阅读说明：本技术 电池组 (Battery pack ) 是由 李石峰 于 2021-05-08 设计创作，主要内容包括：公开了一种电池组。所述电池组包括：电池单元；主电路板,电连接到电池单元且在第一方向上延伸；以及柔性电路板,在第一方向上与主电路板平行延伸且包括位于主电路板外部的位置处的外部连接端子,并且主电路板和柔性电路板分别包括彼此叠置且彼此结合的第一结合垫和第二结合垫。(A battery pack is disclosed. The battery pack includes: a battery cell; a main circuit board electrically connected to the battery cell and extending in a first direction; and a flexible circuit board extending in parallel with the main circuit board in a first direction and including external connection terminals at positions outside the main circuit board, and the main circuit board and the flexible circuit board respectively include first bonding pads and second bonding pads that are stacked and bonded to each other.)

1. A battery pack, comprising:

a battery cell; a main circuit board electrically connected to the battery cell and extending in a first direction; and a flexible circuit board extending in parallel with the main circuit board in a first direction and including external connection terminals at positions outside the main circuit board,

wherein the main circuit board and the flexible circuit board respectively include a plurality of first bonding pads and a plurality of second bonding pads that are stacked and bonded to each other.

2. The battery pack according to claim 1, wherein the plurality of first bonding pads on the main circuit board and the plurality of second bonding pads on the flexible circuit board are at positions corresponding to each other and have different shapes.

3. The battery pack according to claim 1,

the plurality of first bonding pads on the main circuit board includes a first row of bonding pads and a second row of bonding pads spaced apart from each other in a second direction crossing the first direction, and

the plurality of second bond pads on the flexible circuit board includes a first row of bond pads and a second row of bond pads spaced apart from each other in a second direction.

4. The battery pack according to claim 3, wherein each of the first row of bonding pads arranged relatively close to the external connection terminals in the second direction, among the plurality of first bonding pads of the main circuit board and the plurality of second bonding pads of the flexible circuit board, includes at least two bonding pads arranged in the first direction.

5. The battery pack according to claim 3, wherein among the plurality of first bonding pads of the main circuit board and the plurality of second bonding pads of the flexible circuit board, each of the second rows of bonding pads arranged relatively distant from the external connection terminals in the second direction includes a single bonding pad arranged in the first direction.

6. The battery pack according to claim 3,

the plurality of first bonding pads of the main circuit board include outermost bonding pads and inner bonding pads in a first direction from the main circuit board to the flexible circuit board, and

the plurality of second bonding pads of the flexible circuit board include outermost bonding pads and inner bonding pads in a first direction from the main circuit board to the flexible circuit board.

7. The battery pack of claim 6, wherein the outermost bonding pads are longer than the inner bonding pads in the first direction.

8. The battery pack according to claim 6, wherein each of the first row of bonding pads includes an outermost bonding pad and an inner bonding pad in the first direction among the plurality of first bonding pads of the main circuit board and the plurality of second bonding pads of the flexible circuit board.

9. The battery pack according to claim 6, wherein among the plurality of first bonding pads of the main circuit board and the plurality of second bonding pads of the flexible circuit board, each of the second row of bonding pads includes a single bonding pad in the first direction as an outermost bonding pad.

10. The battery pack of claim 6, wherein the outermost bond pads of the first row of bond pads and the outermost bond pads of the second row of bond pads are located at positions corresponding to each other in the first direction.

11. The battery pack according to claim 6,

among the plurality of first bonding pads of the main circuit board and the plurality of second bonding pads of the flexible circuit board,

the outermost bonding pad has a rectangular shape having a length in the first direction larger than a width in the second direction, and

the inner bonding pad has a square shape having a length in the first direction and a width in the second direction.

12. The battery pack according to claim 1, wherein bonding holes are formed in the plurality of second bonding pads of the flexible circuit board to expose portions of the plurality of first bonding pads of the main circuit board through the bonding holes.

13. The battery pack according to claim 12, wherein the main circuit board and the flexible circuit board are bonded to each other via a bonding material on the plurality of first bonding pads exposed through the bonding holes and on the plurality of second bonding pads located around the bonding holes.

14. The battery pack according to claim 12,

the plurality of second bonding pads of the flexible circuit board include outermost bonding pads and inner bonding pads in the first direction, and

the bonding holes include outermost bonding holes formed in the outermost bonding pads and inner bonding holes formed in the inner bonding pads.

15. The battery pack according to claim 14, wherein the outermost coupling holes extend longer in the first direction than the inner coupling holes.

16. The battery pack according to claim 15,

the outermost coupling hole includes an end portion having a width in the first direction increased from an open side of the outermost coupling hole in a second direction crossing the first direction, and

the inner coupling hole includes an end portion having a width in the first direction that decreases from an open side of the inner coupling hole in the second direction.

17. The battery pack according to claim 16, wherein the end portion having the increased width and the end portion having the decreased width are end portions at which the outer coupling hole and the inner coupling hole respectively terminate in the second direction.

18. The battery pack according to claim 14, wherein the outermost coupling holes are elongated in the first direction and include rounded ends at opposite ends of the outermost coupling holes in the first direction.

19. The battery pack according to claim 14, wherein the outermost bonding holes are formed in the outermost bonding pads at opposite inner positions of the outermost bonding pads in the first direction.

20. The battery pack according to claim 19, wherein the outermost bonding holes are formed at positions closer to the inner ends of the outermost bonding pads than the outer ends of the outermost bonding pads in the first direction from the main circuit board to the flexible circuit board.

21. The battery pack according to claim 20, wherein an outer distance from the outermost bonding hole of the outermost bonding pad to the outer end portion is greater than an inner distance from the outermost bonding hole of the outermost bonding pad to the inner end portion.

22. The battery pack according to claim 14, wherein the inner coupling hole is formed in the inner coupling pad at a central position of the inner coupling pad in the first direction.

23. The battery pack according to claim 22, wherein the inner bonding hole is formed at a central position between the outer end portion and the inner end portion of the inner bonding pad in the first direction from the main circuit board to the flexible circuit board.

24. The battery pack according to claim 1,

the main circuit board includes a rigid circuit board, and

the flexible circuit board includes a flexible film type circuit board.

Technical Field

An aspect of one or more embodiments relates to a battery pack.

Background

In general, a secondary battery refers to a battery that can be repeatedly charged and recharged unlike a primary battery that is not rechargeable. Secondary batteries are used as energy sources for devices such as mobile devices, electric vehicles, hybrid electric vehicles, electric bicycles, and uninterruptible power supplies. Depending on the type of device employing the secondary battery, a single-cell secondary battery or a multi-cell secondary battery (battery pack) each including a plurality of cells connected to each other as a unit is used.

A small-sized mobile device such as a cellular phone may operate for a certain time (e.g., a predetermined time) using a single-cell secondary battery. However, the battery pack having high-output, high-capacity characteristics may be suitable for devices (such as electric vehicles and hybrid electric vehicles) that have a long operation time and consume a large amount of electric power. The output voltage or current of the battery pack may be increased by adjusting the number of battery cells included in the battery pack.

Disclosure of Invention

According to an aspect of one or more embodiments, there is provided a battery pack in which a rigidity of a flexible circuit board connected to external connection terminals is enhanced so that the flexible circuit board connected to the external connection terminals may not be damaged or a bond between the flexible circuit board and other circuit boards may not be damaged even when a tensile force or a bending force is applied to the flexible circuit board through the external connection terminals.

Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the disclosed presented embodiments.

According to one or more embodiments, a battery pack includes: a battery cell; a main circuit board electrically connected to the battery cell and extending in a first direction; and a flexible circuit board extending in parallel with the main circuit board in a first direction and including external connection terminals at positions outside the main circuit board, wherein the main circuit board and the flexible circuit board respectively include a plurality of first bonding pads and a plurality of second bonding pads that are stacked and bonded to each other.

In one or more embodiments, the plurality of first bonding pads of the main circuit board and the plurality of second bonding pads of the flexible circuit board may be at positions corresponding to each other and may have different shapes.

In one or more embodiments, the plurality of first bonding pads of the main circuit board may include a first row of bonding pads and a second row of bonding pads spaced apart from each other in a second direction crossing the first direction, and the plurality of second bonding pads of the flexible circuit board may include a first row of bonding pads and a second row of bonding pads spaced apart from each other in the second direction.

In one or more embodiments, among the plurality of first bonding pads of the main circuit board and the plurality of second bonding pads of the flexible circuit board, each of the first row of bonding pads arranged relatively close to the external connection terminal in the second direction may include at least two bonding pads arranged in the first direction.

In one or more embodiments, among the plurality of first bonding pads of the main circuit board and the plurality of second bonding pads of the flexible circuit board, each of the second rows of bonding pads arranged relatively distant from the external connection terminals in the second direction may include a single bonding pad arranged in the first direction.

In one or more embodiments, the plurality of first bonding pads of the main circuit board may include outermost bonding pads and inner bonding pads in a first direction from the main circuit board to the flexible circuit board, and the plurality of second bonding pads of the flexible circuit board may include outermost bonding pads and inner bonding pads in the first direction from the main circuit board to the flexible circuit board.

In one or more embodiments, the outermost bonding pads may be longer than the inner bonding pads in the first direction.

In one or more embodiments, among the plurality of first bonding pads of the main circuit board and the plurality of second bonding pads of the flexible circuit board, each of the first row of bonding pads may include an outermost bonding pad and an inner bonding pad in the first direction.

In one or more embodiments, among the plurality of first bonding pads of the main circuit board and the plurality of second bonding pads of the flexible circuit board, each of the second row of bonding pads may include a single bonding pad in the first direction as an outermost bonding pad.

In one or more embodiments, the outermost bonding pads of the first row of bonding pads and the outermost bonding pads of the second row of bonding pads may be located at positions corresponding to each other in the first direction.

In one or more embodiments, among the plurality of first bonding pads of the main circuit board and the plurality of second bonding pads of the flexible circuit board, the outermost bonding pad may have a rectangular shape having a length in the first direction greater than a width in the second direction, and the inner bonding pad may have a square shape having a length in the first direction equal to the width in the second direction.

In one or more embodiments, bonding holes may be formed in the plurality of second bonding pads of the flexible circuit board to expose portions of the plurality of first bonding pads of the main circuit board through the bonding holes.

In one or more embodiments, the main circuit board and the flexible circuit board may be bonded to each other via a bonding material on a plurality of first bonding pads exposed through the bonding holes and on a plurality of second bonding pads located around the bonding holes.

In one or more embodiments, the plurality of second bonding pads of the flexible circuit board may include outermost bonding pads and inner bonding pads in the first direction, and the bonding holes may include outermost bonding holes formed in the outermost bonding pads and inner bonding holes formed in the inner bonding pads.

In one or more embodiments, the outermost coupling holes may extend longer than the inner coupling holes in the first direction.

In one or more embodiments, the outermost coupling holes may include ends having widths in the first direction that increase from open sides of the outermost coupling holes in a second direction crossing the first direction, and the inner coupling holes may include ends having widths in the first direction that decrease from open sides of the inner coupling holes in the second direction.

In one or more embodiments, the end having the increased width and the end having the decreased width may be ends at which the outer coupling hole and the inner coupling hole respectively terminate in the second direction.

In one or more embodiments, the outermost bonding hole may be elongated in the first direction, and may include rounded ends at opposite ends of the outermost bonding hole in the first direction.

In one or more embodiments, the outermost bonding holes may be formed in the outermost bonding pads at opposite inner positions of the outermost bonding pads in the first direction.

In one or more embodiments, the outermost bonding holes may be formed at positions closer to inner ends of the outermost bonding pads than outer ends of the outermost bonding pads in a first direction from the main circuit board to the flexible circuit board.

In one or more embodiments, the outer distance from the outermost bonding hole of the outermost bonding pad to the outer end portion may be greater than the inner distance from the outermost bonding hole of the outermost bonding pad to the inner end portion.

In one or more embodiments, the inner bonding hole may be formed in the inner bonding pad at a central position of the inner bonding pad in the first direction.

In one or more embodiments, the inner bonding hole may be formed at a central position between the outer end portion and the inner end portion of the inner bonding pad in a first direction from the main circuit board to the flexible circuit board.

In one or more embodiments, the main circuit board may include a rigid circuit board, and the flexible circuit board may include a flexible film type circuit board.

Drawings

The above and other aspects, features and advantages of certain embodiments of the disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings in which:

fig. 1 is an exploded perspective view illustrating a battery pack according to an embodiment;

fig. 2 is a perspective view showing the main circuit board and the flexible circuit board shown in fig. 1;

fig. 3 is an exploded perspective view showing the main circuit board and the flexible circuit board shown in fig. 2;

fig. 4 is a view showing a structure of a first bonding pad of the main circuit board shown in fig. 3;

fig. 5 is a view illustrating a structure of a second bonding pad of the flexible circuit board shown in fig. 3; and

fig. 6A and 6B are sectional views taken along line VI-VI' of fig. 2, respectively showing a state in which the flexible circuit board is not bent and a state in which the flexible circuit board is bent.

Detailed Description

Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. In this regard, the present embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, only the embodiments are described below to explain aspects of the description by referring to the figures. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. When a statement such as "at least one of … …" is placed after a list of elements, that is, modifies the list of elements rather than modifying an individual element in the list.

As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It will be understood that the terms "comprises," "comprising," and "having," as used herein, specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

The size of components in the drawings may be exaggerated for convenience of description. In other words, since the size and thickness of components in the drawings may be arbitrarily illustrated for convenience of description, the following embodiments are not limited thereto.

It will be understood that when a layer, region or component is referred to as being "connected to" another layer, region or component, it can be directly connected to the other layer, region or component or can be indirectly connected to the other layer, region or component with one or more intervening layers, regions or components interposed therebetween. For example, it will be understood that when a layer, region or component is referred to as being "electrically connected to" another layer, region or component, the layer, region or component may be directly electrically connected to the other layer, region or component or may be indirectly electrically connected to the other layer, region or component with one or more intervening layers, regions or components interposed therebetween.

Spatially relative terms, such as "below … …," "below … …," "below," "above … …," "upper," and the like, may be used herein for ease of description to describe one element or feature's relationship to another (additional) element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below … …" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which example embodiments of the inventive concepts belong. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Here, a battery pack according to an embodiment will be described with reference to the accompanying drawings.

Fig. 1 is an exploded perspective view illustrating a battery pack according to an embodiment; fig. 2 is a perspective view showing the main circuit board and the flexible circuit board shown in fig. 1; fig. 3 is an exploded perspective view showing the main circuit board and the flexible circuit board shown in fig. 2; fig. 4 is a view showing a structure of a first bonding pad of the main circuit board shown in fig. 3; fig. 5 is a view illustrating a structure of a second bonding pad of the flexible circuit board shown in fig. 3; fig. 6A and 6B are sectional views taken along line VI-VI' of fig. 2, respectively showing a state in which the flexible circuit board is not bent and a state in which the flexible circuit board is bent.

Referring to fig. 1 to 6B, according to an embodiment, a battery pack may include: a battery cell C; a main circuit board 100 electrically connected to the battery cells C and extending in the first direction Z1; and a flexible circuit board 200 extending in parallel with the main circuit board 100 in the first direction Z1 and including external connection terminals T formed at positions outside the main circuit board 100, and the main circuit board 100 and the flexible circuit board 200 may include a plurality of first bonding pads P1 and a plurality of second bonding pads P2 which are stacked on each other and arranged in the first direction Z1.

In an embodiment, the battery cell C may include: an electrode assembly 10; and a case 15 sealing the electrode assembly 10 together with an electrolyte (not shown), and including a terrace portion 11 electrically connected to the first electrode E1 and the second electrode E2 of the electrode assembly 10 extending outward therefrom. As described later, the main circuit board 100 electrically connected to the first electrode E1 and the second electrode E2 may be disposed on the stage 11.

Although not shown in fig. 1 to 6B, the electrode assembly 10 may include: a first electrode plate and a second electrode plate having different polarities; and a separator disposed between the first electrode plate and the second electrode plate. The electrode assembly 10 is formed in a winding type by winding a first electrode plate and a second electrode plate with a separator interposed therebetween, or in a stacking type by stacking a plurality of first electrode plates and a plurality of second electrode plates with a separator interposed therebetween.

The main circuit board 100, to which the first and second electrodes E1 and E2 are connected, may be disposed on the stage 11, and the first and second electrodes E1 and E2 of the battery cell C extend outward from the stage 11. The charge-discharge current of the battery cell C may flow to the external connection terminal T of the flexible circuit board 200 connected to the main circuit board 100 side by side via the main circuit board 100 connected to the first electrode E1 and the second electrode E2.

The main circuit board 100 may be electrically connected to the battery cell C, for example, the main circuit board 100 may be connected to the first electrode E1 and the second electrode E2 of the battery cell C to form a charge-discharge path of the battery cell C. The main circuit board 100 may be electrically connected to the flexible circuit board 200 including the external connection terminals T, and a charge-discharge path may be formed between the battery cells C and the external connection terminals T of the flexible circuit board 200. The main circuit board 100 may be disposed on the terrace portion 11 from which the first and second electrodes E1 and E2 of the battery cell C extend outward, and may extend in parallel with the terrace portion 11 in the first direction Z1. As described later, the flexible circuit board 200 electrically connected to the main circuit board 100 may also extend in parallel with the main circuit board 100 in the first direction Z1. For reference, throughout the present specification, the first direction Z1 may refer to a length direction of the main circuit board 100 and the flexible circuit board 200, and for example, the first direction Z1 may refer to a direction from the main circuit board 100 toward the flexible circuit board 200. In addition, throughout the present specification, the second direction Z2 may refer to a width direction of the main circuit board 100 and the flexible circuit board 200 or a direction crossing the first direction Z1 (e.g., a direction perpendicular to the first direction Z1).

In the embodiment, unlike the flexible circuit board 200, the main circuit board 100 may be a rigid circuit board harder than the flexible circuit board 200, and the main circuit board 100 may control charging and discharging operations of the battery cell C to cope with abnormal situations such as overheating, overcharging, and overdischarging of the battery cell C while forming a charge-discharge path between the battery cell C and the flexible circuit board 200. To this end, the main circuit board 100 may include a plurality of circuit devices (not shown). For example, the main circuit board 100 may function as a Battery Management System (BMS) that monitors state information such as the temperature, voltage, or current of the battery cells C, and takes protective measures such as stopping the charging or discharging operation of the battery cells C when an abnormal situation is detected. As described above, in the embodiment, unlike the flexible circuit board 200, the main circuit board 100 may be a rigid circuit board that is harder than the flexible circuit board 200. However, in various other embodiments, the main circuit board 100 may be a flexible film type circuit board similar to the flexible circuit board 200.

The flexible circuit board 200 may extend alongside the main circuit board 100 in the first direction Z1. The main circuit board 100 and the flexible circuit board 200 may be electrically connected to each other by bonding the first and second bonding pads P1 and P2 formed on the main circuit board 100 and the flexible circuit board 200, respectively. For example, the first bonding pad P1 formed on the main circuit board 100 and the second bonding pad P2 formed on the flexible circuit board 200 may be bonded to each other using a bonding material 150 such as a soldering material, thereby bonding the main circuit board 100 and the flexible circuit board 200 to each other.

The first and second bonding pads P1 and P2 may be formed on the main circuit board 100 and the flexible circuit board 200 at corresponding positions, respectively, to be overlapped with each other. However, as described later, the first and second bonding pads P1 and P2 may have different shapes. The first and second bonding pads P1 and P2 may be arranged at a plurality of positions in the first direction Z1 to effectively resist the tensile force acting in the first direction Z1. For example, the external connection terminals T may be formed on the flexible circuit board 200, and the first and second bonding pads P1 and P2 for bonding the main circuit board 100 and the flexible circuit board 200 to each other may be disposed at a plurality of positions, so that even when a tensile force acts on the flexible circuit board 200 through the external connection terminals T in the first direction Z1 during a process of connecting the external connection terminals T to an external setting device (not shown), for example, an electronic device using a battery pack as a driving power source, the bonding between the flexible circuit board 200 and the main circuit board 100 may not be damaged.

The first and second bonding pads P1 and P2 may include first rows of bonding pads P11 and P21 and second rows of bonding pads P12 and P22 that are separated or spaced apart from each other in a second direction Z2 that intersects the first direction Z1. In an embodiment, the first and second rows of bond pads P11, P21, P12, and P22 may include different numbers of bond pads. For example, the first row of the bonding pads P11 and P21 relatively close to the external connection terminal T in the second direction Z2 may have more bonding pads than the second row of the bonding pads P12 and P22 relatively far from the external connection terminal T in the second direction Z2. For example, the first row of bonding pads P11 and P21 relatively close to the external connection terminals T in the second direction Z2 may include a relatively large number of bonding pads to effectively resist the tensile force that may occur in a process of connecting the external connection terminals T to an external setting device (e.g., an electronic device using a battery pack as a driving power source), and the second row of bonding pads P12 and P22 may include a relatively small number of bonding pads to save the space occupied by the second row of bonding pads P12 and P22 and use the saved space as a mounting space for the circuit device.

The first and second rows of bond pads P11, P21, P12, and P22 will now be described in more detail. Since the first and second bonding pads P1 and P2 of the main circuit board 100 and the flexible circuit board 200 are stacked on and bonded to each other, the first and second bonding pads P1 and P2 may be at positions corresponding to each other, and thus, the first and second rows of bonding pads P1 and P2 of the main circuit board 100 and the flexible circuit board 200 may include first and second rows of bonding pads P11, P21, P12, and P22.

The first row of the bonding pads P11 of the first bonding pad P1 of the main circuit board 100 and the first row of the bonding pads P21 of the second bonding pad P2 of the flexible circuit board 200 may include at least two bonding pads arranged in the first direction Z1. In an embodiment, among the first bonding pads P1 of the main circuit board 100 and the second bonding pads P2 of the flexible circuit board 200, there may be only a single second row of bonding pads P12 and a single second row of bonding pads P22 in the first direction Z1.

As described above, the first row of bonding pads P11 of the first bonding pad P1 of the main circuit board 100 and the first row of bonding pads P21 of the second bonding pad P2 of the flexible circuit board 200 are relatively close to the external connection terminals T in the second direction Z2, and the second row of bonding pads P12 of the first bonding pad P1 of the main circuit board 100 and the second row of bonding pads P22 of the second bonding pad P2 of the flexible circuit board 200 are relatively distant from the external connection terminals T in the second direction Z2. Therefore, in the embodiment, the number of the first row of bonding pads P11 and P21 relatively close to the external connection terminal T in the second direction Z2 is relatively large to effectively resist against, for example, a tensile force that may occur in a process of connecting the external connection terminal T to an external setting device (not shown, for example, an electronic device using a battery pack as a driving power source).

In an embodiment, the first bonding pads P1 of the main circuit board 100 may include outermost bonding pads P1E and inner bonding pads P1N in the first direction Z1, and the second bonding pads P2 of the flexible circuit board 200 may include outermost bonding pads P2E and inner bonding pads P2N in the first direction Z1. Throughout this specification, the outermost bonding pads P1E and P2E may refer to bonding pads located at outermost positions in a first direction Z1 (e.g., in a first direction Z1 from the main circuit board 100 to the flexible circuit board 200), no bonding pad being outside the outermost bonding pads P1E and P2E in the first direction Z1. In an embodiment, the first and second rows of bond pads P11, P21, P12, and P22 may include outermost bond pads P1E and P2E. The first and second rows of bond pads P11, P21, P12, and P22 may be formed at positions corresponding to each other in the first direction Z1, for example, outermost bond pads P1E and P2E of the first and second rows of bond pads P11, P21, P12, and P22 may be formed at corresponding positions (outermost positions) in the first direction Z1.

The first row of bond pads P11 may include at least two bond pads arranged in the first direction Z1, and the first row of bond pads P21 may include at least two bond pads arranged in the first direction Z1. In an embodiment, the first row of bond pads P11 may include three bond pads arranged in the first direction Z1, and the first row of bond pads P21 may include three bond pads arranged in the first direction Z1. In this case, the first row of bond pads P11 and P21 may include outermost bond pads P1E and P2E and inner bond pads P1N and P2N in the first direction Z1.

In an embodiment, there may be only a single second row of bond pads P12 and only a single second row of bond pads P22 in the first direction Z1, in which case second row of bond pads P12 and second row of bond pads P22 may correspond to outermost bond pads P1E and outermost bond pads P2E, respectively. In an embodiment, when there is only a single second row of bond pads P12 and only a single second row of bond pads P22 in first direction Z1, second row of bond pads P12 and second row of bond pads P22 may be outermost bond pads P1E and P2E of second row of bond pads P12 and P22 to effectively cope with the tensile force acting in first direction Z1, and outermost bond pads P1E and P2E of second row of bond pads P12 and P22 are disposed at outermost positions corresponding to outermost bond pads P1E and P2E of first row of bond pads P11 and P21 in first direction Z1.

The first and second rows of bonding pads P11, P21, P12, and P22 may be formed at positions facing each other in the second direction Z2 and may be symmetrical to each other. For example, among the first and second rows of bonding pads P11, P21, P12, and P22, the outermost bonding pads P1E and P2E in the first direction Z1 may be disposed at positions facing each other in the second direction Z2, and may have symmetrical shapes corresponding to each other. In an embodiment, among the first and second rows of bond pads P11, P21, P12, and P22, the outermost bond pads P1E and P2E and the inner bond pads P1N and P2N in the first direction Z1 may have different shapes. For example, the outermost bonding pads P1E and P2E supporting a relatively large load may have a length greater than that of the inner bonding pads P1N and P2N to effectively cope with a tension acting in the first direction Z1 (e.g., a tension acting from the external connection terminal T). In this case, the length of the bond pad may refer to the dimension in the first direction Z1. For example, among the first bonding pads P1 formed on the main circuit board 100 and the second bonding pads P2 formed on the flexible circuit board 200, the outermost bonding pads P1E and P2E may be longer than the inner bonding pads P1N and P2N in the first direction Z1.

In the embodiment, for example, among the first bonding pads P1 formed on the main circuit board 100 and the second bonding pads P2 formed on the flexible circuit board 200, the outermost bonding pads P1E and P2E extend longer in the first direction Z1 than the inner bonding pads P1N and P2N. For example, the length of each of the outermost bonding pads P1E and P2E in the first direction Z1 (i.e., the length between the outer end and the inner end of each of the outermost bonding pads P1E and P2E in the first direction Z1) may be greater than the length of each of the inner bonding pads P1N and P2N in the first direction Z1 (i.e., the length between the outer end and the inner end of each of the inner bonding pads P1N and P2N in the first direction Z1). In an embodiment, each of the outermost bonding pads P1E and P2E may be formed in a rectangular shape in which the length in the first direction Z1 is greater than the width in the second direction Z2, and each of the inner bonding pads P1N and P2N may be formed in a square (square or substantially square) shape in which the length in the first direction Z1 is equal to (similar to or equal to) the width in the second direction Z2. In other words, among the first bonding pads P1 formed on the main circuit board 100 and the second bonding pads P2 formed on the flexible circuit board 200, the outermost bonding pads P1E and P2E may have a rectangular shape, and the inner bonding pads P1N and P2N may have a square shape. In an embodiment, the outermost bonding pads P1E and P2E may have a rectangular shape with rounded corners, and the inner bonding pads P1N and P2N may have a square shape with rounded corners.

Throughout the present specification, the bonding pads may refer to the first bonding pad P1 formed on the main circuit board 100 and the second bonding pad P2 formed on the flexible circuit board 200, and may be a structure for physically bonding the main circuit board 100 and the flexible circuit board 200 to each other by applying a melted or semi-melted bonding material 150, such as a soldering material, to the first bonding pad P1 of the main circuit board 100 or the second bonding pad P2 of the flexible circuit board 200, or between the first bonding pad P1 of the main circuit board 100 and the second bonding pad P2 of the flexible circuit board 200. In this case, the bonding pad may include a metal material having affinity or wettability with the bonding material 150 such as a solder material.

In an embodiment, a bonding hole P2' may be formed in the second bonding pad P2 of the flexible circuit board 200 to expose the first bonding pad P1 of the main circuit board 100, and the first and second bonding pads P1 and P2 may be bonded to each other by forming a bonding material 150 such as a soldering material on the second bonding pad P2 around the bonding hole P2' and the first bonding pad P1 exposed through the bonding hole P2' or allowing the bonding material 150 to penetrate between the first and second bonding pads P1 and P2.

The first and second bonding pads P1 and P2 may be formed on the main circuit board 100 and the flexible circuit board 200, respectively, at positions corresponding to and overlapping each other, and the first and second bonding pads P1 and P2 may be bonded to each other. In an embodiment, the second bonding pad P2 may include a bonding hole P2' to expose a portion of the first bonding pad P1. The bonding material 150 such as a solder material may be accumulated on the first bonding pad P1 exposed through the bonding hole P2', and the first and second bonding pads P1 and P2 may be bonded to each other by the bonding material 150 accumulated on the first and second bonding pads P1 and P2. In this case, the solder material accumulated on the first and second bonding pads P1 and P2 may permeate between the first and second bonding pads P1 and P2, so that the first and second bonding pads P1 and P2 may be bonded to each other.

In an embodiment, the bonding holes P2' formed in the second bonding pads P2 of the flexible circuit board 200 may have different shapes in the outermost bonding pads P2E and the inner bonding pads P2N in the first direction Z1. For example, the coupling hole P2 'formed in the outermost coupling pad P2E may have an end portion whose width in the first direction Z1 is increased from the opening side in the second direction Z2 in an end portion where the coupling hole P2' terminates in the second direction Z2; the inner bonding pad P2N may have an end portion whose width in the first direction Z1 is reduced from an opening side in the second direction Z2 in an end portion where the inner bonding pad P2N terminates in the second direction Z2.

For example, the bonding hole P2 'formed in the outermost bonding pad P2E of the second bonding pad P2 formed on the flexible circuit board 200 may have an end portion whose width in the first direction Z1 is increased from the opening side in the second direction Z2 in an end portion at which the bonding hole P2' ends in the second direction Z2. In an embodiment, each of the coupling holes P2' formed in the outermost coupling pad P2E of the second coupling pad P2 may have an end at which the coupling hole P2' ends in the second direction Z2, and each of the coupling holes P2' may be elongated in the first direction Z1 and have rounded ends at both or opposite ends in the first direction Z1. Throughout the present specification, it is described that the coupling hole P2 '(the outermost coupling hole P2') formed in the outermost coupling pad P2E of the second coupling pad P2 has an end portion whose width is increased, or the coupling hole P2 '(the inner coupling hole P2') of the inner coupling pad P2N of the second coupling pad P2 has an end portion whose width is decreased, in which case the expression "increased width" or "decreased width" means that when the coupling hole P2 'has an end portion at which the coupling hole P2' is terminated in the second direction Z2, the width of at least some of the end portions is increased or decreased from the open side in the second direction Z2. As described above, the outermost coupling hole P2 'having the end portion whose width is increased may be longer in the first direction Z1 than the inner coupling hole P2' having the end portion whose width is decreased.

In an embodiment, the outermost bonding hole P2' may be relatively long to effectively resist the tensile force acting in the first direction Z1. In the embodiment, for example, the outermost coupling hole P2 'relatively close to the external connection terminal T in the first direction Z1 is longer than the inner coupling hole P2' relatively far from the external connection terminal T in the first direction Z1, so that the coupling between the flexible circuit board 200 and the main circuit board 100 may not be damaged even when a tensile force acts on the flexible circuit board 200 via the external connection terminal T. For example, the bonding hole P2 'relatively long in the first direction Z1 has the effect of increasing the area of the first bonding pad P1 exposed through the bonding hole P2' and the area of the bonding material 150 such as a solder material, and therefore, since the strength of the bonding between the flexible circuit board 200 and the main circuit board 100 is increased due to the increase in the area of the bonding material 150, it is possible to improve the resistance against the tensile force acting in the first direction Z1.

As described above, in the embodiment, the outermost coupling hole P2' is relatively long and the inner coupling hole P2' is relatively short according to the position of the coupling hole P2' in the first direction Z1. In an embodiment, the outermost coupling hole P2 'may have its end portion increased in width in the first direction Z1, and the inner coupling hole P2' may have its end portion decreased in width in the first direction Z1, so that the length of the outermost coupling hole P2 'may be different from the length of the inner coupling hole P2'. In other words, according to an embodiment, the outermost coupling hole P2 'and the inner coupling hole P2' may have different shapes and sizes.

In an embodiment, the outermost bonding holes P2 'may be formed in the second bonding pad P2 (i.e., in the outermost bonding pad P2E) at a relatively inner position of the second bonding pad P2 in the first direction Z1, and the inner bonding holes P2' may be formed in the second bonding pad P2 (i.e., in the inner bonding pad P2N) at a relatively central position of the second bonding pad P2 in the first direction Z1. For example, the inner bonding hole P2' may be formed at a central position of the second bonding pad P2 in the first direction Z1 (i.e., at a central position between outer and inner ends of the second bonding pad P2 in the first direction Z1 from the main circuit board 100 toward the flexible circuit board 200).

In an embodiment, unlike the inner bonding holes P2', the outermost bonding holes P2' may be formed at inner positions of the second bonding pads P2 in the first direction Z1 (i.e., at positions of the second bonding pads P2 closer to inner ends of the second bonding pads P2 than outer ends of the second bonding pads P2 in the first direction Z1 from the main circuit board 100 to the flexible circuit board 200). That is, the position of each of the outermost bonding holes P2' in the second bonding pad P2 may be determined such that the distance (outer distance) LE from the bonding hole P2' of the second bonding pad P2 to the outer end is greater than the distance (inner distance) LN from the bonding hole P2' of the second bonding pad P2 to the inner end.

The bonding hole P2 'is a position at which the bonding material 150 is formed on the first bonding pad P1 exposed from the second bonding pad P2, and may correspond to a central position of a portion of the bonding material 150 formed on the first and second bonding pads P1 and P2, and in this regard, the bonding hole P2' may correspond to a bonding position of the first and second bonding pads P1 and P2 or a bonding central position between the first and second bonding pads P1 and P2. In an embodiment, when the bonding material 150 is formed on the first and second bonding pads P1 and P2, the bonding material 150 may be highest at the position of the bonding hole P2'.

The outer and inner distances LE and LN of the second bonding pad P2 may correspond to a portion of the second bonding pad P2 outside the bonding hole P2', and when the bonding hole P2' is considered as a bonding position of the first and second bonding pads P1 and P2, a portion of the second bonding pad P2 may extend along the outer and inner distances LE and LN of the second bonding pad P2 away from the bonding position of the first and second bonding pads P1 and P2 (the bonding hole P2 '). In this case, a portion of the second bonding pad P2 extending outside the bonding hole P2 'along the outer distance LE may be longer than a portion of the second bonding pad P2 extending outside the bonding hole P2' along the inner distance LN.

When the flexible circuit board 200 is bent in a direction away from the main circuit board 100, a portion of the second bonding pad P2 outside the bonding position of the first and second bonding pads P1 and P2 may impart rigidity to the flexible circuit board 200 to resist bending of the flexible circuit board 200, and thus, since the portion of the second bonding pad P2 receives a bending force, the other portion of the second bonding pad P2 may not be damaged. In other words, when the flexible circuit board 200 is bent in a direction away from the main circuit board 100, the relatively long outer distance LE has an effect of providing rigidity against bending of the flexible circuit board 200, and thus, it is possible to resist bending of the flexible circuit board 200 and prevent or substantially prevent damage to the flexible circuit board 200.

For example, when the flexible circuit board 200 is bent in a direction away from the main circuit board 100, the flexible circuit board 200 may be bent away from the main circuit board 100 up to a bonding position (corresponding to the bonding hole P2') of the first and second bonding pads P1 and P2, in which case a portion (corresponding to the outer distance LE of the second bonding pad P2, for example) of the second bonding pad P2 outside the bonding position (corresponding to the bonding hole P2') of the first and second bonding pads P1 and P2 may resist the bending force, so that a force acting on another portion of the flexible circuit board 200 may be low and the flexible circuit board 200 may not be damaged. In this case, the second bonding pad P2 formed on the flexible circuit board 200 for bonding with the first bonding pad P1 formed on the main circuit board 100 may also serve as a strength-enhancing layer that imparts rigidity to the flexible circuit board 200 against bending of the flexible circuit board 200.

The first and second bonding pads P1 and P2 may be bonded to each other by a bonding material 150 (such as a solder material) formed on the first and second bonding pads P1 and P2, and the first and second bonding pads P1 and P2 may include a metal material having affinity or wettability with the bonding material 150. In this case, the second bonding pad P2 (e.g., a portion of the second bonding pad P2 along the outer distance LE) including a metal material and formed on the flexible circuit board 200 of the flexible film type may supplement the rigidity of the flexible circuit board 200 against bending of the flexible circuit board 200.

Referring to fig. 3, the first bonding pads P1 formed on the main circuit board 100 may include a first row of bonding pads P11 and a second row of bonding pads P12, and the second bonding pads P2 formed on the flexible circuit board 200 may include a first row of bonding pads P21 and a second row of bonding pads P22. In addition, the outermost bonding pad PE in the first direction Z1 may include: an outermost bonding pad P1E among the first bonding pads P1 formed on the main circuit board 100; and the outermost bonding pad P2E among the second bonding pads P2 formed on the flexible circuit board 200. Similarly, the inner bonding pad PN in the first direction Z1 may include: an inner bonding pad P1N among first bonding pads P1 formed on the main circuit board 100; and an inner bonding pad P2N among the second bonding pads P2 formed on the flexible circuit board 200.

Referring to fig. 1, in an embodiment, an insulating tape 20 may be attached along the edge of the battery cell C, and an insulating adhesive tape 30 may be disposed between the terrace portion 11 of the battery cell C, the main circuit board 100, and the flexible circuit board 200 for insulating bonding between the terrace portion 11 of the battery cell C, the main circuit board 100, and the flexible circuit board 200. In an embodiment, the insulating member 80 may be attached to the main circuit board 100 and the flexible circuit board 200 to insulate the main circuit board 100 and the flexible circuit board 200 from the surrounding environment and protect the main circuit board 100 and the flexible circuit board 200. Referring to fig. 1, in an embodiment, a label sheet 51 may be attached to a battery cell C to insulate the battery cell C and protect the battery cell C (e.g., to provide an area for indicating product information such as a model name or a manufacturer of the battery cell C).

As described above, according to one or more embodiments, the rigidity of the flexible circuit board 200 connected to the external connection terminals T is enhanced, so that the flexible circuit board 200 connected to the external connection terminals T may not be damaged or the bonding between the flexible circuit board 200 and other circuit boards may not be damaged even when a tensile force or a bending force is applied to the flexible circuit board 200 through the external connection terminals T.

It is to be understood that the embodiments described herein are to be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should generally be considered as available for other similar features or aspects in other embodiments. While one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure as set forth in the following claims.