阅读说明：本技术 带有具有用于上部封装的激光钻孔的开口的模制基底的堆叠电路封装 (The stacked circuit encapsulation of molded substrate with the opening with the laser drill for top encapsulation ) 是由 约翰·D·布拉兹尔 弗雷德里克·E·贝维尔 大卫·R·Ng 迈克尔·J·安德森 应玉成 于 2019-03-12 设计创作，主要内容包括：描述了堆叠的封装配置,包括底部封装和上部封装。底部封装包括基板,该基板具有带有第一电路的顶部表面以及金属第一焊盘。然后在基板上方形成模制层。然后通过模制层的孔经过激光钻孔以暴露第一焊盘。孔和第一焊盘与上部封装的引线对齐,后者包含更多的电路组件。然后用焊膏部分填充孔。在模制层和上部封装之间施加热环氧树脂。然后将上部封装的引线插入孔中,并将焊膏回流以电、热和机械连接上部封装到底部封装。回流热还可以固化环氧树脂。然后在基板的底部形成球栅阵列。(Describe the package arrangements of stacking, including bottom package and top encapsulation.Bottom package includes substrate, which has the first pad of top surface and metal with the first circuit.Then moulding layer is formed above substrate.Then laser drill is passed through to expose the first pad by the hole of moulding layer.Hole and the first pad are aligned with the lead that top encapsulates, and the latter includes more circuit units.Then hole is partially filled with soldering paste.Apply hot epoxy resin between moulding layer and top encapsulation.Then the lead that top encapsulates is inserted in the hole, and solder paste reflow is encapsulated into bottom package with electricity, heat and mechanical connection top.Reflux heat can be with cured epoxy resin.Then ball grid array is formed in the bottom of substrate.)