阅读说明：本技术 一种led芯片的维修方法 (Maintenance method of LED chip ) 是由 李漫铁 王旭东 陈小超 赵敏 罗国华 周杰 于 2021-07-23 设计创作，主要内容包括：本申请涉及LED芯片的维修方法,属于LED封装技术领域。该维修方法包括,提供具有预设温度的加热件,加热件包括具有目标粗糙度的第一表面,采用加热件的第一表面压合于失效LED芯片所在目标区域内的目标胶体的第二表面,以使第二表面具有目标粗糙度,目标胶体包覆有位于目标区域内的有效LED芯片,通过将加热件的第一表面作用于目标区域的目标胶体的第二表面,由于第一表面具有目标粗糙度,可以使目标区域内的目标胶体的第二表面也具有目标粗糙度,改善了维修点平整度、表面纹路粗糙度不一致的问题,提升了维修质量,得到了良好的产品外观。(The application relates to a maintenance method of an LED chip, belonging to the technical field of LED packaging. The maintenance method comprises the steps of providing a heating element with a preset temperature, wherein the heating element comprises a first surface with target roughness, the first surface of the heating element is pressed on a second surface of a target colloid in a target area where an invalid LED chip is located, so that the second surface has the target roughness, the target colloid is coated with an effective LED chip located in the target area, the first surface of the heating element acts on the second surface of the target colloid in the target area, because the first surface has the target roughness, the second surface of the target colloid in the target area can also have the target roughness, the flatness of a maintenance point is improved, the problem of inconsistent surface texture roughness is solved, the maintenance quality is improved, and good product appearance is obtained.)

1. A maintenance method of an LED chip is characterized by comprising the following steps:

providing a heating element having a preset temperature; the heating element includes a first surface having a target roughness;

pressing the first surface of the heating element on a second surface of a target colloid in a target area where the failed LED chip is located so as to enable the second surface to have the target roughness;

wherein the target colloid is coated with an active LED chip located within the target area.

2. The method for maintaining the LED chip according to claim 1, wherein the providing of the heating member having the preset temperature specifically includes:

a release film is arranged on the heating element; wherein the first surface is the surface of one side of the release film away from the heating element;

heating the heating member to the preset temperature.

3. The method for maintaining the LED chip according to claim 1, wherein before the first surface of the heating element is pressed on the second surface of the target colloid in the target area where the failed LED chip is located, the method further comprises:

placing an active LED chip in the target area;

and filling the target area with the target colloid and exposing the second surface of the target colloid so as to coat the effective LED chip with the target colloid.

4. The method for repairing an LED chip according to claim 3, wherein the placing of the valid LED chip in the target area specifically comprises:

baking the effective LED chip;

and placing the baked effective LED chip in the target area through a wire bonding process.

5. The method of claim 3, wherein the placing the valid LED chips in the target area further comprises:

and removing the failed LED chip positioned in the target area and the colloid coating the failed LED chip through windowing.

6. The method for repairing an LED chip according to any one of claims 1 to 5, wherein an area of an orthographic projection of the second surface on the first surface is equal to an area of the first surface.

7. The method for maintaining the LED chip according to any one of claims 1 to 5, wherein a plurality of heating wires are arranged in the heating element, and the heating element is connected with a constant temperature heating control device.

8. The method for repairing an LED chip according to any one of claims 1 to 5, wherein the weight of the heating member is not less than the weight of the target colloid.

9. The method for repairing an LED chip as claimed in any one of claims 1 to 5, wherein the target colloid is an epoxy resin colloid, and the predetermined temperature range is 100-180 ℃.

10. The method for repairing an LED chip according to any one of claims 1 to 5, wherein the LED chip is a Mini-LED chip or a Micro-LED chip.

Technical Field

The application relates to the technical field of LED packaging, in particular to a maintenance method of an LED chip.

Background

In the related art, the maintenance method of the LED integrated package display product includes removing the colloid and the wafer at the bad position by laser, etching, knife-etching, heating, etc., filling the colloid after re-die bonding and welding, and directly baking and curing the filled colloid.

In the process, the flatness of the maintained area is inconsistent with the flatness of the unrepaired area after the colloid is filled, so that the appearance of the product is affected.

Disclosure of Invention

Therefore, it is necessary to provide a method for repairing an LED chip to solve the above problems, such as the inconsistency between the flatness of the repair points and the roughness of the surface texture.

In order to achieve the above object, an embodiment of the present application provides a method for maintaining an LED chip, where the method includes:

providing a heating element having a preset temperature; the heating element includes a first surface having a target roughness;

pressing the first surface of the heating element on a second surface of a target colloid in a target area where the failed LED chip is located so as to enable the second surface to have the target roughness;

wherein the target colloid is coated with an active LED chip located within the target area.

In one embodiment, the providing a heating element having a predetermined temperature specifically includes:

a release film is arranged on the heating element; wherein the first surface is the surface of one side of the release film away from the heating element;

heating the heating member to the preset temperature.

In one embodiment, before the step of pressing the first surface of the heating element on the second surface of the target colloid in the target area where the failed LED chip is located to make the second surface have the target roughness, the method further includes:

placing an active LED chip in the target area;

and filling the target area with the target colloid and exposing the second surface of the target colloid so as to coat the effective LED chip with the target colloid.

In one embodiment, the placing the valid LED chip in the target area specifically includes:

baking the effective LED chip;

and placing the baked effective LED chip in the target area through a wire bonding process.

In one embodiment, the placing the active LED chip in the target area further comprises:

and removing the failed LED chip positioned in the target area and the colloid coating the failed LED chip through windowing.

In one embodiment, the orthographic area of the second surface on the first surface is equal to the area of the first surface.

In one embodiment, a plurality of heating wires are arranged in the heating element, and the heating element is connected with a constant-temperature heating control device.

In one embodiment, the weight of the heating element is not less than the weight of the target colloid.

In one embodiment, the target colloid is an epoxy resin adhesive, and the predetermined temperature range is 100-180 ℃.

In one embodiment, the LED chip is a Mini-LED chip or a Micro-LED chip.

Among the maintenance method of above-mentioned LED chip, provide the heating member that has preset temperature, the heating member is including the first surface that has the target roughness, the first surface pressfitting that adopts the heating member is on the second surface of the target colloid in inefficacy LED chip place target area, so that the second surface has the target roughness, the target colloid cladding has the effective LED chip that is located the target area, the second surface through the first surface with the heating member acts on the target colloid of target area, because the first surface has the target roughness, the second surface that can make the target colloid in the target area also has the target roughness, the maintenance point roughness has been improved, the inconsistent problem of roughness line, the maintenance quality has been promoted, good product appearance has been obtained.

Drawings

FIG. 1 is a schematic structural diagram of an LED integrated package display module according to an embodiment of the present disclosure;

FIG. 2 is a schematic flow chart illustrating a method for repairing an LED chip according to an embodiment of the present disclosure;

FIG. 3 is a schematic flow chart illustrating a method for repairing an LED chip according to another embodiment of the present disclosure;

FIG. 4 is a schematic flow chart illustrating a method for repairing an LED chip according to another embodiment of the present disclosure;

fig. 5 is a schematic flow chart illustrating a method for repairing an LED chip according to still another embodiment of the present application.

Notation of elements for simplicity:

100. the LED chip comprises substrates 100 and 200, LED chips 300, bonding wires 400 and packaging colloid.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth to provide a thorough understanding of embodiments of the present application. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. The embodiments of this application can be implemented in many different ways than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the invention and therefore the embodiments of this application are not limited to the specific embodiments disclosed below.

It is to be understood that the terms "first," "second," and the like as used herein may be used herein to describe various terms of art, and are not to be construed as indicating or implying relative importance or implicit ly indicating a number of technical features being indicated. However, these terms are not intended to be limiting unless specifically stated. These terms are only used to distinguish one term from another. For example, the first surface and the second surface are different surfaces without departing from the scope of the present application. In the description of the embodiments of the present application, "a plurality" or "a plurality" means at least two, e.g., two, three, etc., unless specifically defined otherwise.

In the description of the embodiments of the present application, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

In the description of the embodiments of the present application, unless otherwise explicitly specified or limited, a first feature "on" or "under" a second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "above," and "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely below the second feature, or may simply mean that the first feature is at a lesser level than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application in the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

To facilitate understanding of technical solutions of the embodiments of the present application, before describing specific embodiments of the present application, some technical terms in the technical field to which the embodiments of the present application belong are briefly explained.

Mini LED/Micro LED, i.e. LED scaling and matrixing, refers to a high-density, Micro-sized LED array integrated on a driving substrate, e.g. each pixel can be addressed and individually driven to light up to realize display. The Mini LED is also called a sub-millimeter light emitting diode, and refers to an LED with a grain size of about 100 microns or more, the Mini LED has a size between that of a conventional LED and that of a Micro LED, and the size of the Mini LED is generally 100 microns to 300 microns, and the size of the Micro LED is generally 100 microns or less.

FIG. 1 is a schematic structural diagram of an LED integrated package display module according to an embodiment of the present application; for ease of illustration, only the portions relevant to the present application are shown.

As shown in fig. 1, the LED integrated package display module includes a substrate 100, a pad (not shown) disposed on the substrate 100, an adhesive (not shown) disposed on the pad, an LED chip 200, a bonding wire 300 for electrically connecting the LED chip to the pad, and a molding compound 400. Before the LED integrated packaging display module is packaged, preliminary lighting detection is carried out to ensure that each LED chip 200 and the components are normally electrically connected. If the LED chip 200 is not lighted or has abnormal brightness and other abnormal lighting conditions, the LED chip is judged to be a failed LED chip, namely a dead spot or a dead lamp, and the position corresponding to the failed LED chip is a bad position. The operating personnel only need in time maintain the dead pixel, and the encapsulation can be carried out after the maintenance is finished.

As described in the background art, in the related art, the repair method of the LED integrated package display product includes removing the colloid and the wafer at the defective position by laser, etching, knife-etching, heating, etc., filling the colloid after re-die bonding and soldering, and directly baking and curing the filled colloid.

In the process, the flatness of the maintained area is inconsistent with the flatness of the unrepaired area after the colloid is filled, so that the appearance of the product is affected.

Aiming at the problems in the related art, the embodiment of the application provides the maintenance method of the LED chip so as to solve the problem that the flatness of the maintenance point and the roughness of the surface grains are inconsistent. The provided LED integrated packaging display module comprises product forms such as an intermediate state (namely a semi-finished product) or a final state (namely a finished product). Since the related structures and related processes for forming the intermediate state or the final state are prior art and are not the main points claimed in the embodiments of the present application, detailed descriptions of the related structures and related processes related to the intermediate state or the final state and other product forms are not provided herein.

Fig. 2 is a schematic flow chart illustrating a method for repairing an LED chip according to an embodiment of the present disclosure.

In one embodiment, referring to fig. 2, the present application provides a method for repairing an LED chip, including the following steps:

s101, providing a heating element with a preset temperature; the heating member includes a first surface having a target roughness;

specifically, the surface roughness is generally formed by the processing method and other factors, and the difference between the processing method and the workpiece material is the depth, density, shape and texture of the trace left on the processed surface, whereas in the embodiment of the present application, the target roughness refers to the roughness of the surface of the encapsulant before the maintenance of the LED integrated package display module. It should be noted that the preset temperature refers to a temperature capable of curing the later-mentioned target colloid, for example, in some embodiments, in order to obtain good appearance characteristics, the used encapsulant is epoxy resin glue, and correspondingly, the target colloid is also epoxy resin glue, when the preset temperature range is 100-. In some embodiments, a plurality of heating wires are arranged in the heating element, and the heating element is connected with the constant-temperature heating control device, so that the heating process is conveniently controlled.

In addition, when the step S101 is performed, that is, before the heating member having the preset temperature is provided, the first surface of the heating member may be processed according to the roughness of the surface of the other region of the LED integrated package display module to obtain the first surface having the target roughness, and the other region is a region where the defective position is removed.

S102, pressing the first surface of the heating element on the second surface of the target colloid in the target area where the failure LED chip is located so as to enable the second surface to have target roughness; wherein the target colloid is coated with active LED chips located within the target area.

Specifically, inefficacy LED chip place target area is the bad position that the former indicated promptly, the target area intussuseption is filled with the target colloid, in order to avoid directly when heating the target colloid, the roughness of the difficult control target colloid, the first surface that adopts the heating member pushes down the heating solidification to the target colloid, the first surface of heating member is to the second surface that is located the target colloid, because the first surface has the target roughness, the second surface of the target colloid after the heating solidification through pushing down also has the target roughness, thereby the maintenance point roughness has been improved, the inconsistent problem of surface texture roughness, the maintenance quality has been promoted, good product appearance has been obtained.

In some embodiments, the orthographic area of the second surface on the first surface is equal to the area of the first surface, so that the second surface can obtain the required target roughness, and the pressure curing is prevented from spreading beyond the edge of the first surface due to the excessive dosage of the target colloid. In other embodiments, the weight of the heating element is not less than the weight of the target colloid, and specifically, the heating element may be configured as a metal block, where the metal block is used to ensure that the metal block is not jacked up during the solidification process of the target colloid, so as to meet the requirement of appearance.

Fig. 3 is a schematic flow chart illustrating a method for repairing an LED chip according to another embodiment of the present disclosure.

Referring to fig. 3, an embodiment of the present application provides a maintenance method for an LED chip, including the following steps:

s201, arranging a release film on a heating element; the first surface is the surface of one side of the release film, which is far away from the heating element;

specifically, use encapsulation colloid usefulness cover the heating member from the type membrane, carry out the shaping back, can guarantee to be unanimous with the surface roughness of other regions of LED integrated package display module assembly, other regions are for getting rid of the region of bad position, and at this moment, leave away from the one side surface of heating member from the type membrane and be the first surface. It can be understood that the release film refers to a film with a differentiated surface energy, the release film has no viscosity or slight viscosity after being contacted with a specific material under a limited condition, and meanwhile, the release film can conduct heat, and the use temperature can at least reach more than 150 ℃, so that the release film is arranged between a target colloid and a heating element, and the purpose of pressing in the subsequent step can be realized. It should be noted that, in providing the heating member with the preset temperature, the heating member includes the first surface with the target roughness, and the first surface may also be integrally formed on the heating member, as long as it is possible to provide the first surface with the target roughness, which is not particularly limited by the embodiment of the present application.

S202, heating a heating element to a preset temperature;

specifically, the specific processes of the above steps can refer to the contents of the foregoing embodiments, and are not described herein again.

S203, pressing the first surface of the heating element on the second surface of the target colloid in the target area where the failure LED chip is located so as to enable the second surface to have target roughness; wherein the target colloid is coated with active LED chips located within the target area.

Specifically, the specific processes of the above steps can refer to the contents of the foregoing embodiments, and are not described herein again.

Fig. 4 is a flow chart illustrating a method for repairing an LED chip according to another embodiment of the present application.

Referring to fig. 4, an embodiment of the present application provides a maintenance method for an LED chip, including the following steps:

s301, placing an effective LED chip in a target area;

specifically, the effective LED chips are supplemented on the failure points of the LED integrated packaging display module. In some embodiments, the method specifically includes baking the active LED chips and placing the baked active LED chips on the target area through a wire bonding process.

S302, filling a target colloid in the target area, and exposing a second surface of the target colloid to enable the target colloid to coat the effective LED chip;

specifically, in some embodiments, the volume of the target gel is slightly larger than the volume of the target area, and the target gel reaches the slightly convex second surface, so that the second surface of the target gel can be exposed out of the target area, and the heating element can be used for carrying out pressurization curing.

S303, providing a heating element with a preset temperature; the heating member includes a first surface having a target roughness;

specifically, the specific processes of the above steps can refer to the contents of the foregoing embodiments, and are not described herein again.

S304, pressing the first surface of the heating element on the second surface of the target colloid in the target area where the failure LED chip is located so as to enable the second surface to have target roughness.

Specifically, the specific processes of the above steps can refer to the contents of the foregoing embodiments, and are not described herein again.

Fig. 5 is a flow chart illustrating a method for repairing an LED chip according to still another embodiment of the present application.

Referring to fig. 5, an embodiment of the present application provides a maintenance method for an LED chip, including the following steps:

s401, removing the failed LED chip positioned in the target area and the colloid covering the failed LED chip through windowing;

specifically, in some embodiments, the position of the failed LED chip on the substrate of the LED integrated package display module is determined, for example, the failed LED chip on the substrate can be marked by a computer. After the failed LED chip positioned in the target area and the colloid covering the failed LED chip are removed through windowing, an accommodating space is formed in the target area on the LED integrated packaging display module, and the LED integrated packaging display module is used for placing the effective LED chip and filling the target colloid in the subsequent steps.

S402, placing an effective LED chip in a target area;

specifically, the specific processes of the above steps can refer to the contents of the foregoing embodiments, and are not described herein again.

S403, filling a target colloid in the target area, and exposing a second surface of the target colloid to enable the target colloid to coat the effective LED chip;

specifically, the specific processes of the above steps can refer to the contents of the foregoing embodiments, and are not described herein again.

S404, providing a heating element with a preset temperature; the heating member includes a first surface having a target roughness;

specifically, the specific processes of the above steps can refer to the contents of the foregoing embodiments, and are not described herein again.

S405, pressing the first surface of the heating element on the second surface of the target colloid in the target area where the failed LED chip is located so that the second surface has target roughness.

Specifically, the specific processes of the above steps can refer to the contents of the foregoing embodiments, and are not described herein again.

It should be noted that some of the technical solutions described above may be implemented as independent embodiments in actual implementation processes, or may be combined with each other and implemented as combined embodiments. Some technical solutions set forth above are exemplary solutions, how to implement the solutions in combination is specifically, and the solutions can be selected according to actual needs, and the embodiments of the present application are not particularly limited. In addition, when the contents of the embodiments of the present application are described, the different embodiments are described according to the corresponding sequence only based on the idea of convenient description, for example, the sequence is preset according to the requirements in the actual implementation process, and the execution sequence between the different embodiments is not limited. Accordingly, in an actual implementation process, if it is required to implement multiple embodiments provided in the embodiments of the present application, the execution sequence provided in the embodiments of the present invention is not necessarily required, and the execution sequence between different embodiments may be arranged according to requirements.

It should be understood that, although the steps in the flowcharts of fig. 2 to 5 are shown in sequence as indicated by the arrows, the steps are not necessarily performed in sequence as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least some of the steps in fig. 2 to 5 may include multiple steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of performing the steps or stages is not necessarily sequential, but may be performed alternately or alternately with other steps or at least some of the other steps or stages.

It should be further noted that the LED chip in each of the above embodiments may be a Mini-LED chip or a Micro-LED chip. Therefore, the LED integrated packaging display module maintained by the maintenance method in each embodiment can be used for preparing a display device and applied to the display field to obtain a good display effect, improve the yield of production, avoid product scrapping and reduce the production cost. Namely, in an LED integrated package display device applied for a period of time, the LED integrated package display module repaired and obtained by the embodiment of the application eliminates failed LED chips on the one hand, ensures the display consistency after maintenance on the other hand, avoids the problems of non-uniformity and inconsistency of display and obtains a good display appearance.

Based on the same inventive concept, an embodiment of the present application further provides a display device, including a package structure obtained by the method for repairing an LED chip provided in each of the above embodiments.

The display device can be applied to the fields of mobile phone terminals, bionic electronics, electronic skins, wearable equipment, vehicle-mounted equipment, Internet of things equipment, artificial intelligence equipment and the like. For example, the display device may be a mobile phone terminal, a tablet, a palmtop, an ipod, a smart watch, a laptop computer, a television, a monitor, or the like.

To sum up, the embodiment of the application provides a maintenance method of an LED chip, which solves the problem that the LED chip is scrapped due to failure, improves the problem that the flatness of a maintenance point and the roughness of surface grains are inconsistent, improves the maintenance quality, obtains good product appearance, ensures the consistency of the display effect of a display module after maintenance, can be continuously and normally used, and saves the production cost.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.