阅读说明：本技术 一种薄型液晶玻璃基板的切割裂片方法 (A kind of cutting splitting method of slim liquid crystal glass base ) 是由 黄华达 于 2019-09-09 设计创作，主要内容包括：本发明公开了一种薄型液晶玻璃基板的切割裂片方法,应用于厚度为0.3mm以下的玻璃基板的切割,采用刀具角度为100-110度的刀具进行切割和裂片,该刀具对玻璃基板产生直线型界痕和/或异形界痕的同时自然裂片；直线型界痕和异形界痕分别满足一定的作业条件和规则。本发明适用于异形厚度为0.3mm以下超薄玻璃的切割工艺,界片的同时可以直接裂开,对于薄玻璃可以不用破片工序,避免使用外加力破片时造成的崩裂不良。同时将设备加入压力自动调整功能,刀头压力根据设定值通过压力阀调整,以保证薄玻璃均匀的界痕,利于裂片。(The invention discloses a kind of cutting splitting methods of slim liquid crystal glass base, applied to the cutting with a thickness of 0.3mm glass substrate below, cutting-tool angle is used to carry out cutting and sliver, nature sliver while which generates linear type circle trace and/or special-shaped boundary's trace to glass substrate for the cutter of 100-110 degree；Linear type circle trace and special-shaped boundary trace meet certain operating condition and rule respectively.The present invention is suitable for abnormity with a thickness of the cutting technique of 0.3mm or less ultra-thin glass, and boundary's piece while can directly split, and can not have to fragmentation process for thin glass, avoids bad using bursting apart caused by when applied force fragmentation.Pressure automatic-regulating function is added in equipment simultaneously, pressure of cutter head is adjusted according to setting value by pressure valve, to guarantee the uniform boundary's trace of thin glass, is conducive to sliver.)

1. a kind of cutting splitting method of slim liquid crystal glass base, which is characterized in that be applied to a thickness of 0.3mm glass below The cutting of glass substrate, uses cutting-tool angle to carry out cutting and sliver for the cutter of 100-110 degree, which generates glass substrate Nature sliver while linear type circle trace and/or special-shaped boundary's trace；

The operating condition of linear type circle trace: 1) depth of cut is 0.1-0.25mm, 2) cutter is to the cutting pressure of glass substrate 0.05-0.1Mpa；

The operating condition of special-shaped boundary's trace: 1) depth of cut 0.1-0.25mm, 2) cutter is 0.05- to the cutting pressure of glass substrate 0.15Mpa；

Cutting pressure and depth of cut are according to following rule adjustment: 1) thickness of glass substrate and cutting pressure, depth of cut at Proportional relation；2) under the thickness of same glass substrate, the cutting pressure of linear type circle trace is less than the cutting pressure of special-shaped boundary trace.

2. a kind of cutting splitting method of slim liquid crystal glass base according to claim 1, it is characterised in that: continuous In the case where cutting, all it is positioned as special-shaped boundary's trace different from the cutting profile of the first knife.

3. a kind of cutting splitting method of slim liquid crystal glass base according to claim 2, it is characterised in that: described The cutting profile of one knife is linear type, then special-shaped boundary's trace is arc-shaped side or bevel edge.

4. a kind of cutting splitting method of slim liquid crystal glass base according to claim 1, it is characterised in that: described to cut The pressure minimum control unit for cutting pressure is 0.001Mpa, and can set the cutting pressure of each knife.

5. a kind of cutting splitting method of slim liquid crystal glass base according to claim 1, it is characterised in that: the knife Tool is diamond break bar.

Technical field

The present invention relates to the processing technique field of liquid crystal glass base, especially a kind of cutting of slim liquid crystal glass base Splinter method.

Background technique

Now with liquid crystal flat panel display in the extensive use of every field, which there is product in market, proposes new want It asks, such as the special-shaped products such as ultra-thin, round, oval, shape changeable.Moreover, having requirements at the higher level to visual angle, contrast.City at present The glass of Chang Baoneng circle 0.3mm thickness, and be conventional rectangle.To meet market demands, while expanding company's specialities Production capacity effectively dominates the market, the ultra-thin special-shaped product of development & production, it is necessary to.But ultra-thin special-shaped product, sets product Meter, technique and equipment requirement are all very high, because thin glass is frangible, cannot bear too big pressure, and special-shaped sliver is more common Rectangle sliver is more difficult, and needs bigger strength that can just break, so more increasing production control difficulty.

Current general LCD product circle piece principle: the trace of certain depth is drawn in glass surface with boundary's piece knife: product is turned over Face, manually or with machine apply pressure from the tool marks back side: product under stress, splits along tool marks.When product thickness is than relatively thin When, the power of application can smash glass, so being unable to complete boundary's piece of thin glass with common method.

Summary of the invention

The technical problem to be solved by the present invention is in view of the above shortcomings of the prior art, provide a kind of slim liquid-crystalline glasses base The cutting splitting method of plate.

In order to solve the above technical problems, the technical solution used in the present invention is: a kind of slim liquid crystal glass base is cut Splinter method is cut, applied to the cutting with a thickness of 0.3mm glass substrate below, uses cutting-tool angle for the knife of 100-110 degree Tool carries out cutting and sliver, nature sliver while which generates linear type circle trace and/or special-shaped boundary's trace to glass substrate；Directly The operating condition of line style circle trace: 1) depth of cut is 0.1-0.25mm, 2) cutter is 0.05- to the cutting pressure of glass substrate 0.1Mpa；The operating condition of special-shaped boundary's trace: 1) depth of cut 0.1-0.25mm, 2) cutter is to the cutting pressure of glass substrate 0.05-0.15Mpa；Cutting pressure and depth of cut are according to following rule adjustment: 1) thickness of glass substrate and cutting pressure, cut It is proportional to cut depth；2) under the thickness of same glass substrate, the cutting pressure of linear type circle trace is less than special-shaped boundary trace Cutting pressure.

In above-mentioned technical proposal, in the case where continuous cutting, different from the first knife cutting profile be all positioned as it is described Special-shaped boundary's trace.

In above-mentioned technical proposal, the cutting profile of first knife is linear type, then special-shaped boundary's trace is arc-shaped side or bevel edge.

In above-mentioned technical proposal, the pressure minimum control unit of the cutting pressure is 0.001Mpa, and can be set The cutting pressure of each knife.

In above-mentioned technical proposal, the cutter is diamond break bar.

The beneficial effects of the present invention are: it is suitable for special-shaped cutting tool and technique with a thickness of 0.3mm or less ultra-thin glass, Cutting tool is the diamond break bar using the Thief zone of more low-angle, is allowed under a certain pressure than common break bar vertical fissure trace It is deeper.It can directly split while boundary's piece, fragmentation process can not had to for thin glass, made when avoiding using applied force fragmentation At burst apart it is bad.Pressure automatic-regulating function is added in equipment simultaneously, pressure of cutter head is adjusted according to setting value by pressure valve, Each lines can set different cutting pressures, and pressure minimum controls unit 0.001Mpa, to guarantee the uniform boundary of thin glass Trace is conducive to sliver.

Specific embodiment

The present invention is described in further detail for lower mask body.

A kind of cutting splitting method of slim liquid crystal glass base, applied to a thickness of 0.3mm glass substrate below Cutting uses cutting-tool angle to carry out cutting and sliver for the cutter of 100-110 degree, and cutter is diamond break bar, and the cutter is to glass Nature sliver while glass substrate generates linear type circle trace and/or special-shaped boundary's trace；The operating condition of linear type circle trace: 1) cutting is deep Degree is 0.1-0.25mm, 2) cutter is 0.05-0.1Mpa to the cutting pressure of glass substrate, and pressure minimum control unit is 0.001Mpa；The operating condition of special-shaped boundary's trace: 1) depth of cut 0.1-0.25mm, 2) cutter is to the cutting pressure of glass substrate 0.05-0.15Mpa, it is 0.001Mpa that pressure minimum, which controls unit,；Cutting pressure and depth of cut are according to following rule adjustment: 1) thickness of glass substrate and cutting pressure, depth of cut are proportional；2) under the thickness of same glass substrate, linear type circle The cutting pressure of trace is less than the cutting pressure of special-shaped boundary trace.When cutting pressure is less than 0.05Mpa, boundary's trace is relatively shallower, it is not easy to It splits；When cutting pressure is greater than 0.15Mpa, the flank of tool is larger to the transverse pressure of glass substrate, and glass substrate is easy to happen It bursts apart, it is irregular bad that the edge after splitting has zigzag.

Wherein, in the case where continuous cutting, all it is positioned as special-shaped boundary's trace different from the cutting profile of the first knife.Example Such as an embodiment: the cutting profile of first knife is linear type, then special-shaped boundary's trace is arc-shaped side or bevel edge.

The above embodiments are merely illustrative and not limiting of the invention, therefore all according to described in present patent application range The equivalent change or modification done of method, be included in the scope of the patent application of the present invention.