阅读说明：本技术 一种基于5g基站用的电磁屏蔽材料的生产工艺 (Production process of electromagnetic shielding material based on 5G base station ) 是由 赵一静 魏淑玲 刘乐华 赵宁 于 2021-09-01 设计创作，主要内容包括：本发明公开了一种基于5G基站用的电磁屏蔽材料的生产工艺,涉及电磁屏蔽材料加工技术领域。本发明包括以下步骤：SS001、金属基材的准备、预备待加工的金属基材,采用超声波清洗设备对上述金属基材进行超声波清洗,采用超声设备对上述金属基材进行烘干处理；SS002、导热和导电层的附加、将上述SS001步骤中烘干完毕后的金属基材在真空镀膜室中依次进行离子清洗和氮化铝陶瓷导热涂层沉积。本发明通过金属基体上导电和导热涂层的增加,变传统的面式电磁屏蔽为板式电磁屏蔽,且在板式电磁屏蔽的基础上通过高导热和高导电性能的增加,能够有效增加该装置的散热、电磁屏蔽和雨雪等恶劣天气下的防护性能,继而使之能够与基站的使用环境进行高匹配。(The invention discloses a production process of an electromagnetic shielding material based on a 5G base station, and relates to the technical field of electromagnetic shielding material processing. The invention comprises the following steps: SS001, preparing a metal base material, preparing the metal base material to be processed, carrying out ultrasonic cleaning on the metal base material by adopting ultrasonic cleaning equipment, and drying the metal base material by adopting ultrasonic equipment; SS002, addition of a heat conducting layer and a conducting layer, and sequentially carrying out ion cleaning and aluminum nitride ceramic heat conducting coating deposition on the metal substrate dried in the SS001 step in a vacuum coating chamber. According to the invention, through the increase of the conductive and heat-conducting coating on the metal substrate, the traditional surface type electromagnetic shielding is changed into plate type electromagnetic shielding, and through the increase of high heat-conducting and high electric-conducting performances on the basis of the plate type electromagnetic shielding, the heat dissipation, electromagnetic shielding and protection performances of the device in severe weather such as rain, snow and the like can be effectively improved, so that the device can be highly matched with the use environment of a base station.)

1. A production process of an electromagnetic shielding material based on a 5G base station is characterized by comprising the following steps:

SS001, preparing a metal base material, preparing the metal base material to be processed, carrying out ultrasonic cleaning on the metal base material by adopting ultrasonic cleaning equipment, and drying the metal base material by adopting ultrasonic equipment after the ultrasonic cleaning is finished;

SS002, addition of a heat conducting layer and a conducting layer, sequentially carrying out ion cleaning, deposition of an aluminum nitride ceramic heat conducting coating, deposition of a diamond-like carbon film coating and deposition of a Cu conducting coating on the metal substrate dried in the step SS001 in a vacuum coating chamber, wherein the substrate processed in the step is the pretreated substrate;

SS003, reprocessing of the base material, punching the base material after the pretreatment in the SS002 step is finished according to set specification parameters, wherein the specification of the plate during punching is matched with that of the base station, and after the punching is finished, adopting a punching and mould pressing process to punch the punched base material into a set shape or a set specification so as to be matched with the shape of the base station;

SS004, preparing an electromagnetic shielding film, selecting a proper amount of amorphous fiber and a proper amount of needle-shaped aluminum to mix, wherein the ratio of the amorphous fiber to the needle-shaped aluminum is 2: 1; placing the two into a mixer, adding a polyaniline conductive adhesive into the mixer after premixing, mixing into slurry, and after the slurry is mixed, placing the slurry into a vacuum drying oven at 75-95 ℃ for drying for 10-15 h; after drying, adding polyamide-6, polypropylene and polycarbonate into the dried material, wherein the ratio of the mass of the polyamide-6 to the mass of the polypropylene to the mass of the polycarbonate to the total mass of the dried material is 1: 2: 1: 20; placing the mixed materials after proportioning into an internal mixer for internal mixing for 2-4 h, mixing the mixture after internal mixing, rolling the mixed materials after mixing, and obtaining the amorphous electromagnetic shielding film after rolling;

SS005, compounding, cutting the amorphous electromagnetic shielding film processed in the SS004 step into a set shape, and compounding the amorphous electromagnetic shielding film on the base material which is processed in the SS003 step through an adhesive;

SS006, electrolytic plating treatment, namely electroplating Ni or Cu on the surface of the compounded electromagnetic shielding film by adopting an electrolytic plating method;

SS007, establishing an insulating protective layer and SS006, coating a layer of thermoplastic resin on the surface of the electroplated electromagnetic film by adopting a roller coating method, coating a layer of hardenable insulating ink on the surface of the thermoplastic resin after the coating is finished, and completing the establishment of the insulating layer after the solidification is finished, wherein the thickness of the thermoplastic resin layer is 2-20 um; the thickness range of the insulating ink layer is 1-10 um, and after the insulating layer is built, the composite electromagnetic shielding substrate is prepared;

SS008, post-processing, and processing the compounded electromagnetic shielding substrate into a set size by adopting a laser cutting process so as to facilitate the post-processing.

2. The process of claim 1, wherein the substrate after drying treatment in the SS001 step is placed in vacuum coating during ion cleaning in the SS002 step, the pressure in the vacuum coating chamber is pumped to a predetermined pressure after the substrate is placed, and argon gas with a concentration of 99.9% is introduced into the vacuum coating chamber for protection after the substrate is pressed; after the argon is flushed, starting a high-frequency pulse power supply, wherein the ion cleaning time is 20-30 min; the technological parameters of the high-frequency pulse power supply are set as follows: the voltage range is 2kv-4kv, the frequency is 40KHz-60KHz, and the duty ratio is 50% -99%.

3. The process of claim 1, wherein the parameters of the vacuum coating chamber during the deposition of the aluminum nitride ceramic thermal conductive coating in the SS002 step are set as follows: pumping the pressure to a set pressure value, flushing argon with the concentration of 99.9 percent into the vacuum coating chamber as protection during deposition, and starting a high-frequency pulse power supply and a medium-frequency sputtering power supply; the technological parameters of the high-frequency pulse power supply are set as follows: the voltage range is 20v-70v, the frequency is 40KHz-60KHz, the duty ratio is 50% -99%, and the deposition time is 4h-5 h; the thickness range of the aluminum nitride ceramic heat-conducting coating is 20um-45 um.

4. The process of claim 1, wherein in the deposition step of the diamond-like carbon film coating in the SS001 step, the process parameters of the vacuum coating chamber are set as follows, the power supply adopts a high-frequency pulse bias power supply, the voltage is 1kv-4kv, the frequency is 40KHz-60KHz, the duty ratio is 50% -99%, and the thickness range of the diamond-like carbon film coating is 1um-5 um.

5. The production process of the electromagnetic shielding material based on the 5G base station as claimed in claim 1, wherein in the Cu conductive coating deposition process in the SS001 step, the process parameters of the vacuum coating chamber are set as follows, the power supply adopts a high-frequency pulse bias power supply, the voltage is 10KW-20KW, the frequency is 40KHz-60KHz, the duty ratio is 50% -99%, and the thickness range of the Cu conductive coating is 20um-70 um; the deposition time of the Cu conductive coating is 0.5h-1.5 h; and a reducing agent is added into the coating liquid during the preparation of the Cu coating liquid, so that the Cu conductive coating with the oxidation resistance is prepared.

6. The process of claim 1, wherein the metal substrate in the SS001 step is one or more of copper, aluminum, magnesium and their alloys.

7. The process of claim 1, wherein the amorphous fiber is an amorphous cobalt-based fiber or an amorphous iron-based fiber; the parameters of the internal mixer in the SS004 step are set as follows: the banburying temperature is 100-165 ℃, and the banburying frequency is 25-45 Hz; the mixing parameters in the SS004 step are set as follows: the roller speed is 1.5m/min, and the temperature is 150-175 ℃; and (3) the pressure delay time, the temperature parameters of which are set as follows: the roller temperature is 155-175 ℃; the roller speed was 1 m/min.

8. The process for producing an electromagnetic shielding material for a 5G base station according to claim 1, wherein the amorphous fiber is in the form of chips in the SS004 step; the adhesive used in the SS005 step is a composite conductive adhesive.

9. The process of claim 8, wherein the composite conductive adhesive comprises carbon nanotubes, superconducting carbon black and a solvent.

10. The process of claim 8, wherein the thickness of the plated layer in the SS006 step is in the range of 40-60 um.

Technical Field

The invention belongs to the technical field of electromagnetic shielding material processing, and particularly relates to a production process of an electromagnetic shielding material based on a 5G base station.

Background

In recent years, with the continuous development of electronic communication and industrial civilization, the popularization of 5G communication, electronic equipment and wireless communication systems leads to increasingly serious electromagnetic interference and generates larger influence on the normal operation of electronic equipment systems; in addition, more and more electronic and electrical equipment and communication systems are rapidly changed, so that people can quickly and conveniently transmit information and serious electromagnetic pollution is caused, the generated electromagnetic waves are seriously harmful to the working and living environment of people, the ecological environment required by the health and sustainable development of people is seriously influenced, and huge loss is caused to the country; in order to reduce the harm caused by electromagnetic pollution, research on novel electromagnetic shielding composite materials with higher performance has become an important direction for technical development.

At present, the commonly used electromagnetic shielding material is a blend of conductive filler and resin, such as gold, silver, copper or graphite mixed with polymer to improve the conductivity thereof, thereby improving the electromagnetic shielding effect, but the polymer matrix has better electrical insulation property and limited effect of improving the electromagnetic shielding performance; in addition, researchers also blend the soft magnetic material and the polymer to prepare the electromagnetic shielding material, but the electromagnetic shielding effect of the composite material is not ideal enough, and meanwhile, the increase of the filling amount can cause the processing difficulty and influence the mechanical property of the material; in addition, researchers mix and press the granular pore-forming agent and the biomass material for molding, and prepare the shielding material with the low-density and wide-frequency porous composite structure through sintering treatment, but the filling material prepared by the method has limited shielding effect, weak chemical corrosion resistance and poor mechanical property.

For the 5G base station, due to the particularity of the arrangement position, the working principle and the use environment of the base station, the conventional electromagnetic shielding film cannot be used for the use and protection requirements of the base station, and the 5G base station generates a large amount of heat during working and is difficult to avoid severe weather such as rain, snow and the like, so that the market is urgently needed to provide a shielding material for the 5G base station with high heat dissipation, high protection and high conductivity.

Disclosure of Invention

The invention aims to provide a production process of an electromagnetic shielding material based on a 5G base station, which solves the problems of poor usability and poor electromagnetic shielding performance of the existing electromagnetic shielding material based on the 5G base station through the optimization of the production process of the electromagnetic shielding material.

In order to solve the technical problems, the invention is realized by the following technical scheme:

the invention relates to a production process of an electromagnetic shielding material based on a 5G base station, which comprises the following steps:

SS001, preparing a metal base material, preparing the metal base material to be processed, carrying out ultrasonic cleaning on the metal base material by adopting ultrasonic cleaning equipment, and drying the metal base material by adopting ultrasonic equipment after the ultrasonic cleaning is finished;

SS002, addition of a heat conducting layer and a conducting layer, sequentially carrying out ion cleaning, deposition of an aluminum nitride ceramic heat conducting coating, deposition of a diamond-like carbon film coating and deposition of a Cu conducting coating on the metal substrate dried in the step SS001 in a vacuum coating chamber, wherein the substrate processed in the step is the pretreated substrate;

SS003, reprocessing of the base material, punching the base material after the pretreatment in the SS002 step is finished according to set specification parameters, wherein the specification of the plate during punching is matched with that of the base station, and after the punching is finished, adopting a punching and mould pressing process to punch the punched base material into a set shape or a set specification so as to be matched with the shape of the base station;

SS004, preparing an electromagnetic shielding film, selecting a proper amount of amorphous fiber and a proper amount of needle-shaped aluminum to mix, wherein the ratio of the amorphous fiber to the needle-shaped aluminum is 2: 1; placing the two into a mixer, adding a polyaniline conductive adhesive into the mixer after premixing, mixing into slurry, and after the slurry is mixed, placing the slurry into a vacuum drying oven at 75-95 ℃ for drying for 10-15 h; after drying, adding polyamide-6, polypropylene and polycarbonate into the dried material, wherein the ratio of the mass of the polyamide-6 to the mass of the polypropylene to the mass of the polycarbonate to the total mass of the dried material is 1: 2: 1: 20; placing the mixed materials after proportioning into an internal mixer for internal mixing for 2-4 h, mixing the mixture after internal mixing, rolling the mixed materials after mixing, and obtaining the amorphous electromagnetic shielding film after rolling;

SS005, compounding, cutting the amorphous electromagnetic shielding film processed in the SS004 step into a set shape, and compounding the amorphous electromagnetic shielding film on the base material which is processed in the SS003 step through an adhesive;

SS006, electrolytic plating treatment, namely electroplating Ni or Cu on the surface of the compounded electromagnetic shielding film by adopting an electrolytic plating method;

SS007, establishing an insulating protective layer and SS006, coating a layer of thermoplastic resin on the surface of the electroplated electromagnetic film by adopting a roller coating method, coating a layer of hardenable insulating ink on the surface of the thermoplastic resin after the coating is finished, and completing the establishment of the insulating layer after the solidification is finished, wherein the thickness of the thermoplastic resin layer is 2-20 um; the thickness range of the insulating ink layer is 1-10 um, and after the insulating layer is built, the composite electromagnetic shielding substrate is prepared;

SS008, post-processing, and processing the compounded electromagnetic shielding substrate into a set size by adopting a laser cutting process so as to facilitate the post-processing.

Preferably, during the ion cleaning in the SS002 step, the substrate dried in the SS001 step is placed in a vacuum coating process, after the substrate is placed in the vacuum coating chamber, the pressure of the vacuum coating chamber is pumped to a set pressure value, and after the punching is finished, argon with the concentration of 99.9% is flushed into the vacuum coating chamber for protection; after the argon is flushed, starting a high-frequency pulse power supply, wherein the ion cleaning time is 20-30 min; the technological parameters of the high-frequency pulse power supply are set as follows: the voltage range is 2kv-4kv, the frequency is 40KHz-60KHz, and the duty ratio is 50% -99%.

Preferably, when the aluminum nitride ceramic heat-conducting coating is deposited in the SS002 step, the parameters of the vacuum coating chamber are set as follows: pumping the pressure to a set pressure value, flushing argon with the concentration of 99.9 percent into the vacuum coating chamber as protection during deposition, and starting a high-frequency pulse power supply and a medium-frequency sputtering power supply; the technological parameters of the high-frequency pulse power supply are set as follows: the voltage range is 20v-70v, the frequency is 40KHz-60KHz, the duty ratio is 50% -99%, and the deposition time is 4h-5 h; the thickness range of the aluminum nitride ceramic heat-conducting coating is 20um-45 um.

Preferably, in the deposition process of the diamond-like carbon film coating in the SS001 step, the process parameters of the vacuum coating chamber are set as follows, the power supply adopts a high-frequency pulse bias power supply, the voltage is 1kv-4kv, the frequency is 40KHz-60KHz, the duty ratio is 50% -99%, and the thickness range of the diamond-like carbon film coating is 1um-5 um.

Preferably, in the Cu conductive coating deposition procedure in the SS001 step, the process parameters of the vacuum coating chamber are set as follows, a high-frequency pulse bias power supply is adopted as the power supply, the voltage is 10KW-20KW, the frequency is 40KHz-60KHz, the duty ratio is 50% -99%, and the thickness range of the Cu conductive coating is 20um-70 um; the deposition time of the Cu conductive coating is 0.5h-1.5 h; and a reducing agent is added into the coating liquid during the preparation of the Cu coating liquid, so that the Cu conductive coating with the oxidation resistance is prepared.

Preferably, the metal substrate in the SS001 step is a composite material of one or more of copper, aluminum, magnesium and alloys thereof.

Preferably, the amorphous fiber is amorphous cobalt-based fiber or amorphous iron-based fiber; the parameters of the internal mixer in the SS004 step are set as follows: the banburying temperature is 100-165 ℃, and the banburying frequency is 25-45 Hz; the mixing parameters in the SS004 step are set as follows: the roller speed is 1.5m/min, and the temperature is 150-175 ℃; and (3) the pressure delay time, the temperature parameters of which are set as follows: the roller temperature is 155-175 ℃; the roller speed was 1 m/min.

Preferably, the amorphous fiber in the SS004 step is in the form of crumbs; the adhesive used in the SS005 step is a composite conductive adhesive.

Preferably, the composite conductive adhesive comprises carbon nanotubes, superconducting carbon black and a proportioning solvent.

Preferably, the thickness of the plating layer in the SS006 step is in the range of 40um to 60 um.

The invention has the following beneficial effects:

1. the invention changes the traditional surface type electromagnetic shielding into plate type electromagnetic shielding by increasing the conductive and heat conductive coating on the metal substrate, and can effectively increase the protective performance of the device under severe weather such as heat dissipation, electromagnetic shielding, rain, snow and the like on one hand and further can carry out high matching with the use environment of the base station by increasing the high heat conduction and high conductivity on the basis of the plate type electromagnetic shielding, thereby being beneficial to improving the use effect of the base station, and on the other hand, can effectively increase the anti-oxidation protective capability and the insulating performance of the device by increasing the conductive and heat conductive coating and the reducing agent,

2. the electromagnetic shielding film has the advantages that the conductivity of the conductive material and the mutual contact strength of the conductive material can be effectively improved by using the amorphous fiber, the needle-shaped aluminum and the polyaniline lamp conductive adhesive in the electromagnetic shielding film, the electromagnetic shielding film has better conductivity by improving the conductivity and the contact strength, the electromagnetic shielding performance of a shielding body can be improved by the special property of an amorphous substance on one hand, the surface of the electromagnetic shielding film can have a net structure on the other hand, the quality of the electromagnetic shielding film is one third or one half less than that of a single material with the traditional equivalent shielding performance, and the use cost of the electromagnetic shielding film can be greatly reduced by improving the performance.

3. According to the invention, through the preparation of the composite material, on one hand, the advantages of high strength, high toughness and high thermal conductivity of the traditional high thermal conductivity metal substrate material are kept, and on the other hand, the electromagnetic radiation resistance of the substrate material is greatly improved, which is beneficial to the rapid assembly of the 5G base station.

Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic flow chart of a production process of an electromagnetic shielding material for a 5G base station;

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example one

Referring to fig. 1, the present invention is a process for producing an electromagnetic shielding material for a 5G base station, including the following steps:

SS001, preparing a metal base material, preparing the metal base material to be processed, carrying out ultrasonic cleaning on the metal base material by adopting ultrasonic cleaning equipment, drying the metal base material by adopting ultrasonic equipment after the ultrasonic cleaning is finished, and repeating the cleaning process for 2-3 times to enhance the ultrasonic cleaning effect;

SS002, addition of a heat conducting layer and a conducting layer, sequentially carrying out ion cleaning, deposition of an aluminum nitride ceramic heat conducting coating, deposition of a diamond-like carbon film coating and deposition of a Cu conducting coating on the metal substrate dried in the step SS001 in a vacuum coating chamber, wherein the substrate processed in the step is the pretreated substrate;

SS003, reprocessing of the base material, punching the base material after the pretreatment in the SS002 step is finished according to set specification parameters, wherein the specification of the plate during punching is matched with that of the base station, and after the punching is finished, adopting a punching and mould pressing process to punch the punched base material into a set shape or a set specification so as to be matched with the shape of the base station;

SS004, preparing an electromagnetic shielding film, selecting a proper amount of amorphous fiber and a proper amount of needle-shaped aluminum to mix, wherein the ratio of the amorphous fiber to the needle-shaped aluminum is 2: 1; placing the two into a mixer, adding a polyaniline conductive adhesive into the mixer after premixing, mixing to obtain slurry, and placing the slurry into a vacuum drying oven at 75 ℃ for drying for 10 hours after the slurry is mixed; after drying, adding polyamide-6, polypropylene and polycarbonate into the dried material, wherein the ratio of the mass of the polyamide-6 to the mass of the polypropylene to the mass of the polycarbonate to the total mass of the dried material is 1: 2: 1: 20; placing the mixed materials after proportioning into an internal mixer for internal mixing for 2 hours, mixing the mixture after internal mixing, rolling the mixed materials after mixing, and obtaining the amorphous electromagnetic shielding film after rolling;

SS005, compounding, cutting the amorphous electromagnetic shielding film processed in the SS004 step into a set shape, and compounding the amorphous electromagnetic shielding film on the base material which is processed in the SS003 step through an adhesive;

SS006, electrolytic plating treatment, namely electroplating Ni or Cu on the surface of the compounded electromagnetic shielding film by adopting an electrolytic plating method;

after the steps of SS007, establishing an insulating protective layer and SS006 are finished, coating a layer of thermoplastic resin on the surface of the electroplated electromagnetic film by adopting a roller coating method, coating a layer of hardenable insulating ink on the surface of the thermoplastic resin after the coating is finished, and completing the establishment of the insulating layer after the solidification is finished, wherein the thickness of the thermoplastic resin layer is 2 um; the thickness of the insulating ink layer is 3um, and after the insulating layer is built, the composite electromagnetic shielding substrate is prepared;

SS008, post-processing, and processing the compounded electromagnetic shielding substrate into a set size by adopting a laser cutting process so as to facilitate the post-processing.

Further, during the ion cleaning in the step SS002, the substrate after the drying treatment in the step SS001 is placed in the vacuum coating process, after the substrate is placed, the air pressure of the vacuum coating chamber is pumped to a set pressure value, and after the punching is finished, argon with the concentration of 99.9% is flushed into the vacuum coating chamber for protection; after the argon is flushed, a high-frequency pulse power supply is started, and the ion cleaning time is 20 min; the technological parameters of the high-frequency pulse power supply are set as follows: the voltage is 3kv, the frequency is 50KHz, and the duty cycle is 50%.

Further, when the aluminum nitride ceramic heat-conducting coating is deposited in the SS002 step, the parameters of the vacuum coating chamber are set as follows: pumping the pressure to a set pressure value, flushing argon with the concentration of 99.9 percent into the vacuum coating chamber as protection during deposition, and starting a high-frequency pulse power supply and a medium-frequency sputtering power supply; the technological parameters of the high-frequency pulse power supply are set as follows: the voltage is 50v, the frequency is 55KHz, the duty ratio is 70%, and the deposition time is 4.5 h; the thickness of aluminium nitride ceramic heat conduction coating is 35 um.

Furthermore, in the deposition process of the diamond-like carbon film coating in the SS001 step, the process parameters of the vacuum coating chamber are set as follows, the power supply adopts a high-frequency pulse bias power supply, the voltage is 2.5kv, the frequency is 50KHz, the duty ratio is 90%, and the thickness of the diamond-like carbon film coating is 3.5 um.

Furthermore, in the deposition process of the Cu conductive coating in the SS001 step, the process parameters of a vacuum coating chamber are set as follows, a high-frequency pulse bias power supply is adopted as the power supply, the voltage is 10KW, the frequency is 40KHz, the duty ratio is 50%, and the thickness of the Cu conductive coating is 20 um; the deposition time of the Cu conductive coating is 0.5 h; the reducing agent is added into the coating liquid during the preparation of the Cu coating liquid, and the oxidation resistance of the device is increased through the increase of the reducing agent, so that the Cu conductive coating with the oxidation resistance is prepared; the metal substrate in the SS001 step is copper.

Further, the amorphous state fiber is amorphous state cobalt-based fiber; the parameters of the internal mixer in the SS004 step are set as follows: the banburying temperature is 100 ℃, and the banburying frequency is 25 Hz; the mixing parameters in the SS004 step are set as follows: the roller speed is 1.5m/min, and the temperature is 150 ℃; and (3) the pressure delay time, the temperature parameters of which are set as follows: the roll temperature was 155 ℃; the roller speed is 1 m/min; the amorphous fiber in the SS004 step is in a crumb shape; the adhesive adopted in the SS005 step is a composite conductive adhesive; the composite conductive adhesive comprises a carbon nano tube, superconducting carbon black and a proportioning solvent; the thickness of the plating layer in the SS006 step was 40 um.

Example two

SS004, preparing an electromagnetic shielding film, selecting a proper amount of amorphous fiber and a proper amount of needle-shaped aluminum to mix, wherein the ratio of the amorphous fiber to the needle-shaped aluminum is 2: 1; putting the two into a mixer, adding polyaniline conductive binder into the mixer after premixing, mixing into slurry, after the slurry is mixed, putting the slurry into a vacuum drying oven at 85 ℃ for drying for 14h, compared with the first embodiment, the drying effect of the device can be effectively improved by prolonging the drying time, the drying rate of the device can be effectively improved by improving the drying temperature, and after drying is finished, adding polyamide-6, polypropylene and polycarbonate into the dried material, wherein the ratio of the mass of the polyamide-6, the mass of the polypropylene and the mass of the polycarbonate to the total mass of the dried material is 1: 2: 1: 20; the mixed materials after the proportioning are placed into an internal mixer for internal mixing for 4 hours, the internal mixing effect of the mixed materials is further improved through prolonging the internal mixing time, after the internal mixing is finished, the mixture is mixed, after the mixing is finished, the mixed materials are rolled, and after the rolling is finished, the amorphous electromagnetic shielding film is prepared;

after the steps of SS007, establishing an insulating protective layer and SS006 are finished, coating a layer of thermoplastic resin on the surface of the electroplated electromagnetic film by adopting a roller coating method, coating a layer of hardenable insulating ink on the surface of the thermoplastic resin after the coating is finished, and completing the establishment of the insulating layer after the solidification is finished, wherein the thickness of the thermoplastic resin layer is 20 mu m; the thickness of the insulating ink layer is 10 micrometers, compared with the first embodiment, the insulating protective performance of the device can be obviously improved through the thickness of the thermoplastic resin layer and the increase of the insulating ink layer, the specific material of the insulating ink layer can be one of PI resin, epoxy resin, polyurethane, phenolic resin and acrylic resin ink, and the thermoplastic resin layer can be thermoplastic groups of rubber, thermoplastic polyurethane, thermoplastic acrylic resin, polyester, polyamide, polyethylene, polypropylene and polystyrene;

after the insulating layer is built, the composite electromagnetic shielding substrate is prepared, and compared with the first embodiment, in order to improve the coating effect of the thermoplastic resin layer and the insulating ink layer, the roll coating method can be changed into a common coating method such as a slit coating method, a lip coating method, a comma coating method, a blade coating method, a roll coating method, a spray coating method, a bar coating method, a spin coating method, a dip coating method, and the like;

further, the amorphous fiber is an amorphous iron-based fiber; the parameters of the internal mixer in the SS004 step are set as follows: the banburying temperature is 165 ℃ and the banburying frequency is 25 Hz; the mixing parameters in the SS004 step are set as follows: the roller speed is 1.5m/min, and the temperature is 150 ℃; and (3) the pressure delay time, the temperature parameters of which are set as follows: the roll temperature was 175 ℃; the roller speed is 1 m/min; compared with the first embodiment, the preparation effect of the electromagnetic shielding film can be effectively improved by increasing the roller temperature and the banburying temperature;

the amorphous fiber in the SS004 step is in a crumb shape; the adhesive adopted in the SS005 step is a composite conductive adhesive; the composite conductive adhesive comprises a carbon nano tube, superconducting carbon black and a proportioning solvent; the thickness of the electroplated layer in the SS006 step is 60um, and compared with the first embodiment, the electromagnetic shielding performance of the device can be effectively improved through the increase of the thickness of the electroplated layer;

in the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.