阅读说明：本技术 一种耐潮防电极金属迁移玻璃式封装的金浆ntc热敏电阻 (Moisture-proof gold paste NTC thermistor capable of preventing electrode metal migration glass type packaging ) 是由 董文进 于 2021-08-20 设计创作，主要内容包括：本发明公开了一种耐潮防电极金属迁移玻璃式封装的金浆NTC热敏电阻,包括金浆电极NTC热敏电阻半导体芯片、玻璃保护外壳、金属杜镁丝引线、金浆电极和NTC芯片陶瓷本体,所述金浆电极NTC热敏电阻半导体芯片的一端设置有两组金属杜镁丝引线,且金浆电极NTC热敏电阻半导体芯片的外侧包裹有玻璃保护外壳。本发明所设计的电阻相较于常规电阻体积更小,对于温度的控制更加精准,且合理的结构设计使得安装更加的方便。(The invention discloses a moisture-proof electrode metal migration-proof glass-packaged gold paste NTC thermistor which comprises a gold paste electrode NTC thermistor semiconductor chip, a glass protective shell, metal magnesium Dumet wire leads, a gold paste electrode and an NTC chip ceramic body, wherein two groups of metal magnesium Dumet wire leads are arranged at one end of the gold paste electrode NTC thermistor semiconductor chip, and the glass protective shell wraps the outer side of the gold paste electrode NTC thermistor semiconductor chip. Compared with the conventional resistor, the resistor designed by the invention has smaller volume, more accurate temperature control and more convenient installation due to reasonable structural design.)

1. The utility model provides a gold thick liquid NTC thermistor of moisture-proof electricity prevention electrode metal migration glass formula encapsulation, includes gold thick liquid electrode NTC thermistor semiconductor chip (1), glass protecting sheathing (2), metal Du Mg silk lead wire (3), gold thick liquid electrode (4) and NTC chip ceramic body (5), its characterized in that: one end of the gold paste electrode NTC thermistor semiconductor chip (1) is provided with two metal magnesium Dewar wire leads (3), the outer side of the gold paste electrode NTC thermistor semiconductor chip (1) is wrapped with a glass protective shell (2), and the glass protective shell (2) wraps the joint of the gold paste electrode NTC thermistor semiconductor chip (1) and the metal magnesium Dewar wire leads (3);

the glass protective shell (2) comprises a gold paste electrode (4) and an NTC chip ceramic body (5), wherein the gold paste electrode (4) is uniformly coated on the upper surface and the lower surface of the NTC chip ceramic body (5).

2. The moisture-resistant, electrode-metal migration-resistant, glass-encapsulated gold paste NTC thermistor of claim 1, wherein: the glass protective shell (2) is oval-like in shape, and the middle of the glass protective shell is sunken to be flat.

3. The moisture-resistant, electrode-metal migration-resistant, glass-encapsulated gold paste NTC thermistor of claim 1, wherein: the thickness of the glass protective shell (2) is less than 0.3 mm.

4. The moisture-resistant, electrode-metal migration-resistant, glass-encapsulated gold paste NTC thermistor of claim 1, wherein: the thickness of the gold paste electrode (4) is between 0.05mm and 0.2 mm.

Technical Field

The invention relates to the technical field of thermistors, in particular to a gold paste NTC thermistor with moisture resistance and electrode metal migration prevention glass type packaging.

Background

Nowadays, society, country and consumers have higher and higher protection consciousness on temperature measurement and control and safe use of household appliances, and simultaneously, new and higher requirements on temperature measurement products except sensitive reaction are also provided. High temperature resistance, moisture resistance and migration resistance are the most demanded in recent years.

At present, silver paste, silver palladium paste, palladium paste and the like are used as electrode materials of the NTC thermistor in products in the domestic NTC thermistor industry, the materials are relatively active metal elements in rare metals, and the phenomenon of silver migration can occur as long as the materials are in a humid condition in the electrifying process, so that the NTC thermistor is ineffective in temperature measurement and control.

Disclosure of Invention

In order to achieve the purpose, the invention provides the following technical scheme: a moisture-proof electrode metal migration-proof glass-packaged gold paste NTC thermistor comprises a gold paste electrode NTC thermistor semiconductor chip, a glass protective shell, metal magnesium wire leads, a gold paste electrode and an NTC sheet ceramic body, wherein two metal magnesium wire leads are arranged at one end of the gold paste electrode NTC thermistor semiconductor chip, the glass protective shell wraps the outer side of the gold paste electrode NTC thermistor semiconductor chip, and the glass protective shell wraps the joint of the metal magnesium wire leads and the metal magnesium wire leads;

the glass protective shell comprises a gold paste electrode and an NTC chip ceramic body, wherein the gold paste electrode is uniformly coated on the upper surface and the lower surface of the NTC chip ceramic body.

Preferably; the glass protective shell is oval-like in shape, and the middle of the glass protective shell is sunken to be flat.

Preferably; the thickness of the glass protective shell is less than 0.3 mm.

Preferably; the thickness of the gold paste electrode is between 0.05mm and 0.2 mm.

The manufacturing method of the gold paste NTC thermistor with the moisture-proof and electrode metal migration-proof glass type package comprises the following steps:

firstly, gold paste is adhered to two sides of a NTC chip ceramic body, a solid gold paste electrode NTC thermistor semiconductor chip is formed by high-temperature sintering, namely, the gold paste forms gold paste electrodes on two sides of the NTC chip ceramic body,

step two: and combining the metal Demet wire lead coated with the gold paste and the gold paste electrodes on the two sides of the gold paste electrode NTC thermistor semiconductor chip 1, and sintering the two together at high temperature.

Step three: and covering a glass protective shell on the outer sides of the NTC thermistor semiconductor chip with the gold paste electrode and the metal Demet wire lead, and then sintering the glass protective shell in sintering equipment to form the metal Demet wire.

Compared with the prior art, the invention has the following beneficial effects:

small, the temperature measurement precision is high, the thermal response time is fast, moreover, the steam generator is simple in structure, high temperature resistant, moisture-proof prevents the migration, the reliability is high, furthermore, the outer side cover of the gold slurry electrode in the NTC thermistor type temperature sensor subassembly is equipped with glass protecting sheathing, can effectual protection product in semiconductor chip not destroyed, avoid appearing the condition such as corruption damage in the use, the group battery work safety degree that adopts this kind of NTC thermistor type temperature sensor is high, the temperature control speed is fast, extension NTC thermistor life, and this thermistor special structural design can be convenient for when the installation wait more convenient.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a semiconductor chip structure of a gold paste electrode NTC thermistor according to the present invention;

fig. 3 is a schematic view of the lead structure of the metal Demet wire of the present invention.

In the figure: 1. a gold paste electrode NTC thermistor semiconductor chip; 2. a glass protective housing; 3. a metal dummie wire lead; 4. a gold paste electrode; 5. NTC chip ceramic body.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1: referring to fig. 1-3, a moisture-resistant electrode metal migration-proof glass-packaged gold paste NTC thermistor comprises a gold paste electrode NTC thermistor semiconductor chip 1, a glass protective case 2, metal magnesium Dumet wire leads 3, a gold paste electrode 4 and an NTC chip ceramic body 5, wherein two metal magnesium Dumet wire leads 3 are arranged at one end of the gold paste electrode NTC thermistor semiconductor chip 1, the glass protective case 2 wraps the outer side of the gold paste electrode NTC thermistor semiconductor chip 1, and the glass protective case 2 wraps the joint of the gold paste electrode NTC thermistor semiconductor chip 1 and the metal magnesium Dumet wire leads 3;

the glass protective shell 2 comprises a gold paste electrode 4 and an NTC chip ceramic body 5, wherein the gold paste electrode 4 is uniformly coated on the upper surface and the lower surface of the NTC chip ceramic body 5.

Preferably; the glass protective shell 2 is oval-like in shape, and is flat in the middle concave.

Preferably; the thickness of the glass protective shell 2 is less than 0.3 mm.

Preferably; the thickness of the gold paste electrode 4 is between 0.05mm and 0.2 mm.

The manufacturing method of the gold paste NTC thermistor with the moisture-proof and electrode metal migration-proof glass type package comprises the following steps:

firstly, gold paste is adhered to two sides of an NTC chip ceramic body 5, a solid gold paste electrode NTC thermistor semiconductor chip 1 is formed by high-temperature sintering, namely, the gold paste forms gold paste electrodes 4 on two sides of the NTC chip ceramic body 5,

step two: the metal Demet wire lead 3 coated with the gold paste and the gold paste electrodes on the two sides of the gold paste electrode NTC thermistor semiconductor chip 1 are combined and sintered together at high temperature.

Step three: and (3) covering a glass protective shell 2 on the outer sides of the NTC thermistor semiconductor chip 1 with the gold paste electrode and the metal Demet wire lead 3, and then sintering the glass protective shell in a sintering device to form the metal Demet wire.

Example 2, referring to fig. 2-3, is substantially the same as example 1 except that the thickness of the glass protective envelope 2 and the thickness of the gold paste electrode 4 are as follows:

the thickness of the glass protective shell is between 0.2mm and 0.3mm, so that the glass protective shell can play a good role in protection, can avoid influencing the heat dissipation effect while protecting, and can control the influence on heat dissipation in the lowest range.

The thickness of the gold paste electrode is between 0.12 mm and 0.2 mm.

Through detection, the heat dissipation degree can be relatively deteriorated, the heat dissipation degree is prevented from being reduced, and the heat generated by the heat dissipation device can be reduced.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.