阅读说明：本技术 电容器模块和包括其的电子装置 (Capacitor module and electronic device including the same ) 是由 柳忠显 姜秉玉 安修镛 张种祐 郭仁燮 吴泽秀 郑具琳 朴常镐 李晟基 于 2021-04-19 设计创作，主要内容包括：提供了一种电容器模块和一种电子装置。所述电容器模块被配置为水平地安装在PCB上,并且包括：壳体,所述壳体包括第一侧表面、相对的第二侧表面、设置在所述第一侧表面处的第一电极焊盘和第二电极焊盘以及设置在所述第二侧表面处的第三电极焊盘；和电解电容器,所述电解电容器包括在第一水平方向上延伸的电介质、接触所述第一电极焊盘的第一电极和接触所述第二电极焊盘的第二电极,其中,所述第一电极焊盘在第二水平方向与第二电极焊盘间隔开。(A capacitor module and an electronic device are provided. The capacitor module is configured to be horizontally mounted on a PCB, and includes: a case including a first side surface, an opposite second side surface, first and second electrode pads disposed at the first side surface, and a third electrode pad disposed at the second side surface; and an electrolytic capacitor including a dielectric extending in a first horizontal direction, a first electrode contacting the first electrode pad, and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from the second electrode pad in a second horizontal direction.)

1. A capacitor module, comprising:

a case horizontally mounted on a printed circuit board having a main surface horizontally extending in a first direction and a second direction perpendicular to the first direction, the case including a first side surface, a second side surface opposite to the first side surface, first and second electrode pads disposed at the first side surface, and a third electrode pad disposed at the second side surface; and

an electrolytic capacitor including a dielectric extending in the first direction, a first electrode electrically connected to the first electrode pad, and a second electrode electrically connected to the second electrode pad,

wherein the second electrode pad is spaced apart from the first electrode pad in the second direction.

2. The capacitor module of claim 1, wherein one of the first and second electrodes is an anode of the electrolytic capacitor and the other of the first and second electrodes is a cathode of the electrolytic capacitor.

3. The capacitor module according to claim 1, wherein at least one of the first electrode pad and the second electrode pad is configured to mechanically support the capacitor module when the capacitor module is mounted on the printed circuit board.

4. The capacitor module of claim 1, wherein the third electrode pad is a dummy electrode pad configured to mechanically support the capacitor module when the capacitor module is mounted on the printed circuit board.

5. The capacitor module according to claim 4, wherein the third electrode pad is floating.

6. The capacitor module according to claim 4, wherein the third electrode pad is grounded.

7. The capacitor module of claim 6, wherein one of the first and second electrodes is a cathode of the electrolytic capacitor, and the third electrode pad is electrically connected to the cathode.

8. The capacitor module of claim 1, wherein the housing further comprises:

a third side surface connecting the first side surface and the second side surface; and

a fourth electrode pad disposed at the third side surface.

9. The capacitor module of claim 8, wherein the third and fourth electrode pads are each dummy electrode pads configured to mechanically support the capacitor module when the capacitor module is mounted on the printed circuit board.

10. The capacitor module according to claim 9, wherein the third electrode pad and the fourth electrode pad are each connected to be floating or grounded.

11. An electronic device, the electronic device comprising:

a printed circuit board having a main surface extending horizontally in a first direction and a second direction perpendicular to the first direction, and including a mounting region, a first contact terminal, a second contact terminal, and a third contact terminal;

a housing configured to be mounted horizontally on the printed circuit board at least partially within the mounting area and including a first side surface, a second side surface opposite the first side surface, first and second electrode pads disposed at the first side surface, and a third electrode pad disposed at the second side surface; and

an electrolytic capacitor including a dielectric extending in the first direction, a first electrode, and a second electrode spaced apart from the first electrode in the second direction,

wherein the electrolytic capacitor is mounted on the case by connecting the first electrode to the first electrode pad and connecting the second electrode to the second electrode pad, and

the case is horizontally mounted within the mounting area of the printed circuit board by connecting the first electrode pad to the first contact terminal, connecting the second electrode pad to the second contact terminal, and connecting the third electrode pad to the third contact terminal.

12. The electronic device of claim 11, wherein one of the first and second electrodes is an anode of the electrolytic capacitor and the other of the first and second electrodes is a cathode of the electrolytic capacitor.

13. The electronic device of claim 11, wherein the third electrode pad is a dummy electrode pad configured to mechanically support the housing when the housing is horizontally mounted on the printed circuit board.

14. The electronic device of claim 11, wherein the printed circuit board further comprises a fourth contact terminal,

the case further includes a third side surface connecting the first and second side surfaces and a fourth electrode pad connected to the third side surface, and

the housing is horizontally mounted within the mounting area of the printed circuit board by further connecting the fourth electrode pad to the fourth contact terminal.

15. The electronic device of claim 14, wherein the third and fourth electrode pads are dummy electrode pads configured to mechanically support the housing when mounted on the printed circuit board, and

the third electrode pad and the fourth electrode pad are connected to be floated or grounded.

16. The electronic device of claim 11, wherein the mounting area is disposed within the printed circuit board to receive and mount the housing in one of a longitudinal manner and a transverse manner.

17. The electronic device of claim 11, further comprising:

a cover case substantially enclosing at least one of an upper surface of the printed circuit board and a lower surface of the printed circuit board.

18. A capacitor module configured to be horizontally mounted on a printed circuit board having upper and lower surfaces extending horizontally in a first direction and a second direction perpendicular to the first direction, the capacitor module comprising:

a case including a frame, a first side surface, a second side surface opposite to the first side surface, a third side surface connecting the first side surface and the second side surface, first and second electrode pads disposed at the first side surface, and a third electrode pad disposed at the third side surface; and

a cylindrical electrolytic capacitor including a dielectric extending in the first direction, a first electrode contacting the first electrode pad, and a second electrode contacting the second electrode pad,

wherein the first electrode pad is spaced apart from the second electrode pad in the second direction, and the frame substantially surrounds a side surface of the cylindrical electrolytic capacitor.

19. The capacitor module of claim 18, wherein one of the first and second electrodes is an anode of the cylindrical electrolytic capacitor and the other of the first and second electrodes is a cathode of the cylindrical electrolytic capacitor, and

the third electrode pad is a dummy electrode pad configured to mechanically support the capacitor module when the capacitor module is mounted on the printed circuit board.

20. The capacitor module of claim 18, wherein the cylindrical electrolytic capacitor is an aluminum electrolytic capacitor.

Technical Field

Embodiments of the inventive concept relate generally to a capacitor module and an electronic device including the same. More particularly, embodiments of the inventive concept relate to horizontally mounted capacitor modules that provide improved integration density and electronic devices including capacitor modules of this type.

Background

Electronic devices that include one or more semiconductor chips or packages typically include electronic circuitry that includes various components that collectively provide multiple functions. In many electronic devices, these components are mounted on a Printed Circuit Board (PCB). For example, to implement a semiconductor device such as a Solid State Disk (SSD), various components such as a controller, a flash memory, a buffer memory, an input/output (I/O) port, an electrolytic capacitor, and the like may be mounted on a PCB.

The various geometric dimensions (e.g., height, width, length) of the constituent components and the minimum spacing requirements between the components determine the overall size of the electronic device. Some components of a semiconductor device may have predetermined dimensions defined by certain functional and/or physical characteristics. For example, electrolytic capacitors may be used in some semiconductor devices to accumulate a desired level of charge. Here, the physical size of the electrolytic capacitor will correspond to the amount of desired capacitance of the electrolytic capacitor. Therefore, the size of the electrolytic capacitor may be difficult to reduce due to the maximum capacitance requirement (or specification) required for the associated circuit or function. As a result, the integration density (e.g., compactness) of a collection of components including one or more electrolytic capacitors may be limited.

Disclosure of Invention

Embodiments of the inventive concept provide a horizontally mounted capacitor module capable of improving the integration of components within an electronic device.

According to an embodiment, a capacitor module includes: a case horizontally mounted on a Printed Circuit Board (PCB) having a main surface horizontally extending in a first direction and a second direction perpendicular to the first direction, the case including a first side surface, a second side surface opposite to the first side surface, first and second electrode pads disposed at the first side surface, and a third electrode pad disposed at the second side surface; and an electrolytic capacitor including a dielectric extending in the first direction, a first electrode electrically connected to the first electrode pad, and a second electrode electrically connected to the second electrode pad, wherein the second electrode pad is spaced apart from the first electrode pad in the second direction.

According to an embodiment, an electronic device includes: a Printed Circuit Board (PCB) having a major surface extending horizontally in a first direction and a second direction perpendicular to the first direction, and including a mounting area, a first contact terminal, a second contact terminal, and a third contact terminal; a case configured to be mounted on the PCB horizontally at least partially within the mounting area and including a first side surface, a second side surface opposite the first side surface, first and second electrode pads disposed at the first side surface, and a third electrode pad disposed at the second side surface; and an electrolytic capacitor including a dielectric extending in the first direction, a first electrode, and a second electrode spaced apart from the first electrode in the second direction, wherein the electrolytic capacitor is mounted on the case by connecting the first electrode to the first electrode pad and connecting the second electrode to the second electrode pad, and the case is horizontally mounted within the mounting area of the PCB by connecting the first electrode pad to the first contact terminal, connecting the second electrode pad to the second contact terminal, and connecting the third electrode pad to the third contact terminal.

According to an embodiment, a capacitor module configured to be horizontally mounted on a Printed Circuit Board (PCB), the PCB having an upper surface and a lower surface extending horizontally in a first direction and a second direction perpendicular to the first direction, the capacitor module comprising: a case including a frame, a first side surface, a second side surface opposite to the first side surface, a third side surface connecting the first side surface and the second side surface, first and second electrode pads disposed at the first side surface, and a third electrode pad disposed at the third side surface; and a cylindrical electrolytic capacitor including a dielectric extending in the first direction, a first electrode contacting the first electrode pad, and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from the second electrode pad in the second direction, and the frame substantially surrounds a side surface of the cylindrical electrolytic capacitor.

Drawings

The foregoing and other objects and features of the inventive concept can be readily understood by considering the following detailed description in conjunction with the accompanying drawings, in which:

fig. 1 is a perspective view illustrating an electronic device according to an embodiment of the inventive concept;

FIG. 2 is a side view of FIG. 1;

fig. 3A, 3B, 3C and 4 are views variously showing a conventional comparative example of an electronic device including an electrolytic capacitor vertically mounted on a PCB;

fig. 5 is a view illustrating an electronic device including a capacitor module according to an embodiment of the inventive concept;

fig. 6A is a conceptual diagram further illustrating the electronic device of fig. 5, and fig. 6B is an exploded perspective view further illustrating the electronic device of fig. 5;

fig. 6C is a sectional view further illustrating a contact surface of a capacitor module according to an embodiment of the inventive concept;

fig. 7A, 7B, 7C, 8A, 8B, and 8C are views variously showing an electronic device according to an embodiment of the inventive concept, respectively;

fig. 9A is a plan view (or top view) illustrating an electronic device including a capacitor module according to an embodiment of the inventive concept;

FIG. 9B is an inverted view of the electronic device of FIG. 9A; and

fig. 10 is a perspective view illustrating an electronic apparatus including an electronic device according to an embodiment of the inventive concept.

Detailed Description

Embodiments of the inventive concept will now be described in more detail with reference to the accompanying drawings. Unless otherwise defined, all terms (including technical or scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. These terms, as defined in general dictionaries, should be interpreted as having a meaning that is consistent with their contextual meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Throughout the written description and drawings, the same reference numbers and labels are used to refer to the same or similar elements and/or features. Throughout this written description, certain geometric terms may be used to emphasize relative relationships between elements, components, and/or features of certain embodiments relative to the inventive concept. Those skilled in the art will recognize that such geometric terms are relative in nature and are arbitrary in describing relationships and/or aspects with respect to the illustrated embodiments. Geometric terms may include, for example: height/width; vertically and horizontally; top/bottom; higher/lower; closer/farther; thicker/thinner; proximal/distal; upper/lower; lower/upper; up/down; center/side; a periphery; stacking/bottoming; and so on.

In all figures, the first, second and third directions (D1, D2 and D3) are shown. Assuming that in an arbitrarily defined set of axes, the first direction D1 can be understood as the first horizontal direction in which the capacitor modules mainly extend; the second direction D2 may be understood as a second horizontal direction substantially perpendicular to the first direction D1; and the third direction D3 may be understood as a vertical direction perpendicular to a plane defined by the first direction D1 and the second direction D2. Here, a plane defined by the first direction D1 and the second direction D2 may extend substantially parallel to a main surface of a Printed Circuit Board (PCB), and the third direction D3 may be a direction in which electrode pads of the capacitor module and contact terminals of the PCB are connected.

Fig. 1 is a perspective view illustrating an electronic device according to an embodiment of the inventive concept in a relevant part. Referring to fig. 1, an electronic device may include a PCB and a capacitor module 100 mounted on the PCB. In some embodiments, the electronic device may be a circuit including various electronic components, such as a Solid State Disk (SSD), a motherboard, and the like.

The capacitor module 100 may be electrically connected to one or more circuits or modules of an electronic device through a PCB. For example, assuming that the electronic device is an SSD, the capacitor module 100 may be electrically connected to a controller, a buffer memory, a flash memory, an I/O port, etc. through a PCB.

The capacitor module 100 may generally include an electrolytic capacitor 110 and a case 120. As will be understood by those skilled in the art, the electrolytic capacitor 110 will include an anode and a cathode, and may be used (e.g., charged and discharged) to store/provide electrical energy. In some embodiments, the electrolytic capacitor 110 may be an aluminum (Al) electrolytic capacitor. In this regard, the electrolytic capacitor 110 will comprise a dielectric. For example, the dielectric of the electrolytic capacitor 110 may include an aluminum thin film disposed within a cylindrical metal case and extending in the first direction D1. In this example, the dielectric of the electrolytic capacitor 110 may store electric energy using an aluminum oxide film formed on the surface of the aluminum thin film.

The housing 120 may be used to mechanically "mount" (e.g., attach, bond, mechanically connect, mechanically contact, and/or electrically connect) the electrolytic capacitor 110. In this regard, the case 120 may protect the electrolytic capacitor 110 from environmental factors and physical impact. In some embodiments, the housing 120 will be physically secured to the electrolytic capacitor 110. The case 120 may include electrode pads for mounting the anode and the cathode of the electrolytic capacitor 110, respectively.

In fig. 1 and 2, the case 120 includes a first electrode pad 121a, a second electrode pad 121b, and a frame 122. The first electrode pad 121a may be mounted (e.g., mechanically and/or electrically connected) to one of the anode and the cathode of the electrolytic capacitor 110. The second electrode pad 121b may be mounted to the other of the anode and the cathode of the electrolytic capacitor 110. The frame 122 may substantially surround at least a portion of the electrolytic capacitor 110.

In some embodiments, the first and second electrode pads 121a and 121b may mechanically support the capacitor module 100 mounted on the PCB and may stably fix the capacitor module 100 mounted on the PCB. In addition, the first and second electrode pads 121a and 121b may provide an electrical connection path for transmitting/receiving electrical energy to/from the anode and cathode of the electrolytic capacitor 110.

In some embodiments, the capacitor module 100 may be electrically connected to the PCB through the first and second electrode pads 121a and 121 b. The capacitor module 100 may transmit/receive power to/from a device electrically connected to (or electrically connected through) a PCB or another component mounted on the PCB. That is, the electrolytic capacitor 110 may be charged or discharged through the first electrode pad 121a and the second electrode pad 121 b.

In some embodiments, the housing 120 may further include at least one electrode pad mechanically connecting (or fixing) the capacitor module 100 to the PCB. For example, the housing 120 may also include at least one dummy electrode pad (not shown in fig. 1) that mechanically supports the capacitor module 100 on the PCB. One example of a capacitor module including at least one dummy electrode pad will be described in more detail with reference to fig. 5.

In some embodiments, capacitor module 100 may be mounted on a PCB using an automated manufacturing process such as Surface Mount Technology (SMT). That is, the electrode pads 121a and 121b of the case 120 of the capacitor module 100 may be mounted on the PCB using this type of automated manufacturing process. Accordingly, since the electronic device including the capacitor module 100 may be manufactured using an automated manufacturing process, a defect rate associated with the electronic device may be reduced and productivity of the electronic device may be improved as compared to a non-automated assembly process (e.g., manual soldering).

In some embodiments, the electronic device may be an SSD that meets the Low-Profile PCI Express (PCIe) standard. That is, the electrolytic capacitor 110 may be a power supply unit configured to supply power (i.e., capacitive charge) satisfying the low-profile PCIe standard. Other electronic components typically associated with low profile PCIe designs may be mounted on the PCB.

The electrolytic capacitor 110 may have a volume consistent with the overall design of the electronic device and its intended function of the design. As an example, assuming that the electrolytic capacitor 110 is an aluminum electrolytic capacitor, the electrolytic capacitor 110 may have a relatively large size compared to other capacitor types (e.g., multilayer ceramic capacitors, tantalum capacitors, etc.), but may be manufactured at a lower cost than the other capacitor types. Thus, the electrolytic capacitor 110 may have a defined volume necessary to accumulate a charge corresponding to a desired capacitance.

Embodiments of the inventive concept provide a method of reducing wasted installation space that is typically associated with conventional methods of installation of electrolytic capacitors. For example, the electrolytic capacitor 110 of fig. 1 may be horizontally mounted on a PCB to minimize wasted mounting space.

In contrast, electrolytic capacitors are typically mounted on the surface of a PCB in a perpendicular orthogonal orientation using conventional methods. That is, the electrolytic capacitor is conventionally mounted on the PCB in the third direction D3 using the nomenclature established above. Unfortunately, because the conventionally mounted electrolytic capacitors project upwardly from the PCB, the physical volume required to house the PCB within the electronic device is very large due to the size and location of the electrolytic capacitors. This results in a considerable amount of wasted installation space.

In sharp contrast, as shown in fig. 1, some embodiments of the inventive concept may include a capacitor module 100, the capacitor module 100 including an electrolytic capacitor 110 horizontally mounted on a PCB. This configuration reduces the wasted mounting space typically associated with PCBs (e.g., space vertically above the horizontal upper surface of the PCB, and/or space vertically below the horizontal lower surface of the PCB). The result is a reduced vertical profile (or height) of an electronic device incorporating a PCB, thereby improving the integration of the electronic device.

Fig. 2 is a side view (e.g., from the first direction D1) further illustrating the electronic device of fig. 1. Here, the capacitor module 100 may be mounted on the PCB on substantially the same plane as the main surfaces (i.e., upper and lower surfaces) of the PCB. For example, the capacitor module 100 may be mounted to substantially overlap a portion of the PCB such that the capacitor module 100 occupies space both below and above the PCB, as measured in the third direction D3.

Thus, unlike conventionally mounted and vertically oriented electrolytic capacitors, the capacitor module 100 of fig. 2 shares a vertical space with the PCB, the vertical space having a first height L1 corresponding to the thickness of the PCB (measured in the third direction D3). Further, the frame 122 of the case 120 of the capacitor module 100 may extend vertically above the PCB by a second height L2, and the body (e.g., having a cylindrical radius) of the electrolytic capacitors 110 of the capacitor module 100 may extend vertically below the PCB by a third height L3.

In some embodiments, the first height L1 may be about 1.0mm, the second height L2 may be about 1.7mm, and the third height L3 may be about 2.6 mm. However, the scope of the inventive concept is not limited thereto, and the first height L1, the second height L2, and the third height L3 may vary depending on, for example, design, intended use, specification requirements, the number of components mounted on the PCB, and the like.

Fig. 3A, 3B, and 3C are views variously showing a conventional comparative example of an electronic device including an electrolytic capacitor vertically mounted on a PCB.

Referring to fig. 3A, the electronic device may include an electrolytic capacitor 10 vertically mounted on a PCB. In this case, a vertical space equal to the height of the electrolytic capacitor 10 (e.g., a cylinder) may become a wasted mounting space with respect to the PCB, thereby increasing the overall physical size of the electronic device and reducing the integration of the electronic device.

Referring to fig. 3B, the electronic device includes an electrolytic capacitor 20 vertically mounted on a PCB. Here, the electrolytic capacitor 20 may include a first electrode 21a, a second electrode 21b, and a dielectric 22. One of the first electrode 21a and the second electrode 21b may be an anode, and the other may be a cathode. Dielectric 22 may be a medium capable of storing electrical energy.

In the illustrated example of fig. 3B, the first electrode 21a and the second electrode 21B of the electrolytic capacitor 20 may be connected to the PCB using a soldering process. As a result, the PCB including the electrolytic capacitor 20 may suffer from a relatively high defect rate and a low production rate, compared to the embodiment of the inventive concept using an automated manufacturing process.

Referring to fig. 3C, the electronic device includes a plurality of tantalum capacitors 30 mounted on a PCB. Here, the tantalum capacitor 30 is vertically mounted on the PCB, and thus, a vertical space at least equal to the height of the tantalum capacitor 30 may become a wasted mounting space with respect to the upper (or lower) surface of the PCB on which the tantalum capacitor 30 is mounted.

The foregoing conventional results are further illustrated in the conceptual diagram of fig. 4. Here, a PCB, an electrolytic capacitor 10, and an electronic device disposed on the PCB are shown.

Each electrolytic capacitor 10 may include a first electrode 11a and a second electrode 11 b. The electrolytic capacitor 10 may be mounted on the PCB using a surface mounting technique, but a vertical space above the PCB equal to the height of the electrolytic capacitor 10 may become a wasteful mounting space.

Fig. 5 is a plan view (or top view) illustrating an electronic device including a PCB and a horizontally mounted capacitor module according to an embodiment of the inventive concept. Here, it is again assumed that the capacitor module 100 includes the electrolytic capacitor 110 and the case 120. The case 120 includes a first electrode pad 121a, a second electrode pad 121b, a third electrode pad 121c, and a frame 122. The first electrode pad 121a, the second electrode pad 121b, and the frame 122 may be substantially similar to the first electrode pad 121a, the second electrode pad 121b, and the frame 122 of fig. 1, respectively.

As an example, it is assumed that the electrolytic capacitor 110 is an aluminum electrolytic capacitor horizontally mounted on a PCB through the case 120. In contrast to the comparative examples of fig. 3A, 3B, 3C, and 4, the electrolytic capacitor 110 of fig. 5 may be mounted at least partially horizontally within (e.g., extending horizontally along) an opening in a PCB. Therefore, a vertical space at least equal to the thickness of the PCB can be avoided from becoming a wasted mounting space. This results in an increase in the integration of the electronic device including the PCB mounted with the electrolytic capacitor 110.

As described above, some embodiments of the inventive concept provide a case (e.g., the case 120) including at least one dummy electrode pad (e.g., the third electrode pad 121 c). Here, the dummy electrode pad is a component unrelated to charging/discharging the electrolytic capacitor 110. Instead, the dummy electrode pad may mechanically support the electrolytic capacitor 110 mounted on the PCB. In this regard, the dummy electrode pads may be variously located within the case 120 according to design.

In some embodiments, the dummy electrode pad of the case 120 may be electrically floated. That is, the dummy electrode pad may not be electrically connected to the anode or the cathode of the electrolytic capacitor 110. Alternatively, the dummy electrode pad of the case 120 may be electrically grounded (e.g., connected to the cathode of the electrolytic capacitor 110, for example, through a separate conductive line).

Fig. 6A is a conceptual diagram further illustrating the electronic device of fig. 5, and fig. 6B is an exploded perspective view further illustrating the electronic device of fig. 5. Fig. 6C is a sectional view further illustrating contact surfaces (e.g., CSa, CSb, and CSc) of the electrode pads 121a, 121b, and 121C of the case 120.

Referring to fig. 6A, 6B, and 6C, an electronic device including a PCB and a capacitor module 100 is shown. The capacitor module 100 may include an electrolytic capacitor 110 and a case 120. The electrolytic capacitor 110 may include a first electrode 111a, a second electrode 111b, and a dielectric 112. One of the first electrode 111a and the second electrode 111b may be an anode, and the other may be a cathode. Dielectric 112 may be a medium capable of storing electrical energy.

The case 120 may include a first electrode pad 121a, a second electrode pad 121b, a third electrode pad 121c, and a frame 122. The housing 120 may extend primarily in the first direction D1. The housing 120 may have a first side surface SS1 extending mainly in a second direction D2 crossing the first direction D1 and an opposite (or facing) second side surface SS 2. For example, the first side surface SS1 and the second side surface SS2 may correspond to respective surfaces of the frame 122.

The first electrode pad 121a may be connected to the first side surface SS1 of the case 120, and the first electrode 111a of the electrolytic capacitor 110 may be mounted. The second electrode pad 121b spaced apart from the first electrode pad 121a in the second direction D2 may be connected to the first side surface SS1 of the case 120, and the second electrode 111b of the electrolytic capacitor 110 may be mounted. The third electrode pad 121c may be connected to the second side surface SS2 of the case 120. The case 120 may further include one or more dummy electrode pads.

In some embodiments, the electrode pads 121a, 121b, and 121c may include respective contact surfaces. For example, as shown in fig. 6C, the first electrode pad 121a may include a first contact surface CSa, the second electrode pad 121b may include a second contact surface CSb, and the third electrode pad 121C may include a third contact surface CSc. The first contact surface CSa, the second contact surface CSb, and the third contact surface CSc may be disposed on the same plane. The capacitor module 100 may be mounted on the PCB through the first contact surface CSa, the second contact surface CSb, and the third contact surface CSc.

The PCB may include a mounting area RG (e.g., an opening cut into the PCB and having a size sufficient to accommodate the capacitor module 100) and first, second, and third contact terminals Ta, Tb, and Tc disposed adjacent to the mounting area RG. In particular, the mounting region RG has a length in the first direction sufficient to allow the capacitor module 100 to be horizontally mounted on the PCB. In some embodiments, the mounting region RG may have a width wider than that of the capacitor module 100 in the second direction.

In some embodiments, the capacitor module 100 may be mounted on a PCB by bonding or connection between the contact terminals Ta, Tb and Tc and the contact surfaces CSa, CSb and CSc.

In some embodiments, the first contact terminal Ta, the second contact terminal Tb, and/or the third contact terminal Tc may be flat contact surfaces, respectively. Here, for example, the first contact terminal Ta (or the second contact terminal Tb or the third contact terminal Tc) may be a contact surface horizontally extending on the upper (or lower) surface of the PCB. Alternatively, the first contact terminal Ta (or the second contact terminal Tb or the third contact terminal Tc) may be a contact surface recessed in the PCB and extending across the PCB. Alternatively, the first contact terminal Ta (or the second contact terminal Tb or the third contact terminal Tc) may be a contact surface at least partially disposed within and extending across the PCB.

In the illustrated example of fig. 6B, the first contact terminal Ta is connected to the first electrode pad 121a of the capacitor module 100, the second contact terminal Tb is connected to the second electrode pad 121B of the capacitor module 100, and the third contact terminal Tc is connected to the third electrode pad 121c of the capacitor module 100. Accordingly, the first contact surface CSa of the first electrode pad 121a may contact the first contact terminal Ta, the second contact surface CSb of the second electrode pad 121b may contact the second contact terminal Tb, and the third contact surface CSc of the third electrode pad 121c may contact the third contact terminal Tc. For example, the first contact surface CSa of the first electrode pad 121a, the second contact surface CSb of the second electrode pad 121b, and the third contact surface CSc of the third electrode pad 121c may be parallel to the first contact terminal Ta, the second contact terminal Tb, and the third contact terminal Tc.

In this respect, the respective connections between the first contact terminal Ta and the first contact surface CSa, between the second contact terminal Tb and the second contact surface CSb and between the third contact terminal Tc and the third contact surface CSc are not limited to only those described above, and the skilled person will appreciate that many different methods may be taken to achieve these mechanical and/or electrical connections. The first, second, and third contact terminals Ta, Tb, and Tc may be disposed on the upper and/or lower surfaces of the PCB, respectively.

The PCB may further include additional structures (e.g., fourth contact terminals) having different sizes and shapes that effectively support the capacitor module 100 being mounted on the PCB.

In some embodiments, the PCB may be manufactured in a size as small as the mounting region RG allows in consideration of the size of the horizontally mounted capacitor module 100. The dielectric 112 of the electrolytic capacitor 110 may have a cylindrical shape defining a diameter (e.g., a total vertical height (up and down from a plane defined by the major surface of the PCB) in the third direction D3) and a radius (e.g., a partial vertical height (up or down from a plane defined by the major surface of the PCB) in the third direction D3).

However, for convenience of assembly, the width of processing or troubleshooting the mounting region RG of the PCB may be greater than the width of the electrolytic capacitor 110. Accordingly, since the overall size of the PCB may be reduced accordingly with respect to the mounting area RG, the integration degree of the electronic device may be improved.

Those skilled in the art will recognize that the foregoing examples of fig. 6A, 6B, and 6C are merely exemplary in nature. The number, size, shape and position of the contact terminals Ta, Tb and Tc and the number, size, shape and position of the electrode pads 121a, 121b and 121c may vary according to design, and the scope of the inventive concept is not limited to only the exemplary examples.

Fig. 7A, 7B, and 7C are views illustrating an electronic device according to an embodiment of the inventive concept. Hereinafter, the first side surface SS1, the second side surface SS2, the third side surface SS3, and the fourth side surface SS4 of the case 120 are labeled, and the frame 122 includes the respective first side surface SS1, the second side surface SS2, the third side surface SS3, and the fourth side surface SS 4. In the illustrated example, the first side surface SS1 is disposed at one end of the frame 122 in the first direction D1, and the second side surface SS2 is opposite to the first side surface SS 1. The third side surface SS3 and the opposite fourth surface SS4 connect the first side surface SS1 and the second side surface SS 2.

Referring to fig. 7A, the electronic device includes a PCB and a capacitor module 100 horizontally mounted on the PCB. It is assumed that the capacitor module 100 includes the electrolytic capacitor 110 and the case 120, wherein the case 120 includes the first electrode pad 121a, the second electrode pad 121b, the third electrode pad 121c, and the frame 122. The first and second electrode pads 121a and 121b may be connected to the first side surface SS1 of the case 120, and the third electrode pad 121c may be connected to the second side surface SS2 of the case 120.

It is assumed that the PCB includes a mounting region RG, a first contact terminal Ta, a second contact terminal Tb, and a third contact terminal Tc. The first, second, and third contact terminals Ta, Tb, and Tc may be disposed adjacent to the mounting region RG. For example, the first and second contact terminals Ta and Tb may be disposed adjacent to each other at one end of the region RG, and the third contact terminal Tc may be disposed at the other end of the mounting region RG.

The capacitor module 100 may be horizontally mounted within the mounting region RG of the PCB. For example, the first contact surface CSa of the first electrode pad 121a may contact the first contact terminal Ta, the second contact surface CSb of the second electrode pad 121b may contact the second contact terminal Tb, and the third contact surface CSc of the third electrode pad 121b may contact the third contact terminal Tc.

In this regard, the first contact surface CSa of the first electrode pad 121a and the second contact surface CSb of the second electrode pad 121b may be opposite to the third contact surface CSc of the third electrode pad 121C (see, e.g., fig. 6C).

In some embodiments, one of the first and second electrode pads 121a and 121b is connected to an anode of the electrolytic capacitor 110, and the other is connected to a cathode of the electrolytic capacitor 110. The third electrode pad 121c is a dummy electrode pad.

Referring to fig. 7B, an electronic device substantially similar to the electronic device of fig. 7A is illustrated, except that the third electrode pad 121c at the second side surface SS2 of the electrolytic capacitor 110 is replaced with a fourth electrode pad 121d at the third side surface SS3 of the electrolytic capacitor 110 and the third contact terminal Tc is replaced with a fourth contact terminal Td. Here, instead of making the first contact surface CSa and the second contact surface CSb opposite, a fourth contact terminal Td is provided on the PCB to receive the fourth electrode pad 121d provided on the third side surface SS3 of the electrolytic capacitor 110. That is, the capacitor module 100 of fig. 7B is different from the capacitor module 100 of fig. 7A in the positioning of the dummy electrode pads.

Referring to fig. 7C, an electronic device combining the second electrode pad 121B (first dummy electrode pad) of fig. 7A with the fourth electrode pad 121d (second dummy electrode pad) of fig. 7B and combining the corresponding second contact terminal Tb and fourth contact terminal Td of the PCB is shown. This is an example of an electronic device that incorporates more than one dummy electrode pad to mechanically support the capacitor module 100 horizontally mounted on a PCB.

The illustrated embodiments of fig. 5, 6A, 6B, 7A, 7B, and 7C are respective examples in which the capacitor module is horizontally mounted on the PCB in a longitudinal manner. It is assumed that the mounting area RG in the PCB is oriented such that the capacitor module will be mounted at least partially in the mounting area according to its length extending across the horizontal width of the PCB (e.g. mainly defined by the largest dimension of the electrolytic capacitor 110).

In contrast, fig. 8A, 8B, and 8C are various views illustrating an electronic device including a capacitor module horizontally mounted on a PCB in a lateral manner according to an embodiment of the inventive concept. That is, unlike the capacitor module 100 (e.g., the embodiments of fig. 7A, 7B, and 7C) horizontally mounted on the PCB in a direction perpendicular to the extension of the anode and cathode of the electrolytic capacitor 110, the capacitor module 100 according to the embodiments shown in fig. 8A, 8B, and 8C may be horizontally mounted on the PCB in a direction parallel to the extension of the anode and cathode of the electrolytic capacitor 110. As a result, it may be assumed that the mounting area RG in the PCB is oriented such that the capacitor module will be mounted at least partially in the mounting area according to its width extending across the horizontal width of the PCB (e.g., defined primarily by a dimension less than the maximum dimension of the electrolytic capacitor 110).

Referring to fig. 8A, the electronic device includes a PCB and a capacitor module 100 mounted at least partially horizontally within the PCB. The capacitor module 100 may again include the electrolytic capacitor 110 and the case 120, wherein the case 120 may include a first electrode pad 121a, a second electrode pad 121b, a third electrode pad 121c, and a frame 122. Here, the first and second electrode pads 121a and 121b may be connected to the first side surface SS1 of the case 120, and the third electrode pad 121c may be connected to the third side surface SS3 of the case 120.

The PCB may again include a mounting area RG and first, second and third contact terminals Ta, Tb and Tc respectively disposed adjacent to the mounting area RG. Here, the first and second contact terminals Ta and Tb may be adjacent to the mounting region RG in the second direction D2, and the third contact terminal Tc may be adjacent to the mounting region RG in the first direction D1.

As before, the capacitor module 100 may be horizontally mounted within the mounting region RG of the PCB. For example, the first contact surface CSa of the first electrode pad 121a may contact the first contact terminal Ta, the second contact surface CSb of the second electrode pad 121b may contact the second contact terminal Tb, and the third contact surface CSc of the third electrode pad 121c may contact the third contact terminal Tc. Here, the first and second contact terminals Ta and Tb may be disposed adjacent to the first side surface SS1 of the capacitor module 100 when the capacitor module 100 is horizontally mounted on the PCB, and the third contact terminal Tc may be disposed adjacent to the third side surface SS3 when the capacitor module 100 is horizontally mounted on the PCB.

In some embodiments, one of the first and second electrode pads 121a and 121b may be connected with an anode of the electrolytic capacitor 110, and the other of the first and second electrode pads 121a and 121b is connected with a cathode of the electrolytic capacitor 110, and the third electrode pad 121c may be a dummy electrode pad.

Referring to fig. 8B, the capacitor module 100 of fig. 8B is substantially similar to the capacitor module 100 of fig. 8A except that the third electrode pad 121c at the third side surface SS2 of the electrolytic capacitor 110 is replaced with a fourth electrode pad 121d at the fourth side surface SS3 of the electrolytic capacitor 110 and the third contact terminal Tc on the PCB is replaced with a fourth contact terminal Td. That is, the capacitor module 100 of fig. 8B is different from the capacitor module 100 of fig. 8A in the positioning of the dummy electrode pads.

Referring to fig. 8C, an electronic device is shown that combines the second electrode pad 121B (first dummy electrode pad) of fig. 8A and the fourth electrode pad 121d (second dummy electrode pad) of fig. 8B, and the corresponding second contact terminal Tb and fourth contact terminal Td on the PCB. This is another example of an electronic device that incorporates more than one dummy electrode pad to mechanically support a capacitor module 100 mounted horizontally on a PCB.

Fig. 9A is a plan view illustrating an upper surface of a PCB including electronic circuits EC of a plurality of capacitor modules 100 horizontally mounted on the constituent PCB (e.g., downward in a third direction D3) according to an embodiment of the inventive concept.

Here, for example, the electronic circuit EC assumes that four (4) capacitor modules 100 are horizontally mounted on a single PCB. However, this is only one example, and the scope of the inventive concept is not limited thereto, as any reasonable number of capacitor modules 100 may be horizontally mounted on one or more PCBs within the electronic circuit EC.

In some embodiments, the electronic circuit EC may also comprise other components (conductive patterns, resistors, integrated circuits or chips, logic gates, buffer memory, non-volatile memory, etc.) mounted on the upper and/or lower surface of the PCB using, for example, various surface mount technologies.

Since the plurality of capacitor modules 100 and other electronic components can be mounted on the PCB using the surface mounting technology as described above, the productivity of the electronic circuit EC can be improved as compared with a manufacturing method including a hybrid process such as manual soldering. As a result, the defect rate of the electronic circuit EC will be relatively low.

Fig. 9B is a plan view (e.g., upward in the third direction D3) illustrating a lower surface of a PCB including electronic circuits EC of a plurality of capacitor modules 100 horizontally mounted on the constituent PCB according to an embodiment of the inventive concept. That is, fig. 9B is a reverse plan view of fig. 9A.

As shown in fig. 9A and 9B, the electronic circuit EC may include a plurality of capacitor modules 100, wherein each capacitor module 100 includes an electrolytic capacitor and is horizontally mounted on a PCB, as described above. Therefore, the integration of the electronic circuit EC can be improved.

Fig. 10 is a perspective view illustrating an electronic device ED according to an embodiment of the inventive concept. Referring to fig. 10, the electronic device ED may include the electronic circuit EC of fig. 9A and 9B and the cover case CC. In some embodiments, the electronic device ED may be an SSD.

Here, the cover case CC may protect the electronic circuit EC from environmental influences and mechanical shocks. For example, the electronic device ED may comprise a cover housing CC arranged on one side of the electronic circuit EC. Alternatively, the electronic device ED may further comprise another cover shell (not shown) arranged on the opposite side of the electronic circuit EC, wherein two (2) cover shells CC may be combined together to completely enclose the electronic circuit EC between them.

In some embodiments, the cover case CC may include one or more I/O port terminals extending through the cover case CC to connect the PCB with an external device. In this way, the electronic apparatus ED and the external device can be hard-wired via the I/O port terminal.

According to embodiments of the inventive concept, it is possible to improve the degree of integration with respect to a vertical installation space by horizontally mounting a capacitor module on a PCB. In addition, the productivity of electronic devices or circuits can be improved by applying a fully automatic manufacturing process such as a surface mounting technique. Further, when the capacitor module is horizontally mounted on the PCB, the structural stability of the resulting device or circuit may be improved by adding one or more dummy electrode pads that mechanically support the capacitor module.

The foregoing embodiments are illustrative in nature. Changes and modifications may be made to the exemplary embodiments without departing from the scope of the inventive concept.