阅读说明：本技术 一种多层印制板的层压质量检测方法 (Lamination quality detection method for multilayer printed board ) 是由 王伟 朱建军 周槿 陈旭 周峻松 于 2021-08-11 设计创作，主要内容包括：本发明公开了一种多层印制板的层压质量检测方法,将待测印制板和标准样板并列装夹在检测仪的两个探测头中间,夹头不遮挡待测区域,调整两个探测头对准待测区域,采用水介质弹性机械振动波扫描待测印制板和标准样板的待测区域,计算两者输出图像颜色的对比度,如果对比度在1：30到1：120,判定存在层压剥离故障,操作方法简单,可直接对产品进行全部区域的检测,不破坏待测产品,不受取样位置和数量的限制,不受试样制备技术能力限制,解决了印制板检测中经常受制样人员能力所限而引起误判的问题,准确率高,也可用于生产过程中的质量控制手段。(The invention discloses a method for detecting the lamination quality of a multilayer printed board, which is characterized in that a printed board to be detected and a standard sample plate are clamped between two detecting heads of a detector in parallel, a chuck does not shield a region to be detected, the two detecting heads are adjusted to be aligned with the region to be detected, the region to be detected of the printed board to be detected and the standard sample plate is scanned by adopting an aqueous medium elastic mechanical vibration wave, the contrast ratio of the colors of output images of the printed board to be detected and the standard sample plate is calculated, and if the contrast ratio is 1:30 to 1: 120, judging that the lamination peeling fault exists, having simple operation method, being capable of directly detecting all areas of the product without damaging the product to be detected, being not limited by the sampling position and the number, being not limited by the sample preparation technical capability, solving the problem of erroneous judgment caused by the limit of the sample preparation personnel capability in the printed board detection, having high accuracy and being also used as a quality control means in the production process.)

1. A method for detecting the lamination quality of a multilayer printed board is characterized by comprising the following steps: the printed board to be detected and the standard sample plate are clamped between two detecting heads of the detector in parallel, the chuck does not shield the area to be detected, the two detecting heads are adjusted to align to the area to be detected, the area to be detected of the printed board to be detected and the standard sample plate is scanned by adopting an aqueous medium elastic mechanical vibration wave, the contrast of the colors of the output images of the two is calculated, and if the contrast is 1:30 to 1: and 120, judging that the lamination peeling fault exists.

2. The method for inspecting lamination quality of a multilayer printed board according to claim 1, further comprising: and clamping and detecting the printed board to be detected 12-48 hours after lamination.

3. The method for inspecting lamination quality of a multilayer printed board according to claim 1, further comprising: the distance between the two detecting heads and the printed board to be tested is kept between 20mm and 40 mm.

4. The method for inspecting lamination quality of a multilayer printed board according to claim 1, further comprising: an ACIS-04 scanner was used, and the frequency of the elastic mechanical vibration wave was set to 0.5Mhz to 2.25Mhz, and the scanning speed was set to 50mm/s to 200 mm/s.

Technical Field

The invention belongs to the technical field of printed board processing, and particularly relates to a quality detection technology.

Background

Printed boards are important components of the electronics industry and need to be used whenever there is an interconnection of electronic components such as integrated circuits. With the improvement of integration and miniaturization of electronic products, the multilayer printed board has been widely applied in various industries. The multilayer printed board is formed by laminating a plurality of single sheets by a hot press, and the lamination quality, particularly the interlayer peeling fault, directly influences the functions of the multilayer printed board on device support and electrical interconnection. In the process of identifying and producing the lamination process of the multilayer printed board, the printed board needs to be subjected to lamination quality test.

A plurality of current standards disclose and describe a method for detecting interlayer peeling faults of a multilayer printed board, which comprises the requirements of general specifications of GJB362B-2009 rigid printed boards, GB/T4677-2002 printed board testing methods, general specifications of GJB9491-2018 microwave printed boards and micro-sectioning inspection of QJ1889A-2012 printed circuit boards, wherein the testing schemes are all subjected to micro-sectioning inspection, and after testing conditions all need to be made into samples, the samples are subjected to micro-sectioning amplification to be subjected to visual inspection or size inspection and evaluation.

The existing method has a complex detection process and is very limited by the preparation technical capability of a sample. The samples should be potted with a suitable potting material, carefully ground and polished on a low speed disk of appropriate media, and any remaining scratches will significantly affect the results. The detection of the sample belongs to a sampling detection mode, only has representativeness under a certain probability, and cannot explain the quality results of all products.

Disclosure of Invention

The invention provides a method for detecting the lamination quality of a multilayer printed board in order to solve the problems in the prior art, and adopts the following technical scheme in order to achieve the purpose.

The printed board to be detected and the standard sample plate are clamped between two detecting heads of the detector in parallel, the chuck does not shield the area to be detected, the two detecting heads are adjusted to align to the area to be detected, the area to be detected of the printed board to be detected and the standard sample plate is scanned by adopting an aqueous medium elastic mechanical vibration wave, the contrast of the colors of the output images of the two is calculated, and if the contrast is 1:30 to 1: and 120, judging that the lamination peeling fault exists.

And further, clamping and detecting the printed board to be detected 12-48 hours after lamination.

Further, the distance between the two detecting heads and the printed board to be tested is kept between 20mm and 40 mm.

Further, an ACIS-04 scanner is used, and the frequency of the elastic mechanical vibration wave is set to be 0.5Mhz to 2.25Mhz, and the scanning speed is set to be 50mm/s to 200 mm/s.

The invention has the beneficial effects that: whether interlayer peeling faults exist or not is judged by comparing chromatic aberration, the operation method is simple, the products can be directly detected in all areas, products to be detected are not damaged, the limitation of sampling positions and quantity is avoided, the limitation of the technical capability of sample preparation is avoided, the problem of misjudgment caused by the limitation of the capability of sample preparation personnel in printed board detection is solved, the accuracy is high, and the method can also be used for quality control means in the production process.

Drawings

Fig. 1 is a detection flow chart.

Detailed Description

The technical scheme of the invention is specifically explained in the following by combining the attached drawings.

The detection process is as shown in fig. 1, the printed board to be detected and the standard sample plate are clamped between two detecting heads of the detector in parallel, the chuck does not shield the region to be detected, the parameters of the two detecting heads are adjusted to align the region to be detected, the region to be detected of the printed board to be detected and the standard sample plate is scanned by adopting the elastic mechanical vibration wave of the aqueous medium, and the contrast of the color of the output image of the printed board to be detected and the color of the standard sample plate to be detected is calculated.

Example 1

(1) Clamping the printed board to be tested and the standard sample plate 24 hours after the printed boards are laminated;

(2) the distance between the two probes and the printed board to be tested is kept at 20 mm;

(3) turning on an ACIS-04 scanner, setting the scanning frequency to be 0.5Mhz and the scanning speed to be 50 mm/s;

(4) scanning a region to be detected of the printed board and a standard sample plate;

(5) the interlayer peeling phenomenon exists in a partial area with the image contrast of 1: 30.

Example 2

(1) Clamping the printed board to be tested and the standard sample plate 12 hours after the printed board is laminated;

(2) the distance between the two probes and the printed board to be tested is kept at 40 mm;

(3) turning on an ACIS-04 scanner, setting the scanning frequency to be 1.5Mhz and the scanning speed to be 100 mm/s;

(4) scanning a region to be detected of the printed board and a standard sample plate;

(5) the interlayer peeling phenomenon exists in a partial area with the image contrast ratio of 1: 40.

Example 3

(1) Clamping the printed board to be tested and the standard sample plate 12 hours after the printed board is laminated;

(2) the distance between the two probes and the printed board to be tested is kept at 30 mm;

(3) turning on an ACIS-04 scanner, setting the scanning frequency to be 1.5Mhz and the scanning speed to be 100 mm/s;

(4) scanning a region to be detected of the printed board and a standard sample plate;

(5) the image contrast was all within 1:20 without interlayer peeling.

The above-described embodiments are not intended to limit the present invention, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present invention are included in the scope of the present invention.