阅读说明：本技术 一种pcb板塞孔油墨 (PCB hole plugging ink ) 是由 赖建春 陈亮 王锁理 于 2021-08-31 设计创作，主要内容包括：本发明公开了一种PCB板塞孔油墨,按质量百分比包括15％～20％酚醛环氧树脂、20％～30％邻甲酚环氧树脂、7％～13％丙烯酸酯、15％～25％硫酸钡、1％～3％除泡剂、1％～3％二氧化硅、0.5％～1.5％颜料及17％～27％高沸点芳烃溶剂。本发明酚醛环氧树脂、邻甲酚环氧树脂、丙烯酸酯、硫酸钡及高沸点芳烃溶剂的热稳定性好,混合封孔效果好,高温条件下,溶剂挥发稳定,PCB板可直接放入烤箱进行高温固化,孔内油墨不会溢出,不会爆油上焊盘,不会导致绿油起泡掉油不良,大幅提高烤箱产能,提高生产效率,大幅度降低耗电量,节约生产成本。(The invention discloses a PCB (printed circuit board) hole plugging ink which comprises, by mass, 15% -20% of novolac epoxy resin, 20% -30% of o-cresol epoxy resin, 7% -13% of acrylate, 15% -25% of barium sulfate, 1% -3% of a defoaming agent, 1% -3% of silicon dioxide, 0.5% -1.5% of pigment and 17% -27% of a high-boiling-point aromatic solvent. The phenolic epoxy resin, the o-cresol epoxy resin, the acrylate, the barium sulfate and the high-boiling-point aromatic solvent have the advantages of good thermal stability, good mixed hole sealing effect, stable solvent volatilization under high-temperature conditions, direct high-temperature curing of the PCB in an oven, no overflow of printing ink in holes, no explosion of oil on bonding pads, no bad oil removal due to green oil foaming, great improvement of oven productivity, great improvement of production efficiency, great reduction of power consumption and production cost saving.)

1. The PCB hole plugging ink is characterized in that: the paint comprises 15-20% of novolac epoxy resin, 20-30% of o-cresol epoxy resin, 7-13% of acrylate, 15-25% of barium sulfate, 1-3% of defoaming agent, 1-3% of silicon dioxide, 0.5-1.5% of pigment and 17-27% of high-boiling-point aromatic solvent by mass percent.

2. The PCB board via hole ink of claim 1, wherein: the paint comprises 15-19% of novolac epoxy resin, 23-29% of o-cresol epoxy resin, 8-12% of acrylate, 17-23% of barium sulfate, 1-3% of defoaming agent, 1-3% of silicon dioxide, 0.5-1.5% of pigment and 19-25% of high-boiling-point aromatic solvent by mass percent.

3. The PCB board via hole ink of claim 1, wherein: comprises 16-18 percent of novolac epoxy resin, 25-27 percent of o-cresol epoxy resin, 9-11 percent of acrylate, 18-22 percent of barium sulfate, 1-3 percent of defoaming agent, 1-3 percent of silicon dioxide, 0.5-1.5 percent of pigment and 20-24 percent of high boiling point aromatic solvent according to mass percentage.

4. The PCB board via hole ink of claim 1, wherein: the paint comprises, by mass, 19% of novolac epoxy resin, 24% of o-cresol epoxy resin, 9% of acrylate, 19% of barium sulfate, 2% of a defoaming agent, 2% of silicon dioxide, 1% of a pigment and 24% of a high-boiling-point aromatic hydrocarbon solvent.

5. The PCB board via hole ink of claim 1, wherein: the paint comprises, by mass, 17% of novolac epoxy resin, 26% of o-cresol epoxy resin, 10% of acrylate, 20% of barium sulfate, 2% of a defoaming agent, 2% of silicon dioxide, 1% of a pigment and 22% of a high-boiling-point aromatic hydrocarbon solvent.

6. The PCB board via hole ink of claim 1, wherein: the pigment is phthalocyanine blue.

7. The PCB board via hole ink of claim 1, wherein: the defoaming agent is dimethyl silicone oil.

8. The PCB board via hole ink of claim 1, wherein: the high boiling point aromatic hydrocarbon solvent is a mixture of dimethyl succinate, dimethyl glutarate and dimethyl adipate.

Technical Field

The invention relates to the technical field of printing ink, in particular to PCB hole plugging printing ink.

Background

There are multiple Via hole designs in the present PCB board, run through the component face from the conducting hole when preventing the customer from crossing wave soldering tin and cause the short circuit and the solder paste to flow in downthehole rosin joint that leads to, so the Via hole adopts the aluminum sheet form at the anti-welding process, special consent printing ink of collocation carries out the hole sealing to the Via hole, but need adopt the segmentation to increase progressively when printing ink high temperature solidification and heat up and the form of extension time lets the downthehole printing ink solvent of Via slowly volatilize out, otherwise can make downthehole printing ink spill over and lead to on the oil burst pad and green oil bubble to fall oily bad, lead to the oven productivity low, the power consumption is many, low in production efficiency. Therefore, there is a need for improvements in the prior art to avoid the disadvantages of the prior art.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provide hole plugging ink for a PCB.

The invention is realized by the following technical scheme:

the PCB hole plugging ink comprises, by mass, 15% -20% of novolac epoxy resin, 20% -30% of o-cresol epoxy resin, 7% -13% of acrylate, 15% -25% of barium sulfate, 1% -3% of a defoaming agent, 1% -3% of silicon dioxide, 0.5% -1.5% of pigment and 17% -27% of a high-boiling-point aromatic solvent.

Further, the paint comprises 15-19% of novolac epoxy resin, 23-29% of o-cresol epoxy resin, 8-12% of acrylate, 17-23% of barium sulfate, 1-3% of defoaming agent, 1-3% of silicon dioxide, 0.5-1.5% of pigment and 19-25% of high-boiling-point aromatic solvent according to mass percentage.

Further, the paint comprises 16-18% of novolac epoxy resin, 25-27% of o-cresol epoxy resin, 9-11% of acrylate, 18-22% of barium sulfate, 1-3% of defoaming agent, 1-3% of silicon dioxide, 0.5-1.5% of pigment and 20-24% of high-boiling-point aromatic solvent by mass percentage.

Further, the paint comprises, by mass, 19% of novolac epoxy resin, 24% of o-cresol epoxy resin, 9% of acrylate, 19% of barium sulfate, 2% of a defoaming agent, 2% of silicon dioxide, 1% of a pigment and 24% of a high-boiling-point aromatic hydrocarbon solvent.

Further, the paint comprises, by mass, 17% of novolac epoxy resin, 26% of o-cresol epoxy resin, 10% of acrylate, 20% of barium sulfate, 2% of a defoaming agent, 2% of silicon dioxide, 1% of a pigment and 22% of a high-boiling-point aromatic hydrocarbon solvent.

Further, the pigment is phthalocyanine blue.

Further, the defoaming agent is dimethyl silicone oil.

Further, the high-boiling-point aromatic hydrocarbon solvent is a mixture of dimethyl succinate, dimethyl glutarate and dimethyl adipate.

Compared with the prior art, the PCB plughole printing ink comprises the novolac epoxy resin, the o-cresol epoxy resin, the acrylic ester, the barium sulfate and the high-boiling-point aromatic hydrocarbon solvent, the novolac epoxy resin, the o-cresol epoxy resin, the acrylic ester, the barium sulfate and the high-boiling-point aromatic hydrocarbon solvent have good thermal stability, the mixed hole sealing effect is good, the solvent is stable in volatilization under a high-temperature condition, the PCB can be directly placed into an oven for high-temperature curing, the printing ink in the plugholes cannot overflow, an upper bonding pad cannot be exploded, poor oil falling caused by bubbling of green oil cannot occur, the capacity of the oven is greatly improved, the production efficiency is improved, the power consumption is greatly reduced, and the production cost is saved.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The PCB hole plugging ink comprises, by mass, 15% -20% of novolac epoxy resin, 20% -30% of o-cresol epoxy resin, 7% -13% of acrylate, 15% -25% of barium sulfate, 1% -3% of a defoaming agent, 1% -3% of silicon dioxide, 0.5% -1.5% of pigment and 17% -27% of a high-boiling-point aromatic solvent.

More specifically, the paint comprises 15-19% of novolac epoxy resin, 23-29% of o-cresol epoxy resin, 8-12% of acrylate, 17-23% of barium sulfate, 1-3% of defoaming agent, 1-3% of silicon dioxide, 0.5-1.5% of pigment and 19-25% of high-boiling-point aromatic solvent by mass percentage.

More specifically, the paint comprises 16-18% of novolac epoxy resin, 25-27% of o-cresol epoxy resin, 9-11% of acrylate, 18-22% of barium sulfate, 1-3% of defoaming agent, 1-3% of silicon dioxide, 0.5-1.5% of pigment and 20-24% of high-boiling-point aromatic solvent by mass percentage.

As a specific embodiment, the paint comprises, by mass, 19% of novolac epoxy resin, 24% of o-cresol epoxy resin, 9% of acrylate, 19% of barium sulfate, 2% of defoaming agent, 2% of silicon dioxide, 1% of pigment and 24% of high-boiling-point aromatic hydrocarbon solvent.

In a preferred embodiment, the paint comprises 17% of phenolic epoxy resin, 26% of o-cresol epoxy resin, 10% of acrylate, 20% of barium sulfate, 2% of defoaming agent, 2% of silicon dioxide, 1% of pigment and 22% of high-boiling-point aromatic hydrocarbon solvent in percentage by mass.

In specific implementation, the pigment is phthalocyanine blue, and the surface color of the PCB hole plugging ink prepared by mixing the phthalocyanine blue with other components is closer to that of the PCB.

The defoaming agent is dimethyl silicone oil which has excellent heat resistance, electrical insulation, weather resistance, hydrophobicity, physiological inertia and smaller surface tension, so that the thermal stability of the PCB hole plugging ink is better.

The high boiling point aromatic solvent is a mixture of dimethyl succinate, dimethyl glutarate and dimethyl adipate, has good thermal stability and stable volatilization, can not overflow during high-temperature curing, and can also be dibasic ester.

In specific implementation, the CAS NO. of the o-cresol epoxy resin is 29690-82-2.

In the manufacturing process, novolac epoxy resin, o-cresol epoxy resin, acrylate, barium sulfate, a defoaming agent, silicon dioxide, a pigment and a high-boiling-point aromatic solvent are added into a stirring container and stirred at the rotating speed of 900rpm for 30min to be uniformly mixed, and the PCB board hole plugging ink is prepared conveniently and quickly.

Compared with the prior art, the PCB plughole printing ink comprises the novolac epoxy resin, the o-cresol epoxy resin, the acrylic ester, the barium sulfate and the high-boiling-point aromatic hydrocarbon solvent, the novolac epoxy resin, the o-cresol epoxy resin, the acrylic ester, the barium sulfate and the high-boiling-point aromatic hydrocarbon solvent have good thermal stability, the mixed hole sealing effect is good, the solvent is stable in volatilization under a high-temperature condition, the PCB can be directly placed into an oven for high-temperature curing, the printing ink in the plugholes cannot overflow, an upper bonding pad cannot be exploded, poor oil falling caused by bubbling of green oil cannot occur, the capacity of the oven is greatly improved, the production efficiency is improved, the power consumption is greatly reduced, and the production cost is saved.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.