阅读说明：本技术 线材拉伸监测系统 (Wire rod stretching monitoring system ) 是由 理查德·萨弗 卡尔·瑙曼 若昂·诺罗娜 于 2020-02-20 设计创作，主要内容包括：一种拉伸模具系统,具有至少两个探针,这些探针用于测量模具盒的部件或拉伸通过模具盒的线材的多种特性。该系统包括智能模具,其中多个探针将信息发送到数据处理单元。数据处理单元从多个探针获取信息并且控制线材拉伸过程的各种参数。一个智能模具有直接从拉伸模具保持器收集信息的探针。该智能模具还包括力传感器,并且被配置为允许模具盒沿平行于线材被拉伸的方向的轴线移动。数据处理单元控制各种线材拉伸参数,比如线材拉伸速度、冷却剂压力以及冷却剂泵送通过系统的速率。(A drawing die system having at least two probes for measuring various characteristics of a component of a die box or a wire drawn through the die box. The system includes an intelligent mold, wherein a plurality of probes send information to a data processing unit. The data processing unit acquires information from the plurality of probes and controls various parameters of the wire drawing process. An intelligent die has a probe that collects information directly from the stretch die holder. The smart die also includes a force sensor and is configured to allow the die box to move along an axis parallel to a direction in which the wire is stretched. The data processing unit controls various wire drawing parameters such as wire drawing speed, coolant pressure, and the rate of coolant pumping through the system.)

1. A drawing die holder, comprising:

a drawing channel, and

a die probe passage extending from an outer wall to an inner wall of the drawing die holder.

2. The drawing die holder of claim 1 wherein the die probe passage is perpendicular to the drawing passage.

3. The stretch die holder of claim 1, wherein the stretch die holder further comprises a first base and a cover.

4. The stretch die holder of claim 2, wherein the stretch die holder further comprises a first base and a cover.

5. The drawing die holder of claim 3 further comprising a second base.

6. The stretch die holder of claim 3 wherein the die probe channel is located within the first base.

7. The drawing die holder of claim 4 further comprising a second base.

8. The stretch die holder of claim 4 wherein the die probe channel is located within the first base.

9. The stretch die holder of claim 1 further comprising a probe received in the die probe channel.

10. The stretch die holder of claim 9, wherein the probe is one or more of a temperature sensor, a vibration sensor, a pressure sensor, an infrared sensor, a pyrometer, a magnetic field sensor.

11. The drawing die holder of claim 10 wherein the temperature sensor is a thermocouple.

12. The drawing die holder of claim 9 comprising a die.

13. The drawing die holder of claim 12 wherein the die is one or more of a pressure die, a drawing die, and a secondary die.

14. The stretch die holder of claim 12 wherein the probe is in contact with the die.

15. The stretch die holder of claim 12, further comprising a spring that provides pressure to the probe against the die.

16. The stretch die holder of claim 9, wherein the probe is in a fixed position or allowed to slide in the die probe channel.

17. The drawing die holder of claim 9 wherein the die probe passage includes a conductive filler material.

18. The drawing die holder of claim 17 wherein the conductive filler material is in contact with the die.

19. The stretch die holder of claim 18, wherein the probe is in contact with the conductive filler material.

20. The stretch die holder of claim 18, further comprising a spring that provides pressure to the probe against the conductive filler material.

21. The stretch die holder of claim 18 wherein the probe is in a fixed position or allowed to slide in the die probe channel.

22. The stretch die holder of claim 9, wherein the probe is configured to gather information from a die without contacting the die.

23. The stretch die holder of claim 22, wherein the probe is configured to transmit information collected by the probe to a data processing device.

24. The drawing die holder of claim 23 wherein the data processing device is a reader, transmitter, or data logger.

25. A mold box, comprising:

two or more probes for measuring various characteristics of a component of the die box or a wire drawn through the die box.

26. The die cartridge of claim 25, further comprising a stretch die holder.

27. The mold box of claim 26, further comprising a box probe channel and a mold probe channel.

28. The die cartridge according to claim 27, wherein the cartridge probe channel and the die probe channel are aligned.

29. The die cartridge of claim 28, wherein the die cartridge and the stretch die holder include alignment elements.

30. The die cartridge according to claim 29, wherein the cartridge probe channel and the die probe channel are radially aligned.

31. The die cartridge of claim 30, wherein the alignment element is a pin on the drawing die holder that mates with a recess on the die cartridge.

32. The mold box of claim 30, further comprising a box alignment channel.

33. The die cartridge according to claim 32, wherein the cartridge alignment channel is parallel to the cartridge probe channel.

34. The die cartridge of claim 33, wherein a first portion of the cartridge alignment channel is in the stretch die holder and a second portion of the cartridge alignment channel is adjacent to the stretch die holder.

35. The die cartridge of claim 34, wherein the first portion of the cartridge alignment channel has an oval or irregular shape.

36. The mold box of claim 34, further comprising a third portion of the box alignment channel extending through the collet.

37. The mold box of claim 36, wherein the third portion of the box alignment channel is aligned with the first and second portions of the box alignment channel.

38. The mold box of claim 37, further comprising an alignment pin extending through the first, second, and third portions of the box alignment channel.

39. The mold box of claim 38, further comprising a displaceable safety block on a top side of the jacket.

40. The mold box of claim 39, wherein the alignment pin is removably attached to the displaceable safety block.

41. The mold box of claim 39, further comprising a primary displacement device.

42. A mould box according to claim 41, wherein the primary displacement means comprises a pivotable lever.

43. The mold box of claim 39, further comprising a secondary displacement device.

44. The die cartridge according to claim 43, wherein the secondary displacement device is a channel on the underside of the displaceable safety block.

45. The mold box of claim 39, further comprising a tertiary displacement device.

46. The die cartridge according to claim 45, wherein the tertiary displacement device is a screw that pushes against the collet and separates the displaceable safety block when the screw is turned.

47. The mold box of claim 39, further comprising a slidable support.

48. The die cartridge according to claim 28, wherein the cartridge probe channel and the die probe channel are axially aligned.

49. The die cartridge of claim 48, wherein the draw die holder has a tapered draw channel.

50. The mold box of claim 25, further comprising a force transducer.

51. The mold box of claim 50, wherein the force transducer is in an unloaded state.

52. The die cartridge of claim 26, further comprising a jacket for indirectly cooling the drawing die holder.

53. The mold box of claim 52, wherein the jacket is a water jacket.

54. The die cartridge according to claim 52, wherein the jacket supports the stretch die holder.

55. The mold box of claim 52, wherein the jacket comprises a water channel.

56. The die cartridge of claim 52, wherein the die cartridge includes guide rods that allow the die cartridge to move along an axis parallel to a draw channel in the draw die holder.

57. The die cartridge according to claim 55, wherein the die cartridge includes a plurality of guide rods.

58. The mold box of claim 56, further comprising a linear bearing.

59. The mold box of claim 46, further comprising a plurality of linear bearings.

60. The die cartridge of claim 26, wherein the drawing die holder is subjected to direct cooling.

61. The die cartridge of claim 60, comprising a die holder O-ring and a die cartridge O-ring that allow direct cooling of the drawing die holder.

62. The mold box of claim 60, further comprising a mold box nut.

63. The die cartridge of claim 62, wherein the die cartridge nut allows the stretch die holder to move along an axis parallel to a stretch channel in the stretch die holder.

64. The die cartridge of claim 63, wherein the die cartridge nut is configured to avoid axial preload when installed.

65. The mold box of claim 52, further comprising a vibration sensor.

66. The mold box of claim 60, further comprising a vibration sensor.

67. The mold box of claim 52, further comprising a magnetic sensor or a Hall effect sensor.

68. The mold box of claim 60, further comprising a magnetic sensor or a Hall effect sensor.

69. The mold box of claim 25, further comprising a coolant flow regulator.

70. The mold box of claim 53, wherein the jacket is connected to a back plate.

71. The die cartridge of claim 70, wherein the collet is connected to the backing plate by a slide.

72. The die cartridge of claim 71, wherein the collet is connected to the backing plate by a plurality of slides.

73. The die cartridge of claim 71, wherein the collet is connected to the backing plate by four slides.

74. The mold box of claim 70, further comprising a slide plate between the jacket and the back plate.

75. The mold box of claim 74, further comprising a force sensor between the slide plate and the back plate.

76. The mold box of claim 75, further comprising a force transfer plate between the force sensor and the jacket.

77. A wire stretch monitoring system, comprising:

a wire drawing box comprising two or more probes measuring two or more properties of a wire drawing device, and wherein one of the two or more properties is measured at a die surface parallel to a die holder surface, an

A control unit, wherein the two or more probes send information to the control unit.

78. The wire stretch monitoring system of claim 77, wherein the wire stretch box comprises a stretch die holder.

79. The wire stretch monitoring system of claim 77, wherein the control unit is configured to receive and process information from the two or more probes.

80. The wire stretch monitoring system of claim 77, further comprising two or more wire stretch boxes.

Technical Field

The present invention relates to the field of manufacturing metal wire by a wire stretcher. And more particularly to a mold and mold holder for such manufacture and a monitoring system.

Background

From a technical and commercial point of view, the use of wires is becoming more and more demanding. This requires wire manufacturers to increase production speeds and draw wires to increasingly stringent finished wire tolerances and specific mechanical properties while minimizing downtime. Some examples are the production of ultra-high strength carbon filaments, super duplex stainless steels, titanium, inconel, etc.

To produce finished wires with the target diameter and mechanical properties, wires of different metal alloys are drawn through one or more wire drawing dies for specialized wire drawing machines to reduce the diameter or change the shape of the wires. To achieve the desired wire diameter and mechanical properties, the wire is cold drawn in as few as 1 and as many as 27 or more sequential steps.

Under current industry conditions, most wire drawing die tips are permanently encased in a steel or other metal casing and are discarded once the carbide or diamond tip material wears beyond its useful life. At that time, the housing and permanently packaged tip can be discarded and recycled. The tip of the wire drawing die is a core material in the wire drawing die and is made of hard materials such as tungsten carbide, polycrystalline diamond, natural or synthetic diamond and the like. In some applications, the die tip is replaceable.

The wiring process can place significant stress on the various components of the stretching system. Due to the tremendous pressures experienced by the system, system components often fail before their expected service life. It is very difficult to measure the physical characteristics of the system. The prior art includes various probes and sensors that may be placed on the exterior of the wire stretcher components. However, no internal sensors can provide a clear image of the state of the various components, and no internal sensors can be combined to control various parameters of the wire drawing process.

Disclosure of Invention

The present application relates to a wire stretch monitoring system and components that facilitate controlling a wire stretching process. One embodiment is a stretch die holder that includes a stretch channel and a die probe channel extending from an outer wall to an inner wall of the stretch die holder. Another embodiment is a die box having two or more probes that measure various characteristics of a component of the die box or a wire being drawn through the die box. Another embodiment is a system comprised of a wire stretch monitoring system having a wire stretch box including two or more probes that measure two or more properties of a wire stretching device. Measuring one of the two or more properties at a mold surface parallel to a mold holder surface; and a control unit, wherein the two or more probes send information to the control unit.

Other and additional objects of the invention will become apparent from consideration of the entire specification.

Drawings

The above and other features, aspects, and advantages of the present invention will be considered in more detail in conjunction with the following description of embodiments of the invention, as illustrated in the accompanying drawings, in which:

fig. 1A is a perspective front view of a mold box.

Fig. 1B is a perspective rear view of the mold box.

Fig. 2A is a perspective view of the mold.

Fig. 2B is a cross-section along the RR axis of the die.

Fig. 2C is a bottom view of the mold.

Fig. 3A is a cross-sectional view of a die holder having a two-piece die.

Fig. 3B shows a cross-sectional view of a die holder with a three-piece die.

Fig. 4A is a front view of the mold box.

Fig. 4B is a cross-section along the axis AA of the die box.

Fig. 4C is a cross-section along the axis BB of the mold box.

Fig. 5A is a top view of the mold box.

Fig. 5B is a cross section along the axis FF of the die box.

Fig. 5C is a cross section along the axis JJ of the die box.

Fig. 6A is a cross-section along axis GG.

Fig. 6B is an enlarged view of the square H of fig. 6A.

Fig. 6C is a rear view of the mold box.

Fig. 7A and 7B are cross-sections of a drawing die holder with a filler material in the die probe passage.

Fig. 8 is a cross-section of a mold box subjected to direct cooling.

Fig. 9 is a perspective view of a mold box with a coolant flow regulator.

Detailed Description

The invention summarized above and defined by the claims set forth below may be better understood by referring to the following description, which should be read in conjunction with the accompanying drawings, in which like reference numerals are used for like parts. This description of the embodiments set forth below enables one to make and use embodiments of the present invention and is not intended to limit the invention but rather to serve as a specific example thereof. Those skilled in the art should appreciate that they may readily use the conception and the specific embodiment disclosed as a basis for modifying or designing other methods and systems for carrying out the same purposes of the present invention. Those skilled in the art should also realize that such equivalent components do not depart from the spirit and scope of the invention in its broadest form.

A wire stretcher monitoring system is described that collects various characteristics of the components of a wire stretcher or multiple wire stretchers to improve the efficiency of the wire stretcher, reduce down time due to component failure, and reduce cost. In some embodiments, the wire stretch monitoring system comprises an intelligent die system component as described herein. The system collects information from one or more probes that measure physical characteristics of the wire stretcher components, such as the various dies, die holders, die boxes, and the wire itself used in the process. As used herein, the term "probe" refers to any type of device that collects information to be used by the system, whether it be a physical probe or any type of sensor. In some embodiments, the system collects information from two or more probes that measure physical characteristics of the wire stretcher components. In some embodiments, the monitoring system includes a mold box 200 as shown in fig. 1A and 1B.

As shown in fig. 2A, 2B, and 2C, the die box 200 has a drawing die holder 100 that accommodates a die 102. The mold 102 is made of a hard material such as tungsten carbide, polycrystalline diamond, natural diamond, or any other similar material, as is known in the art. In some applications, the mold may also be referred to as a "tip (nib)". As shown in fig. 3A, 3B, and 3C, the die 102 may be a single construction or several parts, such as a pressure die 129 or tip, a draw die 126, or a secondary die 131. Fig. 3A shows a drawing die holder 100 containing a two-piece die 102, including a drawing die 126 and a pressure die 129 or tip. Fig. 3B and 3C show a die holder housing containing a three-piece die 102 including a drawing die 126, a pressing die 129, and a secondary die 131. Fig. 3C is an enlarged view of the three-piece mold 102 in the mold box 200. The drawing die holder 100 is configured to accept a probe 115 that measures one or more properties or physical characteristics of the die 102 used during the drawing process. The drawing die holder 100 has a drawing channel 103 that supports the die 102 during the wire drawing process. The drawing channel 103 extends longitudinally in the direction of wire travel during the drawing process. The stretch die holder 100 also has a die probe passage 106 extending from a holder outer wall 109 to a holder inner wall 112 of the stretch die holder 100. As described herein, the drawing channel 103 is the boundary between the die outer wall 110 and the drawing die holder 100; the drawing channel 103 is a channel formed by the inner wall of the drawing die holder 100. The drawing channel 103 is different and parallel to the wire forming channel 105, which wire forming channel 105 is a channel formed by the mould inner wall 113.

In some embodiments, the die probe channel 106 is perpendicular or orthogonal to the draw channel 103. However, it is contemplated that in other embodiments, the die probe channel 106 may have a different angular orientation relative to the draw channel 103, so long as the probe can enter the die 102. For example, if the stretch channel 103 is tapered, the probe channel 106 may extend vertically away from the stretch channel 106, rather than perpendicular or orthogonal to the stretch channel 103.

In some embodiments, the die 102 is enclosed within the drawing die holder 100. In other embodiments, the die 102 may be separate from the die holder 100. In some embodiments, the stretch die holder 100 may be divided into a first base 118 and a cap 121. The first base 118 holds a drawing die 126 that is removable from the first base 118. In other embodiments, the drawing die 126 is encased within the first base 118 and is not removable or replaceable. The cap 121 of the stretch die holder 100 holds a pressure die 129 or tip that can be removed from the cap 121. In some embodiments, the die holder 100 holds more than one pressure die 129. In other embodiments, the pressure die 129 is encased within the cap 121 and is not removable or replaceable. In a further embodiment, the drawing die holder 100 includes a second base 123. The second base 123 holds a removable or replaceable secondary mold 131. In other embodiments, the secondary mold 131 is encased within the second base 123 and is not removable or replaceable. The secondary die 131 is an additional die for imparting specific properties to the wire in addition to those imparted by the drawing die 126 and the pressing die 129. In some embodiments, the secondary die 131 has a small gap with the wire being drawn. In other embodiments, the secondary die 131 imparts a further diameter reduction to the wire. In other embodiments, the secondary die 131 may apply a small skin pass to harden the outer surface of the wire.

In some embodiments, the die probe channel 106 is within the first base 118. In embodiments where the drawing die 126 is permanently encased within the first base 118, this means that the drawing die 126 cannot be removed from the base 118; the die probe passage 106 extends to the holder inner wall 112 of the drawing die holder 100, i.e., the portion of the first base portion 118 that encases the drawing die 126. In other embodiments, the drawing die 126 is not encased, but may be removed from the first base 118; the die probe passage 126 extends to the holder inner wall 112 of the drawing die holder 100, i.e., the portion of the first base 118 that contacts the drawing die 126.

The die probe channel 106 receives a probe 115. In one embodiment, probe 115 collects information from any portion of mold 102, whether it be a stretch mold 126, a pressure mold 129, or a secondary mold 131. In some embodiments, probes 115 contact mold 102. In some embodiments, the probe 115 is a transducer that sends information to the sensor. In some embodiments, probe 115 is a transducer or information collector for one or more of a temperature sensor, a vibration sensor, a pressure sensor, an infrared sensor, a pyrometer, a magnetic field sensor, or any other type of sensor that collects physical properties from mold 102, drawing die holder 100, or the wire being drawn through drawing die holder 100. In some embodiments where the sensor collects temperature information, the temperature sensor is a thermocouple or an infrared sensor, and the probe 115 is part of the sensor: collects temperature information and sends the temperature information to the data processing device 210. In some embodiments, the probes 115 are in physical contact with the mold 102. In other embodiments, the probe 115 may enter the mold 102 through the mold probe channel 106 and collect information from the mold 102 without making direct contact with the mold 102.

In some embodiments, the probes 115 are encased within the die probe channel 106, i.e., the probes 115 are secured within the die probe channel 106 and are not allowed to slide into or out of the die probe channel 106. In other embodiments, the probes 115 may be removable from the die probe channels 106. In some embodiments, retainers (such as springs) provide pressure to the probes 115 against the mold 102.

In other embodiments, as shown in fig. 7A and 7B, the die probe channel 106 contains a conductive fill material 141. The conductive filling material 141 is a material that easily carries physical properties. In some embodiments, the conductive filler material 141 is thermally conductive to allow for accurate reading of the temperature of the mold 102. In some embodiments, the conductive filler material 141 is at the bottom of the die probe channel 106 and contacts the die 102. In some embodiments, the probes 115 contact the conductive filler material 141, indirectly collecting information from the mold 102. In some embodiments, the probes 115 are encased within the die probe channel 106, i.e., the probes 115 are in a fixed position within the probe channel 106 and are not allowed to slide into or out of the die probe channel 106 and contact the conductive filler material 141. In other embodiments, the probes 115 may be removable from the die probe channels 106. In some embodiments, a retainer (such as a spring) provides pressure to the probe 115 against the conductive filler material 141.

In some embodiments, the probe 115 sends information from the mold 102, the mold holder 100, or other component to the data processing device 210. In some embodiments, the data processing device 210 is a reader, transmitter, or data recorder. In some embodiments, the probe 115 is physically connected to the data processing device 210. In other embodiments, the probe 115 communicates wirelessly with the data processing device 210. Wireless communication reduces the likelihood that the physical connection will be damaged during machine operation or when there is a physical tension failure, where loose wire can destabilize damaging the wired connection.

In some embodiments, the stretch die holder 100 is housed within a die box 200, as shown in fig. 4A, 4B, and 4C. The mold box 200 includes a box probe channel 203. The cartridge probe channel 203 extends from a cartridge outer wall 206 to a cartridge inner wall 209 that is adjacent to and runs parallel to the holder outer wall 109.

The cartridge probe channel 203 receives the probe 115. In one embodiment, the probe 115 may collect information from any portion of the stretch die holder 100. In some embodiments, probe 115 is in physical contact with mold holder 100. In other embodiments, the probe 115 enters the die holder 100 through the cartridge probe channel 203 and collects information from the stretch die holder 100 without direct contact with the stretch die holder 100. In a further embodiment, the probe 115 extends through the die holder 100 and contacts the die 102 and collects information from the die 102. In some embodiments, the probes 115 are in contact with a drawing die 126. In a further embodiment, the probe 115 extends through the die holder 100 but does not contact the die 102. Probes 115 collect information from mold 102 without directly contacting mold 102.

In some embodiments, the probes 115 are enclosed within the mold box probe channel 203, i.e., the probes 115 are secured within the box probe channel 203 and are not allowed to slide into or out of the box probe channel 203. In other embodiments, the probe 115 may be removable from the cartridge probe channel 203. In some embodiments, a retainer (such as a spring) provides pressure to the probe 115 against the die holder 100.

In other embodiments, the die cartridge probe channel 203 contains a conductive filler material 141. In some embodiments, the conductive filler material 141 is at the bottom of the cartridge probe channel 203 and contacts the die holder 100. In some embodiments, the probes 115 contact the conductive filler material 141, thereby indirectly collecting information from the mold holder 100. In some embodiments, the probes 115 are enclosed within the cartridge probe channel 203, i.e., the probes 115 are secured within the cartridge probe channel 203 and are not allowed to slide into or out of the cartridge probe channel 203 and contact the conductive filler material 141. In other embodiments, the probe 115 may be removable from the cartridge probe channel 203. In some embodiments, a retainer (such as a spring) provides pressure to the probe 115 against the conductive filler material 141.

In the exemplary embodiment, die cartridge 200 houses die holder 100, which includes die probe channel 106. The mold box of fig. 4B, wherein the box probe channel 203 and the mold probe channel 106 are aligned; the probe 115 may then extend through both channels. In some embodiments, the cartridge 200 and the die holder 100 have alignment elements 213 that help properly align the cartridge probe channel 203 and the die probe channel 106. In some embodiments, the alignment is radial. In some embodiments, the alignment element 213 for radial alignment has two parts: an alignment pin 216 and a recess 219 that mates with the alignment pin 216. In some embodiments, the alignment pins 216 are part of the mold box 200 and the recesses 219 are in the mold holder 100. In other embodiments, the alignment pins 216 are part of the die holder 100 and the recesses 219 are part of the die cartridge 200.

As shown in fig. 5B, the die cartridge 200 has a cartridge alignment channel 222. In some embodiments the cassette alignment channel 222 is parallel to the cassette probe channel 203. The cartridge alignment channel 222 is also parallel to the die probe channel 106. In some embodiments, the first portion 225 of the alignment channel 222 is in the stretch die holder 100 and the second portion 228 of the cassette alignment channel 222 is adjacent to the stretch die holder 100. Together, the first portion 225 of the alignment channel 222 and the second portion 228 of the alignment channel 222 form a single alignment channel that receives the alignment pin 216. In some embodiments, the first portion 225 of the alignment channel has an oval or irregular shape. In other embodiments, the oval or irregular shape is on the second portion 228 of the cartridge alignment channel 222.

In some embodiments, the mold box 200 has a jacket 234 for indirectly cooling the mold holder 100. As discussed herein, indirect cooling refers to a type of cooling in which the mold holder 100 is surrounded by a jacket 234 that includes coolant passages through which coolant flows to remove heat from the jacket 234, which in turn removes heat from the mold holder 100. The jacket 234 is a cooling jacket, and in some embodiments, the coolant is water. The collet 234 supports the die holder 100. The jacket 234 also provides a coolant channel 237 that provides indirect cooling of the die holder 100 and the die 102.

In some embodiments, the mold box 200 includes a third portion of the box alignment channel 222 extending through the collet 234. The third portion 240 of the cartridge alignment channel 222 is aligned with the first portion 225 and the second portion 228 of the cartridge alignment channel 22. In some embodiments, the alignment pin 216 extends through the first portion 225, the second portion 228, and the third portion 240 of the cartridge alignment channel 222.

The die cartridge 200 has a top side 243 that also has a displaceable safety block 246. The displaceable safety block 246 is pressed against the mold box 200 by an "over-center" latch-type toggle clamp 252. In some embodiments, the displaceable safety block 246 of the mold box 200 is located above the collet 234, on the top side 243 of the mold box 200. In some embodiments, the pin 216 is removably attached to the displaceable safety block 246. When the latch-type toggle clamp 252 is actuated to the locked position, the displaceable safety block 246 and the pin 216 are fixed. When the latch-type toggle clamps 252 are actuated to the unlocked position, the safety block 246 and pins 216 are free to be removed from the mold box 246. In some cases, the pin 216 and/or the safety block 246 may become stocked (stock) and need to be removed from the mold box 200. In this case there are a number of displacement options.

In some embodiments, the displaceable security block 246 has a primary displacement device 249 for prying the security block when it is stuck. In some embodiments, the primary displacement device 255 is a flat channel 258 on the bottom side 261 of the displaceable security block 246. In some embodiments, the passage 258 extends through the displaceable security block 246 from the first side to the second side. In other embodiments, the security channel does not run the entire length of the displaceable security block 246, but instead consists of two slots, one on each side, milled into the displaceable security block 246 to allow clearance to pry the security block 246 away from the top surface of the die cartridge 200. In other exemplary embodiments, the secondary displacement device 264 is used to further assist the user in removing the alignment pins 216 from the mold box 200. In an exemplary embodiment, the secondary displacement device 264 is a threaded member that pushes against the collet and separates the displaceable safety block from the mold box 200 when the threaded member is turned. In yet another embodiment, the third displacement device 249 includes a displacement channel 276 that extends from the mold box bottom side 279 toward the box alignment channel 222 and has a diameter that is less than the diameter of the alignment pin 216. A displacement pin (not shown) may be inserted through the displacement channel 276 to push the alignment pin 216 out of the die cartridge 200.

One embodiment includes slidable supports 267 that can slide under the safety block to prevent the safety block from falling out when the mold 102 or mold holder 100 is removed.

In another embodiment, the die holder 100 is aligned within the die cartridge 200 in an axial plane. In some embodiments, axial alignment is achieved by a tapered die box draw channel 105, meaning that the diameter at one end of the draw channel 105 is different than the diameter of the draw channel 105 at the second end.

In an exemplary embodiment, the mold box 200 includes a force transducer 303. In some embodiments, the force transducer 303 is in an unloaded state. To achieve the unloaded state of the force transducer 303, the die cartridge 200 has guide rods 306 that allow the die cartridge 200 to move along an axis parallel to the draw channel 103. In other embodiments, the mold box 200 includes a plurality of guide rods 306. The mold box 200 may also have one or more linear bearings 309, or a plurality of linear bearings 309.

In one embodiment, where indirect cooling is used and the mold box 200 includes a jacket 234 connected to a backing plate 270. The force transfer plate 401 is connected to the force transducer 303. The force transducer 303 is held by the back plate 270 and the durability of the back plate 270 is enhanced by the hardened gasket 403 located between the force transducer 303 and the back plate 270. The force transducer 303 is held in place by a retaining ring 402. The retaining ring 402 applies pressure to the outer ring of the force transducer 303 and spring pressure is supplied by a wave washer 404 held by a retaining clip 405. This configuration fixes the force transducer 303 in a non-preloaded state. The slide plate 330 ensures radial alignment of the force transfer plate 401, but allows linear motion to compress the force sensor by the collet 234 as needed during wire drawing.

The jacket 234 is connected to the back plate 270 by one or more guide rods 306 or a plurality of guide rods 306. In another embodiment, the mold box 200 has a slide plate 330 between the jacket 234 and the back plate 270. The force transducer 303 is placed between the sled 330 and the back plate 270. In other embodiments, the force transfer plate 330 is placed between the force transducer 303 and the collet 234.

In some embodiments, the mold box 200 provides direct cooling. An embodiment of direct cooling is shown in fig. 8. As discussed herein, direct cooling means that coolant is able to enter the die holder 100. To provide direct cooling, mold box 200 includes mold holder O-rings 309 and mold box O-rings 312, which allow for direct cooling of mold holder 100. Coolant inlet 803 delivers coolant to cooling channel 800 which is in direct contact with the drawing die holder 100. As discussed above, the mold holders 100 within the mold box 200 may be cooled directly or indirectly. In either type of cooling, the mold box is connected to a coolant flow regulator 327, as shown in FIG. 9. The coolant flow regulator 327 varies the rate of coolant being pushed through the system to cool the holder 126 to a particular temperature. Information from the various sensors described herein is used to adjust the output of the flow regulator 327.

In some embodiments, the die cartridge 200 includes a die cartridge nut 315 that limits movement of the die holder 100 along an axis parallel to the draw channel 103. In some embodiments, the installation of the die cartridge nut 315 is configured to avoid an axial preload when installed. In a direct cooling application, the die box nut 315 can only pass through the die box 200 to a predetermined position that prevents loading of the force transducer 303 by giving space for the stretching die holder to move. In such embodiments, the drawing die holder 100 is allowed to move along the wire drawing axis. Only the drawing die holder 100 is allowed to travel sufficiently to avoid preloading the force transducer, i.e., the pressure when the wire is not being drawn.

In some embodiments, the mold box 200 includes any of the following sensors: vibration sensor 318, magnetic field sensor 321, hall effect sensor 324, and any other sensor. It is contemplated that in some embodiments, the die cartridge 200 includes a rotary die holder. The rotary die holder is a die holder that allows rotation when drawing a wire. The rotary die holder includes a sensor that wirelessly transmits information collected from the die holder to a control unit.

The die cartridge 200 and die holder 100 are part of a stretching system that includes: two or more probes measuring two or more physical properties of the die box 200, die holder 100, die 102, and other components of the wire drawing system, at least one of the probes measuring a property at a die surface parallel to a die holder surface; and a control unit. As used herein, the term "physical property" refers to a measurable characteristic of the die cartridge 200, die holder 100, die 120, or wire. Such "physical properties" may be quasi-permanent with respect to the materials from which the die box 200, the drawing die holder 100, the components of the die 102, and the wire are made, such as temperature, electrical conductivity, and the like. As used herein, other "physical properties" refer to measurable characteristics that change based on the wire drawing process. Such as the temperature of the mold holder 100 or the mold 102, vibration at the mold box 200, and other similar characteristics. Two or more probes send information to the control unit. The control unit may then send information to a graphical user interface for the user to evaluate or for a program managing machine parameters to take a particular action. In some embodiments, the control unit processes the information and automatically adjusts for specific wire stretch parameters. For example, in some embodiments, the control unit combines the information collected from the various probes and automatically adjusts the draw speed of the process, the coolant flow supplied to the die box, and other similar parameters. In some embodiments, the control unit controls the flow of coolant supplied by the coolant flow regulator at the mold box. One advantage of the system described herein is that the probe sends information to the control unit or data processing device 210 "in real time", i.e. without stopping the system when the wire is being drawn through the machine in order to be able to make adjustments to the wire drawing process.

In some embodiments, the system includes multiple die boxes 200 with multiple probes and sensors that send information to a single control unit that in turn adjusts the parameters of the wire stretcher. The system adjusts the parameters of the machine based on information collected from the probes 115 at the die box 200 and the stretch die holder 100. In some embodiments, multiple die boxes 200 of the system are within a single wire drawing machine. In some embodiments, multiple die boxes 200 may be in multiple wire stretching machines operating simultaneously. The control unit is designed to vary various parameters in different machines based on real-time readings of each mold box 200.

A wire stretch monitoring system having a wire stretch box that includes two or more probes that measure two or more properties of a wire stretching device. As described above, one of the two or more properties is measured at a mold surface parallel to a mold holder surface. The system also has a control unit and the two or more probes send information to the control unit. The wire drawing system also includes a drawing die holder. The wire drawing system has a control unit configured to receive and process information from two or more probes. In some embodiments, the wire drawing system comprises two or more wire drawing boxes.

As described above, the system implements a method of controlling the wire stretcher parameters based on information collected from the probes at the die box 200 and the stretch die holder 100. In the first step of the method, a wire stretcher with probes and sensors on one or more die boxes 200 and a stretch die holder 100 begins wire stretching by stretching the die holder 100. In a second step, information is collected from the probes 115 at the die holder 100 and the die cartridge 200. In some embodiments, probe 115 is within die holder 100. The probe 115 contacts the mold 102 and other probes or sensors gather additional information directly from the mold box 200 and the stretch mold holder 100. In a third step, the information is sent to the data processing means 210. The data processing device 210 includes a processing unit or computer programmed to collect and process the various data received from the probe. In a further step, the collected information is processed. In a further step, the data processing device 210 controls various parameters of the wire stretcher at the die box 200 or die holder 100.

The invention has been described with reference to the preferred embodiments. Although specific values, relationships, materials, and steps have been set forth for purposes of describing the concepts of the invention, it will be appreciated by those skilled in the art that many changes and/or modifications may be made to the invention as shown in the specific embodiments without departing from the spirit or scope of the basic concepts and principles of operation of the invention as broadly described. It will be appreciated, in light of the above teachings, that those skilled in the art may modify such details without departing from the invention taught herein. Having now fully set forth the preferred embodiments and certain modifications of the concepts underlying the present invention, it will be apparent to those skilled in the art that various other embodiments and certain changes and modifications of the embodiments herein shown and described may be made without departing from these basic concepts. It is intended to include all such modifications, alterations and other embodiments, provided they come within the scope of the appended claims or the equivalents thereof. It is, therefore, to be understood that the invention may be practiced otherwise than as specifically set forth herein. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive.

INDUSTRIAL APPLICABILITY

The present invention relates to a metal wire rod manufactured by a drawing machine. And more particularly to a mold and mold holder and monitoring system for such manufacturing, and which are used in the industry.