阅读说明：本技术 一种基于5g信号传输用的高热流密度的散热材料 (High-heat-flux-density heat dissipation material for 5G signal transmission ) 是由 赵一静 刘乐华 赵宁 于 2021-09-01 设计创作，主要内容包括：本发明公开了一种基于5G信号传输用的高热流密度的散热材料,涉及配件散热材料技术领域。本发明按照质量百分比计量配比,包括熔融石英35-45％、石墨20-25％、硅胶10-15％、氧化铝5-10％、氧化镁4-10％、氮化硼5-10％、塑化剂3-10％、聚合氯化铝5-10％和粘合剂5-10％,将所述熔融石英、石墨、硅胶、氧化铝、氧化镁、氮化硼与聚合氯化铝分别粉碎研磨后获得硅微粉、石墨粉、硅胶粉、氧化铝粉、氧化镁粉、氮化硼粉和聚合氯化铝粉,所述硅微粉、石墨粉、硅胶粉、氧化铝粉、氧化镁粉、氮化硼粉与聚合氯化铝粉经筛滤后进行捣拌混合为基料。本发明制得的散热件材料热流密度高,硬度系数高,热流量传递快速,具有优良的导热性能,将散热件材料结合于配件,使得配件使用时散热效果好。(The invention discloses a high-heat-flux-density heat dissipation material for 5G signal transmission, and relates to the technical field of accessory heat dissipation materials. The invention is measured and proportioned according to mass percent and comprises 35-45% of fused quartz, 20-25% of graphite, 10-15% of silica gel, 5-10% of alumina, 4-10% of magnesium oxide, 5-10% of boron nitride, 3-10% of plasticizer, 5-10% of polyaluminium chloride and 5-10% of adhesive, wherein the fused quartz, the graphite, the silica gel, the alumina, the magnesium oxide, the boron nitride and the polyaluminium chloride are respectively crushed and ground to obtain silicon micro powder, graphite powder, silica gel powder, alumina powder, magnesia powder, boron nitride powder and polyaluminium chloride powder, and the silicon micro powder, the graphite powder, the silica gel powder, the alumina powder, the magnesia powder, the boron nitride powder and the polyaluminium chloride powder are sieved and then are mixed to obtain a base material. The heat dissipation material prepared by the invention has high heat flow density, high hardness coefficient, quick heat flow transfer and excellent heat conduction performance, and is combined with accessories, so that the heat dissipation effect of the accessories is good when the accessories are used.)

1. A high heat flux density heat dissipation material based on 5G signal transmission, characterized in that: according to the mass percentage, the material comprises 35-45% of fused quartz, 20-25% of graphite, 10-15% of silica gel, 5-10% of alumina, 4-10% of magnesium oxide, 5-10% of boron nitride, 3-10% of plasticizer, 5-10% of polyaluminium chloride and 5-10% of adhesive, wherein the fused quartz, graphite, silica gel, alumina, magnesium oxide, boron nitride and polyaluminium chloride are respectively crushed and ground to obtain silicon micro powder, graphite powder, silica gel powder, alumina powder, magnesia powder, boron nitride powder and polyaluminium chloride powder, the silicon micro powder, graphite powder, silica gel powder, alumina powder, magnesia powder, boron nitride powder and polyaluminium chloride powder are subjected to sieving and mixing to obtain a base material, the adhesive is doped in the process of stirring and mixing, the plasticizer is added into the base material and is stirred uniformly and heated and mixed to obtain a raw material, and (2) processing the raw materials by an injection molding machine to obtain a heat dissipation billet, and drying the heat dissipation billet in a drying oven to obtain the heat dissipation material.

2. The heat dissipation material with high heat flux density for 5G signal transmission according to claim 1, wherein the heat dissipation material comprises 43% of fused silica, 18% of graphite, 9% of silica gel, 5% of alumina, 4% of magnesium oxide, 6% of boron nitride, 5% of plasticizer, 5% of polyaluminum chloride and 5% of adhesive.

3. The heat dissipation material with high heat flux density for 5G signal transmission according to claim 1, wherein the heat dissipation material comprises 45% of fused silica, 20% of graphite, 10% of silica gel, 5% of alumina, 4% of magnesium oxide, 6% of boron nitride, 3% of plasticizer, 8% of polyaluminum chloride and 4% of adhesive by mass percentage.

4. The heat dissipation material with high heat flow density for 5G signal transmission according to claim 1, wherein the silica powder, graphite powder, silica gel powder, alumina powder, magnesia powder, boron nitride powder and polyaluminium chloride powder are sieved to obtain powders with different fineness meshes, wherein the fineness meshes are as follows: 800 meshes of silicon powder, 1000 meshes of graphite powder, 1500 meshes of silica powder, 600 meshes of silica powder, 900 meshes of alumina powder, 900 meshes of magnesium oxide powder, 1100 meshes of boron nitride powder, 600 meshes of boron nitride powder and 800 meshes of polymerized aluminum chloride powder.

5. The heat dissipating material with high heat flux density for 5G signal transmission as claimed in claim 1, wherein the adhesive is at least one of a vinyl acetate adhesive and an acrylic adhesive.

6. The high heat flux density heat dissipating material of claim 1, wherein the plasticizer is a phthalate plasticizer.

7. The heat dissipating material with high heat flux density for 5G signal transmission as claimed in claim 1, wherein the plasticizer is added to the base material at a temperature of 140 ℃ to 200 ℃, and the plasticizer is added to the base material at a temperature of 0.5-1.1 h.

8. The heat dissipating material with high heat flux density for 5G signal transmission as claimed in claim 1, wherein the drying temperature of the drying process of the heat dissipating block through the drying oven is 100-130 ℃, and the drying time of the drying process of the heat dissipating block through the drying oven is 0.2-0.3 h.

9. The heat dissipating material with high heat flux density for 5G signal transmission as claimed in claim 1, wherein the binder is divided into three equal parts, and the binder is added into the base material at intervals in the first, middle and last stirring and mixing processes.

Technical Field

The invention belongs to the technical field of accessory heat dissipation materials, and particularly relates to a heat dissipation material with high heat flux density for 5G signal transmission.

Background

The 5G network, i.e. the fifth generation mobile communication network (abbreviated as 5G), is the latest generation cellular mobile communication technology. The performance goals are high data rates, reduced latency, energy savings, reduced cost, increased system capacity, and large-scale device connectivity. The main advantage is that the data transmission rate is much higher than in previous cellular networks to meet the needs of enterprises and consumers. In addition to simply providing faster speed, it is predicted that a 5G network needs to meet new use case requirements, such as internet of things (network equipment buildings or Web access vehicles), broadcast services, and lifeline communication in case of natural disasters, the 5G network will adopt 28GHz millimeter wave communication, for example, the 4G currently uses low frequency bands such as 700MHz, 900MHz, 1800MHz, 2600MHz, and the like, although the radio wave diffraction capability is higher, the spectrum resources are quite limited at low frequency, most of millimeter waves at high frequency are few devices such as military fighter radars or speed cameras, the spectrum width is higher, and continuous spectrum is easier to find, so that blank spectrum is very easy to obtain, beam pointing is matched with a MIMO phased array antenna, MIMO multi-input multi-output utilizes space division multiplexing of electromagnetic waves and a multi-antenna system with different paths to improve transmission rate, similar in the commercial technical version that military field's technique will extend, beam adaptation and beam forming can improve the lobe optimization transmission distance of specific direction, in order to adapt to the application of new technologies such as industry thing networking, unmanned automobile, commercial unmanned aerial vehicle, the network delay time will be reduced to below 1 millisecond, and the main objective of 5G network is to let the end user be in the networking state all the time. The future 5G networks support far more than smart phones, but also smart watches, fitness wristbands, smart home devices such as bird's nest type indoor thermostats, etc. The 5G network refers to the next generation wireless network, and the 5G network is a real upgrade version of the 4G network, and the basic requirements of the 5G network are different from those of the wireless network.

However, when the traditional heat dissipation piece material is combined with a 5G base station accessory in the using process, the heat flow density of the heat dissipation piece material is low, the heat flow transfer is slow, and the heat conduction performance of the heat dissipation piece material is poor, so that the heat dissipation effect of the accessory is poor when the accessory is used, the hardness coefficient is low, the manufacturing and processing procedures of the heat dissipation piece material are complicated, and the processing cost is high.

Disclosure of Invention

The invention aims to provide a heat dissipation material with high heat flow density for 5G signal transmission, and solves the problems that the heat dissipation effect is poor when an accessory is used, the manufacturing and processing procedures of the heat dissipation material are complicated, and the processing cost is high due to poor heat conduction performance of the heat dissipation material caused by low heat flow density and slow heat flow transfer of the heat dissipation material in the use process of the traditional heat dissipation material combined with the accessory.

In order to solve the technical problems, the invention is realized by the following technical scheme:

the invention relates to a heat dissipation material with high heat flow density for 5G signal transmission, which comprises 35-45% of fused quartz, 20-25% of graphite, 10-15% of silica gel, 5-10% of alumina, 4-10% of magnesium oxide, 5-10% of boron nitride, 3-10% of plasticizer, 5-10% of polyaluminium chloride and 5-10% of adhesive by mass percentage, wherein the fused quartz, graphite, silica gel, alumina, magnesium oxide, boron nitride and polyaluminium chloride are respectively crushed and ground to obtain silicon micro powder, graphite powder, silica gel powder, alumina powder, magnesium oxide powder, boron nitride powder and polyaluminium chloride powder, the silicon micro powder, graphite powder, silica gel powder, alumina powder, magnesium oxide powder, boron nitride powder and polyaluminium chloride powder are subjected to stirring and mixing to obtain a base material after being filtered, and the adhesive is doped in the stirring and mixing process, adding the plasticizer into the base material, stirring uniformly, heating and mixing to obtain a raw material, processing and forming the raw material through an injection molding machine to obtain a heat dissipation billet, and drying the heat dissipation billet through a drying oven to obtain the heat dissipation material.

Preferably, the material comprises 43% of fused silica, 18% of graphite, 9% of silica gel, 5% of alumina, 4% of magnesium oxide, 6% of boron nitride, 5% of plasticizer, 5% of polyaluminium chloride and 5% of adhesive according to mass percentage.

Preferably, the material comprises, by mass, 45% of fused silica, 20% of graphite, 10% of silica gel, 5% of alumina, 4% of magnesium oxide, 6% of boron nitride, 3% of plasticizer, 8% of polyaluminium chloride and 4% of adhesive.

Preferably, the silica powder, the graphite powder, the silica gel powder, the alumina powder, the magnesia powder, the boron nitride powder and the polyaluminium chloride powder are sieved to obtain powders with different fineness meshes, and the fineness meshes are respectively as follows: 800 meshes of silicon powder, 1000 meshes of graphite powder, 1500 meshes of silica powder, 600 meshes of silica powder, 900 meshes of alumina powder, 900 meshes of magnesium oxide powder, 1100 meshes of boron nitride powder, 600 meshes of boron nitride powder and 800 meshes of polymerized aluminum chloride powder.

Preferably, the adhesive is at least one of a vinyl acetate resin adhesive and an acrylic resin adhesive.

Preferably, the plasticizer is a phthalate plasticizer.

Preferably, the temperature for homogenizing and heating the plasticizer added into the base material is 140-200 ℃, and the time for homogenizing and heating the plasticizer added into the base material is 0.5-1.1 h.

Preferably, the drying temperature of the heat dissipation embryo block for drying material through the drying box is 100-.

Preferably, the binder is divided into three equal parts, and the binder is added at intervals in the process of stirring and mixing before, during and after three times.

The invention has the following beneficial effects:

the invention discloses a heat radiation device, which is characterized in that silicon micro powder, graphite powder, silica gel powder, alumina powder, magnesia powder, boron nitride powder and polyaluminium chloride powder are sieved and mixed to form a base material, a binder is added at intervals in the process of stirring and mixing, a plasticizer is added into the base material and is stirred uniformly and heated to be mixed to prepare a raw material, the raw material is processed and formed by injection molding machinery to prepare a heat radiation billet, the heat radiation billet is dried by a drying oven to obtain a heat radiation piece material, the prepared heat radiation piece material has high heat flow density and high heat flow transfer speed, and has excellent heat conductivity.

Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The first embodiment is as follows:

the invention relates to a high heat flow density heat dissipation material for 5G signal transmission, which comprises 38% of fused quartz, 22% of graphite, 10% of silica gel, 6% of aluminum oxide, 5% of magnesium oxide, 5% of boron nitride, 3% of plasticizer, 6% of polyaluminium chloride and 5% of adhesive by mass percentage, wherein the fused quartz, graphite, silica gel, aluminum oxide, magnesium oxide, boron nitride and the polyaluminium chloride are respectively crushed and ground to obtain silicon micro powder, graphite powder, silica gel powder, aluminum oxide powder, magnesium oxide powder, boron nitride powder and polyaluminium chloride powder, the silicon micro powder, the graphite powder, the silica gel powder, the aluminum oxide powder, the magnesium oxide powder, the boron nitride powder and the polyaluminium chloride powder are sieved and mixed to form a base material, the adhesive is doped in the process of tamping and mixing, the plasticizer is added into the base material and is heated and mixed to obtain a raw material, and (2) processing the raw materials by an injection molding machine to obtain a heat dissipation billet, and drying the heat dissipation billet in a drying oven to obtain the heat dissipation material.

Further, the silica powder, the graphite powder, the silica gel powder, the alumina powder, the magnesia powder, the boron nitride powder and the polyaluminium chloride powder are sieved to obtain powders with different fineness meshes, and the fineness meshes are respectively as follows: the silicon powder, the graphite powder, the silica gel powder, the alumina powder, the magnesia powder, the boron nitride powder and the polyaluminium chloride powder are sieved and filtered, so that the powder fineness is more uniform, and the manufacturing quality of the heat sink material is improved.

Further, the adhesive is at least one of a vinyl acetate resin adhesive and an acrylic resin adhesive.

Further, the plasticizer is a phthalate plasticizer.

Further, the plasticizer adds and homogenizes the temperature of heating in the base-material and is 160 ℃ for the raw materials is in complete molten state all the time, the plasticizer adds and homogenizes in the base-material and heats for a long time and be 0.7h, prevents to take place the flocculation caking phenomenon in the raw materials manufacture process.

Furthermore, the drying temperature of the heat dissipation embryo block for drying material through the drying oven is 110 ℃, the heat dissipation embryo block is prevented from being deformed easily due to overhigh temperature, the drying time of the heat dissipation embryo block for drying material through the drying oven is 0.2h, the heat dissipation embryo block is fully dried, and the production quality of the heat dissipation part material is improved.

Furthermore, the adhesive is divided into three equal parts in equal amount, the adhesive is mixed into the base material at intervals in the three processes of stirring and mixing before, during and after, and the adhesive is added in equal amount in three stages, so that the adhesive can be fully and uniformly mixed into the base material.

Example two:

the invention relates to a heat dissipation material with high heat flow density for 5G signal transmission, which comprises 43% of fused quartz, 18% of graphite, 9% of silica gel, 5% of alumina, 4% of magnesium oxide, 6% of boron nitride, 5% of plasticizer, 5% of polyaluminium chloride and 5% of adhesive by mass percentage, wherein the fused quartz, graphite, silica gel, alumina, magnesium oxide, boron nitride and the polyaluminium chloride are respectively crushed and ground to obtain silicon micro powder, graphite powder, silica gel powder, alumina powder, magnesia powder, boron nitride powder and polyaluminium chloride powder, the silicon micro powder, the graphite powder, the silica gel powder, the alumina powder, the magnesia powder, the boron nitride powder and the polyaluminium chloride powder are filtered and then are tamped and mixed to form a base material, the adhesive is doped at intervals in the tamping and mixing process, the plasticizer is added into the base material and is stirred, heated and mixed to obtain a raw material, and (2) processing the raw materials by an injection molding machine to obtain a heat dissipation billet, and drying the heat dissipation billet in a drying oven to obtain the heat dissipation material.

Further, the silica powder, the graphite powder, the silica gel powder, the alumina powder, the magnesia powder, the boron nitride powder and the polyaluminium chloride powder are sieved to obtain powders with different fineness meshes, and the fineness meshes are respectively as follows: the silicon powder, the graphite powder, the silica gel powder, the alumina powder, the magnesia powder, the boron nitride powder and the polyaluminium chloride powder are sieved and filtered, so that the powder fineness is more uniform, and the manufacturing quality of the heat sink material is improved.

Further, the adhesive is at least one of a vinyl acetate resin adhesive and an acrylic resin adhesive.

Further, the plasticizer is a phthalate plasticizer.

Further, the plasticizer is added into the base material, the temperature of stirring and heating is 160 ℃, so that the raw material is always in a complete molten state, and the time of stirring and heating the plasticizer in the base material is 0.7 h.

Furthermore, the drying temperature of the heat dissipation embryo block for drying the material through the drying oven is 110 ℃, the drying time of the heat dissipation embryo block for drying the material through the drying oven is 0.25h, the heat dissipation embryo block is fully dried, and the production quality of the heat dissipation part material is favorably improved.

Furthermore, the adhesive is divided into three equal parts in equal amount, and the adhesive is mixed into the base material at intervals in the process of three times of stirring and mixing, so that the adhesive can be fully and uniformly mixed into the base material.

Different effects with respect to embodiment one: the heat dissipation element material processed and manufactured in the second embodiment has a high hardness index, and the heat dissipation element material is hard in texture.

Example three:

the invention relates to a high heat flow density heat dissipation material for 5G signal transmission, which comprises 45% of fused quartz, 22% of graphite, 10% of silica gel, 5% of aluminum oxide, 4% of magnesium oxide, 6% of boron nitride, 3% of plasticizer, 6% of polyaluminium chloride and 4% of adhesive by mass percentage, wherein the fused quartz, graphite, silica gel, aluminum oxide, magnesium oxide, boron nitride and polyaluminium chloride are respectively crushed and ground to obtain silicon micro powder, graphite powder, silica gel powder, aluminum oxide powder, magnesium oxide powder, boron nitride powder and polyaluminium chloride powder, the silicon micro powder, graphite powder, silica gel powder, aluminum oxide powder, magnesium oxide powder, boron nitride powder and the polyaluminium chloride powder are sieved and mixed to obtain a base material, the adhesive is doped in the tamping mixing process at intervals, the plasticizer is added into the base material and is heated and mixed to obtain a raw material, and (2) processing the raw materials by an injection molding machine to obtain a heat dissipation billet, and drying the heat dissipation billet in a drying oven to obtain the heat dissipation material.

Further, the silica powder, the graphite powder, the silica gel powder, the alumina powder, the magnesia powder, the boron nitride powder and the polyaluminium chloride powder are sieved to obtain powders with different fineness meshes, and the fineness meshes are respectively as follows: the silicon powder, the graphite powder, the silica gel powder, the alumina powder, the magnesia powder, the boron nitride powder and the polyaluminium chloride powder are sieved and filtered, so that the powder fineness is more uniform, and the manufacturing quality of the heat sink material is improved.

Further, the adhesive is at least one of a vinyl acetate resin adhesive and an acrylic resin adhesive.

Further, the plasticizer is a phthalate plasticizer.

Further, the plasticizer adds and homogenizes the temperature of heating in the base-material and be 180 ℃ for the raw materials is in complete molten state all the time, the plasticizer adds and homogenizes in the base-material and heats for a long time and be 0.7h, prevents to take place the flocculation caking phenomenon in the raw materials manufacture process.

Further, the drying temperature of the heat dissipation embryo block for drying material through the drying oven is 125 ℃, and the drying time of the heat dissipation embryo block for drying material through the drying oven is 0.25 h.

Furthermore, the adhesive is divided into three equal parts in equal amount, and the adhesive is mixed into the base material at intervals in the process of stirring and mixing before, during and after three times.

Different effects with respect to the first and second embodiments: the heat dissipation piece material processed and manufactured in the third embodiment has higher hardness index, stronger corrosion resistance and higher heat transfer coefficient.

In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.