.

In some preferred embodiments of the present invention, the lowest point of the lower surface of the first high level sensor and the lowest point of the lower surface of the second high level sensor are on the same horizontal plane.

In some preferred embodiments of the present invention, the lowest point of the lower surface of the first low level sensor and the lowest point of the lower surface of the second low level sensor are on the same horizontal plane.

In some embodiments of the present invention, a distance between a horizontal plane of a highest point of the first high liquid level sensor and a horizontal plane of a lowest point of the first slurry inlet port is 3cm, and a distance between a horizontal plane of a highest point of the second high liquid level sensor and a horizontal plane of a lowest point of the second slurry inlet port is 3 cm.

In some embodiments of the present invention, a distance between a horizontal plane of a lowest point of the first low liquid level sensor and a horizontal plane of a highest point of the first connection pipe is 3cm, and a distance between a horizontal plane of a lowest point of the second low liquid level sensor and a horizontal plane of a highest point of the second connection pipe is 3 cm.

In some embodiments of the present invention, the first high level sensor, the second high level sensor, the first low level sensor, and the second low level sensor are proximity capacitance sensors.

In some preferred embodiments of the present invention, the first connection pipe is connected to a lower side of the first pressure tank.

In some preferred embodiments of the present invention, the second connection pipe is connected to a lower side of the second pressure tank.

in some embodiments of the present invention, a first slurry injection valve is disposed on the first slurry inlet.

In some embodiments of the present invention, a second slurry injection valve is disposed on the second slurry inlet.

FIG. 2 is a flow chart of a slurry supply method according to some embodiments of the invention. Referring to fig. 1 and 2, the slurry supply method includes the steps of:

S1: closing the first air-operated valve 141 and the second air-operated valve 151, and then injecting the grinding fluid into the first pressure tank 11 in a normal pressure state through the first grinding fluid inlet port 111 until the liquid level of the grinding fluid in the first pressure tank 11 reaches the detection position of the first high liquid level sensor 113;

s2: pressurizing the first pressure tank 11 to a high pressure state as a supply tank by a first pressure regulating valve 112 while pressurizing the second pressure tank 12 to a low pressure state as a recovery tank by a second pressure regulating valve 122, and then opening the first pneumatic valve 141 and the second pneumatic valve 151 to flow the polishing liquid from the first pressure tank 11 to the second pressure tank 12 through a first connecting pipe 14, a valve box 13 and a second connecting pipe 15 in this order until the liquid level of the polishing liquid in the first pressure tank 11 reaches the detection position of a first low liquid level sensor 114, wherein the polishing liquid also enters the polishing apparatus 17 through a polishing apparatus connecting pipe 16 while flowing through the valve box 13;

S3: depressurizing the first pressure tank 11 to a low pressure state as a recovery tank by the first pressure regulating valve 112, and then closing the second air-operated valve 151;

S4: the second pressure tank 12 is depressurized to a normal pressure state by the second pressure regulating valve 122, and then the grinding fluid is injected into the second pressure tank 12 through the second grinding fluid inlet port 121 until the liquid level of the grinding fluid in the second pressure tank 12 reaches the detection position of the second high liquid level sensor 123;

s5: pressurizing the second pressure tank 12 to a low pressure state by the second pressure regulating valve 122, and then opening the second air-operated valve 151;

S6: the second pressure tank 12 is pressurized to a high pressure state as a supply tank by the second pressure regulating valve 122, so that the grinding fluid flows from the second pressure tank 12 to the first pressure tank 11 through the second connecting pipe 15, the valve box 13 and the first connecting pipe 14 in sequence until the liquid level of the grinding fluid in the second pressure tank 12 reaches the detection position of the second low liquid level sensor 124, wherein the grinding fluid also enters the grinding device 17 through the grinding device connecting pipe 16 while flowing through the valve box 13.

In some embodiments of the present invention, the method for supplying polishing slurry further comprises the steps of:

S7: depressurizing the second pressure tank to a low pressure state as a recovery tank through the second pressure regulating valve, and then closing the first pneumatic valve;

s8: depressurizing the first pressure tank to a normal pressure state through the first pressure regulating valve, and then injecting grinding fluid into the first pressure tank through the first grinding fluid inlet until the liquid level of the grinding fluid in the first pressure tank reaches the detection position of the first high liquid level sensor;

S9: pressurizing the first pressure tank to a low pressure state by the first pressure regulating valve and then opening the first pneumatic valve;

s10: and the first pressure tank is pressurized to a high-pressure state through the first pressure regulating valve to serve as a supply tank, so that the grinding fluid flows from the first pressure tank to the second pressure tank through the first connecting pipe, the valve box and the second connecting pipe in sequence until the liquid level of the grinding fluid in the first pressure tank reaches the detection position of the first low liquid level sensor, wherein the grinding fluid flows through the valve box and then enters grinding equipment through the grinding equipment connecting pipe.

in some embodiments of the present invention, the steps S3 to S10 are repeatedly performed to circulate the slurry between the first pressure tank and the second pressure tank.

in some embodiments of the present invention, the pressure in the high pressure state is greater than the pressure in the low pressure state, and the pressure in the low pressure state is lower than the pressure in the normal pressure state. The atmospheric pressure in the normal pressure state is the atmospheric pressure of the place where the polishing liquid supply equipment is used.

In some embodiments of the invention, the high pressure state is 30psi and the low pressure state is 15 psi.

In some embodiments of the present invention, the first polishing slurry injection valve and the second polishing slurry injection valve are opened only when the polishing slurry is injected, and the first polishing slurry injection valve and the second polishing slurry injection valve are maintained in a closed state after the polishing slurry injection is completed.

In some examples of the present invention, the first pressure tank and the second pressure tank are pressurized from the atmospheric pressure in the normal pressure state to the atmospheric pressure in the low pressure state in a manner of pressurization as a direct proportional function.

In some examples of the present invention, the first pressure tank and the second pressure tank are pressurized from the atmospheric pressure in the normal pressure state to the atmospheric pressure in the high pressure state in a pressurization manner as a proportional function.

In some examples of the present invention, the first pressure tank and the second pressure tank are pressurized from the gas pressure in the low pressure state to the gas pressure in the high pressure state in a pressurization manner of a proportional function.

Although the embodiments of the present invention have been described in detail hereinabove, it is apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it is to be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the following claims. Moreover, the invention as described herein is capable of other embodiments and of being practiced or of being carried out in various ways.