阅读说明：本技术 用于调准硅片的清洗设备中的氮气吹送管路的装置及方法 (Device and method for adjusting nitrogen gas blowing pipeline in silicon wafer cleaning equipment ) 是由 马科宁 于 2021-07-22 设计创作，主要内容包括：本发明实施例公开了一种用于调准硅片的清洗设备中的氮气吹送管路的装置及方法,所述装置包括：盘体,所述盘体具有与所述硅片相同的形状,使得所述盘体能够以与所述硅片相同的方式被卡夹在所述清洗设备中；倾斜地设置在所述盘体上的定位杆,所述定位杆形成有沿着所述定位杆的纵向方向延伸并且适于所述氮气吹送管路插入的直线型的孔道,所述孔道的纵向轴线沿着所述氮气吹送管路的插入方向延伸经过所述盘体的上表面的中心；固定件,所述固定件用于在所述氮气吹送管路的未插入到所述孔道中的固定点处将所述氮气吹送管路固定至所述清洗设备。(The embodiment of the invention discloses a device and a method for adjusting a nitrogen blowing pipeline in cleaning equipment of a silicon wafer, wherein the device comprises the following components: a tray body having the same shape as the silicon wafer so that the tray body can be chucked in the cleaning apparatus in the same manner as the silicon wafer; a positioning rod obliquely provided on the tray body, the positioning rod being formed with a linear-type hole passage extending in a longitudinal direction of the positioning rod and adapted for insertion of the nitrogen gas blowing pipe, a longitudinal axis of the hole passage extending through a center of an upper surface of the tray body in an insertion direction of the nitrogen gas blowing pipe; a fixing member for fixing the nitrogen gas blowing line to the cleaning apparatus at a fixing point of the nitrogen gas blowing line that is not inserted into the hole.)

1. An apparatus for aligning a nitrogen gas blowing line in a cleaning apparatus for a silicon wafer, the apparatus comprising:

a tray body having the same shape as the silicon wafer so that the tray body can be chucked in the cleaning apparatus in the same manner as the silicon wafer;

a positioning rod obliquely provided on the tray body, the positioning rod being formed with a linear-type hole passage extending in a longitudinal direction of the positioning rod and adapted for insertion of the nitrogen gas blowing pipe, a longitudinal axis of the hole passage extending through a center of an upper surface of the tray body in an insertion direction of the nitrogen gas blowing pipe;

a fixing member for fixing the nitrogen gas blowing line to the cleaning apparatus at a fixing point of the nitrogen gas blowing line that is not inserted into the hole.

2. The apparatus of claim 1, further comprising a fixing block provided on the tray body, the fixing block being formed with a through hole in which the positioning rod is fitted.

3. The apparatus according to claim 2, wherein the fixing block is formed with a screw hole in a direction perpendicular to the through hole, and an outer circumferential surface of the positioning rod is formed with a notch, so that the positioning rod can be fixed to the fixing block by screwing a screw into the screw hole and fitting with the notch.

4. The apparatus according to claim 2 or 3, wherein the fixing block is provided in the tray at a position closer to a radial center of the tray than an end of a nitrogen gas blowing line inserted into the hole, the positioning rod is movable in the through hole toward the tray in a direction of a longitudinal axis of the hole, and a movable distance of the positioning rod is larger than a length of the nitrogen gas blowing line inserted into the hole.

5. The device of claim 4 wherein the mounting block is removably disposed on the tray.

6. The device of claim 5 further comprising a catch integrally formed with the anchor block, the catch including a catch portion that engages a periphery of the disc to position the anchor block relative to the disc.

7. The apparatus of claim 1 wherein the nitrogen purge line is inserted into the hole for a length of not less than one third of the radius of the disk.

8. The apparatus of claim 1 wherein the length of the nitrogen purge line from the fixed point to the distal end is no more than one-half of the radius of the disk.

9. The device of claim 1 wherein the tray body is made of a PEEK material.

10. A method for aligning a nitrogen gas blowing line in a silicon wafer cleaning apparatus, which is applied to the device according to claim 4, characterized by comprising:

s701: clamping the device on the cleaning equipment by using the tray body;

s702: inserting the nitrogen pipeline into the pore channel of the positioning rod;

s703: fixing the nitrogen gas blowing line to the purge device at a fixing point of the nitrogen gas blowing line that is not inserted into the hole;

s704: moving the positioning rod in the through hole toward the disk body by a distance greater than a length of the nitrogen gas blowing pipe inserted into the hole;

s705: removing the tray body and the securing block and the locating rod from the cleaning apparatus.

Technical Field

The invention relates to the technical field of semiconductor production, in particular to a device and a method for adjusting a nitrogen blowing pipeline in cleaning equipment for silicon wafers.

Background

In the production process of semiconductor silicon wafers, silicon wafers are often cleaned by using silicon wafer cleaning equipment, for example, polishing agent remaining on the surfaces of the silicon wafers is cleaned after the silicon wafers are polished. Specifically, in the process of cleaning the silicon wafer, the mechanical arm grabs the silicon wafer to be cleaned and places the silicon wafer on a chuck of the cleaning equipment, the chuck pin fixes the silicon wafer to the chuck, the cleaning agent supply pipeline supplies cleaning agents such as hydrogen fluoride solution, ozone water and ultrapure water to the surface of the silicon wafer rotating along with the chuck so as to clean the silicon wafer, and in addition, a cylindrical cleaning cover is further arranged on the periphery of the chuck so as to restrict the flow of the cleaning solution.

After the cleaning operation of the silicon wafer is completed, nitrogen gas is generally blown on the surface of the silicon wafer by using a nitrogen gas blowing pipeline to blow and dry the cleaning solution remained on the surface of the silicon wafer. Specifically, the nitrogen gas blowing line is fixed to the wafer cleaning apparatus at a fixing point, such as an upper edge of the cleaning hood, from which the nitrogen gas blowing line extends toward the center of the wafer in a suspended manner for a certain distance to blow nitrogen gas toward the wafer. The requirements for the direction and angle of the suspended portion of the nitrogen gas blowing line are high so that the nitrogen gas jetted from the outlet of the nitrogen gas blowing line can directly reach the center of the silicon wafer in order to dry the surface of the silicon wafer in an efficient manner while the silicon wafer is rotated together with the chuck.

In the process of maintaining the silicon wafer cleaning equipment or in the process of placing the silicon wafer on the chuck or taking the silicon wafer away from the chuck by using the mechanical arm, the nitrogen blowing pipeline suspended from the fixed point may be touched, and the nitrogen blowing pipeline is flexible and can deform and cannot recover after being touched, so that the deformed nitrogen blowing pipeline cannot blow nitrogen to the center of the silicon wafer, and the nitrogen blowing time is usually short, about 10 seconds, so that the drying of the whole silicon wafer surface cannot be completed in the case, or a part of the silicon wafer surface is not dried, so that the pollution on the silicon wafer surface exceeds the standard, and the silicon wafer qualification rate is influenced.

Disclosure of Invention

In order to solve the above technical problems, embodiments of the present invention desirably provide an apparatus and a method for adjusting a nitrogen gas blowing line in a silicon wafer cleaning apparatus, in which the nitrogen gas blowing line is deformed by being touched by mistake, and thus nitrogen gas cannot be blown to the center of a silicon wafer in the cleaning apparatus accurately, the nitrogen gas blowing line may be re-adjusted, so that nitrogen gas ejected from an outlet of the nitrogen gas blowing line may directly reach the center of the silicon wafer, thereby drying the surface of the silicon wafer in an efficient manner and preventing the yield of the silicon wafer from being affected.

The technical scheme of the invention is realized as follows:

in a first aspect, an embodiment of the present invention provides an apparatus for aligning a nitrogen gas blowing line in a silicon wafer cleaning apparatus, the apparatus including:

a tray body having the same shape as the silicon wafer so that the tray body can be chucked in the cleaning apparatus in the same manner as the silicon wafer;

a positioning rod obliquely provided on the tray body, the positioning rod being formed with a linear-type hole passage extending in a longitudinal direction of the positioning rod and adapted for insertion of the nitrogen gas blowing pipe, a longitudinal axis of the hole passage extending through a center of an upper surface of the tray body in an insertion direction of the nitrogen gas blowing pipe;

a fixing member for fixing the nitrogen gas blowing line to the cleaning apparatus at a fixing point of the nitrogen gas blowing line that is not inserted into the hole.

In a second aspect, an embodiment of the present invention provides a method for aligning a nitrogen gas blowing line in a cleaning apparatus for a silicon wafer, the method being applied to an apparatus provided in an embodiment of the present invention, the method including:

s701: clamping the device on the cleaning equipment by using the tray body;

s702: inserting the nitrogen pipeline into the pore channel of the positioning rod;

s703: fixing the nitrogen gas blowing line to the purge device at a fixing point of the nitrogen gas blowing line that is not inserted into the hole;

s704: moving the positioning rod in the through hole toward the disk body by a distance greater than a length of the nitrogen gas blowing pipe inserted into the hole;

s705: removing the tray body and the securing block and the locating rod from the cleaning apparatus.

The embodiment of the invention provides a device and a method for adjusting a nitrogen gas blowing pipeline in a silicon wafer cleaning device, wherein a pore channel is linear, so that after the nitrogen gas blowing pipeline is inserted into the pore channel of a positioning rod, the inserted part, namely the end part of the nitrogen gas blowing pipeline, is shaped into the linear shape, which is beneficial to accurately controlling the flow direction of the conveyed nitrogen gas.

Drawings

FIG. 1 is a schematic view of an apparatus for cleaning a silicon wafer;

FIG. 2 is a schematic view of an apparatus for aligning a nitrogen gas blowing line in a cleaning apparatus for a silicon wafer according to an embodiment of the present invention;

FIG. 3 is a schematic view of an apparatus for aligning a nitrogen gas blowing line in a cleaning apparatus for a silicon wafer according to another embodiment of the present invention;

FIG. 4 is a schematic view of an apparatus for aligning a nitrogen gas blowing line in a cleaning apparatus for a silicon wafer according to another embodiment of the present invention;

FIG. 5 is a schematic view of an apparatus for aligning a nitrogen gas blowing line in a cleaning apparatus for a silicon wafer according to another embodiment of the present invention;

FIG. 6 is a schematic view of an apparatus for aligning a nitrogen gas blowing line in a cleaning apparatus for a silicon wafer according to another embodiment of the present invention;

fig. 7 is a schematic view of a method for aligning a nitrogen gas blowing line in a cleaning apparatus for a silicon wafer according to an embodiment of the present invention.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

FIG. 1 shows a cleaning apparatus CA for cleaning a wafer W. The cleaning apparatus CA as shown in fig. 1 may include: a chuck CH for carrying a wafer W, as shown by the diagonally shaded area intentionally for clarity in FIG. 1; a plurality of chuck pins CP for fixing the silicon wafer W to the chuck CH, wherein six chuck pins are exemplarily shown in fig. 1; a cleaning liquid conveying pipeline CL for conveying a cleaning liquid to the silicon wafer W; a cylindrical cleaning cover CS provided on the periphery of the chuck CH to restrict the flow of the cleaning liquid; and a nitrogen gas blowing line L for blowing nitrogen gas to the center of the wafer W after the wafer W is cleaned to dry the wafer W.

As shown in fig. 1, the nitrogen gas blowing line L may be fixed to the upper edge of the cleaning cap CS at a fixing point LP, and a portion from the fixing point LP to the end of the nitrogen gas blowing line L is suspended, so that the suspended portion is deformed when touched, and the suspended portion is not restored after being deformed due to the flexibility of the nitrogen gas blowing line L, so that nitrogen gas cannot be blown to the center of the silicon wafer W, and the entire silicon wafer W cannot be dried in the case where the silicon wafer W rotates together with the chuck CH.

Based on this, an embodiment of the present invention provides an apparatus 1 for aligning a nitrogen gas blowing line L in a cleaning apparatus CA for a silicon wafer W as shown in fig. 1, and referring to fig. 2, the apparatus 1 may include:

a tray 10 having the same shape as the wafer W as shown in fig. 1 such that the tray 10 can be chucked in the cleaning apparatus CA in the same manner as the wafer W, for example, as can be understood in conjunction with fig. 1 and shown in fig. 2, the tray 10 may be carried on a chuck CH of the cleaning apparatus CA and fixed to the chuck CH by six chuck pins CP;

a positioning rod 20 obliquely arranged on the puck 10, the positioning rod 20 being formed with a rectilinear duct 21 extending in the longitudinal direction of the positioning rod 20 and adapted for insertion of the nitrogen gas blowing lines L (shown in fig. 2 by grid-shaded areas for clarity), as schematically shown in fig. 2 by dashed lines inside the positioning rod 20, a longitudinal axis 21X of the duct 21 extending in the insertion direction D of the nitrogen gas blowing lines L through a center 11C of the upper surface 11 of the puck 10, as schematically shown in fig. 2 by crosses, where for the arrangement of the positioning rod 20, for example, the positioning rod 20 may be formed integrally with the puck 10, or may be arranged on the puck 10 by other means as described in detail below;

a fixing member 30 as schematically shown in fig. 2, the fixing member 30 for fixing the nitrogen gas blowing line L to the cleaning apparatus CA at a fixing point LP of the nitrogen gas blowing line L that is not inserted into the porthole 21, as shown in fig. 2, the fixing point LP may be a point of the nitrogen gas blowing line L that contacts an upper edge of the cylindrical cleaning hood CS, as schematically shown in fig. 2 by a black shaded area in the nitrogen gas blowing line L, and the nitrogen gas blowing line L is also specifically fixed to the upper edge of the cleaning hood CS of the cleaning apparatus CA by the fixing member 30.

Since the port 21 is linear, after the nitrogen gas blowing line L is inserted into the port 21 of the registration lever 20, the inserted portion, i.e., the end portion of the nitrogen gas blowing line L, is shaped linear, which is advantageous for accurately controlling the flow direction of the transferred nitrogen gas, and further, since the longitudinal axis 21X of the port 21 passes through the center 11C of the upper surface 11 of the tray body 10, the nitrogen gas transferred through the nitrogen gas blowing line L inserted into the port 21 via the end portion can directly reach the center 11C of the upper surface 11 of the tray body 10 by inertia, and in the case of chucking the silicon wafer W in the cleaning apparatus CA, the center of the upper surface of the silicon wafer W.

The tray 10 and the spacer 20 may be integrally formed as described above, but in this case, since the tray 10 and the spacer 20 together constitute an irregular structure, it is difficult for the device 1 to be manufactured. In view of this, in a preferred embodiment of the present invention, referring to fig. 3, the device 1 further includes a fixing block 40 provided on the tray 10, the fixing block 40 being formed with a through hole 41, the positioning rod 20 being fitted in the through hole 41. The formation of the through hole 41 in the fixing block 40 is easy, for example by simple drilling, and moreover the fitting of the rod-like member in the through hole is also easy, thereby facilitating the production and manufacture of the device 1.

In a specific implementation of fitting the positioning rod 20 into the through-hole 41 of the fixing block 40, referring to fig. 4, the fixing block 40 is formed with a threaded hole 42 in a direction perpendicular to the through-hole 41, and the outer circumferential surface 20S of the positioning rod 20 is formed with a notch 22, so that the positioning rod 20 can be fixed to the fixing block 40 by screwing a screw S into the threaded hole 42 in a direction shown by a straight arrow in fig. 4 and fitting with the notch 22.

Referring to FIG. 2, it can be understood that after the nitrogen gas blowing lines L are aligned using the apparatus 1 according to the present invention, the tray 10 and the positioning rods 20 provided on the tray 10 are also removed from the cleaning apparatus CA to enable the silicon wafer W to be chucked in the cleaning apparatus CA for cleaning and drying the silicon wafer W. During the removal of the disk 10 and the positioning rod 20, it is necessary to ensure that any interference is not generated with respect to the portion of the nitrogen gas blowing line L from the fixing point LP to the end to prevent the portion from being deformed, so that the nitrogen gas cannot be directly injected to the center of the wafer W. In the case shown in fig. 2, the disk body 10, the positioning rod 20, the chuck CH, and the chuck pin CP are required to be moved together rightward and downward relative to the purge hood CS in the direction of the longitudinal axis 21X of the port 21 to ensure that no interference occurs with the nitrogen gas blowing line L, and it is obviously difficult to achieve such movement. In view of this, in the preferred embodiment of the present invention, referring to fig. 5, in the case where the device 1 includes the fixing block 40, the fixing block 40 is provided in the tray 10 at a position closer to the radial center of the tray 10 or to the center 11C of the upper surface 11 of the tray 10 as shown in fig. 5 than the tip LT of the nitrogen gas blowing line L inserted into the porthole 21, the positioning rod 20 is movable in the through hole 41 toward the tray 10 in the direction of the longitudinal axis 21X of the porthole 21 as shown by the black arrow in fig. 5, and the movable distance MD of the positioning rod 20 (the distance between the end of the positioning rod 20 and the center 11C of the upper surface 11 of the tray 10 as shown in fig. 5) is greater than the length L1 of the nitrogen gas blowing line L inserted into the porthole 21. Thus, by moving the jumper 20, the nitrogen gas blowing line L can be made in a state of not being inserted into the tunnel 21, and the tray 10, the fixed block 40, and the jumper 20 can be removed from the cleaning apparatus CA only by moving the tray body 10 relative to the chuck CH, for example, in the horizontal direction away from the nitrogen gas blowing line L.

In order to facilitate the verification of the alignment of the nitrogen gas blowing line L, it is desirable that the tray 10 of the device 1 is still caught in the cleaning apparatus CA, and the fixing block 40 and the positioning rod 20 are removed from the cleaning apparatus CA, as can be understood with reference to fig. 5, and therefore, in the preferred embodiment of the present invention, the fixing block 40 is detachably provided on the tray 10. In this way, it is possible to check whether the nitrogen gas blowing lines L are aligned, and specifically, for example, it is possible to spray liquid on the upper surface 11 of the tray body 10, then normally supply nitrogen gas through the nitrogen gas blowing lines L and rotate the tray body 10 together with the chucks CH, stop supplying nitrogen gas and stop rotating the chucks CH after, for example, 10 seconds, and if the liquid sprayed on the upper surface 11 of the tray body 10 can be blow-dried, it is indicated that the nitrogen gas blowing lines L have been aligned.

For the implementation of detachably disposing the fixed block 40 on the tray 10, in a preferred embodiment of the present invention, referring to fig. 6, the device 1 further includes a latch 50 integrally formed with the fixed block 40, and the latch 50 includes a latch portion 51 cooperating with a peripheral edge of the tray 10 to position the fixed block 40 relative to the tray 10. The fixing block 40 is thus disposed in such a manner as not to have any influence on the upper surface 11 of the tray body 10, nor on the above-described detection result.

In order to achieve more accurate positioning of the nitrogen gas blowing line L, in the preferred embodiment of the present invention, referring to fig. 5, the length L1 of the nitrogen gas blowing line L inserted into the hole 21 is not less than one third of the radius of the tray body 10.

Since the tray 10, the positioning rod 20, and possibly the fixing block 40 and the snaps 50 are all required to be removed from the cleaning apparatus CA during the nitrogen gas blowing line L blows the nitrogen gas to dry the silicon wafers W as described above, so that the portion of the nitrogen gas blowing line L from the fixing point LP to the end LT is in a suspended state as can be understood with reference to fig. 2, in order that the portion is not deformed by gravity, in a preferred embodiment of the present invention, the length L2 of the nitrogen gas blowing line L from the fixing point LP to the end LT is not more than one-half of the radius of the tray 10 with reference to fig. 2.

Preferably, the tray 10 is made of PEEK material.

Referring to fig. 7, an embodiment of the present invention also provides a method for aligning a nitrogen gas blowing line L in a cleaning apparatus CA for silicon wafers W, which is applied to the apparatus 1 as shown in fig. 5, and which may include:

s701: clamping the device 1 on the cleaning apparatus CA using the tray 10;

s702: inserting the nitrogen line into the bore 21 of the locating rod 20;

s703: fixing the nitrogen gas blowing line L to the purge apparatus CA at a fixing point LP of the nitrogen gas blowing line L which is not inserted into the porthole 21;

s704: moving the positioning rod 20 in the through hole 41 toward the tray 10 by a distance greater than the length of the nitrogen gas blowing line L inserted into the hole 21;

s705: the tray 10 and the fixing block 40 and the positioning rod 20 are removed from the cleaning apparatus CA.

It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.