High-temperature pipeline wall thickness monitoring device, system and method

文档序号:187650 发布日期:2021-11-02 浏览:29次 中文

阅读说明:本技术 一种高温管道壁厚监测装置、系统及方法 (High-temperature pipeline wall thickness monitoring device, system and method ) 是由 黄兴友 陈敬一 于 2021-09-29 设计创作,主要内容包括:本发明涉及一种高温管道壁厚监测装置、系统及方法,属于管道壁厚监测技术领域,包括温度控制装置、高压控制装置、电磁干扰控制装置、超声波测厚装置、电极矩阵测厚装置、中央控制装置、测量结果输出装置等。本发明中,在异径管成型后,先通过温度控制装置、高压控制装置、电磁干扰控制装置提供异径管应用场景所需的温度、高压、电磁干扰环境,然后再启动超声波测厚装置、电极矩阵测厚装置进行壁厚测试,若二者的壁厚测试结果相同,则说明本方案的持续性监测设备能够适应该异径管的使用环境,若二者的壁厚测试结果不同,则说明本方案的持续性监测设备不能够适应该异径管的使用环境,相关的监测工作人员应当对检测设备进行调整。(The invention relates to a device, a system and a method for monitoring the wall thickness of a high-temperature pipeline, belonging to the technical field of pipeline wall thickness monitoring and comprising a temperature control device, a high-pressure control device, an electromagnetic interference control device, an ultrasonic thickness measuring device, an electrode matrix thickness measuring device, a central control device, a measuring result output device and the like. In the invention, after the reducing pipe is formed, the temperature control device, the high-voltage control device and the electromagnetic interference control device are used for providing the temperature, high-voltage and electromagnetic interference environment required by the application scene of the reducing pipe, then the ultrasonic thickness measuring device and the electrode matrix thickness measuring device are started for wall thickness test, if the wall thickness test results of the temperature control device, the high-voltage and electromagnetic interference environment and the electromagnetic interference control device are the same, the continuity monitoring equipment can adapt to the use environment of the reducing pipe, if the wall thickness test results of the temperature control device, the high-voltage and electromagnetic interference environment and the electrode matrix thickness measuring device are different, the continuity monitoring equipment can not adapt to the use environment of the reducing pipe, and related monitoring workers can adjust the detection equipment.)

1. A high-temperature pipeline wall thickness monitoring device is characterized by comprising a temperature control device, a high-pressure control device, an electromagnetic interference control device, an ultrasonic thickness measuring device, an electrode matrix thickness measuring device, a central control device and a measuring result output device; the central control device is respectively connected with the temperature control device, the high-voltage control device, the electromagnetic interference control device, the ultrasonic thickness measuring device, the electrode matrix thickness measuring device and the measuring result output device;

the temperature control device is used for providing a temperature environment required by an application scene of the pipeline to be tested;

the high-pressure control device is used for providing a high-pressure environment required by an application scene of the pipeline to be tested;

the electromagnetic interference control device is used for providing an electromagnetic interference environment required by an application scene of the pipeline to be tested;

the ultrasonic thickness measuring device is used for detecting the wall thickness of the pipeline to be measured through ultrasonic waves;

the electrode matrix thickness measuring device is used for detecting the wall thickness of the pipeline to be measured through the electrode matrix;

the measurement result output device is used for outputting the wall thickness measurement result of the pipeline to be measured;

the central control device starts the temperature control device, the high-voltage control device and the electromagnetic interference control device; when the temperature environment, the high-pressure environment and the electromagnetic interference environment required by the application scene of the pipeline to be measured all reach the standard, the central control device starts the ultrasonic thickness measuring device again; after the ultrasonic thickness measuring device finishes measuring, first wall thickness measuring data are generated, and the central control device starts the electrode matrix thickness measuring device again; generating second wall thickness measurement data after the electrode matrix thickness measuring device finishes measurement; if the first wall thickness measurement data is the same as the second wall thickness measurement data, the central control device starts the measurement result output device, the measurement result output device outputs the first wall thickness measurement data or the second wall thickness measurement data as a measurement result, and otherwise, the central control device judges that the wall thickness detection of the pipeline to be detected is abnormal.

2. The high-temperature pipeline wall thickness monitoring device as claimed in claim 1, wherein the temperature control device comprises a temperature sensor, a first processor, a first data storage, a temperature regulator;

the first processor is respectively connected with the temperature sensor, the first data memory, the temperature regulator and the central control device;

the temperature sensor is used for detecting the actual environment temperature information of the application scene of the pipeline to be detected;

the first data memory is used for storing threshold value environment temperature information required by the application scene of the pipeline to be tested;

the temperature adjuster is configured to adjust the actual ambient temperature information to match the threshold ambient temperature information.

3. The high-temperature pipeline wall thickness monitoring device as claimed in claim 2, wherein the temperature control device further comprises a temperature regulator moving device, and the temperature regulator moving device is connected with the first processor;

the temperature regulator moving device is used for enabling the temperature regulator to do reciprocating motion regularly at a uniform speed along the radial direction of the pipeline to be measured.

4. The high-temperature pipeline wall thickness monitoring device as claimed in claim 1, further comprising an abnormality alarm device, wherein the abnormality alarm device is connected with the central control device;

and when the first wall thickness measurement data is different from the second wall thickness measurement data, starting the abnormity alarm device to alarm for measurement abnormity.

5. The high-temperature pipeline wall thickness monitoring device as claimed in claim 1, wherein the electromagnetic interference control device comprises an electromagnetic field detector, a second processor, a second data storage device, an electromagnetic field regulator;

the second processor is respectively connected with the electromagnetic field detector, the second data memory, the electromagnetic field regulator and the central control device;

the electromagnetic field detector is used for detecting actual environment electromagnetic field information of an application scene of the pipeline to be detected;

the second data memory is used for storing threshold environmental electromagnetic field information required by the application scene of the pipeline to be tested;

the electromagnetic field adjuster is to adjust the actual ambient electromagnetic field information to match the threshold ambient electromagnetic field information.

6. The high-temperature pipeline wall thickness monitoring device as claimed in claim 5, wherein the electromagnetic field regulators are symmetrically arranged on two sides of the pipeline to be tested.

7. The high-temperature pipeline wall thickness monitoring device according to claim 1, wherein the electrode matrix thickness measuring device is tested as follows:

the fingerprint coefficient of the wall thickness condition of the pipeline to be measured monitored by the pair of measuring electrodes is as follows:

(1)

in the formula:Vi(t 0 )Vi(t x )as a pair of electrodesiIn thatt 0 Andt x voltage at time;Vref(t 0 )Vref(t x )for reference electrode int 0 Andt x voltage at time;

the formula for calculating the current wall thickness is:

(2)

in the formula (I), the compound is shown in the specification,WT t0 is composed oft 0 The wall thickness at the moment of time,WT tx is composed oft x Wall thickness at the moment.

8. A high-temperature pipeline wall thickness monitoring system, which is characterized by comprising the high-temperature pipeline wall thickness monitoring device as claimed in any one of claims 1 to 7, further comprising a communication device and a monitoring terminal, wherein the central control device performs data interaction with the monitoring terminal through the communication device.

9. A method for monitoring the wall thickness of a high-temperature pipeline, which is characterized by adopting the device for monitoring the wall thickness of the high-temperature pipeline as claimed in any one of claims 1 to 7.

Technical Field

The invention belongs to the technical field of pipeline wall thickness monitoring, and particularly relates to a device, a system and a method for monitoring the wall thickness of a high-temperature pipeline.

Background

Nuclear energy is widely used internationally as a clean energy source. Sustainable development of nuclear fission energy relies on the full utilization of uranium resources and minimization of nuclear waste. At present, the utilization rate of uranium resources of a thermal reactor nuclear power station operating in the world is less than 1%, U235 capable of being directly used for generating fission nuclear energy is found out that the reserves are not enough for 200 years of use of the nuclear reactor in the world, the proportion of U235 in natural uranium is less than 1%, the proportion of U238 in natural uranium is 99.3%, and U238 itself cannot be directly used for power generation, so that the U238 in the existing pressurized water reactor can only be treated by nuclear waste, and a fast breeder reactor can solve the problem, and can change the U238 with radioactivity from the nuclear waste into nuclear fuel, so that the utilization rate of uranium ore resources is improved from 1% to more than 70%. The problems of uranium ore resource exhaustion, low utilization rate of nuclear materials, difficult treatment of nuclear waste and the like are solved at one step.

The sodium-cooled fast reactor is one of the first-choice reactors of the fourth-generation advanced nuclear energy system, and the development of the sodium-cooled fast reactor has great strategic significance for forming a nuclear fuel closed cycle system, fully utilizing uranium resources, realizing the minimization of nuclear waste and ensuring the sustainable development of nuclear fission energy.

The reducing pipes are used in a large number of pipeline pipe fittings of the sodium-cooled fast reactor, and compared with petroleum and petrochemical pipeline fittings, the reducing pipes for the fast reactor have better required performance and higher forming precision. The reducing pipe is also called reducer, and is one of pipe fittings for connecting two kinds of pipes with different diameters. And is divided into a concentric reducer and an eccentric reducer. The traditional forming process (as shown in fig. 6) of the reducing pipe is to press the pipe section downwards, and the forming of the reducing pipe is controlled by an outer die of the reducing pipe. The external diameter specification of the pipe section is selected to be consistent with the specification of a large head of the reducing pipe to be formed, the wall thickness is also consistent, if the grade difference between the large head and the small head is large, the extension performance of the material is considered, in order to prevent the pipe section from cracking or tearing caused by excessive deformation in the forming process, so that the forming failure is caused, reducing pipe dies with different specification grades are used for pressing for multiple times, and the product is finally formed. The material pipe section for the traditional forming process has large caliber specification, unstable forming and lower precision after forming. And for thin-wall products, because the strength of the pipe section is not enough, the pipe section is directly pressed, the damage rate is extremely high, and the forming qualification rate is low.

After the reducing pipe is formed, only one rough detection is carried out on the reducing pipe at the present stage, and the reducing pipe is put into use when the detection result meets the requirement; however, continuous monitoring of the reducer during use and whether the relevant continuous monitoring equipment is adapted to the use environment (high temperature, high pressure, electromagnetic interference) of the reducer are ignored.

Therefore, at present, a device, a system and a method for monitoring the wall thickness of a high-temperature pipeline are needed to solve the above problems.

Disclosure of Invention

The invention aims to provide a high-temperature pipeline wall thickness monitoring device, which is used for solving the technical problems in the prior art, such as: after the reducing pipe is formed, only one rough detection is carried out on the reducing pipe at the present stage, and the reducing pipe is put into use when the detection result meets the requirement; however, continuous monitoring of the reducer during use and whether the relevant continuous monitoring equipment is adapted to the use environment (high temperature, high pressure, electromagnetic interference) of the reducer are ignored.

In order to achieve the purpose, the technical scheme of the invention is as follows:

a high-temperature pipeline wall thickness monitoring device comprises a temperature control device, a high-pressure control device, an electromagnetic interference control device, an ultrasonic thickness measuring device, an electrode matrix thickness measuring device, a central control device and a measuring result output device; the central control device is respectively connected with the temperature control device, the high-voltage control device, the electromagnetic interference control device, the ultrasonic thickness measuring device, the electrode matrix thickness measuring device and the measuring result output device;

the temperature control device is used for providing a temperature environment required by an application scene of the pipeline to be tested;

the high-pressure control device is used for providing a high-pressure environment required by an application scene of the pipeline to be tested;

the electromagnetic interference control device is used for providing an electromagnetic interference environment required by an application scene of the pipeline to be tested;

the ultrasonic thickness measuring device is used for detecting the wall thickness of the pipeline to be measured through ultrasonic waves;

the electrode matrix thickness measuring device is used for detecting the wall thickness of the pipeline to be measured through the electrode matrix;

the measurement result output device is used for outputting the wall thickness measurement result of the pipeline to be measured;

the central control device starts the temperature control device, the high-voltage control device and the electromagnetic interference control device; when the temperature environment, the high-pressure environment and the electromagnetic interference environment required by the application scene of the pipeline to be measured all reach the standard, the central control device starts the ultrasonic thickness measuring device again; after the ultrasonic thickness measuring device finishes measuring, first wall thickness measuring data are generated, and the central control device starts the electrode matrix thickness measuring device again; generating second wall thickness measurement data after the electrode matrix thickness measuring device finishes measurement; if the first wall thickness measurement data is the same as the second wall thickness measurement data, the central control device starts the measurement result output device, the measurement result output device outputs the first wall thickness measurement data or the second wall thickness measurement data as a measurement result, and otherwise, the central control device judges that the wall thickness detection of the pipeline to be detected is abnormal.

Further, the temperature control device comprises a temperature sensor, a first processor, a first data memory and a temperature regulator;

the first processor is respectively connected with the temperature sensor, the first data memory, the temperature regulator and the central control device;

the temperature sensor is used for detecting the actual environment temperature information of the application scene of the pipeline to be detected;

the first data memory is used for storing threshold value environment temperature information required by the application scene of the pipeline to be tested;

the temperature adjuster is configured to adjust the actual ambient temperature information to match the threshold ambient temperature information.

Further, the temperature control device further comprises a temperature regulator moving device, and the temperature regulator moving device is connected with the first processor;

the temperature regulator moving device is used for enabling the temperature regulator to do reciprocating motion regularly at a uniform speed along the radial direction of the pipeline to be measured.

Further, the system also comprises an abnormity alarm device, wherein the abnormity alarm device is connected with the central control device;

and when the first wall thickness measurement data is different from the second wall thickness measurement data, starting the abnormity alarm device to alarm for measurement abnormity.

Further, the electromagnetic interference control device comprises an electromagnetic field detector, a second processor, a second data memory and an electromagnetic field regulator;

the second processor is respectively connected with the electromagnetic field detector, the second data memory, the electromagnetic field regulator and the central control device;

the electromagnetic field detector is used for detecting actual environment electromagnetic field information of an application scene of the pipeline to be detected;

the second data memory is used for storing threshold environmental electromagnetic field information required by the application scene of the pipeline to be tested;

the electromagnetic field adjuster is to adjust the actual ambient electromagnetic field information to match the threshold ambient electromagnetic field information.

Furthermore, the electromagnetic field regulators are symmetrically arranged on two sides of the pipeline to be tested.

Further, the electrode matrix thickness measuring device is tested as follows:

the fingerprint coefficient of the wall thickness condition of the pipeline to be measured monitored by the pair of measuring electrodes is as follows:

(1)

in the formula:Vi(t 0 )Vi(t x )as a pair of electrodesiIn thatt 0 Andt x voltage at time;Vref(t 0 )Vref(t x )for reference electrode int 0 Andt x voltage at time;

the formula for calculating the current wall thickness is:

(2)

in the formula (I), the compound is shown in the specification,WT t0 is composed oft 0 The wall thickness at the moment of time,WT tx is composed oft x Wall thickness at the moment.

The high-temperature pipeline wall thickness monitoring system comprises the high-temperature pipeline wall thickness monitoring device, a communication device and a monitoring terminal, wherein the central control device carries out data interaction with the monitoring terminal through the communication device.

The method adopts the high-temperature pipeline wall thickness monitoring device to monitor the wall thickness of the high-temperature pipeline.

Compared with the prior art, the invention has the beneficial effects that:

the practical innovation point of the scheme of the application lies in that after the reducing pipe is formed, the temperature control device is firstly passed through, the high-voltage control device, the electromagnetic interference control device provides the temperature required by the application scene of the reducing pipe, high voltage and an electromagnetic interference environment, then the ultrasonic thickness measuring device is started, the electrode matrix thickness measuring device carries out wall thickness test, if the wall thickness test results of the two are the same, the continuity monitoring equipment of the scheme can adapt to the use environment of the reducing pipe, if the wall thickness test results of the two are different, the continuity monitoring equipment of the scheme can not adapt to the use environment of the reducing pipe, and related monitoring workers can adjust the detection equipment.

Drawings

Fig. 1 is a schematic diagram of an overall circuit structure according to an embodiment of the present application.

Fig. 2 is a schematic circuit diagram of a temperature control device according to an embodiment of the present disclosure.

Fig. 3 is a schematic circuit diagram of an electromagnetic interference control apparatus according to an embodiment of the present application.

Fig. 4 is a diagram of a test process of the electrode matrix thickness measuring apparatus according to the embodiment of the present application.

Fig. 5 is a schematic diagram of a testing process of the electrode matrix thickness measuring device according to the embodiment of the application.

Fig. 6 is a schematic view illustrating a conventional reducing pipe forming process according to an embodiment of the present application.

Fig. 7 is a schematic view of the reducer according to the embodiment of the present disclosure before forming.

Fig. 8 is a schematic diagram of a formed reducing pipe according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to fig. 1 to 8 of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example (b):

as shown in fig. 1, a high-temperature pipeline wall thickness monitoring device is provided, which comprises a temperature control device, a high-pressure control device, an electromagnetic interference control device, an ultrasonic thickness measuring device, an electrode matrix thickness measuring device, a central control device and a measurement result output device; the central control device is respectively connected with the temperature control device, the high-voltage control device, the electromagnetic interference control device, the ultrasonic thickness measuring device, the electrode matrix thickness measuring device and the measuring result output device;

the temperature control device is used for providing a temperature environment required by an application scene of the pipeline to be tested;

the high-pressure control device is used for providing a high-pressure environment required by an application scene of the pipeline to be tested;

the electromagnetic interference control device is used for providing an electromagnetic interference environment required by an application scene of the pipeline to be tested;

the ultrasonic thickness measuring device is used for detecting the wall thickness of the pipeline to be measured through ultrasonic waves;

the electrode matrix thickness measuring device is used for detecting the wall thickness of the pipeline to be measured through the electrode matrix;

the measurement result output device is used for outputting the wall thickness measurement result of the pipeline to be measured;

the central control device starts the temperature control device, the high-voltage control device and the electromagnetic interference control device; when the temperature environment, the high-pressure environment and the electromagnetic interference environment required by the application scene of the pipeline to be measured all reach the standard, the central control device starts the ultrasonic thickness measuring device again; after the ultrasonic thickness measuring device finishes measuring, first wall thickness measuring data are generated, and the central control device starts the electrode matrix thickness measuring device again; generating second wall thickness measurement data after the electrode matrix thickness measuring device finishes measurement; if the first wall thickness measurement data is the same as the second wall thickness measurement data, the central control device starts the measurement result output device, the measurement result output device outputs the first wall thickness measurement data or the second wall thickness measurement data as a measurement result, and otherwise, the central control device judges that the wall thickness detection of the pipeline to be detected is abnormal.

In the scheme, after the reducing pipe is formed, the reducing pipe is only roughly detected once in the prior art, and the reducing pipe is put into use when the detection result meets the requirement; however, continuous monitoring of the reducer during use and whether the relevant continuous monitoring equipment is adapted to the use environment of the reducer (especially high temperature, high pressure and electromagnetic interference) are ignored. Therefore, this scheme is after the reducing pipe shaping, earlier through temperature control device, high pressure control device, electromagnetic interference control device provides the required temperature of reducing pipe application scene, high pressure, the electromagnetic interference environment, then start ultrasonic thickness measurement device, electrode matrix thickness measurement device carries out the wall thickness test, if the wall thickness test result of the two is the same, then the service environment that the continuation monitoring facilities of this scheme can adapt to the reducing pipe can be illustrated, if the wall thickness test result of the two is different, then the service environment that the continuation monitoring facilities of this scheme can not adapt to the reducing pipe can be illustrated to the continuation monitoring facilities of this scheme, relevant monitoring staff should adjust check out test set.

As shown in fig. 2, further, the temperature control device includes a temperature sensor, a first processor, a first data storage, and a temperature regulator;

the first processor is respectively connected with the temperature sensor, the first data memory, the temperature regulator and the central control device;

the temperature sensor is used for detecting the actual environment temperature information of the application scene of the pipeline to be detected;

the first data memory is used for storing threshold value environment temperature information required by the application scene of the pipeline to be tested;

the temperature adjuster is configured to adjust the actual ambient temperature information to match the threshold ambient temperature information.

The temperature control device further comprises a temperature regulator moving device, and the temperature regulator moving device is connected with the first processor;

the temperature regulator moving device is used for enabling the temperature regulator to do reciprocating motion regularly at a uniform speed along the radial direction of the pipeline to be measured.

In the above scheme, the temperature environment required by the application scene of the reducer can be uniformly adjusted through the matching among the temperature regulator moving device, the temperature sensor and the temperature regulator, and the condition that the local environment temperature is adjusted and is not completed can be avoided, so that the test result is influenced.

Further, the system also comprises an abnormity alarm device, wherein the abnormity alarm device is connected with the central control device;

and when the first wall thickness measurement data is different from the second wall thickness measurement data, starting the abnormity alarm device to alarm for measurement abnormity.

In the scheme, the measurement abnormity is warned through the abnormity warning device, and relevant measurement workers can perform corresponding adjustment at the first time.

As shown in fig. 3, further, the electromagnetic interference control apparatus includes an electromagnetic field detector, a second processor, a second data storage, and an electromagnetic field regulator;

the second processor is respectively connected with the electromagnetic field detector, the second data memory, the electromagnetic field regulator and the central control device;

the electromagnetic field detector is used for detecting actual environment electromagnetic field information of an application scene of the pipeline to be detected;

the second data memory is used for storing threshold environmental electromagnetic field information required by the application scene of the pipeline to be tested;

the electromagnetic field adjuster is to adjust the actual ambient electromagnetic field information to match the threshold ambient electromagnetic field information.

The electromagnetic field regulators are symmetrically arranged on two sides of the pipeline to be tested.

In the scheme, the electromagnetic interference environment required by the application scene of the reducer can be uniformly adjusted, and the condition that the electromagnetic interference of the local environment is adjusted and the electromagnetic interference of the local environment is not adjusted is avoided, so that the test result is influenced.

As shown in fig. 4 and 5, further, the electrode matrix thickness measuring device is tested as follows:

the fingerprint coefficient of the wall thickness condition of the pipeline to be measured monitored by the pair of measuring electrodes is as follows:

(1)

in the formula:Vi(t 0 )Vi(t x )as a pair of electrodesiIn thatt 0 Andt x voltage at time;Vref(t 0 )Vref(t x )for reference electrode int 0 Andt x voltage at time;

the formula for calculating the current wall thickness is:

(2)

in the formula (I), the compound is shown in the specification,WT t0 is composed oft 0 The wall thickness at the moment of time,WT tx is composed oft x Wall thickness at the moment.

The high-temperature pipeline wall thickness monitoring system comprises the high-temperature pipeline wall thickness monitoring device, a communication device and a monitoring terminal, wherein the central control device carries out data interaction with the monitoring terminal through the communication device.

The method adopts the high-temperature pipeline wall thickness monitoring device to monitor the wall thickness of the high-temperature pipeline.

The improved thin-wall reducing pipe one-step forming die comprises a reducing pipe inner die 1, a matched reducing pipe outer die 3 and a demoulding circular plate 5 which is connected to the reducing pipe inner die 1 through threads, a pipe section 2 with a proper specification is selected according to the product specification of the reducing pipe, the reducing pipe inner die 1 is matched with the reducing pipe outer die 3, and the pipe section 2 is arranged between the reducing pipe inner die 1 and the reducing pipe outer die 3; the reducing pipe inner mold 1 is pressed downwards, the pipe section 2 deforms along with the reducing pipe inner mold 1 until the reducing pipe inner mold 1 is pressed in place, the pipe section 2 is formed into a reducing pipe, the reducing pipe inner mold 1 moves upwards, the demolding circular plate 5 drives the reducing pipe to demold, the demolding circular plate 5 is taken down, and the reducing pipe can be taken down from the reducing pipe inner mold 1. The large end of the inner die 1 of the reducing pipe is provided with an anti-press-in ring 4, and the outer diameter of the anti-press-in ring 4 is larger than the caliber of the large end of the outer die 3 of the reducing pipe. The length of the inner reducing pipe mould 1 is greater than the height of the outer reducing pipe mould 3, wherein the length of the small-diameter end of the inner reducing pipe mould 1 is greater than the height of the small-diameter end of the outer reducing pipe mould 3, so that the small-diameter end of the inner reducing pipe mould 1 penetrates through the outer reducing pipe mould 3 and shapes the pipe section 2.

When forming a concentric reducing pipe with phi 356 multiplied by 5-phi 219 multiplied by 5 mm; the large head specification and the small head specification differ by 2 steps.

Designing and manufacturing a mould according to the specification of the reducing pipe 2 to be formed; the pipe section with the diameter of 273 multiplied by 7mm is selected. The outer die 3 of the reducing pipe is placed in position, the pipe section is placed on the outer die 3, the inner die 2 is placed on the pipe section 2, as shown in fig. 7, the press is started to press the pipe section 2 downwards, the inner die 1 drives the pipe section 2 downwards to deform, the inner die 1 is pressed in position, and the pipe section is formed into the reducing pipe, as shown in fig. 8.

If the product is molded according to the traditional process, the pipe section with the caliber of 356mm and the wall thickness of at least 12mm needs to be selected for molding in consideration of the strength of the product, and the thick wall part is machined and molded after molding.

As shown in fig. 7, the present invention adds a reducing pipe inner mold 1 to a conventional reducing pipe forming mold, and selects a pipe section of a specification between a large-end specification and a small-end specification of the reducing pipe for forming. Comparing the two molding processes, a 50% raw material savings can be achieved from material cost alone.

When the concentric reducing pipe with the diameter of 168 multiplied by 3-73 multiplied by 3mm is formed, the difference between the large-head specification and the small-head specification is about 4 steps.

Designing and manufacturing a mould according to the specification of the reducing pipe 2 to be formed; the pipe sections with the diameter of 102 multiplied by 5mm are selected. The outer die 3 of the reducing pipe is placed in position, the pipe section is placed on the outer die 3, the inner die 2 is placed on the pipe section 2, as shown in fig. 7, the press is started to press the pipe section 2 downwards, the inner die 1 drives the pipe section 2 downwards to deform, the inner die 1 is pressed in position, and the pipe section is formed into the reducing pipe, as shown in fig. 8.

If the product is molded according to the traditional process, the pipe section with the caliber of 168mm and the wall thickness of at least 8mm needs to be selected for molding in consideration of the strength of the product, and the thick wall part is machined and molded after molding. Comparing the two molding processes, 60% of the raw material can be saved from the material cost only.

The outer die and the inner die are matched and pressed together for molding. In the forming process, the lower section of the pipe section is subjected to shrinkage deformation, and the upper section of the pipe section is subjected to expansion deformation. The pressing number can be reduced, so that the material cost and the labor cost are reduced, the deformation of the pipe section is reduced more critically, the product performance is improved compared with the traditional reducing pipe forming process, and the size precision is higher after forming.

The inner die 1 of the reducing pipe is added on the traditional forming die of the reducing pipe. The conventional process for forming the reducing pipe is to press the pipe section 2 downwards and form the reducing pipe through an external mould 3 of the reducing pipe, as shown in fig. 6. For thin-walled pipe sections, the strength of the pipe sections is not sufficient, and the pipe sections may be damaged when directly pressed, thereby causing molding failures. And the reducing pipe inner die 1 is added, in the forming process, the reducing pipe inner die 1 is pressed downwards to drive the pipe section 2 to be formed, the forming precision is high, and the forming qualified rate is high.

The wall thickness monitoring device for the high-temperature pipeline is used for monitoring the wall thickness of the reducing pipe formed by the one-step forming die of the reducing pipe.

The above are preferred embodiments of the present invention, and all changes made according to the technical scheme of the present invention that produce functional effects do not exceed the scope of the technical scheme of the present invention belong to the protection scope of the present invention.

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