阅读说明：本技术 二阶段固化型导热性有机硅组合物及其制造方法 (Two-stage curing type heat-conductive silicone composition and method for producing same ) 是由 铃村克之 于 2018-11-15 设计创作，主要内容包括：本发明提供包含有机硅成分、导热性粒子和固化成分的二阶段固化型导热性有机硅组合物3a、3b,其中,包含(A)100重量份的聚有机硅氧烷、(B)相对于A成分为100～2500重量份的导热性粒子、(C)作为上述聚有机硅氧烷的固化催化剂的铂族系金属催化剂、(D)相对于A成分为0.01～5重量份的有机过氧化物,在一次固化温度下使其进行一次固化,可以在比上述一次固化温度高的温度下进行二次固化,上述一次固化后的二阶段固化型导热性有机硅组合物的热导率为0.2～17W/m·K,硬度以ASKER C计为5～80。(The present invention provides two-stage curing heat-conductive silicone compositions 3a and 3B containing a silicone component, heat-conductive particles, and a curing component, wherein the two-stage curing heat-conductive silicone compositions comprise (A)100 parts by weight of polyorganosiloxane, (B) 100 to 2500 parts by weight of heat-conductive particles relative to the component A, (C) a platinum group metal catalyst as a curing catalyst for the polyorganosiloxane, and (D) 0.01 to 5 parts by weight of an organic peroxide relative to the component A, and are subjected to a primary curing at a primary curing temperature, and a secondary curing at a temperature higher than the primary curing temperature, wherein the two-stage curing heat-conductive silicone composition after the primary curing has a heat conductivity of 0.2 to 17W/m.K and a hardness of 5 to 80 in terms of ASKER C.)

1. A two-stage curing heat-conductive silicone composition comprising a silicone component, heat-conductive particles, and a curing component, characterized by comprising:

(A)100 parts by weight of polyorganosiloxane,

(B) 100 to 2500 parts by weight of a thermally conductive particle based on the component A,

(C) A platinum group metal catalyst as a curing catalyst for the polyorganosiloxane,

(D) 0.01 to 5 parts by weight of an organic peroxide based on the component A,

The primary curing is carried out at a primary curing temperature, the secondary curing may be carried out at a temperature higher than the primary curing temperature,

The two-stage curing type heat-conducting organic silicon composition after primary curing has the heat conductivity of 0.2-17W/m.K and the hardness of 5-80 in terms of ASKER C.

2. the two-stage curing heat-conductive silicone composition according to claim 1, wherein the platinum-group metal catalyst is contained in an amount of 0.01 to 1000ppm in terms of metal atom weight with respect to component A.

3. The two-stage curing type heat conductive silicone composition according to claim 1 or 2, wherein the polyorganosiloxane contains the following components:

(a) Base polymer component: a linear organopolysiloxane containing an average of 2 or more alkenyl groups bonded to silicon atoms at both ends of a molecular chain in 1 molecule;

(b) the cross-linking agent component: an organohydrogenpolysiloxane containing an average of 2 or more hydrogen atoms bonded to silicon atoms in 1 molecule;

the number of moles of the hydrogen atoms bonded to silicon atoms is an amount of less than 1 mole relative to 1 mole of the silicon atom-bonded alkenyl groups in the base polymer component.

4. the two-stage curing type heat conductive silicone composition according to any one of claims 1 to 3, wherein the silicone composition is formed into a sheet shape.

5. The two-stage curing heat-conductive silicone composition according to any one of claims 1 to 4, wherein the first curing is addition reaction curing using a platinum group metal catalyst, and the second curing is curing using a peroxide reaction.

6. The two-stage curing heat-conductive silicone composition according to any one of claims 1 to 5, wherein the hardness of the two-stage curing heat-conductive silicone composition after the secondary curing is 40 or more in ASKER C.

7. A method for producing a two-stage curing heat-conductive silicone composition according to any one of claims 1 to 6, comprising: mixing the following components A to D, molding the mixture into a predetermined shape, primary curing the resulting molded article at a primary curing temperature,

The once-cured molded article may be subjected to secondary curing at a temperature higher than the primary curing temperature,

The molded product after primary curing has a thermal conductivity of 0.2 to 17W/m.K, a hardness of 5 to 80 in terms of ASKER C,

(A)100 parts by weight of polyorganosiloxane,

(B) 100 to 2500 parts by weight of a thermally conductive particle based on the component A,

(C) A platinum group metal catalyst as a curing catalyst for the polyorganosiloxane,

(D) 0.01 to 5 parts by weight of an organic peroxide based on the component A.

8. The method for producing a two-stage curing heat-conductive silicone composition according to claim 7, wherein the platinum-group metal catalyst is contained in an amount of 0.01 to 1000ppm in terms of metal atom weight with respect to component A.

9. The method for producing a two-stage curing heat-conductive silicone composition according to claim 7 or 8, wherein the primary curing temperature is 100 ℃ or lower, and the secondary curing temperature exceeds the primary curing temperature.

10. A method for manufacturing an electronic component including a heat-generating portion and a heat-dissipating portion, comprising the steps of:

The two-stage curing heat-conductive silicone composition according to any one of claims 1 to 6 is disposed between the heat generating part and the heat dissipating part so as to be in contact with both the heat generating part and the heat dissipating part, and then heated at a temperature higher than the primary curing temperature to perform secondary curing,

The heating is performed by heat generated by the heat generating portion.

Technical Field

The present invention relates to a thermally conductive resin composition used for a thermally conductive member such as an electronic component and a method for producing the same. More specifically, the present invention relates to a two-stage curing type heat conductive silicone composition which is cured at different temperatures, and a method for producing the same.

Background

Semiconductors such as Computers (CPUs), transistors, and Light Emitting Diodes (LEDs) generate heat during use, and the performance of electronic components including these may be degraded by the heat. Therefore, in an electronic component generating heat, a heat dissipating unit is attached to a heat generating unit such as a CPU. Since the heat dissipation portion is mostly made of metal, the following method is adopted in order to improve the heat conductivity between the heat generation portion and the heat dissipation portion: a heat conductive composition in the form of a sheet or gel is interposed between a heat generating part and a heat radiating part to improve the adhesion therebetween and to improve the heat conductivity. Patent document 1 proposes that a polyorganosiloxane is pre-crosslinked in the presence of a catalytic amount of a platinum group metal compound, and an organic peroxide is blended with the obtained pre-crosslinked product to obtain a silicone rubber having low hardness and high rebound resilience. Patent document 2 proposes providing a surface printing layer on a base film, adding an ionic liquid to the surface printing layer to perform primary vulcanization, and performing secondary vulcanization at a temperature higher than the temperature of the primary vulcanization.

disclosure of Invention

Problems to be solved by the invention

However, depending on the target product, a heat conductive composition is required which is flexible before being disposed between a heat generating portion and a heat radiating portion and which is cured by heat of the heat generating portion after being disposed in the same portion, and there is a problem that cannot be dealt with by the above-mentioned conventional techniques.

In order to solve the above-mentioned conventional problems, the present invention provides a two-stage curing type heat conductive silicone composition which is cured at different temperatures, and a method for producing the same.

Means for solving the problems

The two-stage curing heat-conductive silicone composition of the present invention is a two-stage curing heat-conductive silicone composition containing a silicone component, heat-conductive particles, and a curing component, and is characterized by comprising:

(A)100 parts by weight of polyorganosiloxane,

(B) 100 to 2500 parts by weight of a thermally conductive particle based on the component A,

(C) a platinum group metal catalyst as a curing catalyst for the polyorganosiloxane,

(D) 0.01 to 5 parts by weight of an organic peroxide based on the component A,

The primary curing may be carried out at a primary curing temperature, the secondary curing may be carried out at a temperature higher than the primary curing temperature,

The two-stage curing type heat-conductive silicone composition after the primary curing has a heat conductivity of 0.2 to 17W/m.K and a hardness of 5 to 80 in terms of ASKER C.

The method for producing a two-stage curing heat-conductive silicone composition of the present invention is a method for producing a two-stage curing heat-conductive silicone composition of the present invention, comprising the steps of: mixing the following components A to D, molding the mixture into a predetermined shape, and curing the obtained molded product at a primary curing temperature; comprises the following steps:

(A)100 parts by weight of polyorganosiloxane,

(B) 100 to 2500 parts by weight of a thermally conductive particle based on the component A,

(C) a platinum group metal catalyst as a curing catalyst for the polyorganosiloxane,

(D) 0.01 to 5 parts by weight of an organic peroxide based on the component A,

And the molded article subjected to the primary curing may be subjected to a secondary curing at a temperature higher than the primary curing temperature,

The molded product after the primary curing has a thermal conductivity of 0.2 to 17W/m.K and a hardness of 5 to 80 in terms of ASKER C.

The method for manufacturing an electronic component of the present invention is a method for manufacturing an electronic component including a heat generating portion and a heat dissipating portion, including the steps of:

The two-stage curing heat-conductive silicone composition of the present invention is disposed between the heat generating part and the heat radiating part so as to be in contact with both the heat generating part and the heat radiating part, and then heated at a temperature higher than the primary curing temperature of the two-stage curing heat-conductive silicone composition of the present invention to be secondarily cured,

The heating is performed by heat generated by the heat generating portion.

Effects of the invention

The present invention can provide a two-stage curing type heat conductive silicone composition which cures at different temperatures, which contains the components a to D, and which is cured at a primary curing temperature, and which can be cured at a secondary curing temperature higher than the primary curing temperature, wherein the two-stage curing type heat conductive silicone composition after the primary curing has a thermal conductivity of 0.2 to 17W/m.k and a hardness of 5 to 80 in terms of ask C. That is, the present invention can provide a heat conductive composition which is soft in a stage of stopping at the primary curing before being disposed between a heat generating part and a heat radiating part, and therefore can be easily put between the heat generating part and the heat radiating part, for example, and can be cured by performing the secondary curing by the heat of the heat generating part after being disposed between the heat generating part and the heat radiating part.

Drawings

Fig. 1A-B of fig. 1 are explanatory diagrams illustrating a method of measuring the thermal conductivity of a sample in one embodiment of the present invention.

Detailed Description

The two-stage curing type heat conductive silicone composition of the present invention (hereinafter, also simply referred to as "silicone composition of the present invention") is cured at a primary curing temperature by an addition reaction curing action of a platinum group metal catalyst, and is cured at a secondary curing temperature higher than the primary curing temperature by a radical reaction curing action of an organic peroxide. In the two-stage curing type heat conductive silicone composition of the present invention, the platinum group metal catalyst and the organic peroxide are mixed together with the polyorganosiloxane and the heat conductive particles, and are formed into a sheet, for example, and are stopped at the primary curing stage. The thermosetting resin materials at this stage are generally considered to be of the "B-stage" or "semi-cured" type, common in the case of epoxy resins and the like. The sheet in this state is soft and can be easily put into a desired portion. In general, the products are shipped from the manufacturer in a primary curing stage, put in a necessary place at a selling destination, and subjected to secondary curing by heat of a heat generating part after the placement.

In the preparation of the silicone composition of the present invention, the following components a to D are preferably used in the amounts described below.

(A)100 parts by weight of polyorganosiloxane

(B) 100 to 2500 parts by weight of thermally conductive particles relative to component A

(C) Platinum group metal catalyst as curing catalyst for the polyorganosiloxane

(D) 0.01 to 5 parts by weight of an organic peroxide based on the component A

Among them, the polyorganosiloxane (a) is a main raw material of an addition-curable silicone polymer, contains a base polymer component and a crosslinking agent component described later, and is usually stored separately in a liquid a and a liquid B. For example, the base polymer component is contained in both of the solution a and the solution B, the curing catalyst, for example, a platinum group metal catalyst is further contained in the solution a, and the crosslinking agent component is further contained in the solution B. Is commercially available in this state. The liquid a, the liquid B, the thermally conductive particles, the organic peroxide, and if necessary, an additional platinum group metal catalyst, other coloring agents, etc. are usually added and mixed to form a sheet-like molded article, for example, and the sheet-like molded article is subjected to primary curing. Curing is also known as crosslinking or vulcanization.

The two-stage curing type heat-conductive silicone composition of the present invention is cured at the primary curing temperature, and can be cured at a temperature higher than the primary curing temperature. The sheet after primary curing has a thermal conductivity of 0.2 to 17W/mK, preferably 0.5 to 15W/mK, and more preferably 1 to 10W/mK. In the above range, the heat from the heat generating portion can be efficiently conducted to the heat radiating portion. The hardness of the sheet after primary curing is 5 to 80, preferably 10 to 75, and more preferably 15 to 70 in terms of ASKER C. When the amount is within the above range, the sheet is soft and can be easily put into a desired portion.

The polyorganosiloxane used in the present invention preferably contains the following components for the purpose of performing the two-stage curing.

(a) Base polymer component: a linear organopolysiloxane containing an average of 2 or more alkenyl groups bonded to silicon atoms at both ends of a molecular chain in 1 molecule.

(b) the cross-linking agent component: an organohydrogenpolysiloxane containing an average of 2 or more hydrogen atoms bonded to silicon atoms in 1 molecule. The number of moles of the hydrogen atoms bonded to the silicon atoms is an amount of less than 1 mole relative to 1 mole of the silicon atom-bonded alkenyl groups in the base polymer component.

The silicone composition of the present invention is preferably formed into a sheet shape. If the sheet-like member is formed, it can be easily inserted between the heat generating member and the heat radiating member.

The silicone composition of the present invention preferably has a difference in hardness between after the primary curing and after the secondary curing of more than 12 in ASKER C, and more preferably has a difference of 15 or more. Thus, the silicone composition of the present invention in the form of, for example, a sheet in the stage of primary curing is soft and can be easily put into a required portion, and after the silicone composition is placed in the required portion, secondary curing is performed by heat of a heat-generating portion, whereby a preferable hardness can be obtained. The hardness of the silicone composition of the present invention in the form of a sheet after secondary curing is preferably 40 or more, and more preferably 45 or more in ASKER C, from the viewpoint that the silicone composition of the present invention has good adhesion to a heat generating portion and a heat dissipating portion of an electronic component.

The method for producing a two-stage curing heat-conductive silicone composition of the present invention comprises the following steps (primary curing step): the following components A to D are mixed and then molded into a predetermined shape, for example, a sheet shape, and the obtained molded article is subjected to primary curing at a primary curing temperature.

(A)100 parts by weight of polyorganosiloxane,

(B) 100 to 2500 parts by weight of a thermally conductive particle based on the component A,

(C) Platinum group metal catalyst as curing catalyst for the polyorganosiloxane

(D) 0.01 to 5 parts by weight of an organic peroxide based on the component A,

The two-stage curing type heat conductive silicone composition (once cured molded product) of the present invention can be subjected to secondary curing at a temperature higher than the primary curing temperature,

The sheet after primary curing has a thermal conductivity of 0.2 to 17W/m.K and a hardness of 5 to 80 in terms of ASKER C.

The primary curing temperature is preferably 100 ℃ or lower, and the secondary curing temperature is preferably higher than the primary curing temperature. Further, the primary curing temperature is preferably from room temperature (25 ℃) to 100 ℃. In addition, the preferable secondary curing temperature is 120-170 ℃. The secondary curing temperature may not be maintained at a constant temperature, and may be a temperature condition in which a heat cycle of-40 ℃ to 170 ℃ is repeated, for example. Thus, the curing action by the addition reaction of the platinum group metal catalyst in the primary curing step and the curing action by the organic peroxide reaction in the secondary curing step can be efficiently exhibited.

Hereinafter, each component will be described.

(1) Base Polymer component (component a of component A)

The base polymer component (component a) is an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms in one molecule, and the organopolysiloxane containing 2 alkenyl groups is the main agent (base polymer component) in the silicone rubber composition of the present invention. The organopolysiloxane has 2 alkenyl groups bonded to silicon atoms, such as vinyl groups and allyl groups, having 2 carbon atoms, particularly 2 to 6 carbon atoms, in one molecule. From the viewpoint of workability, curability, etc., the viscosity is preferably 10 to 1000000 mPas, particularly preferably 100 to 100000 mPas at 25 ℃.

Specifically, an organopolysiloxane containing an average of 2 or more alkenyl groups bonded to silicon atoms at the molecular chain terminals in 1 molecule represented by the following general formula (1) is used. Is a linear organopolysiloxane whose end is blocked by a triorganosiloxy group. An organopolysiloxane having a viscosity of 10 to 1000000 mPas at 25 ℃ is preferred from the viewpoint of workability, curability, and the like. The linear organopolysiloxane may be an organopolysiloxane containing a small amount of branched structure (trifunctional siloxane unit) in the molecular chain.

[ chemical formula 1]

In the general formula (1), R1 represents an unsubstituted or substituted monovalent hydrocarbon group having no aliphatic unsaturated bond, which may be the same or different from each other, R2 represents an alkenyl group, and k represents 0 or a positive integer. Among them, as the unsubstituted or substituted monovalent hydrocarbon group having no aliphatic unsaturated bond of R1, for example, monovalent hydrocarbon groups having 1 to 10, particularly 1 to 6 carbon atoms are preferable, and specific examples thereof include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, neopentyl, hexyl, cyclohexyl, octyl, nonyl, decyl, and the like; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; aralkyl groups such as benzyl, phenylethyl, and phenylpropyl; and groups obtained by substituting a part or all of the hydrogen atoms of these groups with a halogen atom such as fluorine, bromine or chlorine, a cyano group or the like, for example, a halogen-substituted alkyl group such as chloromethyl, chloropropyl, bromoethyl or trifluoropropyl, cyanoethyl or the like. The alkenyl group as R2 is preferably an alkenyl group having 2 to 6, particularly 2 to 3 carbon atoms, and specific examples thereof include a vinyl group, an allyl group, a propenyl group, an isopropenyl group, a butenyl group, an isobutenyl group, a hexenyl group, a cyclohexenyl group and the like, and a vinyl group is preferable. In the general formula (1), k is generally 0 or a positive integer satisfying 0. ltoreq. k.ltoreq.10000, preferably an integer satisfying 5. ltoreq. k.ltoreq.2000, more preferably an integer satisfying 10. ltoreq. k.ltoreq.1200.

The organopolysiloxane of component a may be used in combination with an organopolysiloxane having in one molecule about 3 or more, usually 3 to 30, preferably 3 to 20, alkenyl groups bonded to silicon atoms, such as vinyl groups and allyl groups, having 2 to 8 carbon atoms, particularly 2 to 6 carbon atoms. The molecular structure may be any of linear, cyclic, branched, and three-dimensional network structures. Preferably, the organopolysiloxane is a linear organopolysiloxane having a main chain comprising repeating diorganosiloxane units and having a viscosity at 25 ℃ of 10 to 1000000 mPas, particularly 100 to 100000 mPas, where both ends of the molecular chain are blocked with triorganosiloxy groups.

The alkenyl group may be bonded to a certain portion of the molecule. For example, the compound may contain an alkenyl group bonded to a silicon atom at the molecular chain terminal or at the non-terminal (halfway in the molecular chain) of the molecular chain. Among these, the linear organopolysiloxane represented by the following general formula (2) having 1 to 3 alkenyl groups on silicon atoms at both ends of the molecular chain (wherein, when the total number of alkenyl groups bonded to silicon atoms at both ends is less than 3, at least 1 alkenyl group bonded to silicon atoms at non-ends of the molecular chain (in the middle of the molecular chain) (for example, as a substituent in a diorganosiloxane unit)) is preferable from the viewpoint of workability, curability, and the like. The linear organopolysiloxane may be an organopolysiloxane containing a small amount of branched structure (trifunctional siloxane unit) in the molecular chain.

[ chemical formula 2]

In the general formula (2), R3 are unsubstituted or substituted monovalent hydrocarbon groups which may be the same or different from each other, and at least 1 is an alkenyl group. R4 are mutually the same or different unsubstituted or substituted monovalent hydrocarbon groups having no aliphatic unsaturated bond, R5 is an alkenyl group, and l or m is 0 or a positive integer. Among them, the monovalent hydrocarbon group denoted by R3 is preferably a monovalent hydrocarbon group having 1 to 10, particularly 1 to 6 carbon atoms, and specific examples thereof include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, neopentyl, hexyl, cyclohexyl, octyl, nonyl, and decyl; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; aralkyl groups such as benzyl, phenylethyl, and phenylpropyl; alkenyl groups such as vinyl, allyl, propenyl, isopropenyl, butenyl, hexenyl, cyclohexenyl, and octenyl; or a group obtained by substituting a part or all of hydrogen atoms of these groups with a halogen atom such as fluorine, bromine or chlorine, a cyano group or the like, for example, a halogen-substituted alkyl group such as chloromethyl, chloropropyl, bromoethyl or trifluoropropyl, a cyanoethyl group or the like.

The monovalent hydrocarbon group denoted by R4 is also preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms, particularly 1 to 6 carbon atoms, and examples thereof include the same monovalent hydrocarbon groups as those denoted by R1, but do not include an alkenyl group. The alkenyl group of R5 is preferably an alkenyl group having 2 to 6 carbon atoms, particularly 2 to 3 carbon atoms, and specifically the same alkenyl group as R2 of the general formula (1) is exemplified, and a vinyl group is preferable.

l, m are generally 0 or a positive integer satisfying 0< l + m.ltoreq.10000, preferably 5. ltoreq. l + m.ltoreq.2000, more preferably 10. ltoreq. l + m.ltoreq.1200, and an integer satisfying 0< l/(l + m). ltoreq.0.2, preferably 0.0011. ltoreq. l/(l + m). ltoreq.0.1.

(2) Crosslinking agent component (component b of component A)

The organohydrogenpolysiloxane of component b of the present invention is a component that functions as a crosslinking agent, and is a component that forms a cured product by an addition reaction (hydrosilication) of the SiH groups in the component with the alkenyl groups in the base polymer component. The organohydrogenpolysiloxane may be any organohydrogenpolysiloxane as long as it has 2 or more hydrogen atoms (i.e., SiH groups) bonded to silicon atoms in one molecule, and the molecular structure of the organohydrogenpolysiloxane may be any of linear, cyclic, branched, and three-dimensional network structures, and an organohydrogenpolysiloxane in which the number of silicon atoms in one molecule (i.e., the degree of polymerization) is 2 to 1000, particularly about 2 to 300 may be used.

The position of the silicon atom to which the hydrogen atom is bonded is not particularly limited, and may be a terminal of the molecular chain or a non-terminal (halfway). Examples of the organic group bonded to a silicon atom other than a hydrogen atom include an unsubstituted or substituted monovalent hydrocarbon group having no aliphatic unsaturated bond, as in the case of R1 in the general formula (1).

Examples of the organohydrogenpolysiloxane as the component b include organohydrogenpolysiloxanes having structures represented by the following general formulae (3) to (5).

[ chemical formula 3]

[ chemical formula 4]

[ chemical formula 5]

in the above general formula, R6 is an organic group containing at least 1 of a phenyl group, an epoxy group, an acryloyl group, a methacryloyl group, and an alkoxy group. L is an integer of 0 to 1,000, particularly 0 to 300, and M is an integer of 1 to 200.

(3) thermally conductive particles (component B)

The thermally conductive particles of component B are also referred to as thermally conductive fillers. The thermally conductive particles are preferably added in an amount of 100 to 2500 parts by weight based on 100 parts by weight of the component A as the matrix component. This enables high thermal conductivity to be maintained. The thermally conductive particles are preferably at least one selected from the group consisting of aluminum oxide, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, aluminum hydroxide, and silicon dioxide. The shape may be spherical, scaly, polyhedral, or other various shapes. When alumina is used, α -alumina having a purity of 99.5 wt% or more is preferable. The specific surface area of the thermally conductive particles is preferably in the range of 0.06 to 10m 2/g. The specific surface area is a BET specific surface area, and the measurement method is according to JIS R1626. The average particle diameter is preferably in the range of 0.1 to 100 μm. Measurement of average particle diameter D50 (median particle diameter) was measured by a laser diffraction light scattering method. The measuring instrument is exemplified by a laser diffraction/scattering type particle distribution measuring instrument LA-950S2 manufactured by horiba, Inc.

As the thermally conductive particles, at least 2 kinds of inorganic particles having different average particle diameters may be used in combination. In this way, the thermally conductive inorganic particles having a small particle size can fill the gaps between large particle sizes to be close to the closest packing state, and thus the thermal conductivity is increased.

The inorganic particles are preferably particles surface-treated with a silane compound represented by R (CH3) aSi (OR ') 3-a (R is an unsubstituted OR substituted organic group having 1 to 20 carbon atoms, R' is an alkyl group having 1 to 4 carbon atoms, and a is 0 OR 1), OR a partial hydrolysate thereof. An alkoxysilane compound (hereinafter referred to simply as "silane") represented by R (CH3) aSi (OR ') 3-a (R is an unsubstituted OR substituted organic group having 1 to 20 carbon atoms, R' is an alkyl group having 1 to 4 carbon atoms, and a is 0 OR 1) is exemplified, examples of the silane compound include methyltrimethoxysilane, ethyltrimethoxysilane, propyltrimethoxysilane, butyltrimethoxysilane, pentyltrimethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, octyltrimethoxysilane, octyltriethoxysilane, decyltrimethoxysilane, decyltriethoxysilane, dodecyltrimethoxysilane, dodecyltriethoxysilane, hexadecyltrimethoxysilane, hexadecyltriethoxysilane, octadecyltrimethoxysilane and octadecyltriethoxysilane. The silane compound may be used alone or in combination of two or more. The surface treatment agent may be an alkoxysilane in combination with a single-terminal silanol siloxane. The surface treatment referred to herein includes, in addition to covalent bonding, adsorption and the like. The inorganic particles having an average particle diameter of 2 μm or more are preferably added in an amount of "(100 × specific surface area)/minimum coating area of the surface treatment agent" or more, based on 100 parts by weight of the entire inorganic particles.

(4) platinum group metal catalyst (component C)

The platinum group metal catalyst as the component C is a component for accelerating the first-stage curing of the composition containing the components a to D. As the component C, a catalyst used in a hydrosilation reaction can be used. Examples thereof include platinum black, platinum chloride, platinic chloride, a reaction product of platinic chloride and a monohydric alcohol, a complex of platinic chloride and an olefin or a vinyl siloxane, a platinum-group metal catalyst such as platinum bisacetoacetate, a palladium-group metal catalyst, a rhodium-group metal catalyst, and the like. The amount of the component C to be blended is not particularly limited as long as it is an amount necessary for curing the component a, and is preferably an amount at which the component a is sufficiently cured. The platinum group metal catalyst is usually contained in the silicone component (for example, 2-chamber hot cure silicone polymer) used in the production of the silicone composition of the present invention, but in order to further sufficiently cure the component a, an additional platinum group metal catalyst may be mixed with the silicone component in the production of the silicone composition of the present invention. The amount of the platinum group metal catalyst is preferably 0.01 to 1000ppm in terms of metal atom weight relative to the component A.

in the platinum group metal catalyst, the "amount of the component A which is sufficiently cured" means that the hardness of the primary cured product is set to 5 to 80 in terms of ASKER C.

(5) organic peroxide (D component)

Component D is a curing component which promotes the second stage of curing of the composition containing components A to D. The component D is an organic peroxide, and generates a radical by heating to cause a crosslinking reaction of the component A. Examples of the component D include acyl peroxides such as benzoyl peroxide and bis (p-methylbenzoyl) peroxide; alkyl peroxides such as di-tert-butyl peroxide, 2, 5-dimethyl-2, 5-di (tert-butylperoxy) hexane, tert-butylcumyl peroxide, and dicumyl peroxide; and ester-based organic peroxides such as t-butyl peroxybenzoate. The amount of component D is preferably 0.01 to 5 parts by weight, more preferably 0.1 to 4 parts by weight, based on 100 parts by weight of component A.

(6) Other ingredients

The silicone composition of the present invention may contain other components than those described above as necessary. For example, an inorganic pigment such as red iron oxide, an alkyltrialkoxysilane used for surface treatment of a filler, and the like may be added. As a material added for the purpose of filler surface treatment or the like, an alkoxy group-containing silicone may also be added.

The present invention can also provide a method for manufacturing an electronic component described below.

The method for manufacturing an electronic component of the present invention includes the following steps (secondary curing step): the silicone composition of the present invention is disposed between the heat generating part and the heat radiating part so as to be in contact with both the heat generating part and the heat radiating part, and then heated at a temperature higher than the primary curing temperature of the silicone composition of the present invention (the primary cured molded article) to be secondarily cured. The secondary curing may be performed by heat generated from the heat generating portion. The heating portion and the heat dissipating portion are conventionally known components, the heating portion is a semiconductor such as a Computer (CPU), a transistor, or a Light Emitting Diode (LED), and the heat dissipating portion is often made of metal.