阅读说明：本技术 一种高散热油墨及其制备方法 (High-heat-dissipation ink and preparation method thereof ) 是由 苗磊 陈焰 胡广齐 郑明东 冼慧敏 于 2021-07-20 设计创作，主要内容包括：本发明公开了一种高散热油墨,按照重量份计,其制备原料包括：改性环氧胶30-50份、溶剂15-25份、固化剂10-20份、填料10-20份、催化剂0.5-3份、分散剂0.5-1份、消泡剂2-7份以及碳纳米管0.1-2份；所述改性环氧胶至少包括环氧树脂,所述环氧树脂的体积占所述改性环氧胶的体积的20-50％；其中,所述溶剂包括丙二醇甲醚醋酸酯、乙二醇单丁醚和丙二醇二醋酸酯中的一种或几种；所述填料至少包括纳米硫酸钡。相应的,本发明还提供所述高导热油墨的制备方法。本发明通过上述配比,得到的高散热油墨,通过各种原料之间的相互反应得到,附着力强,耐化学性强,通过填料的加入,在不影响其光学性能的前提下,提高了油墨的耐磨性。(The invention discloses high-heat-dissipation ink which comprises the following preparation raw materials in parts by weight: 30-50 parts of modified epoxy glue, 15-25 parts of solvent, 10-20 parts of curing agent, 10-20 parts of filler, 0.5-3 parts of catalyst, 0.5-1 part of dispersing agent, 2-7 parts of defoaming agent and 0.1-2 parts of carbon nano tube; the modified epoxy glue at least comprises epoxy resin, and the volume of the epoxy resin accounts for 20-50% of the volume of the modified epoxy glue; wherein, the solvent comprises one or more of propylene glycol methyl ether acetate, ethylene glycol monobutyl ether and propylene glycol diacetate; the filler comprises at least nano barium sulfate. Correspondingly, the invention also provides a preparation method of the high-thermal-conductivity ink. The high-heat-dissipation ink obtained by the proportioning is obtained by mutual reaction of various raw materials, has strong adhesive force and chemical resistance, and improves the wear resistance of the ink by adding the filler on the premise of not influencing the optical performance of the ink.)

1. The high-heat-dissipation printing ink is characterized by comprising the following preparation raw materials in parts by weight: 30-50 parts of modified epoxy glue, 15-25 parts of solvent, 10-20 parts of curing agent, 10-20 parts of filler, 0.5-3 parts of catalyst, 0.5-1 part of dispersing agent, 2-7 parts of defoaming agent and 0.1-2 parts of carbon nano tube;

the modified epoxy glue at least comprises epoxy resin, and the volume of the epoxy resin accounts for 20-50% of the volume of the modified epoxy glue;

wherein, the solvent comprises one or more of propylene glycol methyl ether acetate, ethylene glycol monobutyl ether and propylene glycol diacetate;

the filler comprises at least nano barium sulfate.

2. The high heat dissipation ink of claim 1, wherein the modified epoxy glue comprises an epoxy resin and a glue B;

the acid value of the B glue is lower than 115mgKOH/g, and the preparation raw materials comprise, by weight, 25-35 parts of phthalic anhydride, 65-75 parts of polyether polyol and 15-35 parts of propylene glycol methyl ether acetate.

3. The high heat dissipation ink according to claim 1, wherein the solvent includes one or more of propylene glycol methyl ether acetate, ethylene glycol monobutyl ether, and propylene glycol diacetate.

4. The high heat dissipation ink of claim 1, wherein the curing agent comprises one or both of a polyether polyol and phthalic anhydride.

5. The high thermal dissipation ink of claim 1, wherein the filler further comprises nano silica, and the weight of the nano barium sulfate is not less than 50% of the total weight of the filler.

6. The high heat dissipation ink of claim 1, wherein the catalyst comprises one or more of methyl benzene sulfonic acid and N, N-dimethylaminopyridine.

7. The high heat dissipation ink of claim 1, wherein the dispersant is sodium dodecyl diphenyl oxide disulfonate.

8. The high heat dissipation ink of claim 1, wherein the antifoaming agent is ethylene glycol siloxane.

9. A preparation method of the high heat dissipation ink of any one of claims 1 to 8 is characterized by comprising the following steps:

step S1, stirring the solvent for 15-20 minutes at the speed of 800-;

s2, slowly adding the filler, the dispersant and the catalyst into the stirred solvent, stirring for 5-15 minutes at the speed of 800-;

step S3, adding the modified epoxy glue into the mixed solution A, then adding the defoaming agent, and stirring for 5-10 minutes at the speed of 700 and 1000 revolutions per minute at the temperature of 40-70 ℃ under normal pressure to obtain a mixed solution B;

step S4, adding carbon nano tubes into the mixed solution B, and stirring for 5-8 minutes at the speed of 600-;

and step S5, adding a curing agent into the mixed solution C, uniformly stirring, and filtering to obtain a finished product.

10. The method of claim 9, wherein the modified epoxy glue is prepared by the steps of:

step S31, adding phthalic anhydride and polyether polyol into a reaction kettle, stirring, keeping the temperature at 100-140 ℃, keeping the temperature for 30-60min, then heating to 160-180 ℃, keeping the temperature for 4-6H, and cooling to below 100 ℃ to obtain a mixed solution B1;

and S32, adding propylene glycol encrypted acetate into the mixed solution B1 for dilution to obtain a finished modified epoxy adhesive product, wherein the acid value of the finished modified epoxy adhesive product is lower than 115 mgKOH/g.

Technical Field

The invention relates to the technical field of circuit board coatings, in particular to high-heat-dissipation ink, and correspondingly relates to a preparation method of the ink.

Background

With the widespread application of electronic informatization, the PCB is widely applied to various devices, and the PCB mainly functions to mount various electronic components, and when the PCB is applied to the fields of display screens and the like, the PCB is required to have high heat dissipation performance and optical performance.

However, when the PCB is applied to a product with a large heat value, such as a display screen, the adhesion of the ink is affected due to heat accumulation, so that the ink is peeled off and foamed, and the overall optical performance of the PCB is affected.

Disclosure of Invention

The invention aims to solve the technical problem of providing the high-heat-dissipation ink which is strong in adhesive force, good in heat dissipation performance and especially suitable for equipment with large heat productivity.

The invention also aims to solve the technical problem of providing a manufacturing method of the high-heat-dissipation ink, which has simple process and high production efficiency.

In order to solve the technical problems, the invention provides high-heat-dissipation ink which comprises the following preparation raw materials in parts by weight: 30-50 parts of modified epoxy glue, 15-25 parts of solvent, 10-20 parts of curing agent, 10-20 parts of filler, 0.5-3 parts of catalyst, 0.5-1 part of dispersing agent, 2-7 parts of defoaming agent and 0.1-2 parts of carbon nano tube;

the modified epoxy glue at least comprises epoxy resin, and the volume of the epoxy resin accounts for 20-50% of the volume of the modified epoxy glue;

wherein, the solvent comprises one or more of propylene glycol methyl ether acetate, ethylene glycol monobutyl ether and propylene glycol diacetate;

the filler comprises at least nano barium sulfate.

Preferably, the modified epoxy glue comprises epoxy resin and glue B;

the acid value of the B glue is lower than 115mgKOH/g, and the preparation raw materials comprise, by weight, 25-35 parts of phthalic anhydride, 65-75 parts of polyether polyol and 15-35 parts of propylene glycol methyl ether acetate.

Preferably, the solvent comprises one or more of propylene glycol methyl ether acetate, ethylene glycol monobutyl ether and propylene glycol diacetate.

Preferably, the curing agent comprises one or both of a polyether polyol and phthalic anhydride.

Preferably, the filler also comprises nano silica, and the weight of the nano barium sulfate is not less than 50% of the total weight of the filler.

Preferably, the catalyst comprises one or more of methyl benzene sulfonic acid and N, N-dimethylamino pyridine.

Preferably, the dispersant is sodium dodecyl diphenyl oxide disulfonate.

Preferably, the defoamer is a glycol siloxane.

A preparation method of the high-heat-dissipation ink comprises the following steps:

step S1, stirring the solvent for 15-20 minutes at the speed of 800-;

s2, slowly adding the filler, the dispersant and the catalyst into the stirred solvent, stirring for 5-15 minutes at the speed of 800-;

step S3, adding the modified epoxy glue into the mixed solution A, then adding the defoaming agent, and stirring for 5-10 minutes at the speed of 700 and 1000 revolutions per minute at the temperature of 40-70 ℃ under normal pressure to obtain a mixed solution B;

step S4, adding carbon nano tubes into the mixed solution B, and stirring for 5-8 minutes at the speed of 600-;

and step S5, adding a curing agent into the mixed solution C, uniformly stirring, and filtering to obtain a finished product.

Preferably, the preparation method of the modified epoxy glue comprises the following steps:

step S31, adding phthalic anhydride and polyether polyol into a reaction kettle, stirring, keeping the temperature at 100-140 ℃, keeping the temperature for 30-60min, then heating to 160-180 ℃, keeping the temperature for 4-6H, and cooling to below 100 ℃ to obtain a mixed solution B1;

and S32, adding propylene glycol encrypted acetate into the mixed solution B1 for dilution to obtain a finished modified epoxy adhesive product, wherein the acid value of the finished modified epoxy adhesive product is lower than 115 mgKOH/g.

The implementation of the invention has the following beneficial effects:

1. the high-heat-dissipation ink obtained by the proportioning is obtained by mutual reaction among various raw materials, has strong adhesive force and chemical resistance, and improves the wear resistance of the ink by adding the filler on the premise of not influencing the optical performance of the ink.

2. The ink of the invention increases the heat dissipation capability of the ink by adding the carbon nano tube, so that the high heat dissipation ink can be normally used in equipment with large heat productivity, thereby preventing heat from gathering, burning electronic components in the equipment and ensuring the reliability of the equipment.

3. According to the ink disclosed by the invention, the epoxy resin is modified, the ink is prevented from being peeled and cracked, the adhesive force of the ink is ensured, and the raw materials have good reactivity and are matched with each other, so that the ink with excellent quality is obtained.

4. According to the preparation method of the ink, various raw materials are sequentially added according to the steps of the invention, so that the raw materials react with each other to obtain a required mixture, the performances of wear resistance, corrosion resistance, optics and the like of the ink are met, the process is simple, and the production efficiency is high; the ink prepared by the method has strong heat dissipation capacity and strong adhesive force, and is particularly suitable for equipment with large heat productivity.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below.

The invention provides high-heat-dissipation printing ink which comprises the following preparation raw materials in parts by weight: 30-50 parts of modified epoxy glue, 15-25 parts of solvent, 10-20 parts of curing agent, 10-20 parts of filler, 0.5-3 parts of catalyst, 0.5-1 part of dispersing agent, 2-7 parts of defoaming agent and 0.1-2 parts of carbon nano tube;

the modified epoxy glue at least comprises epoxy resin, and the volume of the epoxy resin accounts for 20-50% of the volume of the modified epoxy glue;

wherein, the solvent comprises one or more of propylene glycol methyl ether acetate, ethylene glycol monobutyl ether and propylene glycol diacetate;

the filler comprises at least nano barium sulfate.

The modified epoxy glue at least comprises epoxy resin, and the epoxy resin has good adhesion, high strength, corrosion resistance and the like, but the epoxy resin is easy to generate larger internal stress after being cured, and the cured product has poor flexibility, brittle and hard texture and easy cracking, so the modified epoxy glue needs to be modified.

Specifically, the modified epoxy glue comprises epoxy resin and glue B, the acid value of the glue B is lower than 115mgKOH/g, and the preparation raw materials comprise, by weight, 25-35 parts of phthalic anhydride, 65-75 parts of polyether polyol and 15-35 parts of propylene glycol monomethyl ether acetate.

The solvent comprises one or more of propylene glycol methyl ether acetate, ethylene glycol monobutyl ether and propylene glycol diacetate.

The curing agent comprises one or two of polyether polyol and phthalic anhydride, and the good reactivity between the curing agent and the epoxy resin is utilized to improve the performance of the high-heat-dissipation ink.

The filler at least comprises nano barium sulfate, and the barium sulfate has good dispersibility in epoxy resin, is an aid capable of adjusting the concentration of the ink, can increase the thickness of the rubbed ink and improve the wear resistance of the rubbed ink, so that in the embodiment, when the filler also comprises other materials, the weight of the nano barium sulfate is not less than 50% of the total weight of the filler.

In order to further increase the wear resistance of the high heat dissipation ink, the filler also comprises nano silicon dioxide, because the hardness of the silicon dioxide is high, and the addition of the silicon dioxide in the ink can obviously improve the scratch resistance and the wear resistance of a coating film. However, the use of silica affects other properties of the coating film, such as reduced gloss and increased haze. Therefore, the nano-silica is selected as the raw material of the scratch resistance agent, the particle size of the nano-silica is small, on the other hand, the content of the nano-silica is controlled to be less than 50 percent of the total weight of the filler, the comprehensive performance of the nano-barium sulfate and the nano-silica is fully utilized, the optical performance and the wear resistance of the ink such as glossiness and the like are ensured, and the ink with excellent quality is obtained.

The catalyst comprises one or more of methyl benzene sulfonic acid and N, N-dimethylamino pyridine.

The dispersant is sodium dodecyl diphenyl oxide disulfonate, and has excellent dispersing, wetting and emulsifying capacities.

The defoaming agent is ethylene glycol siloxane;

the carbon nano tubes are uniformly mixed in the raw materials and used for improving the heat dissipation performance of the raw materials, wherein the content of the carbon nano tubes is 0.1-2 parts, the heat dissipation effect is poor due to too low content, the physical performance of the ink is affected due to too high content, and the production cost is high.

According to the high-heat-dissipation ink provided by the invention, the wear resistance of the ink is improved through the arrangement of the filler, the optical performance of the ink is not influenced, the epoxy resin is modified, the ink is prevented from being stripped and cracked, the adhesive force of the ink is ensured, and the raw materials have good reactivity and are matched with each other to obtain the ink with excellent quality.

Through the addition of the carbon nano tube, the heat dissipation capacity of the ink is improved, so that the high-heat-dissipation ink can be normally used in equipment with large heat productivity, heat accumulation is prevented, electronic components in the equipment are burnt out, and the reliability of the equipment is ensured.

Correspondingly, the invention also provides a preparation method of the high heat dissipation ink, which comprises the following steps:

step S1, stirring the solvent for 15-20 minutes at the speed of 800-;

s2, slowly adding the filler, the dispersant and the catalyst into the stirred solvent, stirring for 5-15 minutes at the speed of 800-;

step S3, adding the modified epoxy glue into the mixed solution A, then adding the defoaming agent, and stirring for 5-10 minutes at the speed of 700 and 1000 revolutions per minute at the temperature of 40-70 ℃ under normal pressure to obtain a mixed solution B;

the preparation method of the modified epoxy glue comprises the following steps:

step S31, adding phthalic anhydride and polyether polyol into a reaction kettle, stirring, keeping the temperature at 100-140 ℃, keeping the temperature for 30-60min, then heating to 160-180 ℃, keeping the temperature for 4-6H, and cooling to below 100 ℃ to obtain a mixed solution B1;

and S32, adding propylene glycol encrypted acetate into the mixed solution B1 for dilution to obtain a finished modified epoxy adhesive product, wherein the acid value of the finished modified epoxy adhesive product is lower than 115 mgKOH/g.

Step S4, adding carbon nano tubes into the mixed solution B, and stirring for 5-8 minutes at the speed of 600-;

and step S5, adding a curing agent into the mixed solution C, uniformly stirring, and filtering to obtain a finished product.

The high-heat-dissipation ink obtained by the proportioning is obtained by mutual reaction of various raw materials, has strong adhesive force and chemical resistance, and improves the wear resistance of the ink by adding the filler on the premise of not influencing the optical performance of the ink.

The ink disclosed by the invention has the advantages that the heat dissipation capacity of the ink is increased by adding the carbon nano tubes, so that the high-heat-dissipation ink can be normally used in equipment with large heat productivity, the heat accumulation is prevented, electronic components in the equipment are burnt out, and the reliability of the equipment is ensured.

According to the ink disclosed by the invention, the epoxy resin is modified, the ink is prevented from being peeled and cracked, the adhesive force of the ink is ensured, and the raw materials have good reactivity and are matched with each other, so that the ink with excellent quality is obtained.

According to the preparation method of the ink, various raw materials are sequentially added according to the steps of the invention, so that the raw materials react with each other to obtain a required mixture, the performances of wear resistance, corrosion resistance, optics and the like of the ink are met, the process is simple, and the production efficiency is high; the ink prepared by the method has strong heat dissipation capacity and strong adhesive force, and is particularly suitable for equipment with large heat productivity.

Example 1

The embodiment provides a high heat dissipation ink, which comprises the following preparation raw materials: 30 parts of modified epoxy glue, 15 parts of solvent, 10 parts of curing agent, 10 parts of filler, 0.5 part of catalyst, 0.5 part of dispersing agent, 2 parts of defoaming agent and 0.1 part of carbon nano tube;

the modified epoxy glue comprises epoxy resin and glue B, wherein the volume of the epoxy resin accounts for 20% of that of the modified epoxy glue;

the acid value of the B glue is 113mgKOH/g, and the preparation raw materials comprise 25 parts of phthalic anhydride, 65 parts of polyether polyol and 15 parts of propylene glycol monomethyl ether acetate;

the solvent is propylene glycol methyl ether acetate; the curing agent is polyether polyol;

the filler comprises nano barium sulfate and nano silicon dioxide, and the weight of the nano barium sulfate is 50% of the total weight of the filler.

The catalyst is methyl benzenesulfonic acid, the dispersing agent is sodium dodecyl diphenyl ether disulfonate, and the defoaming agent is ethylene glycol siloxane.

Correspondingly, the embodiment also provides a preparation method of the high heat dissipation ink, which comprises the following steps:

step S1, stirring the solvent for 15 minutes at the speed of 800 rpm at the temperature of 50 ℃ under the pressure of normal pressure to obtain the stirred solvent;

step S2, slowly adding the filler, the dispersant and the catalyst into the stirred solvent, stirring for 5 minutes at the speed of 800 rpm at the temperature of 50 ℃ under normal pressure to obtain a mixed solution A;

step S3, adding the modified epoxy glue into the mixed solution A, then adding the defoaming agent, and stirring for 5 minutes at the speed of 700 revolutions per minute and at the temperature of 40 ℃ and under the normal pressure to obtain mixed solution B;

the preparation method of the modified epoxy glue comprises the following steps:

step S31, adding phthalic anhydride and polyether polyol into a reaction kettle, stirring, keeping the temperature at 100 ℃ for 30min, then heating to 160 ℃, keeping the temperature for 4H, and cooling to below 90 ℃ to obtain a mixed solution B1;

and S32, adding propylene glycol encrypted acetate into the mixed solution B1 for dilution to obtain a finished modified epoxy adhesive product with an acid value of 113 mgKOH/g.

Step S4, adding the carbon nano tube into the mixed solution B, and stirring for 5 minutes at the speed of 600 revolutions per minute at the temperature of 30 ℃ and under the pressure of 8MPa to obtain mixed solution C;

and step S5, adding a curing agent into the mixed solution C, uniformly stirring, and filtering to obtain a finished product.

Example 2

The embodiment provides a high heat dissipation ink, which comprises the following preparation raw materials: 50 parts of modified epoxy glue, 25 parts of solvent, 20 parts of curing agent, 20 parts of filler, 3 parts of catalyst, 1 part of dispersing agent, 7 parts of defoaming agent and 2 parts of carbon nano tube;

the modified epoxy glue comprises epoxy resin and glue B, wherein the volume of the epoxy resin accounts for 50% of that of the modified epoxy glue;

the acid value of the B glue is 110mgKOH/g, and the preparation raw materials comprise 35 parts of phthalic anhydride, 75 parts of polyether polyol and 35 parts of propylene glycol methyl ether acetate;

the solvent is propylene glycol methyl ether acetate; the curing agent is polyether polyol;

the filler comprises nano barium sulfate and nano silica, and the weight of the nano barium sulfate is 60% of the total weight of the filler.

The catalyst is methyl benzenesulfonic acid, the dispersing agent is sodium dodecyl diphenyl ether disulfonate, and the defoaming agent is ethylene glycol siloxane.

Correspondingly, the embodiment also provides a preparation method of the high heat dissipation ink, which comprises the following steps:

step S1, stirring the solvent for 20 minutes at the speed of 1200 rpm, the temperature of 80 ℃ and the pressure of normal pressure to obtain the solvent which is stirred;

step S2, slowly adding the filler, the dispersant and the catalyst into the stirred solvent, stirring for 15 minutes at the speed of 1200 rpm at the temperature of 80 ℃ under normal pressure to obtain a mixed solution A;

step S3, adding the modified epoxy glue into the mixed solution A, then adding the defoaming agent, and stirring for 10 minutes at the speed of 1000 rpm, the temperature of 70 ℃ and the pressure of normal pressure to obtain mixed solution B;

the preparation method of the modified epoxy glue comprises the following steps:

step S31, adding phthalic anhydride and polyether polyol into a reaction kettle, stirring, keeping the temperature at 140 ℃ for 60min, then heating to 180 ℃, keeping the temperature for 6H, and cooling to 95 ℃ to obtain a mixed solution B1;

and S32, adding propylene glycol encrypted acetate into the mixed solution B1 for dilution to obtain a finished modified epoxy adhesive product, wherein the acid value of the finished modified epoxy adhesive product is 110 mgKOH/g.

Step S4, adding carbon nanotubes into the mixed solution B, and stirring for 8 minutes at the speed of 1000 rpm, the temperature of 70 ℃ and the pressure of 8MPa to obtain mixed solution C;

and step S5, adding a curing agent into the mixed solution C, uniformly stirring, and filtering to obtain a finished product.

Example 3

The embodiment provides a high heat dissipation ink, which comprises the following preparation raw materials: 40 parts of modified epoxy glue, 20 parts of solvent, 15 parts of curing agent, 15 parts of filler, 2 parts of catalyst, 0.8 part of dispersing agent, 5 parts of defoaming agent and 1 part of carbon nano tube;

the modified epoxy glue comprises epoxy resin and glue B, wherein the volume of the epoxy resin accounts for 30% of that of the modified epoxy glue;

the acid value of the B glue is 108mgKOH/g, and the preparation raw materials comprise 30 parts of phthalic anhydride, 70 parts of polyether polyol and 25 parts of propylene glycol monomethyl ether acetate;

the solvent is propylene glycol methyl ether acetate; the curing agent is polyether polyol;

the filler comprises nano barium sulfate and nano silicon dioxide, and the weight of the nano barium sulfate is 65% of the total weight of the filler.

The catalyst is methyl benzenesulfonic acid, the dispersing agent is sodium dodecyl diphenyl ether disulfonate, and the defoaming agent is ethylene glycol siloxane.

Correspondingly, the embodiment also provides a preparation method of the high heat dissipation ink, which comprises the following steps:

step S1, stirring the solvent for 18 minutes at the speed of 1000 rpm, the temperature of 70 ℃ and the pressure of normal pressure to obtain the solvent which is stirred;

step S2, slowly adding the filler, the dispersant and the catalyst into the stirred solvent, stirring for 18 minutes at the speed of 1000 rpm at the temperature of 60 ℃ under normal pressure to obtain a mixed solution A;

step S3, adding the modified epoxy glue into the mixed solution A, then adding the defoaming agent, and stirring for 10 minutes at the speed of 900 rpm at the temperature of 50 ℃ under normal pressure to obtain mixed solution B;

the preparation method of the modified epoxy glue comprises the following steps:

step S31, adding phthalic anhydride and polyether polyol into a reaction kettle, stirring, keeping the temperature at 120 ℃ for 40min, then heating to 170 ℃, keeping the temperature for 5H, and cooling to 85 ℃ to obtain a mixed solution B1;

and S32, adding propylene glycol encrypted acetate into the mixed solution B1 for dilution to obtain a finished modified epoxy adhesive product, wherein the acid value of the finished modified epoxy adhesive product is 108 mgKOH/g.

Step S4, adding the carbon nano tube into the mixed solution B, and stirring for 7 minutes at the speed of 800 rpm, the temperature of 50 ℃ and the pressure of 8MPa to obtain mixed solution C;

and step S5, adding a curing agent into the mixed solution C, uniformly stirring, and filtering to obtain a finished product.

Comparative example 1

This example is substantially the same as the above examples, except that a conventional epoxy resin is used, and specifically, a high heat dissipation ink is provided, which is prepared from the following raw materials: 40 parts of modified epoxy glue, 20 parts of solvent, 15 parts of curing agent, 15 parts of filler, 2 parts of catalyst, 0.8 part of dispersing agent, 5 parts of defoaming agent and 1 part of carbon nano tube;

wherein the modified epoxy glue is epoxy resin;

the solvent is propylene glycol methyl ether acetate; the curing agent is polyether polyol;

the filler comprises nano barium sulfate and nano silicon dioxide, and the weight of the nano barium sulfate is 65% of the total weight of the filler.

The catalyst is methyl benzenesulfonic acid, the dispersing agent is sodium dodecyl diphenyl ether disulfonate, and the defoaming agent is ethylene glycol siloxane.

Correspondingly, the embodiment also provides a preparation method of the high heat dissipation ink, which comprises the following steps:

step S1, stirring the solvent for 18 minutes at the speed of 1000 rpm, the temperature of 70 ℃ and the pressure of normal pressure to obtain the solvent which is stirred;

step S2, slowly adding the filler, the dispersant and the catalyst into the stirred solvent, stirring for 18 minutes at the speed of 1000 rpm at the temperature of 60 ℃ under normal pressure to obtain a mixed solution A;

step S3, adding the modified epoxy glue into the mixed solution A, then adding the defoaming agent, and stirring for 10 minutes at the speed of 900 rpm at the temperature of 50 ℃ under normal pressure to obtain mixed solution B;

step S4, adding the carbon nano tube into the mixed solution B, and stirring for 7 minutes at the speed of 800 rpm, the temperature of 50 ℃ and the pressure of 8MPa to obtain mixed solution C;

and step S5, adding a curing agent into the mixed solution C, uniformly stirring, and filtering to obtain a finished product.

Comparative example 2

This example is substantially the same as the above examples, except that no carbon nanotubes are added to the raw materials, specifically, a high heat dissipation ink is provided, which comprises the following raw materials: 40 parts of modified epoxy glue, 20 parts of solvent, 15 parts of curing agent, 15 parts of filler, 2 parts of catalyst, 0.8 part of dispersing agent and 5 parts of defoaming agent;

the modified epoxy glue comprises epoxy resin and glue B, wherein the volume of the epoxy resin accounts for 30% of that of the modified epoxy glue;

the acid value of the B glue is 108mgKOH/g, and the preparation raw materials comprise 30 parts of phthalic anhydride, 70 parts of polyether polyol and 25 parts of propylene glycol monomethyl ether acetate;

the solvent is propylene glycol methyl ether acetate; the curing agent is polyether polyol;

the filler comprises nano barium sulfate and nano silicon dioxide, and the weight of the nano barium sulfate is 65% of the total weight of the filler.

The catalyst is methyl benzenesulfonic acid, the dispersing agent is sodium dodecyl diphenyl ether disulfonate, and the defoaming agent is ethylene glycol siloxane.

Correspondingly, the embodiment also provides a preparation method of the high heat dissipation ink, which comprises the following steps:

step S1, stirring the solvent for 18 minutes at the speed of 1000 rpm, the temperature of 70 ℃ and the pressure of normal pressure to obtain the solvent which is stirred;

step S2, slowly adding the filler, the dispersant and the catalyst into the stirred solvent, stirring for 18 minutes at the speed of 1000 rpm at the temperature of 60 ℃ under normal pressure to obtain a mixed solution A;

step S3, adding the modified epoxy glue into the mixed solution A, then adding the defoaming agent, and stirring for 10 minutes at the speed of 900 rpm at the temperature of 50 ℃ under normal pressure to obtain mixed solution B;

the preparation method of the modified epoxy glue comprises the following steps:

step S31, adding phthalic anhydride and polyether polyol into a reaction kettle, stirring, keeping the temperature at 120 ℃ for 40min, then heating to 170 ℃, keeping the temperature for 5H, and cooling to 85 ℃ to obtain a mixed solution B1;

and S32, adding propylene glycol encrypted acetate into the mixed solution B1 for dilution to obtain a finished modified epoxy adhesive product, wherein the acid value of the finished modified epoxy adhesive product is 108 mgKOH/g.

And step S5, adding a curing agent into the mixed liquid B, uniformly stirring, and filtering to obtain a finished product.

Comparative example 3

The difference between this embodiment and the above embodiments is that, in this embodiment, no nano silicon dioxide is added, and this embodiment provides a high heat dissipation ink, which includes the following raw materials: 40 parts of modified epoxy glue, 20 parts of solvent, 15 parts of curing agent, 15 parts of filler, 2 parts of catalyst, 0.8 part of dispersing agent, 5 parts of defoaming agent and 1 part of carbon nano tube;

the modified epoxy glue comprises epoxy resin and glue B, wherein the volume of the epoxy resin accounts for 30% of that of the modified epoxy glue;

the acid value of the B glue is 108mgKOH/g, and the preparation raw materials comprise 30 parts of phthalic anhydride, 70 parts of polyether polyol and 25 parts of propylene glycol monomethyl ether acetate;

the solvent is propylene glycol methyl ether acetate; the curing agent is polyether polyol;

the filler comprises nano barium sulfate. The catalyst is methyl benzene sulfonic acid, the dispersing agent is sodium dodecyl diphenyl ether disulfonate, and the defoaming agent is ethylene glycol siloxane.

Correspondingly, the embodiment also provides a preparation method of the high heat dissipation ink, which comprises the following steps:

step S1, stirring the solvent for 18 minutes at the speed of 1000 rpm, the temperature of 70 ℃ and the pressure of normal pressure to obtain the solvent which is stirred;

step S2, slowly adding the filler, the dispersant and the catalyst into the stirred solvent, stirring for 18 minutes at the speed of 1000 rpm at the temperature of 60 ℃ under normal pressure to obtain a mixed solution A;

step S3, adding the modified epoxy glue into the mixed solution A, then adding the defoaming agent, and stirring for 10 minutes at the speed of 900 rpm at the temperature of 50 ℃ under normal pressure to obtain mixed solution B;

the preparation method of the modified epoxy glue comprises the following steps:

step S31, adding phthalic anhydride and polyether polyol into a reaction kettle, stirring, keeping the temperature at 120 ℃ for 40min, then heating to 170 ℃, keeping the temperature for 5H, and cooling to 85 ℃ to obtain a mixed solution B1;

and S32, adding propylene glycol encrypted acetate into the mixed solution B1 for dilution to obtain a finished modified epoxy adhesive product, wherein the acid value of the finished modified epoxy adhesive product is 108 mgKOH/g.

Step S4, adding the carbon nano tube into the mixed solution B, and stirring for 7 minutes at the speed of 800 rpm, the temperature of 50 ℃ and the pressure of 8MPa to obtain mixed solution C;

and step S5, adding a curing agent into the mixed solution C, uniformly stirring, and filtering to obtain a finished product.

The ink obtained by the method is coated on a PCB (printed Circuit Board), and is dried and tested, and the high-heat-dissipation ink prepared by the method and the formula has the following properties:

the adhesive force in the upper table is used for pulling the ink on the PCB by using an adhesive tape method, and whether the ink is peeled off or not is tested, and the ink is unqualified if the ink is peeled off, and is not qualified if the ink is not peeled off.

The surface temperature of the upper table is obtained by measuring the surface temperature of the display screen after the PCB is applied to the display screen and works for one hour.

While the invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not to be limited to the disclosed embodiment, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.