阅读说明：本技术 一种高散热保护膜及其应用 (High-heat-dissipation protective film and application thereof ) 是由 刘河洲 于 2021-09-18 设计创作，主要内容包括：本发明公开了一种高散热保护膜,其特征在于,包括：PI膜层,所述PI膜层的表面涂覆有散热胶层,在所述散热胶层表面涂布环氧胶层后贴合离型纸；所述散热胶层按重量百分比计算,包括如下组分：主体树脂20-50％；橡胶20-30％；导电散热材料10-40％；固化剂5-15％；所述主体树脂为环氧、丙烯酸或饱和聚酯树脂中的任意一种或多种；所述橡胶为端羧基丁晴橡胶；所述导电散热材料为人工石墨粉或天然石墨粉中的任意一种或多种；所述固化剂为氨类固化剂。(The invention discloses a high heat dissipation protective film, which is characterized by comprising the following components: the surface of the PI film layer is coated with a heat dissipation adhesive layer, and the surface of the heat dissipation adhesive layer is coated with an epoxy adhesive layer and then is attached to release paper; the heat dissipation glue layer comprises the following components in percentage by weight: 20-50% of main body resin; 20-30% of rubber; 10-40% of conductive heat dissipation material; 5-15% of a curing agent; the main resin is any one or more of epoxy resin, acrylic resin or saturated polyester resin; the rubber is carboxyl-terminated butadiene-acrylonitrile rubber; the conductive heat dissipation material is any one or more of artificial graphite powder or natural graphite powder; the curing agent is an ammonia curing agent.)

1. A high heat dissipation protection film, comprising:

the surface of the PI film layer is coated with a heat dissipation adhesive layer, and the surface of the heat dissipation adhesive layer is coated with an epoxy adhesive layer and then is attached to release paper;

the heat dissipation glue layer comprises the following components in percentage by weight:

20-50% of main body resin;

20-30% of rubber;

10-40% of conductive heat dissipation material;

5-15% of a curing agent;

the main resin is any one or more of epoxy resin, acrylic resin or saturated polyester resin;

the rubber is carboxyl-terminated butadiene-acrylonitrile rubber;

the conductive heat dissipation material is any one or more of artificial graphite powder or natural graphite powder;

the curing agent is an ammonia curing agent.

2. The high-heat-dissipation protective film according to claim 1, wherein the ammonia curing agent is 3, 3 diaminodiphenyl sulfone, 3, 4 diaminodiphenyl sulfone, or 4, 4 diaminodiphenyl sulfone.

3. The high-heat-dissipation protective film according to claim 1, wherein the specific preparation method of the high-heat-dissipation protective film comprises:

coating the heat dissipation glue on the PI film, drying the PI film in an oven, wherein the thickness of the dry glue is 2-5 microns, preferably 3 microns, baking the coated PI film in an oven at a medium temperature for 72 hours to test the heat conduction, chemical resistance, adhesive force and the like of the PI film, coating the epoxy glue at the half cost of baking and curing, attaching release paper, controlling a certain glue flow rate, and preparing the high heat dissipation protective film for the circuit board.

4. The use of a high thermal dissipation protective film according to any one of claims 1-3, wherein the use is for preparing 5G materials.

Technical Field

The invention relates to the field of 5G material preparation, and particularly relates to a high-heat-dissipation protective film and application thereof.

Background

With the continuous demand of 5G materials, the heat dissipation requirement of circuit board materials is higher and higher, the heat conductivity of common circuits is low and is generally only 0.8-1.0, which is insufficient for meeting the requirements of subsequent 5G materials.

Disclosure of Invention

In order to overcome the above-mentioned defects of the prior art, the present invention aims to provide a high heat dissipation protective film and applications thereof.

In order to realize the purpose of the invention, the adopted technical scheme is as follows:

a high heat dissipation protective film comprising:

the surface of the PI film layer is coated with a heat dissipation adhesive layer, and the surface of the heat dissipation adhesive layer is coated with an epoxy adhesive layer and then is attached to release paper;

the heat dissipation glue layer comprises the following components in percentage by weight:

20-50% of main body resin;

20-30% of rubber;

10-40% of conductive heat dissipation material;

5-15% of a curing agent;

the main resin is any one or more of epoxy resin, acrylic resin or saturated polyester resin;

the rubber is carboxyl-terminated butadiene-acrylonitrile rubber;

the conductive heat dissipation material is any one or more of artificial graphite powder or natural graphite powder;

the curing agent is an ammonia curing agent.

The ammonia curing agent is 3, 3 diamino diphenyl sulfone, 3, 4 diamino diphenyl sulfone and 4, 4 diamino diphenyl sulfone.

The specific preparation method of the high-heat-dissipation protective film comprises the following steps:

coating the heat dissipation glue on the PI film, drying the PI film in an oven, wherein the thickness of the dry glue is 2-5 microns, preferably 3 microns, baking the coated PI film in an oven at a medium temperature for 72 hours to test the heat conduction, chemical resistance, adhesive force and the like of the PI film, coating the epoxy glue at the half cost of baking and curing, attaching release paper, controlling a certain glue flow rate, and preparing the high heat dissipation protective film for the circuit board.

The application of the high-heat-dissipation protective film is to prepare a 5G material.

The invention has the beneficial effects that:

the high heat dissipation protective film can meet the heat dissipation requirement of circuit board materials, the heat conductivity can reach 2.2-2.5, and the circuit board process is not increased.

Detailed Description

The invention is illustrated below with reference to specific examples:

firstly, the adhesive is prepared as shown in the following table 1:

TABLE 1

1. The components are added according to the proportion of the adhesive, a certain amount of solvent of 50-55 is added, the mixture is stirred for 4.0 hours, and the heat dissipation adhesive is prepared to be coated.

2. The heat dissipation glue is coated on the PI film, a product with the thickness of 3 microns is coated, and the heat conduction glue film is prepared by volatilizing the solvent at the maximum temperature of 160 ℃ in an oven.

3. The adhesive of graphene powder is coated on one surface of the PI film, the graphite adhesive layer starts a heat dissipation effect, the high heat dissipation effect is started for high heat accompanying 5G high-speed communication, normal use of a circuit is guaranteed, and meanwhile the service life of the circuit board is prolonged.

4. The results were measured, and the results and criteria of the measurements were as follows.

Example 1: the heat dissipation glue is coated on the PI film, a product with the thickness of 1 micron is coated, and the heat conduction glue film is prepared by volatilizing the solvent at the maximum temperature of 160 ℃ in an oven.

Example 2: the heat dissipation glue is coated on the PI film, a product with the thickness of 3 microns is coated, and the heat conduction glue film is prepared by volatilizing the solvent at the maximum temperature of 180 ℃ in an oven.

The results are shown in table 2 below:

TABLE 2