阅读说明：本技术 三维物体成型方法、装置和电子设备 (Three-dimensional object forming method and device and electronic equipment ) 是由 吴俊中 沈为真 杨前程 何兴帮 梁澳徽 于 2021-08-03 设计创作，主要内容包括：本申请提出了一种三维物体成型方法、装置和电子设备,涉及快速成型技术领域。其中,上述三维物体成型方法包括：首先,根据第n成型层在各个曝光区域的实际温度与目标温度,确定第n+1粉末层在各个曝光区域所需的补偿温度。然后,根据补偿温度,确定第n+1粉末层在各个曝光区域所需的曝光能量。最后,基于第n+1粉末层在各个曝光区域所需的曝光能量,对第n+1粉末层进行面曝光,得到第n+1成型层。利用成型层的温度场对后续粉末层的曝光能量进行精准调控,从而可提高后续粉末层温度场的均匀性,进而提高三维物体的成型质量。(The application provides a three-dimensional object forming method and device and electronic equipment, and relates to the technical field of rapid forming. The three-dimensional object forming method comprises the following steps: firstly, according to the actual temperature and the target temperature of the nth forming layer in each exposure area, the compensation temperature required by the (n + 1) th powder layer in each exposure area is determined. Then, the exposure energy required for the (n + 1) th powder layer in each exposure area is determined based on the compensation temperature. And finally, performing surface exposure on the (n + 1) th powder layer based on exposure energy required by the (n + 1) th powder layer in each exposure area to obtain an (n + 1) th forming layer. The exposure energy of the subsequent powder layer is accurately regulated and controlled by utilizing the temperature field of the forming layer, so that the uniformity of the temperature field of the subsequent powder layer can be improved, and the forming quality of the three-dimensional object is improved.)

1. A method of forming a three-dimensional object, comprising:

determining the compensation temperature required by the (n + 1) th powder layer in each exposure area according to the actual temperature and the target temperature of the n-th forming layer in each exposure area;

determining the exposure energy required by the (n + 1) th powder layer in each exposure area according to the compensation temperature;

performing surface exposure on the (n + 1) th powder layer based on exposure energy required by the (n + 1) th powder layer in each exposure area to obtain an (n + 1) th forming layer;

wherein n is a positive integer.

2. The method of claim 1, wherein determining the exposure energy required by the (n + 1) th powder layer in the respective exposure area according to the compensation temperature comprises:

determining each overlap exposure area between the (n + 1) th powder layer and the nth powder layer according to the printing data;

and determining the exposure energy of the (n + 1) th powder layer in each overlapped exposure area according to the compensation temperature.

3. The method of claim 2, wherein determining the exposure energy of the (n + 1) th powder layer in the respective overlap exposure areas according to the compensation temperature comprises:

according to the compensation temperature, determining the compensation energy required by the (n + 1) th powder layer in each overlapping exposure area;

and determining the exposure energy required by the (n + 1) th powder layer in each overlapped exposure area according to the compensation energy.

4. The method of claim 3, wherein determining the exposure energy required by the (n + 1) th powder layer in each overlap exposure area according to the compensation energy comprises:

determining the exposure energy required by the (n + 1) th powder layer in each overlapped exposure area according to the compensation energy and the preset energy of the (n + 1) th powder layer; alternatively, the first and second electrodes may be,

determining the exposure energy required by the (n + 1) th powder layer in each overlapped exposure area according to the compensation energy and the exposure energy of the (n) th powder layer;

wherein the preset energy is determined according to an actual temperature and a target temperature of the respective powder layer.

5. Method according to claim 4, wherein determining the preset energy from the actual temperature and the target temperature of the respective powder layer comprises:

determining the required preset temperature of the powder layer in each exposure area according to the actual temperature and the target temperature of the corresponding powder layer in each exposure area;

and determining the corresponding preset energy of the powder layer in each exposure area according to the preset temperature.

6. The method according to claim 5, wherein the predetermined temperature required for the powder layer in the respective exposure area is determined in dependence on the actual temperature of the respective powder layer in the respective exposure area and on a target temperature, the method further comprising:

preheating the corresponding powder layers, and detecting the preheated powder layers to obtain the actual temperatures of the powder layers in the exposure areas; and the number of the first and second groups,

and determining the target temperature of the powder layer corresponding to each exposure area according to the printing data of the powder layer.

7. The method according to claim 1, characterized in that the exposure energy is controlled by exposure time and/or exposure intensity.

8. The method of claim 1, wherein after obtaining the (n + 1) th molding layer, the method further comprises:

and repeatedly forming a powder layer and carrying out surface exposure until an n + m-th forming layer is obtained, wherein the n + m-th forming layer is the last layer of the three-dimensional object, and m is a positive integer.

9. A three-dimensional object forming apparatus, comprising:

the controller is used for determining the compensation temperature required by the (n + 1) th powder layer in each exposure area according to the actual temperature and the target temperature of the n-th forming layer in each exposure area;

the controller is further used for determining the exposure energy required by the (n + 1) th powder layer in each exposure area according to the compensation temperature;

the energy supply component is used for carrying out surface exposure on the (n + 1) th powder layer on the basis of exposure energy required by the (n + 1) th powder layer in each exposure area to obtain an (n + 1) th forming layer;

wherein n is a positive integer.

10. The apparatus of claim 9, further comprising:

and the temperature sensor is used for detecting the actual temperature of the nth forming layer in each exposure area.

11. The device of claim 10, wherein the temperature sensor is any one of an infrared thermal imager and an optical temperature probe.

12. The apparatus according to claim 9, wherein the energy density supplied by the energy supply unit is in the range of 0.1-200W/cm³。

13. The apparatus of claim 9, further comprising:

a supply member for supplying a powder material to form an n +1 th powder layer;

and the forming platform is used for bearing the nth forming layer.

14. The apparatus of claim 9, further comprising:

and the lifting structure is connected with the forming platform and drives the forming platform to ascend or descend in the vertical direction.

15. The apparatus of claim 9, further comprising:

and the preheating component is used for preheating the (n + 1) th powder layer.

16. The apparatus of claim 15, wherein the preheating component is a combination of one or more of an ultraviolet lamp, an infrared lamp, a microwave emitter, a heating wire, a heating sheet, and a heating plate.

17. An electronic device, comprising:

at least one processor; and

at least one memory communicatively coupled to the processor, wherein:

the memory stores program instructions executable by the processor, the processor invoking the program instructions to perform the method of any of claims 1 to 8.

18. A computer-readable storage medium storing computer instructions for causing a computer to perform the method of any one of claims 1 to 8.

[ technical field ] A method for producing a semiconductor device

The present disclosure relates to the field of rapid prototyping technologies, and in particular, to a method and an apparatus for forming a three-dimensional object, and an electronic device.

[ background of the invention ]

The three-dimensional object forming technology is also called 3D printing technology, and the main process is to obtain multilayer printing data according to a digital model file, and to use printing materials such as wax, ceramic, metal or plastic and the like to construct an object by printing layer by layer. The existing powder forming technology, such as Selective Laser Sintering (SLS) technology, uses a focused Laser spot light source to heat powder layers layer by layer in Selective areas until the powder layers are melted and solidified to form a three-dimensional object.

However, due to factors such as uneven heat dissipation inside and outside the powder layer, uneven heat absorption of the powder, and the like, the temperature distribution of the powder layer is uneven, and if the temperature difference is too large, the powder material may shrink inconsistently, so that the printed three-dimensional object has deformation, warping and cracking phenomena, and the forming quality of the three-dimensional object is seriously affected.

[ summary of the invention ]

The embodiment of the application provides a three-dimensional object forming method, a three-dimensional object forming device and electronic equipment.

In a first aspect, an embodiment of the present application provides a three-dimensional object forming method, which determines compensation temperatures required by an n +1 th powder layer in each exposure area according to an actual temperature and a target temperature of an nth forming layer in each exposure area; determining the exposure energy required by the (n + 1) th powder layer in each exposure area according to the compensation temperature; performing surface exposure on the (n + 1) th powder layer based on exposure energy required by the (n + 1) th powder layer in each exposure area to obtain an (n + 1) th forming layer; wherein n is a positive integer.

In one possible implementation manner, determining, according to the compensation temperature, an exposure energy required by the (n + 1) th powder layer in each exposure area includes: determining each overlap exposure area between the (n + 1) th powder layer and the nth powder layer according to the printing data; and determining the exposure energy of the (n + 1) th powder layer in each overlapped exposure area according to the compensation temperature.

In one possible implementation manner, the method further includes: according to the compensation temperature, determining the exposure energy of the (n + 1) th powder layer in each overlapping exposure area, including: according to the compensation temperature, determining the compensation energy required by the (n + 1) th powder layer in each overlapping exposure area; and determining the exposure energy required by the (n + 1) th powder layer in each overlapped exposure area according to the compensation energy.

In one possible implementation manner, determining, according to the compensation energy, an exposure energy required by the (n + 1) th powder layer in each overlap exposure area includes: determining the exposure energy required by the (n + 1) th powder layer in each overlapped exposure area according to the compensation energy and the preset energy of the (n + 1) th powder layer; or determining the exposure energy required by the (n + 1) th powder layer in each overlapped exposure area according to the compensation energy and the exposure energy of the (n) th powder layer; wherein the preset energy is determined according to an actual temperature and a target temperature of the respective powder layer.

In one possible implementation manner, determining the preset energy according to the actual temperature and the target temperature of the corresponding powder layer includes: determining the required preset temperature of the powder layer in each exposure area according to the actual temperature and the target temperature of the corresponding powder layer in each exposure area; and determining the corresponding preset energy of the powder layer in each exposure area according to the preset temperature.

In one possible implementation manner, before determining the required preset temperature of the powder layer in each exposure area according to the actual temperature and the target temperature of the corresponding powder layer in each exposure area, the method further includes: preheating the corresponding powder layers, and detecting the preheated powder layers to obtain the actual temperatures of the powder layers in the exposure areas; and determining the target temperature of the powder layer corresponding to each exposure area according to the printing data of the powder layer.

In one possible implementation, the exposure energy is controlled by exposure time and/or exposure intensity.

In one possible implementation manner, after obtaining the (n + 1) th molding layer, the method further includes: and repeatedly forming a powder layer and carrying out surface exposure until an n + m-th forming layer is obtained, wherein the n + m-th forming layer is the last layer of the three-dimensional object, and m is a positive integer.

In a second aspect, an embodiment of the present application provides a three-dimensional object forming apparatus, including: the controller is used for determining the compensation temperature required by the (n + 1) th powder layer in each exposure area according to the actual temperature and the target temperature of the n-th forming layer in each exposure area; the controller is further used for determining the exposure energy required by the (n + 1) th powder layer in each exposure area according to the compensation temperature; the energy supply component is used for carrying out surface exposure on the (n + 1) th powder layer on the basis of exposure energy required by the (n + 1) th powder layer in each exposure area to obtain an (n + 1) th forming layer; wherein n is a positive integer.

In one possible implementation manner, the apparatus further includes: and the temperature sensor is used for detecting the actual temperature of the nth forming layer in each exposure area.

In one possible implementation manner, the temperature sensor is any one of an infrared thermal imager and an optical temperature measuring probe.

In one possible implementation manner, the energy density provided by the energy supply component ranges from 0.1W/cm to 200W/cm³。

In one possible implementation manner, the apparatus further includes: a supply member for supplying a powder material to form an n +1 th powder layer; and the forming platform is used for bearing the nth forming layer.

In one possible implementation manner, the apparatus further includes: and the lifting structure is connected with the forming platform and drives the forming platform to ascend or descend in the vertical direction.

In one possible implementation manner, the apparatus further includes: and the preheating component is used for preheating the (n + 1) th powder layer.

In one possible implementation manner, the preheating component is one or a combination of multiple ultraviolet lamps, infrared lamps, microwave emitters, heating wires, heating sheets and heating plates.

In a third aspect, an embodiment of the present application provides an electronic device, including: at least one processor; and at least one memory communicatively coupled to the processor, wherein: the memory stores program instructions executable by the processor, the processor being capable of performing the method of the first aspect when invoked by the processor.

In a fourth aspect, embodiments of the present application provide a computer-readable storage medium storing computer instructions for causing a computer to perform the method according to the first aspect.

The technical scheme provided by the application can achieve the following beneficial effects:

the application provides a three-dimensional object forming method, a three-dimensional object forming device and electronic equipment.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a flowchart of a three-dimensional object forming method according to an embodiment of the present disclosure;

FIG. 2 is a flow chart of another method for forming a three-dimensional object according to an embodiment of the present disclosure;

FIGS. 3a-3g are schematic structural diagrams illustrating a three-dimensional object forming process according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a three-dimensional object forming apparatus according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a storage medium according to an embodiment of the present application.

[ detailed description ] embodiments

For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.

It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be noted that the terms "upper", "lower", "left", "right", and the like used in the embodiments of the present application are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application.

Fig. 1 is a flowchart of a three-dimensional object forming method according to an embodiment of the present disclosure, and as shown in fig. 1, the three-dimensional object forming method may include:

step 101, determining the compensation temperature required by the (n + 1) th powder layer in each exposure area according to the actual temperature and the target temperature of the n-th forming layer in each exposure area.

After exposing the nth powder layer to obtain the nth molding layer, the actual temperature of the nth molding layer can be detected. Specifically, the actual temperature of the nth molding layer in each exposure area may be determined according to a plurality of exposure areas divided in advance.

In the embodiment of the present application, the target temperature refers to a temperature which the nth molding layer is expected to reach in each exposure region. The target temperature can be preset according to the requirements of actual conditions. The target temperature may be divided into a target temperature for the molding region and a target temperature for the non-molding region. The molding area refers to an area containing print data. The non-molding region refers to a blank region not containing print data.

Due to the difference between the heat absorption performance and the heat dissipation performance of the powder layer in each exposure area, the actual temperature of each exposure area may be different from each other, and the difference between the actual temperature and the target temperature is different from each other. The embodiment of the application can respectively calculate the difference between the actual temperature and the target temperature of the nth forming layer in each exposure area, and the obtained difference is used as the compensation temperature required by the (n + 1) th powder layer in each exposure area. Therefore, the temperature field of each exposure area of the (n + 1) th powder layer can be regulated and controlled according to the obtained compensation temperature.

In the embodiment of the application, the value of n is a positive integer.

And step 102, determining the exposure energy required by the (n + 1) th powder layer in each exposure area according to the compensation temperature.

In the embodiment of the present application, first, each overlap exposure area between the (n + 1) th powder layer and the (n) th powder layer may be determined according to print data. Then, the exposure energy of the (n + 1) th powder layer in each overlap exposure area can be determined according to the compensation temperature.

Specifically, in the embodiment of the present application, a set functional relationship exists between the temperature and the energy. The compensation energy of the (n + 1) th powder layer in each overlap exposure area can be obtained according to the compensation temperature of the (n + 1) th powder layer in each overlap exposure area.

The exposure energy of the (n + 1) th powder layer in each overlap exposure area can then be determined from the compensation energy of the (n + 1) th powder layer in each overlap exposure area.

In a possible implementation manner, the exposure energy of the (n + 1) th powder layer in each overlap exposure area can be obtained according to the compensation energy of the (n + 1) th powder layer in each overlap exposure area and the corresponding preset energy of the (n + 1) th powder layer. For example, the sum of the compensation energy and the preset energy of the (n + 1) th powder layer may be used as the exposure energy of each overlap exposure region.

In another possible implementation manner, the exposure energy of the (n + 1) th powder layer in each overlap exposure area can be obtained according to the compensation energy of the (n + 1) th powder layer in each overlap exposure area and the exposure energy of the (n) th powder layer. For example, the sum of the compensation energy and the exposure energy of the nth powder layer may be used as the exposure energy of each overlap exposure area.

The exposure energy of the nth powder layer is determined in the same manner as the (n + 1) th powder layer. Illustratively, when n is greater than 1, the exposure energy of the nth powder layer is the sum of the exposure energy of the (n-1) th powder layer and the compensation energy obtained from the (n-1) th shaping layer; specifically, when n is 1, the exposure energy of the nth powder layer is equal to the preset energy of the nth powder layer.

It should be noted that each powder layer has a corresponding preset energy. The preset energy may be determined according to the actual temperature and the target temperature of each powder layer.

Specifically, the above-described (n + 1) -th powder layer will be described as an example. The preset temperature required by the (n + 1) th powder layer in each exposure area can be determined according to the actual temperature of the (n + 1) th powder layer in each exposure area and the target temperature. For example, a difference temperature between the target temperature and the actual temperature of the (n + 1) th powder layer may be determined as the desired preset temperature. Then, the preset energy of the (n + 1) th powder layer in each exposure area can be determined according to the set functional relationship between the temperature and the energy.

Wherein the actual temperature and the target temperature of the (n + 1) -th powder layer in each exposure area can be determined by the following method.

For the actual temperature of the (n + 1) th powder layer in each exposure area, the (n + 1) th powder layer may be preheated after the (n + 1) th powder layer is formed on the (n) th molding layer. Then, the temperature of the preheated (n + 1) th powder layer can be detected, and the actual temperature of the (n + 1) th powder layer in each exposure area can be obtained.

Further, the target temperature for the (n + 1) th powder layer in each exposure area can be determined according to the print data of the (n + 1) th powder layer. Specifically, if the exposure area does not contain print data, the corresponding target temperature is the target temperature of the non-molding area. Conversely, the corresponding target temperature is the target temperature of the molding area. The values of the target temperature of the non-molding region and the target temperature of the molding region may be set in advance.

And 103, performing surface exposure on the (n + 1) th powder layer based on exposure energy required by the (n + 1) th powder layer in each exposure area to obtain an (n + 1) th forming layer.

In the embodiments of the present application, the exposure energy may be controlled by the exposure time and/or the exposure intensity. The surface exposure form can be a surface light source arranged in a point source array, and can also be a projection type laser surface light source.

Furthermore, the surface exposure form can independently control the exposure energy of each exposure area, and the size of each exposure area is determined according to the surface exposure form. Therefore, the uniform distribution of the temperature field of the powder layer can be realized by regulating and controlling the exposure energy of each exposure area, and the forming quality of the three-dimensional object is improved.

Specifically, when the surface exposure form is a surface light source arranged in a point source array, the energy of the corresponding exposure area can be regulated and controlled by controlling the exposure intensity and/or the exposure time of each point source, so that the temperature of each exposure area can be regulated.

For example, when the same exposure time is used for each point, the energy of the corresponding exposure area can be regulated and controlled by controlling the exposure intensity of different points. On the contrary, when each point adopts the same exposure intensity, the energy of the corresponding exposure area can be regulated and controlled by controlling the exposure time of different point positions.

When the surface exposure form is a projection type laser area light source, the energy of the corresponding exposure area can be regulated and controlled by controlling the exposure time of each exposure area, so that the uniform distribution of the powder layer temperature field is realized.

In the embodiment of the application, the exposure energy of each exposure area of the subsequent powder layer can be independently regulated and controlled by utilizing the temperature difference between the temperature field of the forming layer and the target temperature. Therefore, more accurate temperature control can be realized, the uniformity of the temperature field of the subsequent powder layer is improved, and the forming quality of the three-dimensional object is further improved.

Further, the embodiment of the present application provides energy to the powder layer in the form of a planar pattern using a surface light source based on a surface exposure form. Compared with the traditional powder forming technology, such as a method of heating the powder material point by point layer by using a point light source in Selective Laser Sintering (SLS), the production efficiency can be greatly improved.

Fig. 2 is a flowchart of another three-dimensional object forming method according to an embodiment of the present disclosure. As shown in fig. 2, a three-dimensional object forming method provided in an embodiment of the present application may include:

in step 201, print data is generated based on a digital model of a three-dimensional object.

In the embodiment of the present application, the method for obtaining the digital model of the three-dimensional object may be to obtain the original data of the three-dimensional object by a scanning manner, and then perform three-dimensional modeling to obtain the digital model of the three-dimensional object. It is also possible to build a digital model of a three-dimensional object by design.

After the digital model of the three-dimensional object is obtained, the digital model may be converted into a format recognizable by slicing software. For example, the Format may be converted into a Stereolithography (STL) Format, a Polygon File Format (PLY) Format, a Virtual Reality Language (WRL) Format, and the like.

Then, slicing software can be used for slicing and layering the model to obtain sliced layer image data and further obtain printing data. The print data may be used to represent information of the shape of the object.

Step 202, an nth powder layer is formed.

In embodiments of the present application, the powder layer may be formed by providing a powder material. Wherein the powder material may be nylon, plastic, ceramic, metal, etc. The specific forming manner of the powder layer can refer to the conventional technical means in the field, and the application is not limited.

As shown in fig. 3a, in a specific embodiment, a powder layer may be formed by providing a powder material 1 onto a forming table 3 (shown in fig. 4) using a supply component 2.

Step 203, preheat the nth powder layer.

In the embodiment of the present application, as shown in fig. 3b, after the nth powder layer is formed, the preheating part 5 may preheat the nth powder layer.

The value of the preheating temperature is dependent on the properties of the powder material 1 used. In an alternative implementation, the preheating temperature may be lower than the melting point or melting temperature of the powder material 1. Thus, it is possible to prevent melting of the powder material 1 in the non-molding region while supplying a part of heat to the powder material 1.

By preheating the powder layer, it is beneficial to reduce the power consumption required when the subsequent energy supply part 7 (shown in fig. 4) exposes the powder layer, reduce the output power, and improve the safety performance of the energy supply part 7 (shown in fig. 4).

And step 204, performing surface exposure on the nth powder layer according to the printing data of the nth powder layer to form an nth molding layer.

In the embodiment of the present application, as shown in fig. 3c, the energy supply member 7 may be used to perform surface exposure on the nth powder layer in a planar pattern based on the print data of the nth powder layer and the exposure energy required by the nth powder layer in each exposure region to form the molding region 31, i.e., the nth molding layer.

Specifically, when n is 1, the exposure energy for surface-exposing the nth powder layer may be equal to the preset energy corresponding to the nth powder layer.

The preset energy of the 1 st powder layer may be obtained from a difference between an actual temperature of the 1 st powder layer and a target temperature. For a specific implementation, reference may be made to the description of the preset energy in the foregoing embodiments, which is not described herein again.

And step 205, determining the compensation temperature required by the (n + 1) th powder layer in each exposure area according to the actual temperature and the target temperature of the n-th forming layer in each exposure area.

In the embodiment of the present application, as shown in fig. 3d, the temperature sensor 6 may be used to detect the temperature field of the nth molding layer. The temperature field of the nth shaping layer may include an actual temperature of the nth shaping layer at each exposed region. And then, calculating the difference between the actual temperature of the nth molding layer in each exposure area and the target temperature to obtain the compensation temperature.

At step 206, an n +1 th powder layer is formed on the nth molding layer.

In the embodiment of the present application, as shown in fig. 3e, the powder material 1 may be supplied onto the nth molding layer using the supply part 2 to form the (n + 1) th powder layer.

Step 207, determining the exposure energy required by the (n + 1) th powder layer in each exposure area according to the compensation temperature.

In the embodiment of the present application, an overlap exposure area and a non-overlap exposure area between the (n + 1) th powder layer and the (n + 1) th powder layer may be determined according to the print data of the (n) th layer and the (n + 1) th layer, respectively.

For the overlapped exposure area, compensation energy corresponding to compensation temperature can be obtained according to a set functional relation between the temperature and the energy. Further, the exposure energy of the (n + 1) th powder layer in each overlap exposure area may be determined based on the compensation energy. Specifically, the exposure energy required by the (n + 1) th powder layer in each overlap exposure area can be determined according to the compensation energy and the preset energy of the (n + 1) th powder layer. Alternatively, the exposure energy required for the (n + 1) th powder layer in each overlap exposure area may be determined based on the compensation energy and the exposure energy of the (n) th powder layer.

For example, when n is 3, the exposure energy required for the (n + 1) th powder layer in each overlap exposure area is the sum of the exposure energy of the (n + 1) th powder layer and the compensation energy of the (n + 1) th powder layer. The exposure energy of the nth powder layer is a sum of the exposure energy of the (n-1) th powder layer and the compensation energy of the nth powder layer. The exposure energy of the (n-1) th powder layer is the sum of the exposure energy of the (n-2) th powder layer and the compensation energy of the (n-1) th powder layer. That is, the exposure energy required for the 4 th powder layer in each overlap exposure area is the sum of the preset energy of the 1 st powder layer, the 2 nd powder layer compensation energy, the 3 rd powder layer compensation energy, and the 4 th powder layer compensation energy.

For the non-overlapping exposure area, the preset energy corresponding to the (n + 1) th powder layer may be determined as the exposure energy.

And step 208, performing surface exposure on the (n + 1) th powder layer based on the exposure energy required by the (n + 1) th powder layer in each exposure area to obtain an (n + 1) th molding layer.

In the embodiment of the present application, as shown in fig. 3f, exposure energy may be supplied in a planar pattern to each exposure area of the (n + 1) th powder layer by using the energy supply member 7 according to the print data of the (n + 1) th powder layer to form the (n + 1) th molding layer.

And step 209, repeatedly forming a powder layer and carrying out surface exposure until an n + m forming layer is obtained.

In the embodiment of the present application, as shown in fig. 3g, in the process of forming the three-dimensional object, each time a forming layer is obtained, the forming platform 3 (shown in fig. 4) is driven by the lifting mechanism 4 to descend by a distance of at least one layer thickness. The supply part 2 will then provide a new powder layer on top of the previously obtained shaped layer. The energy supply means 7 can thus perform a surface exposure of a new powder layer on the shaping area 31 to form a new shaping layer.

The embodiment of the application can repeatedly execute the process until the n + m-th forming layer is obtained. The (n + m) th molding layer is the last layer of the three-dimensional object W, wherein m is a positive integer.

According to the three-dimensional object forming method provided by the embodiment of the application, the exposure energy of the subsequent powder layer can be accurately regulated and controlled by utilizing the temperature field of the forming layer, so that the uniformity of the temperature field of the subsequent powder layer is improved, and the forming quality of the three-dimensional object is further improved.

Fig. 4 is a schematic structural diagram of a three-dimensional object forming apparatus according to an embodiment of the present application. As shown in fig. 4, the three-dimensional object forming apparatus may include: a controller 8 and an energy supply 7.

And the controller 8 is used for determining the required compensation temperature of the (n + 1) th powder layer in each exposure area according to the actual temperature and the target temperature of the n-th forming layer in each exposure area.

The controller 8 is further adapted to determine the exposure energy required for the (n + 1) th powder layer in the respective exposure area based on the compensated temperature.

And an energy supply member 7 for surface-exposing the (n + 1) th powder layer based on exposure energy required for the (n + 1) th powder layer in each exposure region to obtain an (n + 1) th molded layer. Wherein n is a positive integer.

In a specific implementation manner, the apparatus further includes: and the temperature sensor 6 is used for detecting the actual temperature of the nth forming layer in each exposure area.

In a particular implementation, the temperature sensor 6 is also used to detect the actual temperature of the unformed powder layer in the respective exposure area.

In one specific implementation, the temperature sensor 6 is also used to feed back the detected temperature to the controller 8.

In a specific implementation manner, the temperature sensor 6 is any one of an infrared thermal imager and an optical temperature measuring probe.

In a specific implementation manner, the energy density range provided by the energy supply part 7 is 0.1-200W/cm³。

In a specific implementation manner, the surface light source provided by the energy supply part 7 may be a surface light source arranged in a point source array, and may also be a projection type laser surface light source. The projection type laser surface light source comprises a laser component and a projection component. The laser assembly includes an infrared laser and a laser regulator. Wherein the laser regulator may be used to regulate the output power of the infrared laser. The projection assembly includes a Digital Micromirror Device (DMD) chip. The DMD chip may project a laser beam onto a powder layer to heat powder material on the powder layer. The controller 8 may control the projection shapes of the laser modulator and the DMD chip. The DMD chip has a plurality of micromirror reflecting surfaces, the size of the micromirror reflecting surfaces determines the size of an exposure area, and the controller 8 can independently control each micromirror reflecting surface of the DMD, so that the exposure energy of each exposure area is independently controlled.

In a particular implementation, the above-mentioned apparatus further comprises a supply member 2 for supplying the powder material 1 to form the powder layer L0.

In a specific implementation, the supply part 2 comprises a powder spreader 21, a lifter 22 and a powder storage chamber 23. Among other things, the powder spreader 21 may be used to spread the powder material 1 in the powder storage chamber 23 onto the forming platform 3 to form a powder layer L0. A typical powder spreader 21 may be a spreader bar or a scraper. The powder storage chamber 23 is used for storing the powder material 1, and the inside of the powder storage chamber 23 is provided with a movable support plate 231. The lifter 22 is connected to the supporting plate 231, and drives the supporting plate 231 to ascend or descend in the Z direction.

In a specific implementation, the apparatus further comprises a forming platform 3 for carrying the powder layer L0.

In a specific implementation manner, the device further comprises a lifting mechanism 4, and the lifting mechanism 4 is connected with the forming platform 3 and can be used for driving the forming platform 3 to ascend or descend along the vertical direction.

In a specific implementation, the apparatus further comprises a preheating component 5, and the preheating component 5 is used for preheating the powder layer L0.

In a specific implementation, the preheating part 5 may be selected from one or more of an ultraviolet lamp, an infrared lamp, a microwave emitter, a heating wire, a heating sheet, and a heating plate.

In a specific implementation, the preheating part 5, the temperature sensor 6, and the power supply part 7 may be sequentially installed on the guide rail 9 and may be movable on the guide rail 9.

Fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present application. As shown in fig. 5, the electronic device may include at least one processor; and at least one memory communicatively coupled to the processor, wherein: the memory stores program instructions executable by the processor, and the processor calls the program instructions to execute the three-dimensional object forming method provided by the embodiment of the application.

The electronic device may be a desktop computer, a notebook, a palm computer, a cloud server, or other computing devices.

FIG. 5 illustrates a block diagram of an exemplary electronic device suitable for use in implementing embodiments of the present application. The electronic device shown in fig. 5 is only an example, and should not bring any limitation to the functions and the scope of use of the embodiments of the present application.

As shown in fig. 5, the electronic device is in the form of a general purpose computing device. Components of the electronic device may include, but are not limited to: one or more processors 410, a memory 430, and a communication bus 440 that connects the various system components (including the memory 430 and the processors 410).

Communication bus 440 represents one or more of any of several types of bus structures, including a memory bus or memory controller, a peripheral bus, an accelerated graphics port, and a processor or local bus using any of a variety of bus architectures. These architectures include, but are not limited to, Industry Standard Architecture (ISA) bus, Micro Channel Architecture (MAC) bus, enhanced ISA bus, Video Electronics Standards Association (VESA) local bus, and Peripheral Component Interconnect (PCI) bus, to name a few.

Electronic devices typically include a variety of computer system readable media. Such media may be any available media that is accessible by the electronic device and includes both volatile and nonvolatile media, removable and non-removable media.

Memory 430 may include computer system readable media in the form of volatile Memory, such as Random Access Memory (RAM) and/or cache Memory. The electronic device may further include other removable/non-removable, volatile/nonvolatile computer system storage media. Although not shown in FIG. 5, a disk drive for reading from and writing to a removable, nonvolatile magnetic disk (e.g., a "floppy disk") and an optical disk drive for reading from or writing to a removable, nonvolatile optical disk (e.g., a Compact disk Read Only Memory (CD-ROM), a Digital versatile disk Read Only Memory (DVD-ROM), or other optical media) may be provided. In these cases, each drive may be connected to the communication bus 440 by one or more data media interfaces. Memory 430 may include at least one program product having a set (e.g., at least one) of program modules that are configured to carry out the functions of embodiments of the application.

A program/utility having a set (at least one) of program modules, including but not limited to an operating system, one or more application programs, other program modules, and program data, may be stored in memory 430, each of which examples or some combination may include an implementation of a network environment. The program modules generally perform the functions and/or methodologies of the embodiments described herein.

The electronic device may also communicate with one or more external devices (e.g., keyboard, pointing device, display, etc.), one or more devices that enable a user to interact with the electronic device, and/or any devices (e.g., network card, modem, etc.) that enable the electronic device to communicate with one or more other computing devices. Such communication may occur via communication interface 420. Furthermore, the electronic device may also communicate with one or more networks (e.g., a Local Area Network (LAN), a Wide Area Network (WAN), and/or a public Network such as the Internet) via a Network adapter (not shown in FIG. 5) that may communicate with other modules of the electronic device via the communication bus 440. It should be appreciated that although not shown in FIG. 5, other hardware and/or software modules may be used in conjunction with the electronic device, including but not limited to: microcode, device drivers, Redundant processing units, external disk drive Arrays, disk array (RAID) systems, tape Drives, and data backup storage systems, among others.

The processor 410 executes various functional applications and three-dimensional object forming, for example, implementing the three-dimensional object forming method provided by the embodiment of the present application, by executing the program stored in the memory 430.

Fig. 6 is a schematic structural diagram of a storage medium according to an embodiment of the present application. As shown in fig. 6, the storage medium 60 may store therein a program 61. The apparatus in which the storage medium 60 is located may perform the three-dimensional object forming method described above when the program 61 is run.

The storage media described above may take any combination of one or more computer-readable media. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a Read Only Memory (ROM), an Erasable Programmable Read Only Memory (EPROM), a flash Memory, an optical fiber, a portable compact disc Read Only Memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.

A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.

Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing steps of a custom logic function or process, and alternate implementations are included within the scope of the preferred embodiment of the present application in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present application.

It should be noted that the terminal according to the embodiments of the present application may include, but is not limited to, a read-write device, a consumable chip, a printer, a Personal Computer (Personal Computer; hereinafter, abbreviated as PC), a Personal Digital Assistant (Personal Digital Assistant; hereinafter, abbreviated as PDA), a wireless handheld device, a Tablet Computer (Tablet Computer), a mobile phone, an MP3 player, an MP4 player, and the like.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions in actual implementation, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.