阅读说明：本技术 一种巨量转移装置及其方法 (Mass transfer device and method thereof ) 是由 姚黎晓 刘金龙 李健林 王春阳 于 2021-07-16 设计创作，主要内容包括：本申请实施例提供一种巨量转移装置及其方法,该装置包括转移单元、承接基板、电热单元以及光线焊接单元；转移单元包括：转移基板、热敏胶层和待转移芯片,转移基板设置有相对的第一表面和第二表面,待转移芯片通过热敏胶层固定于转移基板的第二表面,待转移芯片底部设置有焊盘,所焊盘朝承接基板的方向设置；承接基板与转移基板平行,承接基板设置有相对的第三表面和第四表面,第三表面与转移基板的第二表面相对设置；电热单元设置于所述转移基板的第一表面方向；光线焊接单元,光线焊接单元设置于承接基板的第四表面方向该巨量转移装置可以在进行焊接时不需要穿过芯片,降低芯片被激光损坏的概率。(The embodiment of the application provides a mass transfer device and a method thereof, wherein the device comprises a transfer unit, a bearing substrate, an electric heating unit and a light welding unit; the transfer unit includes: the chip to be transferred is fixed on the second surface of the transfer substrate through the heat-sensitive adhesive layer, and a bonding pad is arranged at the bottom of the chip to be transferred and faces the direction of bearing the substrate; the bearing substrate is parallel to the transfer substrate, the bearing substrate is provided with a third surface and a fourth surface which are opposite, and the third surface is opposite to the second surface of the transfer substrate; the electric heating unit is arranged in the direction of the first surface of the transfer substrate; the light welding unit is arranged in the direction of the fourth surface of the bearing substrate, the huge transfer device does not need to penetrate through the chip during welding, and the probability that the chip is damaged by laser is reduced.)

1. A mass transfer device is characterized by comprising a transfer unit, a bearing substrate, an electric heating unit and a light welding unit;

the transfer unit, the transfer unit includes: the chip transfer device comprises a transfer substrate, a thermosensitive adhesive layer and a chip to be transferred, wherein the transfer substrate is provided with a first surface and a second surface which are opposite, the chip to be transferred is fixed on the second surface of the transfer substrate through the thermosensitive adhesive layer, the bottom of the chip to be transferred is provided with a bonding pad, and the bonding pad is arranged towards the direction of the carrying substrate;

the carrying substrate is parallel to the transfer substrate, the carrying substrate is provided with a third surface and a fourth surface which are opposite, and the third surface is opposite to the second surface of the transfer substrate;

the electric heating unit is arranged in the direction of the first surface of the transfer substrate, and is used for heating the heat-sensitive adhesive layer until the chip to be transferred is separated from the heat-sensitive adhesive layer and falls on the third surface of the carrying substrate, and the bonding pad is in contact with the third surface;

and the light welding unit is arranged in the direction of the fourth surface of the bearing substrate and is used for emitting light to penetrate through the bearing substrate and welding the bonding pad.

2. The bulk transfer device of claim 1, wherein the receiving substrate is made of a transparent material.

3. The mass transfer device of claim 1, wherein the electric heat unit comprises: the electric heating elements are arranged in an array and are light ray electric heating elements.

4. The bulk transfer device of claim 1, wherein the light welding unit comprises: a plurality of light welding elements arranged in an array.

5. The bulk transfer device of claim 1, wherein the receiving substrate is made of a flexible material, the device further comprising: a reel take-up and pay-off device;

one end of the bearing substrate is fixed on a winding shaft of the reel winding and unwinding device, and the other end of the bearing substrate is fixed on an unwinding shaft of the reel winding and unwinding device;

one part of the receiving substrate is wound on the winding shaft, and the other part of the receiving substrate is wound on the unwinding shaft.

6. The bulk transfer device of claim 1, wherein the receiving substrate is made of polyethylene terephthalate.

7. The bulk transfer device of claim 1, wherein the pads comprise: and (7) a tin plate.

8. A mass transfer method applied to a mass transfer apparatus according to any one of claims 1 to 7, the method comprising:

laying a thermosensitive adhesive layer on the second surface of the transfer substrate, wherein the chip to be transferred is fixed on the second surface of the transfer substrate through the thermosensitive adhesive layer;

heating the thermosensitive adhesive layer through the electric heating unit until the chip to be transferred is separated from the thermosensitive adhesive layer and falls on the third surface of the carrying substrate;

and the light welding unit emits light which passes through the fourth surface of the bearing substrate to weld the bonding pad.

9. The bulk transfer method according to claim 8, wherein the heating the thermal adhesive layer by the electrothermal unit comprises:

the electric heating unit heats the first preset area of the thermosensitive adhesive layer.

10. The mass transfer method of claim 8, further comprising:

and starting the reel winding and unwinding device, and winding the bearing substrate on the reel winding and unwinding device.

Technical Field

The embodiment of the application relates to the technical field of display, in particular to a mass transfer device and a mass transfer method.

Background

After the Micro LED light emitting chips are manufactured, tens of thousands to hundreds of thousands of Micro LED light emitting chips need to be transferred to the driving circuit board to form an LED array, and this process is called "bulk transfer". After the Mini/Micro LED chips are manufactured, a huge amount of Mini/Micro LED chips are usually transferred, specifically, a large amount (usually several tens to millions of) Mini/Micro LED chips are transferred to a driving circuit board to form an LED array. In the current bulk transfer method, after a plurality of chips are formed on a substrate, all the chips are adhered to the same blue film, and the substrate is removed; and finally, transferring all the chips on the blue film to a circuit substrate, and welding and fixing the chips on the driving circuit board through a bonding pad at the bottom of each chip. In the prior art, a laser welding device needs to penetrate through a chip when welding a welding pad, so that the probability of damage to the chip by laser is increased.

Disclosure of Invention

The embodiment of the application provides a huge transfer device, can need not pass the chip when carrying out the welding, reduces the probability that the chip is damaged by the laser.

The embodiment of the application provides a mass transfer device, which comprises a transfer unit, a bearing substrate, an electric heating unit and a light welding unit;

the transfer unit, the transfer unit includes: the chip transfer device comprises a transfer substrate, a thermosensitive adhesive layer and a chip to be transferred, wherein the transfer substrate is provided with a first surface and a second surface which are opposite, the chip to be transferred is fixed on the second surface of the transfer substrate through the thermosensitive adhesive layer, the bottom of the chip to be transferred is provided with a bonding pad, and the bonding pad is arranged towards the direction of the carrying substrate;

the carrying substrate is parallel to the transfer substrate, the carrying substrate is provided with a third surface and a fourth surface which are opposite, and the third surface is opposite to the second surface of the transfer substrate;

the electric heating unit is arranged in the direction of the first surface of the transfer substrate, and is used for heating the heat-sensitive adhesive layer until the chip to be transferred is separated from the heat-sensitive adhesive layer and falls on the third surface of the carrying substrate, and the bonding pad is in contact with the third surface;

and the light welding unit is arranged in the direction of the fourth surface of the bearing substrate and is used for emitting light to penetrate through the bearing substrate and welding the bonding pad.

In some embodiments, the receiving substrate is made of a transparent material.

In some embodiments, the electric heating unit comprises: the electric heating elements are arranged in an array and are light ray electric heating elements.

In some embodiments, the light welding unit comprises: a plurality of light welding elements arranged in an array.

In some embodiments, the receiving substrate is made of a flexible material, and the apparatus further includes: a reel take-up and pay-off device;

one end of the bearing substrate is fixed on a winding shaft of the reel winding and unwinding device, and the other end of the bearing substrate is fixed on an unwinding shaft of the reel winding and unwinding device;

one part of the receiving substrate is wound on the winding shaft, and the other part of the receiving substrate is wound on the unwinding shaft.

In some embodiments, the receiving substrate is made of polyethylene terephthalate.

In some embodiments, the pad includes: and (7) a tin plate.

An embodiment of the present application further provides a bulk transfer method, where the method is applied to the bulk transfer apparatus in the foregoing embodiment, and the method includes:

laying a thermosensitive adhesive layer on the second surface of the transfer substrate, wherein the chip to be transferred is fixed on the second surface of the transfer substrate through the thermosensitive adhesive layer;

heating the thermosensitive adhesive layer through the electric heating unit until the chip to be transferred is separated from the thermosensitive adhesive layer and falls on the third surface of the carrying substrate;

and the light welding unit emits light which passes through the fourth surface of the bearing substrate to weld the bonding pad.

In some embodiments, the heating the thermal adhesive layer by the electrothermal unit includes:

the electric heating unit heats the first preset area of the thermosensitive adhesive layer.

In some embodiments, the method further comprises:

and starting the reel winding and unwinding device, and winding the bearing substrate on the reel winding and unwinding device.

The embodiment of the application provides a mass transfer device, which comprises a transfer unit, a bearing substrate, an electric heating unit and a light welding unit; the transfer unit includes: the chip to be transferred is fixed on the second surface of the transfer substrate through the heat-sensitive adhesive layer, and a bonding pad is arranged at the bottom of the chip to be transferred and faces to the direction of bearing the substrate; the bearing substrate is parallel to the transfer substrate, the bearing substrate is provided with a third surface and a fourth surface which are opposite, and the third surface is opposite to the second surface of the transfer substrate; the electric heating unit is arranged in the direction of the first surface of the transfer substrate and used for heating the thermosensitive adhesive layer until the chip to be transferred is separated from the thermosensitive adhesive layer and falls on the third surface of the carrying substrate, and the bonding pad is in contact with the third surface; the light welding unit is arranged in the direction of the fourth surface of the bearing substrate and used for emitting light to penetrate through the bearing substrate and welding the welding disc. Therefore, in the actual application process of the mass transfer device, the light welding unit can be arranged on the back surface of the bearing substrate, and when welding is carried out, light emitted by the light welding unit penetrates through the bearing substrate and directly reaches the bonding pad of the chip to be transferred without penetrating through the chip to be transferred, so that the probability that the chip to be transferred is damaged by laser is reduced.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a device diagram of a bulk transfer device according to an embodiment of the present application.

Fig. 2 is a flowchart of a bulk transfer method according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "length," "width," "height," "depth," and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Embodiments of the present disclosure provide a bulk transfer apparatus, by which light source devices such as a backlight source of an electronic device can be manufactured. The backlight source can be used in cooperation with a terminal, such as a smart phone, a tablet computer, a notebook computer or a personal computer. The mass transfer device can be used for welding without penetrating through a chip, so that the probability of damaging the chip by laser is reduced. The mass transfer apparatus will be described in detail below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.

The present application will be described in detail with reference to the accompanying drawings and specific embodiments, and referring to fig. 1, fig. 1 is a diagram of an apparatus of a bulk transfer apparatus according to an embodiment of the present application. The apparatus includes a transfer unit 100, a receiving substrate 200, an electric heating unit 300, and a light welding unit 400.

Specifically, the transfer unit 100 includes: the chip transfer device comprises a transfer substrate 1001, a thermal adhesive layer 1002 and a chip to be transferred 1003, wherein the transfer substrate 1001 is provided with a first surface and a second surface which are opposite, the chip to be transferred 1003 is fixed on the second surface of the transfer substrate 1001 through the thermal adhesive layer 1002, a bonding pad 1004 is arranged at the bottom of the chip to be transferred 1003, and the bonding pad 1004 is arranged towards the bearing substrate 200.

More specifically, the heat sensitive glue is a polyhydroxyether polymer.

In some embodiments, the chip 1003 to be transferred may also be fixed to the second surface of the transfer substrate 1001 by a photosensitive adhesive layer.

In some embodiments, the transfer substrate 1001 may be a blue film, and the blue film is made of a stretchable material, and according to practical applications, the blue film may be subjected to planar stretching deformation to increase the distance between the adjacent chips 1003 to be transferred.

In some embodiments, the chip 1003 to be transferred may be a red chip, a green chip, a blue chip, or a white chip.

And a receiving substrate 200, the receiving substrate 200 being parallel to the transfer substrate 1001, the receiving substrate 200 being provided with a third surface and a fourth surface opposite to each other, the third surface being provided opposite to the second surface of the transfer substrate 1001.

Specifically, the receiving substrate 200 is made of a transparent material, so that the receiving substrate 200 may be a transparent conductive substrate, and polyethylene terephthalate may be selected as the material of the receiving substrate 200.

In some embodiments, the chip 1003 to be transferred may be provided with a boss structure, and the receiving substrate 200 may be provided with a groove, and the boss and the groove may be used in cooperation.

In some embodiments, the electric heating unit 300 is disposed in the direction of the first surface of the transfer substrate 1001, the electric heating unit 300 is configured to heat the thermal sensitive adhesive layer 1002 until the chip 1003 to be transferred falls on the third surface of the receiving substrate 200 away from the thermal sensitive adhesive layer 1002, and the bonding pad 1004 contacts with the third surface.

In some embodiments, the electric heating unit 300 includes a plurality of electric heating elements arranged in an array, and the thermal adhesives at different positions can be heated by controlling the electric heating elements at different positions, so as to precisely control the falling position of the chip 1003 to be transferred. According to the practical application, the electric heating element can be a light ray electric heating element, namely a laser heating element.

And the light welding unit 400, wherein the light welding unit 400 is arranged in the direction of the fourth surface of the receiving substrate 200 and is used for emitting light to penetrate through the receiving substrate 200 and welding the welding pad 1004.

Specifically, the receiving substrate 200 is made of a transparent material, the bonding pads 1004 are arranged at the bottom of the chip 1003 to be transferred, and light emitted by the light welding unit 400 can pass through the receiving substrate 200 and directly reach the bonding pads 1004 of the chip 1003 to be transferred without passing through the chip 1003 to be transferred, so that the probability that the chip 1003 to be transferred is damaged by laser is reduced. The pads 1004 may be solder pads, depending on the application.

In some embodiments, the light welding unit 400 includes: the light welding elements are arranged in an array. The chips 1003 to be transferred at different positions can be welded by controlling the light welding elements at different positions, so that the welding positions of the chips 1003 to be transferred can be accurately controlled, and the probability that the chips 1003 to be transferred are damaged by laser can be reduced. The light welding unit 400 may be a laser welding unit according to practical applications.

In some embodiments, the bulk transfer device 10 further comprises: and the reel winding and unwinding device is characterized in that the bearing substrate 200 is made of a flexible material, one end of the bearing substrate 200 is fixed on a winding shaft of the reel winding and unwinding device, and the other end of the bearing substrate is fixed on an unwinding shaft of the reel winding and unwinding device. One part of the receiving substrate 200 is wound on the winding shaft, and the other part is wound on the unwinding shaft, so that the operation space can be saved.

The embodiment of the present application provides a bulk transfer apparatus 10, which includes a transfer unit 100, a receiving substrate 200, an electric heating unit 300, and a light welding unit 400; the transfer unit 100 includes: the chip transfer device comprises a transfer substrate 1001, a thermal sensitive adhesive layer 1002 and a chip to be transferred 1003, wherein the transfer substrate 1001 is provided with a first surface and a second surface which are opposite, the chip to be transferred 1003 is fixed on the second surface of the transfer substrate 1001 through the thermal sensitive adhesive layer 1002, a bonding pad 1004 is arranged at the bottom of the chip to be transferred 1003, and the bonding pad 1004 is arranged towards the bearing substrate 200; a receiving substrate 200, the receiving substrate 200 being parallel to the transfer substrate 1001, the receiving substrate 200 being provided with a third surface and a fourth surface opposite to each other, the third surface being provided opposite to the second surface of the transfer substrate 1001; the electric heating unit 300 is arranged in the direction of the first surface of the transfer substrate 1001, the electric heating unit 300 is used for heating the thermal sensitive adhesive layer 1002 until the chip 1003 to be transferred falls on the third surface of the carrying substrate 200 after being separated from the thermal sensitive adhesive layer 1002, and the bonding pad 1004 is in contact with the third surface; and the light welding unit 400, wherein the light welding unit 400 is arranged in the direction of the fourth surface of the receiving substrate 200 and is used for emitting light to penetrate through the receiving substrate 200 and welding the welding pad 1004. The mass transfer device can be used for welding without penetrating through a chip, so that the probability of damaging the chip by laser is reduced.

The embodiment of the application also discloses a mass transfer method, which is applied to the mass transfer device in the embodiment, and the device comprises a transfer unit, a receiving substrate, an electric heating unit and a light welding unit.

Specifically, the transfer unit includes: the chip transfer device comprises a transfer substrate, a thermosensitive adhesive layer and a chip to be transferred, wherein the transfer substrate is provided with a first surface and a second surface which are opposite, the chip to be transferred is fixed on the second surface of the transfer substrate through the thermosensitive adhesive layer, a bonding pad is arranged at the bottom of the chip to be transferred, and the bonding pad is arranged towards the direction of bearing the substrate.

More specifically, the heat sensitive glue is a polyhydroxyether polymer.

In some embodiments, the chip to be transferred may also be fixed to the second surface of the transfer substrate by a layer of photosensitive glue.

In some embodiments, the transfer substrate may be a blue film, the blue film is made of a stretchable material, and according to practical application, the blue film may be subjected to planar stretching deformation to increase a distance between adjacent chips to be transferred.

In some embodiments, the chip to be transferred may be a red chip, a green chip, a blue chip, or a white chip.

And the bearing substrate is parallel to the transfer substrate, is provided with a third surface and a fourth surface which are opposite, and is opposite to the second surface of the transfer substrate.

Specifically, the receiving substrate is made of a transparent material, so that the receiving substrate can be a transparent conductive base material, and polyethylene terephthalate can be selected as the material of the receiving substrate.

In some embodiments, the chip to be transferred may be provided with a boss structure, the receiving substrate may be provided with a groove, and the boss and the groove may be used in cooperation.

In some embodiments, the electric heating unit is disposed in the direction of the first surface of the transfer substrate, and is configured to heat the thermal adhesive layer until the chip to be transferred falls on the third surface of the receiving substrate away from the thermal adhesive layer, and the bonding pad contacts the third surface.

In some embodiments, the electric heating unit comprises a plurality of electric heating elements which are arranged in an array, and the thermal sensitive adhesive at different positions can be heated by controlling the electric heating elements at different positions, so that the falling position of the chip to be transferred can be accurately controlled. According to the practical application, the electric heating element can be a light ray electric heating element, namely a laser heating element.

And the light welding unit is arranged in the direction of the fourth surface of the bearing substrate and is used for emitting light to penetrate through the bearing substrate and welding the welding disc.

Specifically, the material of accepting the base plate is transparent material, and the pad setting is in waiting to shift the chip bottom, and light is launched out to the light welding unit and can be passed and accept the base plate, directly reaches and waits to shift the chip pad, need not pass and wait to shift the chip, reduces and waits to shift the probability that the chip is damaged by laser. The bonding pad can be a tin plate according to practical application.

In some embodiments, the light welding unit comprises: the light welding elements are arranged in an array. The chips to be transferred at different positions can be welded by controlling the light welding elements at different positions, so that the welding positions of the chips to be transferred are accurately controlled, and the probability of laser damage to the chips to be transferred can be reduced. The light welding unit may be a laser welding unit according to practical applications.

In some embodiments, the bulk transfer device further comprises: and the reel winding and unwinding device is characterized in that the bearing substrate is made of a flexible material, one end of the bearing substrate is fixed on a winding shaft of the reel winding and unwinding device, and the other end of the bearing substrate is fixed on an unwinding shaft of the reel winding and unwinding device. One part of the bearing substrate is wound on the winding shaft, and the other part of the bearing substrate is wound on the unwinding shaft, so that the operation space can be saved.

Referring to fig. 2, the bulk transfer method includes: s201, laying a thermosensitive adhesive layer on the second surface of the transfer substrate, and fixing the chip to be transferred on the second surface of the transfer substrate through the thermosensitive adhesive layer; s202, heating the thermosensitive adhesive layer through the electric heating unit until the chip to be transferred is separated from the thermosensitive adhesive layer and falls on the third surface of the carrying substrate; s203, the light welding unit emits light which penetrates through the fourth surface of the bearing substrate to weld the welding disc.

And arranging a first preset area on the transfer substrate, selecting an electric heating element corresponding to the first preset area, and starting the electric heating element to heat the first preset area of the thermosensitive adhesive layer.

In some embodiments, the method further comprises: and starting the reel winding and unwinding device, and winding the bearing substrate on the reel winding and unwinding device. The operating space can be saved.

An embodiment of the present application provides a bulk transfer method, which is applied to the bulk transfer apparatus in the foregoing embodiment, and the method includes: laying a thermosensitive adhesive layer on the second surface of the transfer substrate, wherein the chip to be transferred is fixed on the second surface of the transfer substrate through the thermosensitive adhesive layer; heating the thermosensitive adhesive layer through the electric heating unit until the chip to be transferred is separated from the thermosensitive adhesive layer and falls on the third surface of the carrying substrate; and the light welding unit emits light which passes through the fourth surface of the bearing substrate to weld the bonding pad. The mass transfer method can be used for welding without penetrating through the chip, so that the probability of damaging the chip by laser is reduced.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The bulk transfer device and the method thereof provided by the embodiments of the present application are described in detail above, and the principle and the implementation manner of the present application are explained in the present application by applying specific examples, and the description of the embodiments above is only used to help understanding the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.