阅读说明：本技术 一种能够实现高效散热的服务器 (Server capable of achieving efficient heat dissipation ) 是由 聂爱君 于 2021-07-13 设计创作，主要内容包括：本发明提供一种能够实现高效散热的服务器,包括：服务器机箱、主控节点模组、主控节点散热进风口、PCIE模组、PCIE模组散热进风口、散热风扇模组、供电电源模组以及电源模组散热进风口,所述主控节点模组设置于所述服务器机箱的一端,所述主控节点散热进风口设置于所述服务器机箱的前面板以及所述主控节点模组上方的服务器机箱顶板上；所述PCIE模组和供电电源模组设置于所述服务器机箱的另一端,所述PCIE模组和供电电源模组之间设置有密封件,所述电源模组散热进风口设置于所述供电电源模组旁边的服务器机箱侧壁上。本发明对散热结构和散热风道进行了独特的优化设计,能够有效地提高产品的散热效率,优化设计后的方案合理且高效。(The invention provides a server capable of realizing high-efficiency heat dissipation, which comprises: the system comprises a server case, a master control node module, a master control node heat dissipation air inlet, a PCIE module heat dissipation air inlet, a heat dissipation fan module, a power supply module and a power module heat dissipation air inlet, wherein the master control node module is arranged at one end of the server case; the PCIE module and the power supply module are arranged at the other end of the server case, a sealing piece is arranged between the PCIE module and the power supply module, and a heat dissipation air inlet of the power supply module is arranged on the side wall of the server case beside the power supply module. The invention carries out unique optimization design on the heat dissipation structure and the heat dissipation air duct, can effectively improve the heat dissipation efficiency of the product, and has reasonable and high-efficiency scheme after the optimization design.)

1. A server capable of achieving efficient heat dissipation, comprising: the system comprises a server case, a master control node module, a master control node heat dissipation air inlet, a PCIE module heat dissipation air inlet, a heat dissipation fan module, a power supply module and a power module heat dissipation air inlet, wherein the master control node module is arranged at one end of the server case; the PCIE module and the power supply module are arranged at the other end of the server case, a sealing piece is arranged between the PCIE module and the power supply module, the heat dissipation air inlet of the PCIE module is positioned at the front end of the PCIE module, and the heat dissipation air inlet of the power supply module is arranged on the side wall of the server case beside the power supply module; the heat dissipation fan module is arranged below the PCIE module and the power supply module; the air of the heat-dissipation air inlet of the main control node passes through the main control node module, and is discharged from the heat-dissipation fan module to form a node heat-dissipation air channel; the air of the PCIE module heat dissipation air inlet passes through the PCIE module and is exhausted from the heat dissipation fan module to form a PCIE heat dissipation air duct; the air of the heat dissipation air inlet of the power supply module passes through the power supply module, and then the air is discharged by the fan of the power supply module, so that an independent power supply heat dissipation air channel is formed.

2. The server according to claim 1, further comprising a connection partition disposed between the master node module and the power supply module.

3. The server according to claim 2, wherein the main control node modules are connected to one side of the connection partition in parallel.

4. The server according to claim 2, wherein the PCIE module, the cooling fan module, and the power supply module are respectively plugged to the other side of the connection partition.

5. The server according to claim 2, wherein the power supply modules are symmetrically disposed on two sides of the server chassis, the PCIE module is disposed between the power supply modules on the two sides, and the sealing member is disposed between each power supply module and the PCIE module.

6. The server according to claim 5, wherein the sealing member includes a vertical sealing end and a horizontal sealing end, the vertical sealing end is vertically disposed between the PCIE module and the power supply module, and the horizontal sealing end is disposed above the power supply module.

7. The server according to claim 6, wherein the sealing member is disposed at an end of the power supply module close to the master control node module.

8. The server according to any one of claims 1 to 7, wherein the main control node heat dissipation air inlet comprises three sets of air inlet holes disposed on a top plate of the server chassis, and the three sets of air inlet holes are distributed in three sections and disposed above the main control node module.

9. The server of claim 8, wherein the three sets of air inlet holes have a greater number of air inlet holes closer to the front panel of the server casing.

10. The server according to any one of claims 1 to 7, wherein an air outlet gap is reserved between the bottom of the PCIE module and the heat dissipation fan module, and an air pressure at the air outlet gap is smaller than an air pressure of the heat dissipation air inlet of the PCIE module.

Technical Field

The present invention relates to a server, and more particularly, to a server capable of efficiently dissipating heat.

Background

Servers, also known as servers, are devices that provide computing services. Since the server needs to respond to and process the service request, the server generally has the capability of assuming and securing the service. The server comprises a processor, a hard disk, a memory, a cooling fan and the like, is similar to a general computer architecture, but needs to provide high-reliability service, so that the server has higher requirements on a CPU (central processing unit) master control node module and a cooling effect, and the size of a 4U multi-node standard server is fixed and unchanged, so that in a limited standard space, the requirements of high performance and high-efficiency cooling can be met along with the upgrading of a product, and the optimization design on a cooling structure and a duct design is needed.

Disclosure of Invention

The technical problem to be solved by the invention is to provide a server capable of realizing the optimized design of a heat dissipation structure and a heat dissipation air duct, thereby meeting the high-efficiency heat dissipation requirement of the server and improving the heat dissipation efficiency of a product.

In view of the above, the present invention provides a server capable of achieving efficient heat dissipation, including: the system comprises a server case, a master control node module, a master control node heat dissipation air inlet, a PCIE module heat dissipation air inlet, a heat dissipation fan module, a power supply module and a power module heat dissipation air inlet, wherein the master control node module is arranged at one end of the server case; the PCIE module and the power supply module are arranged at the other end of the server case, a sealing piece is arranged between the PCIE module and the power supply module, the heat dissipation air inlet of the PCIE module is positioned at the front end of the PCIE module, and the heat dissipation air inlet of the power supply module is arranged on the side wall of the server case beside the power supply module; the heat dissipation fan module is arranged below the PCIE module and the power supply module; the air of the heat-dissipation air inlet of the main control node passes through the main control node module, and is discharged from the heat-dissipation fan module to form a node heat-dissipation air channel; the air of the PCIE module heat dissipation air inlet passes through the PCIE module and is exhausted from the heat dissipation fan module to form a PCIE heat dissipation air duct; the air of the heat dissipation air inlet of the power supply module passes through the power supply module, and then the air is discharged by the fan of the power supply module, so that an independent power supply heat dissipation air channel is formed.

The invention has the further improvement that the power supply system further comprises a connecting partition plate, and the connecting partition plate is arranged between the master control node module and the power supply module.

The invention is further improved in that the main control node modules are inserted in parallel at one side of the connecting partition plate.

The invention has the further improvement that the PCIE module, the heat radiation fan module and the power supply module are respectively inserted into the other side of the connecting partition plate.

The invention has the further improvement that the power supply modules are symmetrically arranged at two sides of the server case, the PCIE module is arranged between the power supply modules at two sides, and the sealing element is arranged between each power supply module and the PCIE module.

The invention is further improved in that the sealing element comprises a vertical sealing end and a horizontal sealing end, the vertical sealing end is vertically arranged between the PCIE module and the power supply module, and the horizontal sealing end is arranged above the power supply module.

The invention is further improved in that the sealing element is arranged at one end of the power supply module close to the master control node module.

The invention is further improved in that the heat-radiating air inlet of the main control node comprises three groups of air inlet holes arranged on the top plate of the server case, and the three groups of air inlet holes are dispersed into three sections and arranged above the main control node module.

The invention is further improved in that the number of the three groups of air inlet holes is larger as the air inlet holes are closer to the front panel of the server case.

The invention has the further improvement that an air outlet gap is reserved between the bottom of the PCIE module and the heat dissipation fan module, and the air pressure at the air outlet gap is smaller than the air pressure of a heat dissipation air inlet of the PCIE module.

Compared with the prior art, the invention has the beneficial effects that: a sealing element is arranged between the PCIE module and the power supply module, the air at the heat dissipation air inlet of the power supply module can pass through the power supply module and is discharged from a fan carried by the power supply module to form an independent power supply heat dissipation air duct, thereby enabling the power supply module to realize independent heat dissipation different from the node heat dissipation air duct and the PCIE heat dissipation air duct, on the basis, the heat dissipation air inlet of the power supply module is arranged on the side wall of the server case beside the power supply module, so that the problems of backflow, turbulence and the like caused by inconsistent air outlet directions of fans carried by the power supply module can be effectively solved.

Drawings

FIG. 1 is a schematic perspective view of a rear view of an embodiment of the present invention;

FIG. 2 is a schematic perspective view of a front view of an embodiment of the present invention;

FIG. 3 is a schematic diagram of a heat dissipation structure and a heat dissipation duct according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a heat dissipation structure and a heat dissipation duct with a transverse cross section according to an embodiment of the present invention;

fig. 5 is a schematic diagram of a heat dissipation structure and a heat dissipation air duct with a longitudinal cross section according to an embodiment of the invention.

Detailed Description

Preferred embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

As shown in fig. 1 to 5, this example provides a server capable of achieving efficient heat dissipation, including: the system comprises a server case 1, a master control node module 2, a master control node heat dissipation air inlet 3, a PCIE module 4, a PCIE module heat dissipation air inlet, a heat dissipation fan module 6, a power supply module 7 and a power module heat dissipation air inlet 8, wherein the master control node module 2 is arranged at one end of the server case 1, and the master control node heat dissipation air inlet 3 is arranged on a front panel of the server case 1 and a top plate of the server case 1 above the master control node module 2; the PCIE module 4 and the power supply module 7 are arranged at the other end of the server case 1, a sealing element 9 is arranged between the PCIE module 4 and the power supply module 7, the heat dissipation air inlet of the PCIE module is positioned at the front end of the PCIE module 4, and the heat dissipation air inlet 8 of the power supply module is arranged on the side wall of the server case 1 beside the power supply module 7; the heat dissipation fan module 6 is arranged below the PCIE module 4 and the power supply module 7; the air of the main control node heat dissipation air inlet 3 passes through the main control node module 2, and is discharged from the heat dissipation fan module 6 to form a node heat dissipation air channel; the air of the PCIE module heat dissipation air inlet passes through the PCIE module 4 and is exhausted from the heat dissipation fan module 6 to form a PCIE heat dissipation air duct; the air of the heat dissipation air inlet 8 of the power supply module passes through the power supply module 7, so that the air is exhausted by the fan arranged on the power supply module 7, and an independent power supply heat dissipation air channel is formed.

The main control node module 2 in this example refers to a main control node of a server, also called a main control module or a main control unit, and includes a main control circuit board including a CPU, a memory, and the like; the main control node heat dissipation air inlet 3 refers to an air inlet for realizing heat dissipation of the main control node module 2, as shown in fig. 1 to 3, the main control node heat dissipation air inlet 3 includes three groups of air inlet holes arranged on a top plate of the server case 1 and gaps between front panels of the server case 1, and the three groups of air inlet holes are distributed into three sections and arranged above the main control node module 2.

The reason for this arrangement is that it is preferable that two CPUs are provided for each of the master node modules 2 in the server, and as shown in fig. 4, it is preferable that 8 master node modules 2, i.e., servers of 4U8 nodes are provided in parallel, and there are 16 CPUs in total; the server of the 4U4 node comprises 8 processors and 48 matched hard disks, and the server of the 4U2 node comprises 4 processors and 72 matched hard disks, so that the power consumption is very high, a large amount of high temperature and high heat are generated, and a great challenge is brought to the temperature reduction of the server; the temperature of the position which is close to the front panel of the server case 1 and is just started to enter air is not too high, but the temperature is higher the later, and the heat dissipation pressure is also higher; in order to reduce the heat dissipation pressure at the rear end of the server, three groups of air inlet holes are formed above the main control node module 2 in a dispersing manner, so that the air inlet amount at the front end close to the front panel of the server case 1 can be effectively reduced, some cold air of the server case 1 is sucked from the rear end, and the high-temperature pressure of rear-end devices is reduced; preferably, the main control node module 2 and the main control node heat dissipation air inlet 3 on the top plate of the server case 1 are also provided with air inlets at corresponding positions for realizing more efficient heat dissipation.

As shown in fig. 3, in the three groups of air inlet holes, the number of air inlet holes closer to the front panel of the server chassis 1 is larger, so that the design has the advantage that the high-temperature pressure of the devices at the rear end of the server chassis 1 can be reduced, and the size of the inlet air can be controlled by the number of the air inlet holes, thereby preventing the direction of the heat dissipation air duct from being affected by too much cold air sucked from the rear end.

The PCIE module 4 in this embodiment is a PCIE module component disposed at one end of the rear panel of the server chassis 1, the PCIE module heat dissipation air inlet is an air inlet of the PCIE module 4, and the PCIE module heat dissipation air inlet is preferably located at the front end of the PCIE module 4, that is, a gap in the rear panel of the server chassis 1 where the PCIE module 4 is disposed is used as a heat dissipation air inlet thereof, as shown in fig. 3 to 5, no special air vent needs to be additionally disposed; the heat dissipation fan module 6 is a row of heat dissipation fans arranged at the lower part of the rear panel of the server chassis 1, and is used for realizing heat dissipation and air outlet of the main control node module 2, the PCIE module 4 and other modules; the power supply module 7 preferably adopts 2+2 redundant power supply, and it is worth mentioning that, be provided with sealing member 9 between PCIE module 4 and the power supply module 7, and then make the power supply module 7 of server machine case 1 both sides realizes independent heat dissipation wind channel, in addition, power module heat dissipation air intake 8 set up in on the server machine case 1 lateral wall next door of power supply module 7, through the side air inlet, and then avoided effectively because the inconsistent backward flow and the turbulent scheduling problem that produces of power fan air-out direction.

In this embodiment, air in the main control node heat dissipation air inlet 3 passes through the main control node module 2, and is discharged from the heat dissipation fan module 6 to form a node heat dissipation air duct, wherein the air inlet and outlet directions of the node heat dissipation air duct are shown by solid arrows in fig. 3 to 5; the air of the heat dissipation air inlet of the PCIE module passes through the PCIE module 4, and is discharged from the heat dissipation fan module 6 to form a PCIE heat dissipation air duct, wherein the air inlet and outlet directions of the PCIE heat dissipation air duct are shown by hollow arrows in figures 3 to 5; the air of the power supply module heat dissipation air inlet 8 passes through the power supply module 7, so that the air outlet of the power supply module 7 is realized by the fan arranged on the power supply module, an independent power supply heat dissipation air channel is formed, and the air inlet and air outlet directions of the power supply heat dissipation air channel are shown by dotted arrows in fig. 3 to 5.

Therefore, in this embodiment, a sealing member 9 is disposed between the PCIE module 4 and the power supply module 7, and the wind energy of the power supply module heat dissipation air inlet 8 can pass through the power supply module 7 to realize air outlet from the fan of the power supply module 7, so as to form an independent power supply heat dissipation air duct, so that the power supply module 7 can realize independent heat dissipation from the node heat dissipation air duct and the PCIE heat dissipation air duct, on this basis, the power supply module heat dissipation air inlet 8 is disposed on the side wall of the server case 1 beside the power supply module 7, which can effectively avoid the problems of backflow, turbulence and the like caused by the inconsistent air outlet direction of the fan of the power supply module 7, and this embodiment performs unique optimization design on the heat dissipation structure and the heat dissipation air duct, can effectively improve the heat dissipation efficiency of the product, and the optimized scheme is reasonable and efficient, high stability and long service life.

The power supply system also comprises a connecting partition plate 5, wherein the connecting partition plate 5 is a circuit back plate for realizing power supply and communication connection, and the connecting partition plate 5 is arranged between the master control node module 2 and the power supply module 7; the main control node modules 2 are inserted into one side of the connecting partition plate 5 in parallel, and the PCIE module 4, the cooling fan module 6 and the power supply module 7 are respectively inserted into the other side of the connecting partition plate 5, so that the server realizes the structural design that the front end and the rear end are respectively inserted, the assembly efficiency of a product is improved, and the subsequent maintenance cost is reduced; simultaneously, through mutually supporting of connecting baffle 5 and sealing member 9, can further guarantee power heat dissipation wind channel's independence can obviously improve its holistic radiating efficiency through realizing different heat dissipation wind channels to different modules.

As shown in fig. 1 to fig. 3, in this embodiment, the power supply modules 7 are symmetrically disposed on two sides of the server chassis 1, the PCIE module 4 is disposed between the power supply modules 7 on the two sides, and the sealing member 9 is disposed between each power supply module 7 and the PCIE module 4. Preferably, the sealing element 9 is disposed at one end of the power supply module 7 close to the master control node module 2, the sealing element 9 includes a vertical sealing end 901 and a horizontal sealing end 902, the vertical sealing end 901 is vertically disposed between the PCIE module 4 and the power supply module 7, and the horizontal sealing end 902 is disposed above the power supply module 7, so that the independence of the power heat dissipation air duct is ensured, and mutual interference is prevented.

In this embodiment, an air outlet gap 10 is reserved between the bottom of the PCIE module 4 and the cooling fan module 6, where the air outlet gap 10 has a smaller space, that is, a space between the PCIE module 4 and the cooling fan module 6, when the cooling fan module 6 works, the air pressure at the position of the air outlet gap 10 is obviously smaller than the air pressure of the cooling air inlet of the PCIE module, and the air inevitably enters from the side of the PCIE module 4 with higher air pressure, flows toward the cooling fan module 6, and is discharged outside the server chassis 1 through the cooling fan module 6; in practical application, an expansion module or a CMC module may be further disposed at the position of the PCIE module 4, and the cooling air duct and the PCIE cooling air duct may be shared.

The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.