阅读说明：本技术 一种发声层张紧工艺 (Sound production layer tensioning process ) 是由 匡正 毛峻伟 胡亚云 于 2021-08-30 设计创作，主要内容包括：本发明公开了一种发声层张紧工艺,包括：在非发声层背板上设置框贴区,将发声层与非发声层背板通过框贴区进行边框贴合；将发声层在一定的定型温度和定型时间下进行定型,使发声层定型后张紧,定型温度范围为50℃～200℃,定型时间范围为5min～180min。本发明可以对发声层实现收缩定型,使发声层在工作过程中不易产生蠕变,从而不影响相关定向超声产品的超声声学特性。(The invention discloses a sound production layer tensioning process, which comprises the following steps: arranging a frame pasting area on the non-sounding layer backboard, and carrying out frame pasting on the sounding layer and the non-sounding layer backboard through the frame pasting area; and (3) shaping the sounding layer at a certain shaping temperature and for a certain shaping time, so that the sounding layer is tensioned after being shaped, wherein the shaping temperature range is 50-200 ℃, and the shaping time range is 5-180 min. The invention can realize the shrinkage and the shaping of the sounding layer, so that the sounding layer is not easy to creep in the working process, thereby not influencing the ultrasonic acoustic characteristics of related directional ultrasonic products.)

1. A sound generation layer tensioning process, the process comprising:

s1, arranging a frame pasting area on the non-sounding layer backboard, and carrying out frame pasting on the sounding layer and the non-sounding layer backboard through the frame pasting area;

s2, shaping the sounding layer at a certain shaping temperature and for a certain shaping time, and tensioning the sounding layer after shaping, wherein the shaping temperature range is 50-200 ℃, and the shaping time range is 5-180 min.

2. The process of claim 1, wherein the sounding layer is made of polymer or composite material or flexible glass, and the polymer or composite material comprises any one of TAC (cellulose triacetate), PET (polyethylene terephthalate), COP (COP), PI (polyimide), PVDF (polyvinylidene fluoride).

3. The process of claim 1, wherein the frame attachment region comprises a setting region, or a setting region and a positioning region, the setting region and the positioning region are both arranged along the outer edge of the non-sound layer back plate in a circle, and the setting region is located outside the positioning region.

4. A sound-generating layer tensioning process according to claim 3, wherein the fixing region is made of a first fixing material resistant to a temperature of 90 ℃ to 350 ℃ and the positioning region is made of a second fixing material resistant to a temperature of 80 ℃ to 150 ℃.

5. The process of claim 4, wherein the curing of the first fixing material is performed simultaneously during the shaping of the sounding layer, and the first fixing material is cured before the shaping of the sounding layer is completed.

6. The process of claim 5, wherein the curing temperature of the first fixing material is equal to or lower than the setting temperature of the sounding layer, and the curing time is shorter than or equal to the setting time of the sounding layer.

7. The process of claim 1, wherein a protective film is attached to the outer surface of the sound-generating layer, and the protective film is torn off after the sound-generating layer is shaped.

8. The sound generation layer tensioning process of claim 1, further comprising, before step S1: the sound-emitting layer is pre-tensioned by a tensioning device.

9. A sound generation layer tensioning process according to claim 1, wherein the process comprises:

s1, arranging a frame pasting area on the non-sounding layer backboard, and carrying out frame pasting on the sounding layer backboard and the non-sounding layer backboard through the frame pasting area, wherein the sounding layer is made of a high polymer polymerization or composite material with the shrinkage rate lower than 1.5%, the frame pasting area comprises a shaping area or a shaping area and a positioning area, the shaping area is made of a first fixing material resistant to 50-200 ℃, and the positioning area is made of a second fixing material resistant to 5-200 ℃;

s2, shaping the sounding layer at a shaping temperature of 80-200 ℃ for 10-50 min, and tensioning the sounding layer after shaping.

10. A sound generation layer tensioning process according to claim 1, wherein the process comprises:

s1, arranging a frame pasting area on a non-sounding layer backboard, and carrying out frame pasting on the sounding layer backboard and the non-sounding layer backboard through the frame pasting area, wherein the sounding layer is made of a high polymer polymerization or composite material with the shrinkage rate of 1.5% -8%, the frame pasting area comprises a shaping area or a shaping area and a positioning area, the shaping area uses a first fixing material resistant to 50-200 ℃, and the positioning area uses a second fixing material resistant to 5-200 ℃;

s2, shaping the sounding layer at a shaping temperature of 60-120 ℃ for 10-50 min, and tensioning the sounding layer after shaping.

Technical Field

The invention relates to a membrane tensioning technology, in particular to a sound production layer tensioning technology.

Background

The sound signals output by sound output components such as existing loudspeakers, screen ultrasonic output components and the like are propagated along with air vibration, and the output sound signals can be diffused to the periphery. For example, when a user uses a mobile terminal to make a call or listen to music, an audio signal output from an audio output unit is diffused from the mobile terminal to the surroundings. However, the user does not want the call information to be heard by others, nor does the sound of the music interfere with the environment in which others are located. Therefore, the sound signal output by the sound output part has no directivity, and the sound signal output by the mobile terminal spreads to the periphery along with the propagation of air vibration, so that the privacy is poor and the user experience is poor.

At present, transparent screen directional loudspeakers that combine a screen sound field with an ultrasonic transducer are under development. The self-vibration of the screen is used as the loudspeaker, the resonant cavity space of the traditional loudspeaker is saved, and meanwhile, the directional propagation characteristic meets the privacy requirement of personal electronic equipment and the non-interference requirement of public equipment.

However, the directional ultrasonic transparent material studied at present is very prone to creep deformation in a working environment to cause functional failure, and in order to ensure the stability of the product functions under a multilayer structure and ensure that the reliability meets the industry standard, the directional ultrasonic transparent material needs to be tensioned so as to avoid the phenomenon that the ultrasonic acoustic characteristics of the material are affected by the large creep deformation in the working process.

The invention content is as follows:

the invention aims to provide a sound production layer tensioning process for positioning and baking and shaping a sound production layer.

In order to achieve the above object, the present invention provides a sound layer tensioning process, including:

s1, arranging a frame pasting area on the non-sounding layer backboard, and carrying out frame pasting on the sounding layer and the non-sounding layer backboard through the frame pasting area;

s2, shaping the sounding layer at a certain shaping temperature and for a certain shaping time, and tensioning the sounding layer after shaping, wherein the shaping temperature range is 50-200 ℃, and the shaping time range is 5-180 min.

In a preferred embodiment, the material of the sound generating layer is a polymer or composite material or flexible glass, and the polymer or composite material includes any one of a triacetate fiber film TAC, a polyethylene terephthalate PET, an optical material COP, a polyimide PI, and a polyvinylidene fluoride PVDF.

In a preferred embodiment, the frame pasting region comprises a setting region, or a setting region and a positioning region, wherein the setting region and the positioning region are arranged along the outer edge of the non-sounding layer back plate in a circle, and the setting region is located on the outer side of the positioning region.

In a preferred embodiment, the shaping area uses a first fixing material resistant to 90-350 ℃, and the positioning area uses a second fixing material resistant to 80-150 ℃.

In a preferred embodiment, during the shaping of the sound layer, the first fixing material is cured simultaneously, and the first fixing material is cured before the shaping of the sound layer is completed.

In a preferred embodiment, the curing temperature of the first fixing material is less than or equal to the setting temperature of the sound-emitting layer, and the curing time is shorter than or equal to the setting time of the sound-emitting layer.

In a preferred embodiment, a protective film is further attached to the outer surface of the sounding layer, and the protective film is torn off after the sounding layer is shaped.

In a preferred embodiment, before step S1, the method further includes: the sound-emitting layer is pre-tensioned by a tensioning device.

In a preferred embodiment, the process comprises:

s1, arranging a frame pasting area on the non-sounding layer backboard, and carrying out frame pasting on the sounding layer backboard and the non-sounding layer backboard through the frame pasting area, wherein the sounding layer is made of a high polymer polymerization or composite material with the shrinkage rate lower than 1.5%, the frame pasting area comprises a shaping area or a shaping area and a positioning area, the shaping area is made of a first fixing material resistant to 50-200 ℃, and the positioning area is made of a second fixing material resistant to 5-200 ℃;

s2, shaping the sounding layer at a shaping temperature of 80-200 ℃ for 10-50 min, and tensioning the sounding layer after shaping.

In a preferred embodiment, the process comprises:

s1, arranging a frame pasting area on a non-sounding layer backboard, and carrying out frame pasting on the sounding layer backboard and the non-sounding layer backboard through the frame pasting area, wherein the sounding layer is made of a high polymer polymerization or composite material with the shrinkage rate of 1.5% -8%, the frame pasting area comprises a shaping area or a shaping area and a positioning area, the shaping area uses a first fixing material resistant to 50-200 ℃, and the positioning area uses a second fixing material resistant to 5-200 ℃;

s2, shaping the sounding layer at a shaping temperature of 60-120 ℃ for 10-50 min, and tensioning the sounding layer after shaping.

Compared with the prior art, the invention has the following beneficial effects:

1. according to the invention, after the sounding layer and the non-sounding layer back plate frame are pasted and positioned, the sounding layer is baked to realize shrinkage shaping, and the process is simple and easy to realize.

2. The invention realizes the accurate control of the shrinkage of the sounding layer through the matching design of the sounding layer material, the frame fixing structure, the fixing material, the curing time of the fixing material, the setting condition and the like.

3. The invention realizes the shrinkage and the shaping of the sounding layer, thereby ensuring that the sounding layer is not easy to creep in the working process, and further not influencing the ultrasonic acoustic characteristics of related directional ultrasonic products.

Description of the drawings:

FIG. 1 is a schematic flow diagram of the sound generation layer tensioning process of the present invention;

FIG. 2 is a schematic view of a split structure of the back plate of the generating layer and the non-sound-producing layer in a state of not being attached to a frame;

FIG. 3 is an enlarged schematic view of portion A of FIG. 2;

FIG. 4 is a schematic structural view of one preferred embodiment of the styling region of the present invention.

The reference signs are:

1. the sound-emitting device comprises a non-sound-emitting layer back plate, 11, a frame pasting area, 111, a shaping area, 111a, a first limiting portion, 111b, a second limiting portion, 111c, a fixing area, 112, a positioning area, 2 and a sound-emitting layer.

The specific implementation mode is as follows:

the following detailed description of specific embodiments of the invention is provided, but it should be understood that the scope of the invention is not limited to the specific embodiments.

Throughout the specification and claims, unless explicitly stated otherwise, the word "comprise", or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.

As shown in fig. 1, the process for tensioning a sound generating layer disclosed by the invention comprises the following steps:

and S1, setting a frame pasting area 11 on the non-sound-producing layer back plate 1, and carrying out frame pasting on the sound-producing layer 2 and the non-sound-producing layer back plate 1 through the frame pasting area 11.

In the embodiment shown in fig. 2 and fig. 3, in particular, the non-sound-emitting layer back plate 1 is generally made of a material with a high young's modulus, such as glass, but not limited to glass, and may also be made of other opaque materials. The sounding layer 2 is made of a film material with a relatively low Young's modulus, such as a high polymer or composite material or flexible glass, and the high polymer or composite material can be specifically any one of a triacetate fiber film TAC, a polyethylene terephthalate PET, an optical material COP, a polyimide PI, a polyvinylidene fluoride PVDF and the like.

Before the design is toasted, sound production layer 2 is earlier with non-sound production layer backplate 1 and is carried out effective fixed position through frame subregion 11 to guarantee that sound production layer 2 is toasting the design in-process, its material deformation of offsetting that can be fine, thereby realize fine tensioning design effect.

Frame pad pasting 11 sets up on non-sound production layer backplate 1, also can set up on sound production layer 2 certainly, in this embodiment, sets up on non-sound production layer backplate 1, specifically sets up along non-sound production layer backplate 1's frame. The specific implementation structure of the frame region 11 can be designed differently according to the material of the sound-emitting layer 2. Specifically, the frame region 11 may include a single shaping region 111, or a mixed structure of the shaping region 111 and the positioning region 112, but is not limited to the frame region 11 defined herein, as long as the sound-generating layer 2 can be attached and fixed to the frame of the non-sound-generating layer back plate 1 before shaping. The fixing effect of the fixing region 111 is better than the positioning effect of the positioning region 112, and in practice, it is preferable to adopt a single fixing region 111 or a mixed structure of the fixing region 111 and the positioning region 112. Wherein, design district 111 and locating area 112 all set up along the outer fringe of non-vocal layer backplate 1 round, and design district 111 is located the outside of locating area 112. The positioning area 112 is mainly used for positioning the sounding layer 2 and the non-sounding layer backboard 1, and the shaping area 111 is mainly used for fixing the sounding layer 2 and the non-sounding layer backboard 1 after the sounding layer 2 and the non-sounding layer backboard 1 are positioned.

For the sound layer 2 made of low-shrinkage material, the sound layer 2 with the shrinkage rate of less than 1.5% in TD (transverse Direction) and MD (Machine Direction) can be used, such as optical PET substrate, COP substrate, etc.; for example, the sound generation layer 2 is made of a material with a shrinkage rate of 1.5% -8% in TD (transverse Direction) and MD (Machine Direction), such as an optical TAC substrate. In order to prevent the sound layer 2 made of these materials from creeping in the working environment, the frame region 11 may include the shaped region 111, or a mixed structure of the shaped region 111 and the positioning region 112. If only set up the locating area 112 alone, the sound production layer 2 passes through locating area 112 promptly and is fixed with non-sound production layer backplate 1, then can be because the fixed effect of locating area 112 is not good, can't guarantee the solidification effect in 2 anabatics on sound production layer to can't prevent material later stage creep, influence the design effect of sound production layer 2.

As another example, for some sound-emitting layers 2 made of materials with higher young's modulus, such as ultra-thin flexible glass, the frame region 11 may include a single patterned region 111, or a single positioning region 112, or a mixed structure of the patterned region 111 and the positioning region 112. The material is not particularly limited to the width of the setting region 111, but the width is preferably selected to be more than 2mm in order to prevent the material from being deformed by shearing force.

In addition, as shown in fig. 4, when a single fixing area 111 is adopted, the fixing area 111 may be designed to have a fence-type fixing area 111, and specifically includes a first limiting portion 111a, a second limiting portion 111b and a fixing area 111c, the first limiting portion 111a and the second limiting portion 111b are both arranged in turn along the outer edge of the non-sound-emitting layer back plate 1, and a fixing area 111c is formed between the first limiting portion 111a and the second limiting portion 111b, and the fence-type fixing area 111 may ensure the thickness and width of the fixing material in the fixing area 111 c.

The fixing material of the shaping area is defined as a first fixing material, and the fixing material of the positioning area is defined as a second fixing material. Wherein, the second fixing material generally adopts acid-free high-transparency chemical glue which can resist 80-150 ℃, and has the advantages that: for the directional ultrasonic screen with the narrow frame, a certain area needs to be attached by a second fixing material to the visible area, the material is transparent and bubble-free, the visible area is formed except the boundary line, and other areas are integrated with the visible area. If non-transparent materials are adopted, a high-precision laminating process is needed to match the narrow frame. The first fixing material is generally a colloid which is more resistant to high temperature than the second fixing material, such as a liquid colloid which is resistant to 90-350 ℃, and specifically such as high-temperature curing silica gel. Of course, the first fixing material and the second fixing material are not limited to the glue, and other fixing materials capable of stably and fixedly adhering the sound-emitting layer 2 and the non-sound-emitting layer back plate 1 are also applicable to the present invention.

S2, shaping the sounding layer 2 at a certain shaping temperature and for a certain shaping time, and tensioning the sounding layer 2 after shaping, wherein the shaping temperature range is 50-200 ℃, and the shaping time range is 5-180 min.

Specifically, after the sound layer 2 and the non-sound layer backboard 1 are stably fixed and attached together through the frame attaching area 11, the sound layer 2 needs to be baked, so that the sound layer is shrunk and shaped. The selection of the setting time and the setting temperature is adjusted according to the difference of the material of the sounding layer 2 and the first fixing material, so that the sounding layer 2 can reach the maximum shrinkage after being set. When in implementation, the setting temperature range can be 50-200 ℃, and the setting time range can be 5-180 min.

For some first fixing materials needing to be cured, the first fixing materials can be cured simultaneously in the process of shaping the sounding layer 2, and the curing process needs to be completed before the shaping process is finished. If the setting temperature range of the sounding layer 2 is 50-200 ℃ and the setting time range is 5-180 min, the curing temperature of the first fixing material is less than or equal to the setting temperature of the sounding layer 2, if the curing temperature is 80-150 ℃, the curing time is shorter than or equal to the setting time of the sounding layer 2, if the curing time is 5-20 min.

In addition, a protective film (not shown) is attached to the outer surface of some thin sounding layers, and in order to achieve flatness and no creep of the sounding layer 2, it is necessary to ensure that the protective film of the sounding layer 2 is integrated with the sounding layer 2 during the shaping process, i.e. the protective film is torn off after the sounding layer 2 is shaped. If the protective film is torn and then the sound production layer 2 is shaped, the material will wrinkle after shaping; and to the 2 materials of sound production layer of thick type, if more than 100um of thickness, sound production layer 2 is thicker, and it takes place the fold probability and lower, and for example sound production layer 2 more than 200um of thickness again, it can match solitary design district 111, and does not have the protection film, also can guarantee the level and smooth compactness of its design.

Further, before the sound-generating layer 2 is attached to the frame of the back plate 1 of the non-sound-generating layer, the sound-generating layer 2 may be pre-tensioned by a tensioning device (not shown). However, after pre-tensioning, the design of the subsequent frame regions 11, as well as the setting time, setting temperature, etc., also need to be adjusted accordingly.

The following describes the process of the sound generation layer tensioning process of the present invention in two specific embodiments.

Example 1

The sounding layer 2 is an optical PET substrate or COP substrate with the shrinkage rate of less than 1.5%, the frame patch area 11 may include a shaping area 111 or a mixed structure of the shaping area 111 and the positioning area 112, and the width of the shaping area 111 is preferably not less than 1.5 mm. The first fixing material of the shaping area 111 is high temperature curing silica gel resistant to 50-200 ℃, and the second fixing material of the positioning area 112 is acid-free high-transmittance chemical glue resistant to 5-200 ℃. In the shaping process, the shaping temperature is 80-200 ℃, and the shaping time is 10-50 min.

Example 2

The sound generating layer 2 is a polarizer type of an optical TAC substrate with the shrinkage rate of 1.5% -8%, the frame pasting area 11 can comprise a setting area 111 or a mixed structure of the setting area 111 and a positioning area 112, and the width of the setting area 111 is preferably not less than 1.5 mm. The first fixing material of the shaping area 111 is high temperature curing silica gel resistant to 50-200 ℃, and the second fixing material of the positioning area 112 is acid-free high-transmittance chemical glue resistant to 5-200 ℃. In the shaping process, the shaping temperature is 50-105 ℃, preferably 60-80 ℃, and the shaping time is 10-50 min. If the film is a non-polarizing film, the setting temperature can be 60-120 ℃ as long as the effect of the sound production layer is not influenced.

The invention has the advantages that 1, after the sounding layer 2 and the non-sounding layer backboard 1 are pasted and positioned, the sounding layer 2 is baked to realize shrinkage shaping, the process is simple and easy to realize; 2. according to the invention, the accurate control of the shrinkage of the sounding layer 2 is realized through the matching design of the sounding layer 2 material, the frame fixing structure, the fixing material, the curing time of the fixing material, the setting condition and the like; 3. the invention realizes the shrinkage and the shaping of the sounding layer 2, thereby ensuring that the sounding layer 2 is not easy to creep in the working process, and further not influencing the ultrasonic acoustic characteristics of related directional ultrasonic products.

The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.