阅读说明：本技术 用于基板支撑件的非接触式温度校正工具和使用所述温度校正工具的方法 (Non-contact temperature correction tool for substrate support and method of using the same ) 是由 尼拉日·曼吉特 拉拉·霍里切克 梅兰·贝哈特 迪特里希·盖奇 克里斯托弗·道 平·阮 迈 于 2018-03-09 设计创作，主要内容包括：本公开的实施方式涉及：用于测量温度的方法和一种用于校正在处理腔室中的基板支撑件的温度控制而不与所述基板支撑件的表面相接触的工具。在一个实施方式中,具有温度传感器的测试夹具可移除地被安装至所述处理腔室的腔室主体的上表面,以使得所述温度传感器具有视场,所述视场包含所述基板支撑件的与被设置在所述基板支撑件中的电阻性线圈相邻的区域。所述基板支撑件的所述区域的一或多个校正温度测量由所述温度传感器来获取并且对应于每一校正温度测量的所述电阻性线圈的一或多个校正电阻测量被同时地获取。被设置在所述基板支撑件中的加热元件的温度控制基于所述校正温度测量和所述校正电阻测量来校正。(embodiments of the present disclosure relate to: methods for measuring temperature and a tool for correcting temperature control of a substrate support in a processing chamber without contacting a surface of the substrate support. In one embodiment, a test fixture having a temperature sensor is removably mounted to an upper surface of a chamber body of the process chamber such that the temperature sensor has a field of view encompassing an area of the substrate support adjacent to a resistive coil disposed in the substrate support. One or more correction temperature measurements of the area of the substrate support are acquired by the temperature sensor and one or more correction resistance measurements of the resistive coil corresponding to each correction temperature measurement are acquired simultaneously. Temperature control of a heating element disposed in the substrate support is corrected based on the corrected temperature measurement and the corrected resistance measurement.)

1. A method of measuring temperature in a processing chamber, comprising:

Removably mounting a test fixture to an upper surface of a chamber body of the process chamber, the test fixture having a first temperature sensor having a field of view that includes a first region of a first substrate support adjacent a first resistive coil disposed in the first substrate support of the process chamber;

Obtaining one or more temperature measurements of the first region of the first substrate support with the first temperature sensor and simultaneously obtaining one or more correction resistance measurements of the first resistive coil corresponding to each temperature measurement; and

correcting control of a heating element disposed in the first substrate support based on the measured temperature of the first substrate support and the measured correction resistance of the first resistive coil disposed in the first substrate support.

2. The method of claim 1, further comprising the steps of:

Removing the test fixture; and

The lid of the process chamber is closed.

3. The method of claim 1, wherein obtaining one or more temperature measurements of the first region of the first substrate support and simultaneously obtaining one or more corrective resistance measurements of the first resistive coil further comprises:

Obtaining a plurality of temperature measurements and corrected resistance measurements;

Determining a plurality of resistance parameters, each resistance parameter based on a relationship between the measured temperature of the first substrate support and the measured corrected resistance of the first resistive coil disposed in the first substrate support and representing a relationship between an actual temperature and a measured resistance of the first resistive coil.

4. The method of claim 3, further comprising the step of:

Measuring a resistance of the first resistive coil while processing a substrate on the first substrate support; and

Determining a temperature of the first substrate support based on the first resistance parameter and the measured resistance of the first resistive coil disposed in the first substrate support.

5. The method of claim 1, further comprising the steps of:

Correcting control of a heating element disposed in a second substrate support located in the process chamber based on the measured temperature of the second substrate support and the measured correction resistance of a second resistive coil disposed in a second substrate.

6. The method of claim 5, wherein the step of correcting control of a heating element disposed in the second substrate support comprises the steps of:

Obtaining one or more temperature measurements of a first area of the second substrate support with a second temperature sensor fixed to the test fixture and simultaneously obtaining one or more corrective resistance measurements corresponding to the one or more temperature measurements for the second resistive coil disposed in the second substrate support.

7. the method of claim 5, wherein correcting control of heating elements disposed in the first and second substrate supports is performed simultaneously.

8. The method of claim 7, further comprising the steps of:

Increasing the temperature of the first substrate support relative to the second substrate support to infer which of the first temperature sensor and the second temperature sensor is associated with each of the first substrate support and the second substrate support.

9. The method of claim 3, wherein the resistance parameter is representable as a best fit graphical line of a relationship between the measured temperature of the first substrate and the measured corrected resistance of the first resistive coil disposed in the first substrate support.

10. A test fixture for measuring temperature in a processing chamber, comprising:

a cover plate sized to cover an upper surface of a chamber body of the process chamber when a lid of the process chamber is open;

One or more cooling channels in thermal contact with the cover plate;

A first opening and a second opening formed through the cover plate; and

A first non-contact temperature sensor mounted over the first opening and a second non-contact temperature sensor mounted over the second opening, the first and second non-contact temperature sensors configured to measure a temperature of a surface below the cover plate through the opening of the cover plate.

11. The test fixture of claim 10, wherein the cover plate further comprises:

A plurality of handles.

12. The test fixture of claim 10, wherein the cover plate is made of aluminum.

13. The test fixture of claim 10, further comprising:

A first bracket separating the first non-contact temperature sensor above the first opening, and a second bracket separating the second non-contact temperature sensor above the second opening.

14. The test fixture of claim 10, wherein each of the first opening and the second opening further comprises:

A quartz window.

15. the test fixture of claim 10, further comprising:

a plastic cover disposed over the cover plate.

description of the Prior Art

during the performance of temperature sensitive semiconductor processes, such as annealing, the temperature of a semiconductor substrate is continuously measured as the substrate is processed in a processing chamber. Existing solutions for measuring the temperature of a semiconductor substrate involve correcting the temperature control of a heating element disposed within a substrate support on which the substrate is processed while contacting the substrate or a surface of the substrate support. Such solutions may result in: contaminants are introduced into the processing chamber. For example, one of the solutions for calibrating the heating element is: a calibration substrate with some thermocouples was used. However, copper within the thermocouple may undesirably be introduced into the chamber as a contaminant. While there may be temporary weight solutions for reducing the risk of having contaminants, the use of thermocouples on the calibration substrate is generally undesirable.

Another existing solution for measuring the temperature of a semiconductor substrate or substrate support involves: use of a spring loaded thermocouple. However, it has been found that spring-loaded thermocouples have poor or inconsistent contact with the substrate or substrate support, thus producing inaccurate temperature measurements.

Thus, there is a need for improved methods for measuring temperature and improved apparatuses for correcting temperature control of a substrate support.

Disclosure of Invention

Embodiments of the present disclosure relate generally to: methods for measuring temperature and a tool for correcting temperature control of a substrate support in a processing chamber without contacting a surface of the substrate support. In one embodiment, a method for measuring a temperature of a first substrate support disposed in a process chamber is disclosed. A test fixture having a first temperature sensor is removably mounted to an upper surface of a chamber body of the process chamber such that the first temperature sensor mounted to the test fixture has a field of view that encompasses a first region of the first substrate support adjacent a first resistive coil disposed in the first substrate support. One or more correction temperature measurements of the first region of the first substrate support are acquired by the first temperature sensor and one or more correction resistance measurements of the first resistive coil corresponding to each correction temperature measurement are acquired simultaneously. Temperature control of a first heating element disposed in the first substrate support is corrected based on the corrected temperature measurement and the corrected resistance measurement.

another embodiment of the present disclosure provides: a test fixture for measuring a temperature of a substrate support disposed in a processing chamber. The test fixture includes: a cover plate, one or more cooling channels in thermal contact with the cover plate, a first opening and a second opening formed through the cover plate, and a first non-contact temperature sensor mounted over the first opening and a second non-contact temperature sensor mounted over the second opening such that the first non-contact temperature sensor and the second non-contact temperature sensor are configured to measure a temperature of a surface below the cover plate through the opening of the cover plate. The cover plate is sized to: covering an upper surface of a chamber body of the process chamber when a lid of the process chamber is open.

Drawings

so that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. However, it should be noted that: the drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of the scope of the disclosure (as the disclosure may admit to other equally effective embodiments).

Figure 1 is a schematic representation of a front view of a process chamber having a test fixture mounted thereon for measuring a temperature of a substrate support disposed in the process chamber.

FIG. 2 is a schematic representation of a side view of the process chamber with the test fixture mounted thereon.

FIG. 3 is a top view of one embodiment of a cover plate of the test fixture.

Figure 4 is a flow chart of a method for measuring a temperature of a substrate support in a processing chamber without contacting a surface of the substrate support.

figure 5 is a flow chart of a method for simultaneously measuring the temperature of two substrate supports disposed in a processing chamber.

To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. Consider that: elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

Detailed Description

Embodiments of the present disclosure relate generally to: methods and tools for correcting temperature measurements of a substrate support in a processing chamber without contacting a surface of the substrate support. In particular, a temperature sensor, such as (but not limited to): a pyrometer, is used to correct the measurement of temperature. The pyrometer allows the measurement of temperature without contact with the substrate support (even at low temperatures), thus reducing any risk of contamination while maintaining the accuracy and precision of the measurement. The measurements are then utilized to correct control of a heating element disposed in the substrate support. While a pyrometer is selected as the temperature sensor in the particular embodiments described in this disclosure, it is understood that: other non-contact temperature sensors (such as infrared thermometers, infrared scanning systems, infrared thermographs, and the like) may also be selected. The underlying principles of the methods and tools described in this disclosure may be adapted to correct: a variety of heating elements embedded in the substrate support.

Figure 1 is a schematic representation of a front view of a test fixture 110 disposed on a processing chamber 100 for measuring a temperature of a substrate support disposed in the processing chamber. Although the processing chamber 100 is illustrated as having two substrate supports 150a, 150b, it is contemplated that: the test fixture 110 may be adapted to measure the temperature of any number of substrate supports that may be disposed within the chamber 100 without contacting the surface of the substrate support. The processing chamber 100 may be configured to perform semiconductor fabrication processes, such as etching, implantation, annealing, deposition, and plasma processing of materials on a substrate. In the embodiment shown in fig. 1, the processing chamber 100 is adapted for annealing a substrate.

the processing chamber 100 has: a chamber body 170 and a lid 130 coupled to the body 170. The lid 130 may be opened to reveal the interior of the chamber body 170. The chamber body 170 has two sidewalls 172, 174 and a bottom plate 176. A bottom plate 176 couples the two side walls 172 and 174 together. The chamber body 170 has: a partition wall 178 that divides the two process spaces 180a, 180b defined within the chamber body 170. A substrate support 150a is disposed in the process volume 180a and a substrate support 150b is disposed in the process volume 180b (wherein the process volume 180b has a substrate support 150 b). Each of the substrate supports 150a, 150b may be centrally located within the respective process volumes 180a, 180 b. Each of the substrate supports 150a, 150b optionally comprises: vacuum chucks or electrostatic chucks. Each of the substrate supports 150a, 150b has: cylindrical base 150a₀、150b₀And a rounded top surface 150a₁、150b₁. Top surface 150a₁、150b₁Configured to support a substrate when processed, for example, at temperatures up to 550 degrees celsius. Top surface 150a₁、150b₁May be made from a material compatible with the substrate being processed on the top surface and compatible with the processing environment in the chamber. Exemplary materials include: quartz and ceramics (e.g., alumina and aluminum nitride, which can withstand high temperatures).

Each of the substrate supports 150a, 150b has at least two controllable heating zones-a circular inner zone 154a, 154b and an annular outer zone 152a, 152b disposed about the inner zone 154a, 154 b. Each of the inner zones 154a, 154b has an in-line heating element 153a, 153 b. The heating elements 153a, 153b may be: a resistive heating element or other suitable heater. The temperature of each of the heating elements 153a, 153b is controlled by supplying current from one or more power supplies (not shown). Each of the inner regions 154a, 154b also has: in-line thermocouples 157a, 157b for measuring the temperature of the substrate supports 150a, 150b adjacent to each of the heating elements 153a, 153 b. Each of the thermocouples 157a, 157b is coupled to the controller 140 via respective connection lines 158a, 158 b.

each of the outer zones 152a, 152b has an in-line heating element 151a, 151 b. In one embodiment, in-line heating elements 151a, 151b may be: a resistive heating element or other suitable heater. The temperature of each of the heating elements 151a, 151b is controlled by supplying current from one or more power supplies (not shown).

Resistive coils 155a, 155b are disposed in the substrate supports 150a, 150b adjacent to each heating element 151a, 151 b. Each of the resistive coils 155a, 155b is connected to an ohmmeter 159a, 159b by a respective connection line 156a, 156b to measure the resistance of the respective resistive coil 155a, 155 b. The ohmmeters 159a, 159b are configured to measure the resistance in the resistive coils 155a, 155b and provide resistance information to the controller 140 via respective connection lines 156a ', 156 b'.

The controller 140 includes: a Central Processing Unit (CPU)142, a memory 144, and support circuits 146. The controller 140 may be utilized to regulate: power applied to the heating elements 151a, 151b and 153a, 153b from a power supply (not shown), and receiving: information about the temperature of the heating elements 153a, 153b measured by the respective thermocouples 157a, 157b and information about the resistance of each of the resistive coils 155a, 155b measured by the respective ohmmeters 159a, 159 b. The CPU 142 may be: a generic target computer processor of any form that can be used in industrial setting (industrial setting). The memory 144 may be: random access memory, read only memory, floppy disk, or hard drive, or other form of digital storage. The support circuits 146 are conventionally coupled to the CPU 142 and may include: cache, clock circuits, input/output systems, power supplies, and the like.

Figure 2 is a schematic representation of a side view of a test fixture 110 disposed on a processing chamber 100 for measuring the temperature of a substrate support 150a, 150b without contacting a surface of the substrate support. During calibration, the lid 130 of the processing chamber 100 is lifted to an open position and the test fixture 110 is placed on top of the chamber body 170. The test fixture 110 is placed on top of the chamber body 170. When the test fixture 110 is configured to calibrate a single substrate support, the test fixture 110 need only be configured with test fixture elements identified by the reference numbers with subscript "a" in the figures. After calibration, the test fixture 110 is removed and the lid 130 is closed to seal the chamber body 170 for processing of the substrate.

As shown in fig. 2 and 3, the test fixture 110 includes: a cover plate 305, at least one cooling channel 315, external openings 112a and 112b, and two non-contact temperature sensors 120a, 120 b. The non-contact temperature sensors 120a, 120b may be: infrared thermometers, pyrometers, infrared scanning systems, infrared thermal imagers, and the like. In one embodiment, the non-contact temperature sensors 120a, 120b are pyrometers.

the cover plate 305 of the test fixture 110 is made from aluminum or other suitable material. The overlay 305 may have: a thickness of between 0.5 inches and 0.75 inches. The outer openings 112a, 112b are formed through the cover plate 305 and are located above the respective annular outer regions 152a, 152b of the substrate supports 150a, 150 b. Alternatively, the overlay 305 may comprise: at least two internal openings 312a, 312b formed through the cover plate 305, the internal openings 312a, 312b being aligned with the inner regions 154a, 154b of the substrate supports 150a, 150 b. The outer openings 112a, 112b are utilized to allow the respective non-contact temperature sensors 120a, 120b to pass through the cover plate 305 to detect the temperature in the outer zones 152a, 152b of the substrate supports 150a, 150b during the calibration process. Internal openings 312a, 312b may be utilized to allow non-contact temperature sensors 120a, 120b to be placed over thermocouples 157a, 157b embedded in respective inner zones 154a and 154b to verify: temperature measurements obtained by the non-contact temperature sensors 120a, 120 b. Quartz windows 118a, 118b may be disposed in the outer openings 112a, 112 b. The quartz windows 118a, 118b are transmissive to radiation emitted by the substrate supports 150a, 150b such that the temperature of the substrate supports 150a, 150b can be measured by the non-contact temperature sensors 120a, 120 b.

The non-contact temperature sensors 120a, 120b are mounted over respective external openings 112a, 112b of the cover plate 305. Brackets 114a, 114b attached to the cover plate 305 and the non-contact temperature sensors 120a, 120b are utilized to separate the non-contact temperature sensors 120a, 120b on top of the substrate supports 150a, 150 b. In embodiments where the non-contact temperature sensors 120a, 120b are pyrometers, the carriages 114a, 114b separate the non-contact temperature sensors 120a, 120b from the top of the substrate supports 150a, 150b by a distance commensurate with the focal length of the pyrometers for making accurate and reliable measurements of the temperature of the substrate supports. Clamps, screws, or other fastening means may further be used to hold the contactless temperature sensors 120a, 120b to the brackets 114a, 114 b. When fastened, the noncontact temperature sensors 120a, 120b have: a respective field of view 122a, 122b through the respective quartz window 118a, 118b to a region of each of the substrate supports 150a, 150b adjacent the respective resistive coil 155a, 155 b. The non-contact temperature sensors 120a, 120b are configured to obtain temperature measurements of respective areas over each of the substrate supports 150a, 150b and to communicate the information to the controller 140 via connection lines 124a and 124 b. In the embodiment shown, the non-contact temperature sensors 120a, 120b may be: the model isIGA 6-23MB 10. The non-contact temperature sensors 120a, 120b may measure temperatures over a wide range (e.g., between about 50 degrees celsius and 1000 degrees celsius) and have a focal length between about 210mm and 5000 mm.

The cooling channels 315 avoid the following from occurring in the cover plate 305: overheating due to heat generated by the substrate supports 150a, 150 b. In one example, the cooling channels 315 are made of stainless steel tubing and are disposed in grooves formed in the cover plate 305. An encapsulation compound (not shown) is used to fill: a groove around the stainless steel tube to ensure: efficient cooling of the cover plate 305. A plurality of tabs (tab)304a, 304b, and 304c are coupled to the cover plate 305 over the cooling channel 315 such that the cooling channel 315 is retained within a groove formed in the cover plate 305. In alternative embodiments, the tabs may be replaced by other fastening members. Fittings 302a and 302b are coupled to the inlet and outlet of the cooling channel 315 to facilitate easy connection to a source of heat transfer fluid (not shown) for circulating the heat transfer fluid (such as water) within the cooling channel 315 to control the temperature of the cover plate 305.

test fixture 110 includes a plurality of handles 116 such that: the test fixture 110 may be easily placed over the chamber body 170 and removed after the calibration has been performed. The plastic cover 160 may be disposed over the top of the cover plate 305 to avoid: the exposure of the potentially hot surface of the cover plate 305. As the lid 130 may play a role during operation of the process chamber 100, the plastic lid 160 also prevents heat loss through the interior openings 312a and 312b, thereby facilitating the non-contact temperature sensors 120a, 120b to reliably measure the temperature of the substrate supports 150a, 150 b.

The test fixture 110 is used to correct the measurement of the temperature of the substrate support members 150a, 150b using the resistive coils 155a, 155b without contacting the surface of the substrate support members. Initially, the lid 130 of the processing chamber 100 is moved to an open state to receive the test fixture 110 on the upper surface of the chamber body 170. The cover plate 305 of the test fixture 110 serves as a lid for the processing chamber 100 during the calibration process. The cover plate 305 includes an interlock (not shown) that engages a sensor coupled to the chamber body 170 to simulate the closing of the lid 130, allowing operation of the processing chamber 100. The non-contact temperature sensors 120a, 120b are mounted over the external openings 112a, 112b of the test fixture 110 by brackets 114a, 114b such that the distance between the substrate supports 150a, 150b and the non-contact temperature sensors 120a, 120b is substantially equal to the focal length of the non-contact temperature sensors. The noncontact temperature sensors 120a and 120b have: the respective fields of view 122a, 122b are focused at regions adjacent to the respective resistive coils 155a, 155b of the respective substrate supports 150a, 150 b. Each of the ohmmeters 159a, 159b is connected to a respective resistive coil 155a, 155b to directly measure the resistance of the resistive coil as the resistance varies in proportion to the temperature of the substrate support 150a, 150 b.

Both substrate supports 150a, 150b disposed in the processing chamber 100 may be calibrated at the same time. In one example of a calibration process of the first substrate support 150a, the substrate support 150a is heated to 550 ℃ in 50 ℃ increments. Acquiring a number of corrected temperature measurements t of the outer region 152a of the substrate support 150a using the non-contact temperature sensor 120a at each temperature increment₁、t₂，…，t_N. Simultaneously, a plurality of correction resistance measurements r of the resistive coil 155a corresponding to each correction temperature measurement₁、r₂，…，r_NIs acquired. At each temperature, a relationship between the measured corrected temperature of the substrate support 150a and the measured corrected resistance of the resistive coil 155a is determined. Multiple resistance parameters k₁、k₂，…，k_N(each representing a relationship at each temperature) is determined as a product of the calibration process. The final resistance parameter k may be determined as: the slope of a linear best fit line segment defining a relationship over a temperature range. This relationship between the measured resistance of the resistive coil 155a and the temperature T of the substrate support 150a corresponding to the measured resistance of the resistive coil 155a may be defined as:

T＝k*f(R)…………………………………(i)

Where 'k' is a passing point t drawn on the X-Y Cartesian coordinate plane₁、t₂，…，t_NAnd r₁、r₂，…，r_NThe slope of the linear best fit line segment of (a); and

'f' represents: such that the temperature T of the substrate support 150a may be determined from the measured resistance R of the resistive coil 155a disposed within the substrate support 150 a.

The same process is also used simultaneously and the temperature of the outer zone 152b of the substrate support 150b is corrected by taking measurements with the non-contact temperature sensor 120 b. To verify, the temperature of the substrate support 150a is increased relative to the substrate support 150b to deduce which of the contactless temperature sensors 120a, 120b is associated with the substrate supports 150a, 150b if the connections of the contactless temperature sensors 120a, 120b to the controller 140 are exchanged. During the calibration process, the temperature of the outer zones 152a, 152b of the substrate supports 150a, 150b is maintained in the range described below: a temperature range within 10 degrees celsius hotter than the inner regions 154a, 154b and within 30 degrees celsius cooler than the inner regions 154a, 154b to avoid cracking of the substrate support. After calibration is performed, the test fixture 110 is removed from the chamber body 170 and the lid 130 of the processing chamber 100 is closed.

during subsequent processing of a substrate on the substrate support 150a, 150b located in the process chamber 100, the temperature of the outer zones 152a, 152b of the substrate support 150a, 150b (and thus the outer regions of the substrate on the substrate support 150a, 150b) may be determined from the known final resistance parameter k and the relationship (i) between the measured resistance of the resistive coils 155a, 155b and the temperature corresponding to the measured resistance of the resistive coils 155a, 155 b.

Figure 4 is a flow diagram of a method 400 for measuring a temperature of a substrate support in a processing chamber without contacting a surface of the substrate support according to another embodiment of the present disclosure. The method 400 begins at block 410 by mounting a test fixture having a temperature sensor on an upper surface of a chamber body of a process chamber. In one example, the test fixture 110 is mounted on an upper surface of the chamber body 170 of the process chamber 100. The test fixture 110 has a contactless temperature sensor 120a arranged on the test fixture 110, wherein this is done in such a way that: the non-contact temperature sensor 120a has a field of view that covers an area of the substrate support 150a adjacent to the resistive coil 155a embedded within the substrate support 150a (i.e., the area of the outer region 152 a).

At block 420, a temperature sensor is utilized to measure: a corrected temperature of a substrate support located in a processing chamber. In the previously described example, the non-contact temperature sensor 120a is used to measure the corrected temperature of the substrate support 150a in the outer region 152 a. The corrected temperature T is measured from radiation emitted by the substrate support 150a heated by the heating element 151a, which passes through the quartz window 118a and reaches the sensing end of the non-contact temperature sensor 120 a.

At block 430, a corrected resistance of a resistive coil disposed in an outer zone of the substrate support is measured by an ohmmeter. In the previously described example, the correction resistance R of the resistive coil 155a disposed in the outer region 152a of the substrate support 150a is measured using an ohmmeter 159a connected to the resistive coil 155 a. The corrected resistance measurement is acquired at the same time as the corrected temperature measurement is acquired by the non-contact temperature sensor 120 a.

At block 440, a resistance parameter is determined based on a relationship between a measured corrected temperature of an outer zone of the substrate support and a measured corrected resistance of the resistive coil. In the previously described example, the relationship between the measured corrected temperature of the outer region 152a of the substrate support 150a and the measured corrected resistance of the resistive coil 155a is determined at each temperature. Multiple resistance parameters k₁、k₂，…，k_N(each representing the relationship in the case of each of the temperature measurements) is determined as: the product of the process is corrected. The final resistance parameter k is determined as: the slope of a linear best fit line segment defining the relationship between the measured corrected temperature and the corrected resistance measurement over a range of temperatures. The temperature T of the outer region 152a of the substrate support 150a can then be achieved by this known final resistance parameter k and the relationship (i) between the measured resistance Ri of the resistive coil 155a and the temperature corresponding to the measured resistance of the resistive coil 155a_iAnd (4) determining.

At block 450, temperature control of a heating element disposed in the substrate support is corrected based on the resistance parameter. In the previously described example, control of the heating element 151a disposed in the outer zone 152a of the substrate support 150a is corrected based on the final resistance parameter k.

At block 460, the test fixture is removed. In the previously described example, the test fixture 110 is removed from the chamber body 170 by way of the handle 116.

at block 470, the lid of the processing chamber is closed to begin processing the substrate. In the foregoing example, the lid 130 is closed on the chamber body 170 to prepare the processing chamber 100 for processing. The method 400 as outlined in block 410-450 is used to correct the measurement of the temperature of a substrate support (e.g., substrate support 150a) and any substrate placed thereon during processing.

At block 480, the resistance of a resistive coil disposed in an outer zone of a substrate support is measured during processing of a substrate placed on the substrate support. In the previously described example, an ohmmeter is used to measure the resistance (e.g., R) of the resistive coil 155a disposed in the substrate support 150a_a)。

at block 490, the temperature of the outer zone of the substrate support is determined based on the final resistance parameter k and the measured resistance of the resistive coil disposed in the outer zone of the substrate support. In the previously described examples, the temperature T of the outer zone 152a of the substrate support 150a and a substrate placed on the substrate support 150a_iCan be determined from the measured resistance of the resistive coil 155a and the resulting resistance parameter k. Measured resistance R_iIs used in the relationship (i) between the measured resistance R of the resistive coil 155a and the temperature T corresponding to the measured resistance of the resistive coil 155a, such that:

T_i＝k*f(R_i)…………………………………(ii)

figure 5 is a flow chart of a method for simultaneously correcting measurements of the temperature of two substrate supports in a processing chamber.

At block 510, the method usesThe method 400 outlined in blocks 410-450 of the flowchart of FIG. 4 and corrects control of the first heating element disposed in the first substrate support based on the first resistance parameter. In the previously described example, the non-contact temperature sensor 120a and the method 400 as outlined in block 410-450 of the flow chart of FIG. 4 are used and based on the first resistance parameter k_aTo calibrate the heating element 151a of the substrate support 150 a.

at block 520, control of a second heating element disposed in a second substrate support is corrected using the method 400 as outlined in block 410-450 of the flowchart of FIG. 4 and based on a second resistance parameter. In the previously described example, the non-contact temperature sensor 120b and the method 400 as outlined in block 410-450 of the flow chart of FIG. 4 are used and based on the second resistance parameter k_bto calibrate the heating element 151b of the substrate support 150 b.

At block 530, the temperature of the first substrate support is increased relative to the second substrate support to infer which of the first and second temperature sensors is associated with the first and second substrate supports. In the previously described examples, the temperature of the substrate support 150a is increased relative to the substrate support 150b to deduce which of the non-contact temperature sensors 120a, 120b is associated with each of the substrate supports 150a, 150 b.

The method and test fixture described in this disclosure provide for: an improved way to accurately calibrate a heating element of a substrate support without contacting the substrate or a surface of the substrate support. The improvement is achieved by using a temperature sensor, in particular a non-contact temperature sensor that can measure the temperature of the substrate or substrate support without contacting the surface of the substrate or substrate support. The lack of contact eliminates the risk of metal contamination in the processing chamber. Furthermore, because the non-contact temperature sensor is capable of reliably and accurately measuring temperatures in a wide range with an accuracy of ± 2 degrees celsius, the substrate support may be calibrated to a desired temperature accuracy.

While the foregoing is directed to particular embodiments of the present disclosure, it is understood that: such embodiments are merely illustrative of the principles and applications of the present invention. It is thus understood that: many modifications may be made to the illustrative embodiments to achieve other embodiments without departing from the spirit and scope of the present invention, as defined by the following claims.