阅读说明：本技术 电子设备 (electronic device ) 是由 中田宗文 山崎诚仁 于 2019-02-25 设计创作，主要内容包括：本发明提供能够提高屏蔽结构体的制造效率并且减少制造成本的电子设备。电子设备具备屏蔽结构体。屏蔽结构体具有：导电性热扩散板,其设置于电子电路基板的与CPU等电子部件的安装面对置的位置,使从CPU等产生的热扩散；和导电性海绵状部件,其固定于电子电路基板的安装面以及与电子电路基板的安装面对置的导电性热扩散板的表面的至少一方,并以将产生电磁波噪声的CPU等与天线之间分隔的方式配置。(The invention provides an electronic device capable of improving the manufacturing efficiency of a shielding structure body and reducing the manufacturing cost. The electronic device includes a shield structure. The shield structure has: a conductive heat diffusion plate which is provided at a position of the electronic circuit board facing a mounting surface of an electronic component such as a CPU and diffuses heat generated from the CPU; and a conductive sponge member that is fixed to at least one of the mounting surface of the electronic circuit board and the surface of the conductive heat diffusion plate facing the mounting surface of the electronic circuit board, and that is disposed so as to separate the antenna from a CPU or the like that generates electromagnetic wave noise.)

1. An electronic device including an electronic circuit board on which an electronic component is mounted, the electronic device comprising:

An antenna capable of receiving radio waves; and

A shielding structure for shielding electromagnetic wave noise generated from the electronic component,

The shielding structure has:

A conductive heat diffusion plate that is provided at a position of the electronic circuit board facing a mounting surface of the electronic component and diffuses heat generated from the electronic component; and

And a conductive sponge member fixed to at least one of the mounting surface of the electronic circuit board and the surface of the conductive heat diffusion plate facing the mounting surface of the electronic circuit board, and arranged to separate the antenna from an electronic component that generates the electromagnetic wave noise.

2. The electronic device of claim 1,

The shielding structure further includes a conductive wall member provided on the mounting surface of the electronic circuit board and configured to separate the antenna from an electronic component that generates the electromagnetic wave noise,

An upper end surface of the conductive wall member abuts against the conductive sponge member fixed to the surface of the conductive heat diffusion plate.

3. The electronic device of claim 2,

the conductive wall member is configured as a plurality of metal plates mounted in a row on the electronic circuit board.

4. The electronic device of claim 3,

The conductive wall member has a gap between at least a part of the adjacent metal plates,

The conductive sponge member spans the gap between the upper end surfaces of the adjacent metal plates.

5. The electronic device of claim 4,

The width of the gap between adjacent metal plates is equal to or less than one sixth of the wavelength of the frequency of the radio wave received by the antenna.

6. the electronic device according to any one of claims 3 to 5,

a heat pipe having a narrower width than the conductive heat diffusion plate is joined to the surface of the conductive heat diffusion plate,

the plurality of metal plates include metal plates having different height dimensions from the mounting surface of the electronic circuit board,

The metal plates other than the metal plate having the highest height among the plurality of metal plates are disposed at positions corresponding to the heat transfer tubes.

7. The electronic device according to any one of claims 4 to 6,

A metal member is provided on the mounting surface of the electronic circuit board,

the metal member is disposed in a gap between ends of the conductive wall members,

The width of the gap between the metal member and each end of the conductive wall member is equal to or less than one sixth of the wavelength of the frequency of the radio wave received by the antenna.

8. The electronic device of claim 7,

The metal member includes at least a screw fastening member formed with an internally threaded hole of a screw, or a connector connection terminal to which a connector is connected.

9. An electronic device including an electronic circuit board on which an electronic component is mounted, the electronic device comprising:

An antenna capable of receiving radio waves; and

A shielding structure for shielding electromagnetic wave noise generated from the electronic component,

The shielding structure has:

A conductive wall member provided on a mounting surface of the electronic component on the electronic circuit board and configured to separate the antenna from the electronic component that generates the electromagnetic wave noise; and

A conductive plate provided at a position facing the mounting surface of the electronic circuit board and electrically connected to an upper end surface of the conductive wall member,

The conductive wall member is configured by arranging a plurality of metal plates mounted on the electronic circuit board, and a gap is provided between at least a part of the adjacent metal plates,

The conductive plate spans the gap between the upper end surfaces of the adjacent metal plates.

10. The electronic device of claim 9,

A conductive adhesive member or a conductive sponge member is interposed between the conductive plate and the upper end surface of the metal plate.

11. The electronic device of claim 9 or 10,

The width of the gap between adjacent metal plates is equal to or less than one sixth of the wavelength of the frequency of the radio wave received by the antenna.

Technical Field

The present invention relates to an electronic device including a shield structure for shielding electromagnetic wave noise.

Background

an electronic circuit board on which electronic components such as a CPU (central processing unit) are mounted and an antenna for wireless communication are mounted on an electronic device such as a notebook PC (notebook personal computer), a tablet PC, or a mobile phone. Generally, such an electronic device includes a shield structure for preventing electromagnetic wave noise generated from an electronic component from affecting the reception sensitivity of an antenna.

Disclosure of Invention

The present invention has been made in view of the above problems of the conventional art, and an object thereof is to provide an electronic device capable of improving the manufacturing efficiency of a shield structure and reducing the manufacturing cost.

An electronic device according to a first aspect of the present invention is an electronic device including an electronic circuit board on which electronic components are mounted, the electronic device including: an antenna capable of receiving radio waves; and a shielding structure for shielding electromagnetic wave noise generated from the electronic component, the shielding structure including: a conductive heat diffusion plate which is provided at a position of the electronic circuit board facing the mounting surface of the electronic component and diffuses heat generated from the electronic component; and a conductive sponge member fixed to at least one of the mounting surface of the electronic circuit board and the surface of the conductive heat diffusion plate facing the mounting surface of the electronic circuit board, and arranged to separate the antenna from an electronic component that generates the electromagnetic wave noise.

according to such a configuration, the periphery of the electronic component that generates electromagnetic wave noise is surrounded by the conductive heat diffusion plate and the conductive sponge member fixed to at least one of the mounting surface of the electronic circuit board and the surface of the conductive heat diffusion plate. Thus, the conductive heat diffusion plate for heat diffusion of the electronic component is used as the shield cover, and the conductive sponge member is used as the shield wall, so that the electromagnetic wave noise of the electronic component can be prevented from affecting the antenna. Therefore, in the shield structure, the conductive sponge-like member flexibly conforms to the uneven shape of the surface of the conductive heat diffusion plate or the mounting surface of the electronic circuit board. As a result, the shield structure can exhibit reliable shielding performance without considering the sheet metal working accuracy of the shield member and the skill of the assembly worker, and therefore, the manufacturing efficiency is improved and the manufacturing cost is reduced.

The shielding structure may further include a conductive wall member provided on the mounting surface of the electronic circuit board and arranged to separate an electronic component that generates the electromagnetic wave noise from the antenna, and an upper end surface of the conductive wall member may be in contact with the conductive sponge member fixed to the surface of the conductive heat diffusion plate. In this way, the conductive wall member provided between the surface of the conductive heat diffusion plate and the mounting surface of the electronic circuit board further improves the shielding performance against electromagnetic wave noise generated by the shielding structure. Further, the upper end surface of the conductive wall member can be reliably electrically connected only by being pressed against the conductive sponge member. Therefore, the requirements for the processing accuracy of the conductive wall member and the contact with the conductive heat diffusion plate can be reduced, and the manufacturing efficiency and the assembly efficiency can be improved.

The conductive wall member may be configured as a plurality of metal plates mounted in a row on the electronic circuit board. Thus, the shielding wall portion can be easily formed on the mounting surface of the electronic circuit board on which the circuit and the electronic component are complicatedly mounted, and workability and versatility are improved.

The conductive sponge member may be configured to span between the upper end surfaces of the adjacent metal plates, and the conductive sponge member may be configured to span between the upper end surfaces of the adjacent metal plates. In this way, the gaps between the adjacent metal plates are reliably communicated with each other through the conductive heat diffusion plate via the conductive sponge member, and therefore, the shielding performance can be more reliably ensured.

The width of the gap between adjacent metal plates may be equal to or less than one sixth of the wavelength of the frequency of the radio wave received by the antenna. Thus, the electromagnetic wave shielding performance can be ensured even if the adjacent metal plates are configured to have a gap therebetween.

A heat transfer pipe having a smaller width than the conductive heat diffusion plate may be joined to a surface of the conductive heat diffusion plate, the plurality of metal plates may include metal plates having different height dimensions from a mounting surface of the electronic circuit board, and the metal plate other than the metal plate having the highest height dimension among the plurality of metal plates may be disposed at a position corresponding to the heat transfer pipe. In this way, the cooling performance of the electronic component can be improved by providing the heat transfer pipe, and the conductive sponge-like member can be compressed at a constant compression rate even between the conductive heat diffusion plate having a surface partially reduced by the heat transfer pipe and the upper end surface of the metal plate. Therefore, the electronic device obtains more stable shielding performance.

The electronic circuit board may be configured such that a metal member is provided on the mounting surface of the electronic circuit board, the metal member is disposed in a gap between ends of the conductive wall members, and a width of the gap between the metal member and each end of the conductive wall members is equal to or less than one sixth of a wavelength of a frequency of the radio wave received by the antenna. In this way, the conventional metal member provided on the mounting surface of the electronic circuit board can be used as a part of the shield. Further, the electromagnetic wave shielding performance can be ensured even if the metal member and the conductive wall member are configured to have a gap formed therebetween.

The metal member may include at least a screw fastening member having a female screw hole formed therein for screwing a screw, or a connector connection terminal for connecting a connector.

An electronic device according to a second aspect of the present invention is an electronic device including an electronic circuit board on which an electronic component is mounted, the electronic device including: an antenna capable of receiving radio waves; and a shielding structure for shielding electromagnetic wave noise generated from the electronic component, the shielding structure including: a conductive wall member provided on a mounting surface of the electronic component on the electronic circuit board and arranged to separate the antenna from the electronic component that generates the electromagnetic wave noise; and a conductive plate that is provided at a position facing the mounting surface of the electronic circuit board and is electrically connected to an upper end surface of the conductive wall member, wherein the conductive wall member is configured as a plurality of metal plates that are mounted in a row on the electronic circuit board, and a gap is provided between at least a part of the adjacent metal plates, and the conductive plate spans the gap over the upper end surfaces of the adjacent metal plates.

According to such a configuration, the conductive wall member provided between the surface of the conductive plate and the mounting surface of the electronic circuit board can reliably shield electromagnetic wave noise from the electronic component. In this case, the conductive wall member is configured such that a plurality of metal plates are arranged with a gap therebetween, but the upper end surfaces thereof are connected to each other through the conductive plate, thereby exhibiting sufficient shielding performance, improving manufacturing efficiency, and reducing manufacturing cost.

a conductive adhesive member or a conductive sponge member may be interposed between the conductive plate and the upper end surface of the metal plate.

The width of the gap between adjacent metal plates may be equal to or less than one sixth of the wavelength of the frequency of the radio wave received by the antenna. Thus, the electromagnetic wave shielding performance can be ensured even if the adjacent metal plates are configured to have a gap therebetween.

According to an aspect of the present invention, it is possible to improve the manufacturing efficiency of the shield structure and reduce the manufacturing cost thereof.

Drawings

Fig. 1 is a top view of an electronic apparatus according to an embodiment of the present invention.

Fig. 2 is a bottom view schematically showing the internal structure of the main body frame.

fig. 3 is a structural diagram of the electronic circuit board shown in fig. 2.

Fig. 4 is a structural diagram of the conductive heat diffusion plate shown in fig. 2.

Fig. 5 is an exploded perspective view schematically showing the structure of the shield structure.

Fig. 6A is a cross-sectional view taken along line VI-VI in fig. 2 schematically showing the structure of the shielding structure.

fig. 6B is a sectional view schematically showing an assembly process of the shield structure shown in fig. 6A.

Description of the reference numerals

an electronic device; a main body frame; an electronic circuit substrate; a mounting surface; a conductive thermal diffuser plate; 30. an antenna; a first communication module; a CPU; a power supply circuit; a memory; a second communication module; a connector connection terminal; a heat pipe; 58 a-58 c. A shielding structure; an electrically conductive wall member; 62a to 62c, 62a (l) to 62c (l.) metal plate; 64. 64 a-64 c.

Detailed Description

Hereinafter, an electronic device according to the present invention will be described in detail by referring to the drawings.

Fig. 1 is a top view of an electronic device 10 according to an embodiment of the present invention. In the present embodiment, an electronic device 10 as a notebook PC is exemplified. The electronic device 10 may also be a tablet PC, smart phone, mobile phone, or the like.

As shown in fig. 1, the electronic device 10 includes: a main body housing 14 provided with the keyboard device 12, and a display housing 18 provided with a display 16. The display frame 18 is rotatably coupled to the rear end portion of the main body frame 14 via a pair of left and right hinges 20, 20.

Fig. 1 is a top plan view of electronic apparatus 10 in which display housing 18 is opened from main housing 14 by hinge 20 to be used. Hereinafter, the front side of the main body housing 14 will be referred to as the front side, the rear side as the rear side, the thickness direction as the top and bottom, and the width direction as the left and right sides, with reference to the direction in which the display 16 of the electronic device 10 in the usage form shown in fig. 1 is viewed from the front.

The main body housing 14 is a thin box-shaped housing formed by an upper surface cover 22 and a lower surface cover 24. The upper cover 22 is a plate-like member formed by projecting a wall, which is a side wall of the main body housing 14, to the periphery. The upper cover 22 constitutes the upper surface and the peripheral side surfaces of the main body frame 14. The lower cover 24 is a plate-like member constituting the bottom surface of the main body housing 14.

the display frame 18 is electrically connected to the main body frame 14 by a wiring not shown through the hinge 20. The display 16 is, for example, a liquid crystal display.

Fig. 2 is a bottom view schematically showing the internal structure of the main body frame 14. Fig. 2 is a schematic view of the inside of the main body housing 14 viewed from the inner surface side of the upper surface cover 22 with the lower surface cover 24 removed. As shown in fig. 2, an electronic circuit board 26, a conductive heat diffusion plate 28, a pair of left and right antennas 30 and 31, and a first communication module 32 are housed inside the main body housing 14.

fig. 3 is a structural diagram of the electronic circuit board 26 shown in fig. 2. As shown in fig. 2 and 3, the electronic circuit board 26 is a PCB (printed circuit board) on which various electronic components such as a CPU34, a power supply circuit 36, a memory 38, a second communication module 40, a connector connection terminal 42, an external device connection terminal 44, and the like are mounted on a Surface Mount Technology (SMT). The electronic circuit board 26 has a back surface 26a facing upward in the main body housing 14 as a mounting surface for the upper cover 22, and a front surface 26b facing downward as a mounting surface 26c for the CPU34 and the like.

The CPU34 is a central processing unit that performs calculations related to the main control and processing of the electronic device 10. The CPU34 is the largest level of heating element among the electronic components mounted in the main body casing 14. The power supply circuit 36 is a circuit for controlling the power supply of the electronic apparatus 10, and is electrically connected to, for example, a battery device not shown. The memory 38 is, for example, a read/write-capable recording device (RAM). The power supply circuit 36 and the memory 38 are heat generators next to the CPU 34. The second communication module 40 is electrically connected to the left and right antennas 30 and 31 by a cable not shown. The second communication module 40 is an electronic component that performs wireless communication with an external access point or the like via the antennas 30 and 31, and is, for example, a wireless communication module for WLAN (wireless LAN). The second communication module 40 is disposed, for example, at the right corner of the rear end of the electronic circuit board 26. The connector connection terminal 42 is connected to a connector of a cable that electrically connects the electronic circuit board 26 and each component mounted on the electronic device 10. The connector connection terminal 42 is a metal block-shaped member. The external device connection terminal 44 is, for example, a female-side connector according to usb (universal Serial bus) type C standard. A controller 46 for controlling an external device connected to the external device connection terminal 44 is mounted on the mounting surface 26c of the electronic circuit board 26.

fig. 4 is a structural diagram of the electrically conductive heat diffusion plate 28 shown in fig. 2. As shown in fig. 2 and 4, the conductive heat diffusion plate 28 is a plate-like member that is provided at a position facing the mounting surface 26c of the electronic circuit board 26 and that covers substantially the entire area of the mounting surface 26c excluding the portion where the second communication module 40 and the external device connection terminal 44 are provided. The conductive heat diffusion plate 28 is formed of a metal plate having conductivity and high thermal conductivity, such as copper or aluminum. The electrically conductive heat diffusion plate 28 is a heat sink that absorbs heat generated from heat-generating elements such as the CPU34, the power supply circuit 36, and the memory 38 via a surface 28a facing the mounting surface 26c of the electronic circuit board 26, and diffuses the heat in the in-plane direction.

In the present embodiment, heat transfer pipes 48 extending in the left-right direction are joined to the surface 28a of the electrically conductive heat diffuser plate 28. The heat transfer pipe 48 is, for example, a structure obtained by crushing a metal pipe having both ends joined to form a closed space inside, and is a heat transport device capable of efficiently transporting heat by utilizing a phase change of a working fluid enclosed in the closed space. One end side of the heat transfer pipe 48 is connected to the top surface of the CPU34 via a heat receiving plate 50 made of copper, aluminum, or the like so as to be able to transfer heat. In other words, the CPU34 has the heated plate 50, the heat pipe 48, and the conductive heat diffusion plate 28 laminated in this order on its top surface. The other end of heat transfer pipe 48 is joined to a fan plate 52 laminated on an unillustrated blower fan. The heat transfer pipe 48 and the fan plate 52 may be omitted.

the heated plate 50 has plate springs 50a, 50b, 50c protruding in three directions. The leaf springs 50a to 50c have holes 54 formed at the respective front ends. Screw fastening members 58a, 58b, and 58c (see fig. 3) each having a boss with an axial female screw hole 56 formed at the center thereof are provided so as to protrude from the mounting surface 26c of the electronic circuit board 26. The leaf springs 50a to 50c are disposed in contact with the top surfaces of the screw fastening members 58a to 58c, and are fastened to the electronic circuit board 26 by screws 59 that pass through the holes 54 and are screwed into the female screw holes 56 (see fig. 2). This allows the heat receiving plate 50 to be more reliably attached to the top surface of the CPU34 without rattling.

As shown in fig. 1 and 2, the antennas 30 and 31 are formed in an L shape in a plan view, for example, and are provided at the left and right corners of the front end portion of the main body housing 14, respectively. The antennas 30 and 31 are antennas corresponding to, for example, WWAN (wireless WAN) and WLAN.

As shown in fig. 1 and 2, the first communication module 32 is an electronic component that performs wireless communication with an external base station or the like via the antennas 30 and 31, and is, for example, a wireless communication module for WWAN (wireless WAN). In the present embodiment, the first communication module 32 is disposed at the front right of the electronic circuit board 26.

as shown in fig. 2 to 4, the electronic device 10 includes a shield structure 60 in the main body housing 14. The shield structure 60 is provided to separate the electromagnetic wave noise generation source such as the CPU34, the power supply circuit 36, and the memory 38 from the first communication module 32, the second communication module 40, and the antennas 30 and 31 by a conductor. The shield structure 60 shields electromagnetic wave noise generated by the CPU34 or the like, thereby preventing the electromagnetic wave noise from affecting the first communication module 32, the second communication module 40, and the antennas 30 and 31. The shield structure 60 includes the conductive heat diffuser 28, the conductive wall member 62, and the conductive sponge member 64.

fig. 5 is an exploded perspective view schematically showing the structure of the shield structure 60. Fig. 6A is a cross-sectional view taken along line VI-VI in fig. 2 schematically showing the structure of the shielding structure 60. Fig. 6B is a sectional view schematically showing an assembly process of the shield structure 60 shown in fig. 6A.

as described above, the conductive heat diffusion plate 28 is formed of a metal plate having conductivity. Therefore, the conductive heat diffusion plate 28 has electromagnetic wave noise shielding performance, and covers the CPU34 or the like as a source of generation of electromagnetic wave noise.

As shown in fig. 3 and 5, the conductive wall member 62 is a conductive wall member provided to separate the CPU34, the power supply circuit 36, the memory 38, and the like from the first communication module 32, the second communication module 40, and the antennas 30 and 31. The conductive wall member 62 is formed by arranging a plurality of metal plates 62a, 62b, and 62c mounted on the mounting surface 26c of the electronic circuit board 26 in the longitudinal direction. The metal plate 62a and the like are linear plate pieces that are surface-mounted (SMT) on the mounting surface 26c of the electronic circuit board 26 together with electronic components such as the CPU34, for example. The metal plates 62a to 62c are formed to have the same plate thickness but different widths (longitudinal dimensions). As shown in the metal plates 62a (l), 62b (l), and 62c (l) in fig. 5, the metal plates 62a to 62c may be used together to form a member having a reduced height. In the configuration example shown in fig. 3, the conductive wall member 62 is formed by appropriately combining six kinds of metal plates 62a to 62c, 62a (l) to 62c (l), which have three kinds of widths and two kinds of heights, in total. Of course, the number of kinds of metal plates forming the conductive wall member 62 may be more or less than six. The metal plate 62a is a member obtained by plating stainless steel (SUS304) with tin, for example.

The conductive wall member 62 has a gap C between adjacent metal plates 62a to 62C, 62a (l) to 62C (l). In the configuration example shown in fig. 3, the gaps C of various sizes are provided between almost all the metal plates 62a to 62C, 62a (l) to 62C (l), but the metal plates 62a to 62C, 62a (l) to 62C (l) may be brought into contact with each other without providing the gaps C. Among them, the metal plates 62a to 62C, 62a (l) to 62C (l) need to be mounted on the electronic circuit board 26 and arranged to pass through the gap of the electronic components such as the CPU34, and thus it is difficult to have the gap C at all.

As shown in fig. 6A, the width W of each gap C is set to be equal to or less than one sixth of the wavelength of 800MHz of the WWAN frequency received by the antennas 30 and 31, for example, at the frequency of radio in the electronic device 10, thereby ensuring reliable electromagnetic wave shielding performance. Of course, the height H of each gap C is set to be equal to or less than one sixth of the wavelength of 800MHz of the WWAN frequency received by the antennas 30 and 31, similarly to the width W.

In the present embodiment, the conductive wall member 62 has a first wall portion 62A on the mounting surface 26c of the electronic circuit board 26, the first wall portion surrounding the CPU34, the power supply circuit 36, the memory 38, and the controller 46; and a second wall portion 62B surrounding the second communication module 40 in both directions. The first wall portion 62A shields electromagnetic wave noise generated by the CPU34 and the like by surrounding the CPU34 and the like. The second wall portion 62B shields the second communication module 40 from the CPU34 or the like.

The screw fastening members 58b and 58c as metal members and the connector connection terminal 42 stand upright at the gaps between the end portions of the adjacent metal plates 62A to 62c, 62A (l) to 62c (l) of the first wall portion 62A. That is, in the first wall portion 62A, the conductive wall member 62 surrounding the CPU34 and the like is formed using the screw fastening members 58b and 58c and the connector connection terminal 42, which partially have electromagnetic wave shielding performance, as substitutes for the metal plate 62A and the like. Of course, the width W of the gap C between the end of the metal plate 62a or the like, the screw fastening members 58b and 58C, and the connector connection terminal 42 is set to be equal to or less than one sixth of the wavelength of 800MHz of the WWAN frequency received by the antennas 30 and 31.

As shown in fig. 4 and 5, the conductive sponge member 64 is provided to separate the CPU34, the power supply circuit 36, the memory 38, and the like from the first communication module 32, the second communication module 40, and the antennas 30 and 31. The conductive sponge member 64 is fixed to the surface 28a of the conductive heat diffuser 28 by an adhesive member 66 (see fig. 6A) such as a double-sided tape or an adhesive, and traces the same as the conductive wall member 62 on the electronic circuit board 26 side. The adhesive member 66 may be a material having no conductivity because it is extremely thin, but is preferably a conductive adhesive member having conductivity. The conductive sponge member 64 extends in a strip shape with a width dimension larger than the thickness of the metal plate 62a or the like constituting the conductive wall member 62. In the present embodiment, for example, a conductive sponge member 64a having a large thickness, a conductive sponge member 64b having a small thickness, and a conductive sponge member 64c having a smaller thickness in the vertical direction are used as the conductive sponge members 64 (see fig. 5 and 6A). The width and thickness of the conductive sponge member 64 can be changed as appropriate. The conductive sponge-like member 64 is, for example, a sponge formed of a material obtained by tin plating copper, or a sponge obtained by kneading carbon with a resin such as polyethylene. The conductive sponge-like member 64 may be fixed to the mounting surface 26c of the electronic circuit board 26 by using an adhesive member 66, or may be fixed to both the mounting surface 26c of the electronic circuit board 26 and the surface 28a of the conductive heat diffuser plate 28 by using the adhesive member 66.

The conductive sponge member 64 is thereby brought into close contact with the upper end surface 62d of the metal plate 62a or the like, the screw fastening members 58b, 58c, and the top surface of the connector connection terminal 42. In other words, the electrically conductive sponge member 64 electrically connects the upper end surfaces 62d of the adjacent metal plates 62a and the like, the screw fastening members 58b and 58C, and the top surfaces of the connector connection terminals 42 via the electrically conductive heat diffusion plate 28, thereby ensuring shielding performance at the gap C.

As shown in fig. 6A and 6B, the conductive sponge member 64 is assembled in a state where its top surface abuts against the upper end surface 62d of the conductive wall member 62 and receives a compressive force in the thickness direction. Therefore, the thickness of the conductive sponge member 64 and the height of the metal plate 62a are appropriately set according to the shape of the irregularities of the heat transfer pipe 48 and the like on the surface 28a of the conductive heat diffuser plate 28, for example. This makes the compression amount of each of the conductive sponge members 64a to 64c constant, and makes the conductivity of each of the conductive sponge members 64a to 64c uniform. Further, by using the metal plate 62a (l) or the like having a low height at the position overlapping the heat transfer pipe 48, the amount of compression of the conductive sponge-like member 64 can be easily made constant even in the portion where the heat transfer pipe 48 is provided.

As described above, in the electronic device 10 of the present embodiment, the shield structure 60 includes: a conductive heat diffusion plate 28 which is provided at a position facing a mounting surface 26c of an electronic component such as a CPU34 in the electronic circuit board 26 and diffuses heat generated from the CPU34 and the like; and a conductive sponge member 64 fixed to at least one of the mounting surface 26c of the electronic circuit board 26 and the surface 28a of the conductive heat diffusion plate 28 facing the mounting surface 26c of the electronic circuit board 26, and arranged to separate the antenna 30, 31 from the CPU34 and the like that generate electromagnetic wave noise. In this way, the shield structure 60 may be configured without the conductive wall member 62.

Therefore, the shield structure 60 is provided such that the periphery of the CPU34 and the like is surrounded by the conductive heat diffuser 28 and the conductive sponge member 64 fixed to at least one of the mounting surface 26c of the electronic circuit board 26 and the surface 28a of the conductive heat diffuser 28. Thus, the conductive heat diffusion plate 28 for heat diffusion of electronic components is used as a shield cover, and the conductive sponge member 64 is used as a shield wall, so that electromagnetic wave noise from the CPU34 and the like can be prevented from affecting the antennas 30 and 31. Therefore, in the shield structure 60 of the electronic device 10, the conductive sponge-like member 64 flexibly conforms to the irregularities of the surface 28a of the conductive heat diffuser plate 28 and the mounting surface 26c of the electronic circuit board 26. As a result, the shield structure 60 can exhibit reliable shielding performance without considering the sheet metal working accuracy of the shield member and the skill of the assembly worker as in the conventional technique, and therefore, the manufacturing efficiency is improved and the manufacturing cost is reduced. In addition, since the shield structure 60 also shields the electromagnetic wave noise generation source such as the CPU34 from the communication modules 32 and 40, the wireless communication quality of the electronic device 10 is further improved.

the shield structure 60 further includes a conductive wall member 62, the conductive wall member 62 is provided on the mounting surface 26c of the electronic circuit board 26 and is disposed so as to separate the CPU34 and the like from the antennas 30 and 31, and an upper end surface 62d of the conductive wall member 62 is in contact with a conductive sponge member 64 fixed to the surface 28a of the conductive heat diffuser plate 28. In this way, the shielding performance of the electromagnetic wave noise generated by the shielding structure 60 is further improved by the conductive wall member 62 provided between the surface 28a of the conductive heat diffuser plate 28 and the mounting surface 26c of the electronic circuit board 26. The upper end surface 62d of the conductive wall member 62 can be reliably electrically connected only by being pressed against the conductive sponge member 64. Therefore, the requirements for the processing accuracy of the conductive wall member 62 and the contact with the conductive heat diffuser plate 28 can be reduced, and the manufacturing efficiency and the assembly efficiency can be improved.

in this case, the conductive wall member 62 is formed by arranging a plurality of metal plates 62a and the like mounted on the electronic circuit board 26. The conductive wall member 62 has a gap C at least between a part of the adjacent metal plates 62a, and the conductive sponge member 64 spans the gap C between the upper end surfaces 62d of the adjacent metal plates 62 a. Since the conductive wall member 62 is formed of the plurality of metal plates 62a, etc., which are linear plate pieces, the shielding wall portion can be easily formed on the mounting surface 26c of the electronic circuit board 26 in which the circuits and the electronic components are complicatedly assembled, and workability and versatility are high. Further, the gaps C between the adjacent metal plates 62a and the like are reliably conducted through the conductive heat diffuser plate 28 via the conductive sponge member 64, and therefore shielding performance can be ensured.

in the electronic device 10 of the present embodiment, the shield structure 60 includes: a conductive wall member 62 provided on a mounting surface 26c of an electronic component such as a CPU34 on the electronic circuit board 26 and arranged to separate the antenna 30, 31 from a CPU34 or the like that generates electromagnetic wave noise; and a conductive plate (in the present embodiment, the conductive heat diffusion plate 28) that is provided at a position facing the mounting surface 26c of the electronic circuit board 26 and is electrically connected to the upper end surfaces 62d of the plurality of metal plates 62a and the like. The conductive wall member 62 is formed by arranging a plurality of metal plates 62a and the like mounted on the electronic circuit board 26, and a gap C is provided between at least a part of the adjacent metal plates 62a and the like, and the conductive heat diffuser plate 28 spans the gap C between the upper end surfaces 62d of the adjacent metal plates 62a and the like. In this way, the shield structure 60 may be configured without the conductive sponge member 64. Instead of the conductive heat diffusion plate 28, a simple conductive plate not intended for heat diffusion by the CPU34 or the like may be used.

therefore, in such a configuration, electromagnetic wave noise from the CPU34 and the like can be reliably shielded by the conductive wall member 62 provided between the surface 28a of the conductive heat diffuser plate 28 and the mounting surface 26c of the electronic circuit board 26. In this case, the conductive wall member 62 is configured such that a plurality of metal plates 62a are arranged with the gap C therebetween, but the upper end surfaces 62d thereof are connected to each other by the conductive plate (conductive heat diffusion plate 28), and sufficient shielding performance can be exhibited, so that manufacturing efficiency is improved and manufacturing cost is reduced. Further, the upper end surface 62d of the conductive wall member 62 and the conductive plate (conductive heat diffusion plate 28) are connected to each other by a conductive adhesive member such as a conductive sponge member 64 or an adhesive member 66, whereby shielding performance can be obtained more reliably.

in the electronic device 10, the screw fastening members 58b and 58c and the connector connection terminal 42 are used as a part of the conductive wall member 62. This can reduce the number of metal plates 62a and the like used, and further reduce the manufacturing cost. In other words, as in the related art, a shield structure in which the CPU34 and the like are surrounded by a shield member made of sheet metal needs to have a complicated structure in which interference with the conductive screw fastening members 58b and 58c and the connector connection terminal 42 is avoided. In contrast, in the electronic device 10, the components independent of the shield structure 60 are used as a part of the shield structure 60, so that the device structure can be simplified and the component cost can be reduced. Metal members other than the screw fastening members 58b and 58c and the connector connection terminal 42 may be used as a part of the conductive wall member 62.

the present invention is not limited to the above-described embodiments, and can be modified freely without departing from the scope of the present invention.

In the above embodiment, the configuration in which the antennas 30 and 31 are mounted in the main body housing 14 is illustrated, but the antennas 30 and 31 may be mounted in the display housing 18 as in the antennas 30 and 31 shown by the two-dot chain lines in fig. 1, for example. In this case as well, the reception quality of the radio waves of the antennas 30, 31 can be improved by the shield structure 60.