阅读说明：本技术 一种垂直导体pcb板及其加工方法 (vertical conductor PCB and processing method thereof ) 是由 解福洋 孙丽丽 许少泽 朱华明 于 2019-08-27 设计创作，主要内容包括：本发明公开了一种垂直导体PCB板及其加工方法,包括以下步骤：S1：PCB板压合,发料后进行PCB板内层图形制作与检测,然后压合PCB板；S2：捞初槽制作,在PCB板上钻孔或捞初槽；S3：沉铜电镀,在捞初槽的槽壁和槽底均匀沉铜电镀；S4：捞底槽制作,在初槽的槽底钻或捞开底铜形成底槽；S5：交叉槽制作,在初槽的两侧钻或捞形成交叉槽；S6：树脂堵塞,在槽内堵塞树脂,并打磨掉表面多余的树脂；S7：表面处理,PCB板外层图形制作后涂覆绿油后进行表面处理,然后风干除杂；S8：终检。通过设置初槽,槽壁沉铜电镀,底槽和交叉槽将铜内壁切成垂直导体。垂直导体面比孔壁而言没有弧度,所以线路板在传输信号过程中不再有过孔阻抗的干扰,从而也有更低的信号损耗。(the invention discloses a vertical conductor PCB and a processing method thereof, comprising the following steps: s1: pressing the PCB, performing inner layer graph manufacturing and detection on the PCB after material sending, and then pressing the PCB; s2: manufacturing a primary fishing groove, and drilling a hole or fishing the primary fishing groove on the PCB; s3: copper deposition electroplating, wherein the copper deposition electroplating is uniformly performed on the wall and the bottom of the first fishing tank; s4: manufacturing a bottom fishing groove, drilling or fishing bottom copper at the bottom of the primary groove to form a bottom groove; s5: manufacturing a crossed groove, namely drilling or fishing on two sides of the primary groove to form the crossed groove; s6: resin blocking, namely blocking resin in the groove and polishing off redundant resin on the surface; s7: surface treatment, namely coating green oil after the outer layer graph of the PCB is manufactured, performing surface treatment, and then air-drying to remove impurities; s8: and (5) final inspection. The copper inner wall is cut into vertical conductors by the bottom groove and the cross groove. The vertical conductor surface has no radian compared with the hole wall, so that the circuit board has no interference of via impedance in the signal transmission process, thereby having lower signal loss.)

1. A vertical conductor PCB board characterized in that: including first groove (1), kerve (2) and a plurality of crossing groove (3), first groove (1) is located in the PCB board, first groove (1) bottom is located in kerve (2), a plurality of crosses groove (3) is located first groove (1) both sides, first groove (1) cell wall is equipped with copper layer (4).

2. A vertical conductor PCB board according to claim 1 wherein: the depth of the cross groove (3) is the same as that of the bottom groove (2) and the cross groove and the bottom groove are communicated with each other.

3. A vertical conductor PCB board according to claim 1 wherein: resin layers (5) are arranged in the primary groove (1), the bottom groove (2) and the cross groove (3).

4. A vertical conductor PCB processing method is characterized by comprising the following steps:

s1: after the material is sent out, the inner layer graph of the PCB is manufactured and detected, and then the PCB (6) is pressed;

S2: manufacturing a primary groove (1) on a PCB (6);

s3: uniformly depositing copper and electroplating on the wall and the bottom of the primary tank (1) to form a copper layer (4);

s4: removing the copper layer (4) at the bottom of the primary groove (1) to form a bottom groove (2);

S5: a plurality of crossed grooves (3) are formed in the wall of the primary groove (1), the copper layers (4) of the wall of the primary groove (1) are separated by the plurality of crossed grooves (3) to form a plurality of vertical conductors, and the depth of the crossed grooves (3) is the same as that of the bottom groove (2) and the crossed grooves are communicated with each other;

S6: blocking resin in the primary groove (1), the bottom groove (2) and the cross groove (3), and polishing off redundant resin on the surface;

S7: and (3) coating green oil after the outer layer graph of the PCB (6) is manufactured, and then air-drying and removing impurities.

5. the vertical conductor PCB processing method of claim 6, wherein: and the step S2 also comprises the step of taking out burrs and glue residues in the primary groove (1).

6. The method for processing the vertical conductor PCB as recited in claim 6, further comprising a step S8 of final inspection.

Technical Field

The invention belongs to the technical field of PCB processing, and particularly relates to a vertical conductor PCB and a processing method thereof.

Background

a Printed Circuit Board (PCB), which is called a Printed Circuit Board (PCB) in chinese, is an important electronic component, a support for an electronic component, and a carrier for electrical connection of the electronic component. It is called a "printed" circuit board because it is made using electronic printing.

The traditional PCB production process comprises the following steps:

one, contact the manufacturer

the manufacturer needs to be contacted first, then the customer number is registered, and the person can quote, place an order and follow up the production progress.

Second, cutting

The purpose is as follows: according to the requirements of the engineering data MI, the large sheet material which meets the requirements is cut into small production plate pieces, and the small sheet material which meets the requirements of customers is cut into small sheet materials.

the process comprises the following steps: large plate → cutting plate according to MI requirement → curium plate → round corner of beer \ edging → discharging plate

third, drilling

the purpose is as follows: and drilling the required hole diameter at the corresponding position on the plate material with the required size according to the engineering data.

the process comprises the following steps: laminated plate pin → upper plate → drilling hole → lower plate → inspection \ repair

Four, copper deposition

The purpose is as follows: the copper deposition is to deposit a layer of thin copper on the wall of the insulating hole by a chemical method.

The process comprises the following steps: rough grinding → hanging plate → copper deposition line → lower plate → leaching% diluted H2SO4 → thickened copper

Fifthly, pattern transfer:

The purpose is as follows: transferring the customer's pattern to the copper surface of the copper-clad plate

The process comprises the following steps: chemical pretreatment, plaster, dry film, exposure and development etching

Sixthly, pattern electroplating purpose: the pattern electroplating is to electroplate a copper layer with required thickness and a gold nickel or tin layer with required thickness on the exposed copper sheet or the hole wall of the circuit pattern.

the process comprises the following steps: upper plate → degreasing → washing twice → microetching → washing → acid washing → copper plating → washing → pickling → tin plating → washing → lower plate

Seventh, etching

The purpose is as follows: the etching is to etch the copper layer at the non-circuit part by chemical reaction.

Eight, green oil

The purpose is as follows: the green oil transfers the pattern of the green oil film to the board, and plays the role of protecting the circuit and preventing tin on the circuit when welding parts

The process comprises the following steps: grinding plate → printing photosensitive green oil → cramping plate → exposing → developing; grinding board → printing the first side → baking board → printing the second side → baking board

nine, character

The purpose is as follows: the character being a mark provided for easy recognition

the process comprises the following steps: after the final curium of the green oil → cooling and standing → screen adjustment → character printing → post curium

Ten, gold-plated finger

The purpose is as follows: plating a layer of nickel/gold layer with required thickness on the plug finger to ensure that the plug finger has hardness and wear resistance

The process comprises the following steps: upper plate → degreasing → washing twice → microetching → washing twice → pickling → copper plating → washing → nickel → washing → gold plating

Tin plate (parallel a technology)

The purpose is as follows: the tin spraying is to spray a layer of lead tin on the exposed copper surface which is not covered with solder resist oil so as to protect the copper surface from corrosion and oxidation and ensure good welding performance.

the process comprises the following steps: microetching → air drying → preheating → rosin coating → solder coating → hot air smoothing → air cooling → washing and air drying

Eleven, forming

The purpose is as follows: method for gong forming required by customer by die stamping or numerical control gong machine gong

description of the drawings: the accuracy of the data gong machine plate and the beer plate is high, and secondly, the hand gong machine plate can only be made into some simple shapes at the lowest.

Twelve, test

the purpose is as follows: through an electronic 100% test, defects which are difficult to be found visually, such as open circuit, short circuit and the like, and influence functionality are detected.

The process comprises the following steps: top mold → place of plate → test → pass → FQC visual inspection → fail → repair → return test → OK → REJ → scrap

Thirteen, final inspection

the purpose is as follows: the appearance defects of the plate are inspected by 100% eyes, and minor defects are repaired, so that the defective plate is prevented from flowing out.

the specific working process is as follows: incoming material → view data → visual inspection → qualified → FQA spot inspection → qualified → packaging → unqualified → processing → inspection OK

Disclosure of Invention

the invention aims to overcome the defect that signals of through hole conductors are damaged in the prior art, and provides a vertical conductor PCB and a processing method thereof, wherein the wiring density of the PCB is improved by more than 2 times compared with that of the PCB with traditional holes under the condition of the same area. The processing method of the invention does not have holes, and the width of the line can be consistent with that of the vertical conductor, thereby having no signal loss of the via hole.

The vertical conductor PCB comprises a primary groove, a bottom groove and a plurality of crossed grooves, wherein the primary groove is arranged in the PCB, the bottom groove is arranged at the bottom of the primary groove, the plurality of crossed grooves are arranged on two sides of the primary groove, and a copper layer is arranged on the wall of the primary groove.

Further, the crossing grooves and the bottom grooves have the same depth and are communicated with each other.

furthermore, a copper layer is arranged on the wall of the primary groove.

furthermore, resin layers are arranged in the primary groove, the bottom groove and the cross groove.

the invention relates to a vertical conductor PCB processing method, which comprises the following steps:

S1: after the material is sent out, making and detecting inner layer patterns of the PCB, and then pressing the PCB;

S2: manufacturing a primary groove on the PCB;

S3: uniformly depositing copper and electroplating on the wall and the bottom of the primary tank to form a copper layer;

s4: removing the copper layer at the bottom of the primary groove to form a bottom groove;

S5: manufacturing a plurality of crossed grooves on the wall of the primary groove, wherein the copper layers on the wall of the primary groove are separated by the plurality of crossed grooves to form a plurality of vertical conductors, and the depth of the crossed grooves is the same as that of the bottom groove and the crossed grooves are communicated with each other;

s6: blocking resin in the primary groove, the bottom groove and the cross groove, and polishing off redundant resin on the surface;

S7: coating green oil after the outer layer graph of the PCB is manufactured, and then air-drying to remove impurities;

further, the step S2 includes taking out the burrs and the scum in the primary groove.

the invention has the following beneficial effects:

Through setting up the first groove, the inslot sinks copper to electroplate, forms perpendicular conductor with kerve and crossing groove cooperation, has replaced the through-hole conductor, has avoided the problem of via hole signal loss, and perpendicular conductor face does not have the radian than the pore wall, so the circuit board no longer has the interference of via hole impedance at the transmission signal in-process to also have lower signal loss.

Drawings

FIG. 1 is a schematic view of a fishing initial trough of the present invention;

FIG. 2 is a schematic diagram of the copper deposition electroplating in the initial fishing tank of the invention;

FIG. 3 is a schematic view of a drag well and a cross well of the present invention;

FIG. 4 is a schematic representation of the present invention after resin plugging of the drag out bottom tank and the crossover tank;

FIG. 5 is a side view of the fishing starter groove of the present invention;

FIG. 6 is a side view of a drag well and a cross well of the present invention;

FIG. 7 is a schematic representation of the finished invention;

FIG. 8 is a flow chart of a process of the present invention;

FIG. 9 is a flow chart of the process of the present invention.

Reference numerals:

The copper-clad plate comprises an initial groove 1, a bottom groove 2, a cross groove 3, a copper layer 4, a resin layer 5 and a PCB 6.

Detailed Description

The invention is further described below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.

As shown in fig. 1-7, the vertical conductor PCB of the present invention includes a primary groove 1, a bottom groove 2 and a plurality of cross grooves 3, wherein the primary groove 1 extends to about 0.1mm below a target layer from the surface of the PCB, the bottom groove 2 is disposed at the bottom of the primary groove 1, the plurality of cross grooves 3 are distributed at two sides of the primary groove 1, the bottom of the primary groove is communicated with the bottom of the bottom groove to the same depth, and the bottom groove 2 is in cross communication with the cross grooves 3.

The wall of the primary groove 1 is provided with a copper layer 4 to form a vertical conductor. Resin layers 5 are arranged in the primary tank 1, the bottom tank 2 and the cross tank 3. As shown in fig. 8-9, a vertical conductor PCB processing method includes the following steps:

s1: after the material is sent out, the inner layer graph of the PCB 6 is manufactured and detected, and then the PCB 6 is pressed;

S2: drilling or fishing a PCB (printed Circuit Board) and other mechanical modes to form a primary groove 1;

S3: uniformly depositing copper and electroplating on the wall and the bottom of the primary tank 1;

S4: removing the copper layer 4 at the bottom of the primary groove 1 by drilling, fishing or laser and the like to form a bottom groove 2;

S5: removing part of the copper layer 4 on the wall of the initial groove 1 by adopting a mechanical method such as drilling or fishing and the like to form a plurality of cross grooves 3, separating the copper layer 4 on the wall of the initial groove 1 by the plurality of cross grooves 3 to form a plurality of vertical conductors, wherein the depth of each cross groove 3 is the same as that of the bottom groove 2, and the cross grooves 3 are communicated with each other;

S6: blocking resin, namely blocking the resin in the primary groove 1, the bottom groove 2 and the cross groove 3, and polishing off the redundant resin on the surface;

S7: coating green oil on the outer layer of the PCB after the outer layer of the PCB is manufactured, then performing surface treatment, and then air-drying to remove impurities;

s8: and (5) final inspection.

Specifically, the manufacturing of the inner layer patterns is also detected from the first step of material sending, then the PCB is pressed, then a primary groove 1 is formed in a drilling or fishing mode, then deburring is carried out in the groove, the glue residue is removed, copper deposition and electroplating are carried out in the primary groove, then bottom copper is drilled or fished out at the groove bottom of the primary groove 1 to form a bottom groove 2, a plurality of crossed grooves are formed at two sides of the primary groove in a drilling or fishing mechanical mode, the bottoms of the crossed grooves are communicated with the bottoms of the bottom grooves and are equal in depth, deburring is carried out in the groove, the groove is blocked by resin, redundant resin on the surface is ground, the resin blocking groove can be uniformly carried out after the primary groove 1, the bottom groove 2 and the crossed groove 3 are manufactured, the first time is blocked after the primary groove 1 is electroplated, and the second time is blocked after the crossed groove 3 and the bottom groove 2 are manufactured. And then making an outer layer pattern, coating green oil, performing surface treatment to form a plurality of formed small units, and finally performing final inspection.

The thickness of the PCB and the depths of the primary groove 1, the bottom groove 2 and the cross groove 3 are adjusted according to requirements, generally, the thickness of the PCB is 3mm, the depth of the primary groove 1 is 2mm, the depth of the bottom groove is 2.1mm, and the depth of the cross groove is 2.1 mm.

After the primary groove 1 is electroplated, the inner layers can be communicated with each other through the copper layers 4 of the groove walls, the bottom groove 2 can cut off the copper at the bottom of the primary groove 1, so that the copper layers 4 at two sides of the primary groove 1 form two-sided independent copper walls, and after the crossed groove 3 is manufactured, the independent copper wall surfaces are cut into a plurality of copper wall surfaces, namely the vertical conductor columns.

the above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.