阅读说明：本技术 接触探针 (Contact probe ) 是由 佐藤贤一 于 2020-03-24 设计创作，主要内容包括：能够利用于在端子部(81)形成有凹部的半导体封装(80)的检查的、接触探针(10)具有柱塞(10a),该柱塞具有与所述端子部(81)接触的顶端部(11A),所述顶端部(11A)具有：朝向所述端子部(81)突出的突出部(12)；和向所述端子部(81)的突出高度比所述突出部(12)低的肩部(13)。(A contact probe (10) which can be used for inspecting a semiconductor package (80) having a recessed portion formed in a terminal portion (81) has a plunger (10a) having a tip portion (11A) which contacts the terminal portion (81), and the tip portion (11A) has: a protrusion (12) protruding toward the terminal section (81); and a shoulder portion (13) having a height of projection to the terminal portion (81) lower than that of the projection portion (12).)

1. A contact probe usable for an inspection of a semiconductor package having a recessed portion formed in a terminal portion, the contact probe comprising a plunger having a tip portion contacting the terminal portion,

the distal end portion has:

a protrusion portion protruding toward the terminal portion; and

a shoulder portion having a height of projection to the terminal portion lower than the projection portion.

2. The contact probe of claim 1,

the difference between the projection height of the projection and the projection height of the shoulder is smaller than the depth of the recess.

3. The contact probe according to claim 1 or 2,

the distal end portion has a shape in which the cross-sectional area of the probe cross-section decreases toward the distal end.

4. The contact probe according to any one of claims 1 to 3,

the shoulder is present in plurality, located around the projection.

5. The contact probe according to any one of claims 1 to 4,

the protruding end of the protruding part is flat.

6. The contact probe according to any one of claims 1 to 4,

the protruding end of the protruding part is in a mountain shape.

7. The contact probe according to any one of claims 1 to 4,

the protruding end of the protruding part is in a tapered shape.

8. The contact probe according to any one of claims 1 to 4,

the protrusion has a cutout.

9. The contact probe according to any one of claims 1 to 8,

the front end of the shoulder is flat.

10. The contact probe according to any one of claims 1 to 8,

the front end of the shoulder is in an inclined shape.

11. The contact probe according to any one of claims 1 to 8,

the front end of the shoulder part is in a mountain shape.

Technical Field

The present invention relates to a contact probe.

Background

In order to electrically contact a semiconductor package to be inspected with an inspection apparatus, a contact probe and a socket for supporting the contact probe are used. A plurality of contact probes corresponding to terminals provided on the semiconductor package are supported by the socket. When the socket is brought close to a semiconductor package to be inspected, the tip of the contact probe is brought into contact with a terminal on the semiconductor package side to be electrically connected.

For example, patent document 1 discloses a technique relating to a socket capable of narrowing a supporting interval of a contact probe. Patent document 2 discloses a contact probe capable of suppressing the risk of strength reduction of a plunger and the difficulty in pipe processing.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2018-071991

Patent document 2: japanese patent laid-open publication No. 2018-194411

Disclosure of Invention

Some terminals of a semiconductor package to be inspected have a recess as a mark for image inspection in a mounting process. The shape of the recess can be set in various ways depending on the production side of the semiconductor package. One terminal of the semiconductor package has a terminal portion 81 with a dimple (die) as shown in fig. 21. The dimpled terminal portion 81 has a quarter-sphere shaped recess called dimple 82 at the male corner of the terminal. Such a dimpled terminal 81 is used, for example, by a Quad Flat Non-leaded package (QFN) or the like facing a vehicle-mounted device.

Conventionally, in the inspection of a semiconductor package having a terminal portion 81 with a dimple, a contact probe having a plunger with a wedge-shaped tip portion 11J (or a tapered tip) as shown in fig. 22 can be used.

When the inspection is performed using the contact probe having the wedge-shaped distal end portion 11J, the inspection needs to be performed so that the distal end is aimed at and brought into contact with the flat portion of the dimpled terminal portion 81 (the flat portion around the dimple 82). However, as shown in fig. 23, the protruding end of the distal end portion 11J may enter the cavity 82 due to an error or deviation in the positional relationship with the semiconductor package that is transported and set for inspection. In this case, if the inside of the socket 82 is in a clean state without dust, even if the protruding end of the distal end portion 11J contacts the inner surface of the socket 82 or the inclined portion of the distal end portion 11J contacts the periphery of the socket 82, the conduction between the distal end portion 11J and the terminal portion 81 with the socket can be ensured.

However, the interior of the recess 82 is not guaranteed to be in a dust-free clean condition. In the production process of a semiconductor package, there is a step of forming a surface by cutting the surface where the terminals are exposed, for each mold material. Although cleaning is performed after cutting, since the size of the recess 82 is extremely small, cutting powder may remain in the recess 82 during cutting. If the tip of the tip portion 11J enters the recess 82 with the cutting powder remaining in the recess 82, the normal conduction is hindered by the cutting powder, and an accurate inspection result may not be obtained.

Therefore, it is considered to use a plunger whose protruding end has a tip end portion 11K formed only by a flat surface having a width such as to straddle the dimple 82, although the plunger is wedge-shaped when viewed from the side, as shown in fig. 24. In this case, since the protruding end of the distal end portion 11K does not enter the inside of the dimple 82 and passes over the dimple 82, it is considered that the inspection can be performed by achieving conduction between the distal end portion 11K and the dimpled terminal portion 81 regardless of the state inside the dimple 82. However, there is a problem in this case.

An error or deviation occurs in the positional relationship between the tip end portion 11K and the semiconductor package that is carried and set for inspection. If a displacement occurs in the contact position between the distal end portion 11K and the female terminal portion 81, a part of the flat surface of the distal end portion 11K may come off the female terminal portion 81 and come into contact with the mold around the female terminal portion 81. The mold mostly contains glass fibers. When the tip portion 11K is brought into contact with the mold, the tip portion 11K of the plunger wears more than when it is brought into contact with the dimpled terminal portion 81, and the life of the contact probe becomes shorter. In addition, contact with the mold may not lead to accurate inspection results.

An example of an object of the present invention is to provide a technique of a contact probe suitable for inspection of a semiconductor package having a recessed portion formed in a terminal portion.

One aspect of the present invention is a contact probe usable for inspection of a semiconductor package having a recessed portion formed in a terminal portion, the contact probe including a plunger having a distal end portion that contacts the terminal portion, the distal end portion including: a protrusion portion protruding toward the terminal portion; and a shoulder portion having a height of projection to the terminal portion lower than the projection portion.

According to this aspect, when the contact probe is brought into contact with the terminal portion, the protruding portion enters the recessed portion, and the shoulder portion comes into contact with the outer peripheral portion of the recessed portion of the terminal portion (the flat surface around the recessed portion of the terminal portion). Thus, even if foreign matter such as dust and cutting powder remains in the recessed portion, and the foreign matter is sandwiched between the protruding portion and the recessed portion, the shoulder portion and the terminal portion can be brought into contact with each other, whereby conduction (electrical connection) between the contact probe and the terminal portion can be ensured, and accurate inspection can be performed. Further, according to this aspect, the shoulder portion is less likely to come into contact with the mold around the terminal portion, and thus the life of the contact probe can be extended. A contact probe suitable for inspection of a semiconductor package having a recessed portion formed in a terminal portion can be realized.

In addition, even when the contact probe according to the present embodiment is used for inspection of a semiconductor package having a flat terminal portion without a recessed portion, the protrusion portion is brought into contact with the terminal portion to ensure conduction between the contact probe and the terminal portion, and thus accurate inspection can be performed.

Drawings

Fig. 1 is a perspective view showing the inspection of a contact probe and a semiconductor package according to embodiment 1.

FIG. 2 is an enlarged perspective view of the distal end portion of the contact probe according to embodiment 1.

FIG. 3 is a front view of the distal end portion of the contact probe according to embodiment 1, as viewed from a direction orthogonal to the probe axis.

Fig. 4 (a) is a view showing a state where the tip end portion of embodiment 1 is brought into contact with the terminal portion with the dimple in a positional relationship where the protruding portion enters the recessed portion.

Fig. 5 is a diagram (second diagram) showing a state in which the tip end portion of embodiment 1 is brought into contact with the terminal portion with a dimple in a positional relationship in which the protruding portion enters the recessed portion.

Fig. 6 (a) is a view showing a state where the tip end portion of embodiment 1 is brought into contact with the terminal portion with a dimple in a positional relationship where the protruding portion is separated from the recessed portion.

Fig. 7 is a diagram (second diagram) showing a state in which the distal end portion of embodiment 1 is brought into contact with the terminal portion with a dimple in a positional relationship in which the protruding portion is disengaged from the recessed portion.

FIG. 8 is a perspective view showing the appearance of a Kelvin test using a contact probe having a tip portion according to embodiment 1.

FIG. 9 is an enlarged perspective view of the distal end portion of the contact probe according to embodiment 2.

FIG. 10 is a front view of the distal end portion of the contact probe according to embodiment 2 as viewed from a direction orthogonal to the probe axis.

Fig. 11 is a diagram showing a state in which the tip end portion of embodiment 2 is brought into contact with the terminal portion with a dimple in a positional relationship in which the protruding end portion enters the recessed portion.

FIG. 12 is an enlarged perspective view of the distal end portion of the contact probe according to embodiment 3.

FIG. 13 is a front view of the distal end portion of the contact probe according to embodiment 3 as viewed from a direction perpendicular to the probe axis.

Fig. 14 is a diagram showing a state in which the tip end portion of embodiment 3 is brought into contact with the dimpled terminal portion in a positional relationship in which the protruding portion enters the recessed portion.

FIG. 15 shows a modification of the distal end portion of the contact probe according to embodiment 1.

FIG. 16 is a view showing a modification of the distal end portion of the contact probe according to embodiment 1.

FIG. 17 is a view showing a modification of the distal end portion of the contact probe according to embodiment 2.

FIG. 18 is a view showing a modification of the distal end portion of the contact probe according to embodiment 3.

FIG. 19 is a view showing a modification of the distal end portion of the contact probe.

FIG. 20 is a view showing a modification of the distal end portion of the contact probe.

Fig. 21 is a perspective view showing an example of the terminal portion with the dimple.

FIG. 22 is (a) an enlarged perspective view of the distal end portion of a conventional contact probe.

Fig. 23 is a diagram showing a state in which a conventional contact probe is brought into contact with a dimpled terminal portion.

FIG. 24 is an enlarged perspective view of the distal end portion of a conventional contact probe (second embodiment).

Detailed Description

Hereinafter, preferred embodiments of the present invention will be described, but the direction in which the present invention can be applied is not limited to the following embodiments. In the drawings in which the distal end portion of the contact probe is enlarged, three orthogonal axes for showing the common direction in the drawings are shown. The Z-axis of the three orthogonal axes indicates a direction parallel to the axis (longitudinal direction) of the contact probe, and the Z-axis normal direction is a direction from the contact probe toward the semiconductor package. The explanation will be given with the X-axis positive direction as the front direction, the X-axis negative direction as the rear direction, the Y-axis positive direction as the right direction, and the Y-axis negative direction as the left direction.

[ 1 st embodiment ]

Fig. 1 is a perspective view showing the inspection of a contact probe and a semiconductor package according to embodiment 1.

The contact probe 10 is designed to be usable for inspection of the semiconductor package 80.

The semiconductor package 80 is a leadless semiconductor package having a terminal portion 81 with a dimple as a connection terminal to be soldered to a mounting board. In fig. 1, a portion indicated by a grid line around the dimpled terminal portion 81 is a mold.

Fig. 2 is an enlarged perspective view of the distal end portion 11A of the contact probe 10 (corresponding to the lower end portion of the contact probe 10 shown in fig. 1). More specifically, the distal end portion 11A abuts against a distal end portion of a plunger 10a (see fig. 1) included in the contact probe 10.

Fig. 3 is a front view (a view showing a surface facing the X-axis direction) of the distal end portion 11A of the touch probe 10 as viewed from a direction (X-axis direction) orthogonal to the probe axis Sp (an axis in the longitudinal direction of the touch probe 10).

The distal end portion 11A of the contact probe 10 includes: 1) a protrusion 12 protruding in the distal direction (Z-axis direction) and located away from the probe center when viewed from the front; and 2) a shoulder 13 having a lower projection height in the front end direction than the projection 12. The term "front end front view" as used herein means a visual line direction in which the distal end portion 11A is viewed from the axial direction of the probe axis Sp (Z-axis forward direction) as shown in fig. 2.

The front surface 14F (surface facing the positive X-axis direction) and the back surface 14B (surface facing the negative X-axis direction) of the distal end portion 11A are configured to be left as they are as part of the side surfaces of the column that is the basic shape of the plunger 10 a. A flat surface 14R and a flat surface 14L are formed on the left and right side surfaces (surfaces facing the Y-axis positive direction and the Y-axis negative direction) of the distal end portion 11A, respectively. The tip portion 11A has an inclined surface 15 formed from the rear surface 14B toward the front surface 14F of the tip portion so that the cross-sectional area of the probe cross-section S (the cross-section with the normal line directed in the Z-axis direction) decreases toward the tip.

The projection 12 and the shoulder 13 are formed on the inclined upper portion of the inclined surface 15 at a position offset from the probe center (the position of the probe axis Sp) toward the X-axis positive direction when viewed from the front end front.

The protruding end of the protruding portion 12 is flat with a normal line parallel to the probe axis Sp.

The tip of the shoulder 13 is also flat with a normal parallel to the probe axis Sp, as in the case of the protrusion 12.

When the tip end portion 11A is viewed from the front, the shoulder portions 13 are located on both sides across the protruding portion 12 in the circumferential direction. The distal end portion 11A may be a convex layered shape having shoulders 13 formed on both sides of one protruding portion 12. The shoulder 13 is present in plural number, and is located around the projection 12. When the distal end portion 11A is viewed from the left (negative Y-axis direction) or right (positive Y-axis direction), it has a one-way wedge shape.

Fig. 4 and 5 are views showing a state in which the tip end portion 11A is brought into contact with the dimpled terminal portion 81 in a positional relationship in which the protruding portion 12 enters the dimple 82 (concave portion) of the dimpled terminal portion 81. Specifically, fig. 4 is a diagram of the distal end portion 11A as viewed obliquely from the rear, and fig. 5 is a diagram of the terminal portion 81 with a dimple as viewed from the package outer peripheral direction (the back surface side of the distal end portion 11A).

The tip portion 11A is configured as follows: when the protruding portion 12 is moved toward the dimple 82 of the dimpled terminal portion 81, the shoulder portion 13 comes into contact with the periphery of the dimple 82 of the dimpled terminal portion 81 (a flat portion of the dimpled terminal portion 81, a flat portion of the periphery of the dimple 82) before the protruding end of the protruding portion 12 reaches the bottom of the dimple 82.

Specifically, the left-right width (width in the Y axis direction) of the protruding portion 12 is set smaller than the left-right width (diameter of the ball if the dimple 82 is a quarter-sphere-shaped recess portion) of the dimple 82 of the dimpled terminal portion 81 of the semiconductor package 80 to be inspected. The convex dimension (height in the Z-axis direction from the shoulder 13: level difference height) of the protruding portion 12 is set smaller than the maximum depth (radius of the ball if the dimple 82 is a quarter-sphere shaped recess) of the dimpled terminal portion 81 from the flat surface at the periphery of the dimple 82 to the bottom surface of the dimple 82. That is, the difference between the projection height of the projecting end of the projecting portion 12 and the projection height of the shoulder portion 13 is set smaller than the maximum depth of the dimple 82.

Therefore, when the contact probe 10 approaches the dimpled terminal portion 81 in a positional relationship in which the protruding portion 12 enters the dimple 82, and the shoulder portion 13 abuts against a flat surface on the periphery of the dimple 82. Thus, even if foreign matter remains in the dimple 82, the shoulder portion 13 is in direct contact with the flat surface of the dimpled terminal portion 81 around the dimple 82 to reliably conduct, and the semiconductor package 80 can be accurately inspected regardless of the presence or absence of foreign matter in the dimple 82.

The dimple 82 of the present embodiment has a shape of a substantially quarter sphere (substantially 1/4 sphere) that opens in both directions on the side where the contact probe 10 contacts and the outer peripheral side of the four sides of the package. Thus, the protruding portion 12 can push out foreign matter remaining in the recess 82 from the recess 82 by entering into the recess 82.

Fig. 6 and 7 are views showing a state in which the tip end portion 11A is brought into contact with the terminal portion 81 with a dimple in a positional relationship in which the protruding portion 12 is disengaged from the dimple 82. Fig. 6 is a diagram of the distal end portion 11A as viewed obliquely from the rear, and fig. 7 is a diagram of the dimpled terminal portion 81 as viewed from the package outer peripheral direction (the back side of the distal end portion 11A).

In the present embodiment, the distal end portion 11A is configured as follows: when the protruding portion 12 is moved toward the dimple 82, the shoulder portion 13 comes into contact with the periphery of the dimple 82 of the terminal portion 11A before the protruding end of the protruding portion 12 reaches the bottom of the dimple 82. When the projecting portion 12 is in a positional relationship of being separated from the dimple 82, the projecting portion 12 is brought into direct contact with the flat surface on the periphery of the dimple 82 to be electrically connected. The semiconductor packages 80 that are carried and placed for inspection cannot be always placed at the correct same positions, and errors and variations in the placement positions occur. Therefore, there is a possibility that the test is performed with the tip end portion 11A being in contact with the dimpled terminal portion 81 in a positional relationship where the protruding portion 12 is disengaged from the dimple 82. However, even in this case, the protrusion 12 is in direct contact with the flat surface around the dimple 82, and reliable conduction is achieved.

Focusing on the shoulder portions 13, the shoulder portions 13 on either the left or right side overflow from the dimpled terminal portions 81, but the shoulder portions 13 do not contact the mold portion (the portion of the mold around the dimpled terminal portions 81) because the protruding height of the shoulder portions 13 is lower than the protruding height of the protruding portions 12. The material forming the mold part often contains a glass fiber material. In the manufacturing process of the semiconductor package 80, the contact surface between the contact probes is sometimes cut together with the mold portion and the dimpled terminal portion 81 to form a flat surface. In this case, if the shoulder portion 13 comes into contact with the surface of the mold portion, the shoulder portion 13 wears as if it comes into contact with sandpaper, and more wear occurs than when the shoulder portion 13 comes into contact with the flat portion (flat surface) of the dimpled terminal portion 81. However, in the present embodiment, since the shoulder portion 13 is kept away from the mold portion, such a loss does not occur.

FIG. 8 is a perspective view showing a Kelvin test using a contact probe having a tip portion 11A. The 1 st contact probe 10a and the 2 nd contact probe 10b are brought into contact with respect to one dimpled terminal portion 81.

As described above, the projection 12 and the shoulder 13 are formed at positions offset from the probe center when the tip is viewed from the front. Therefore, when the 1 st contact probe 10a and the 2 nd contact probe 10b are brought into a relative posture in which the respective protruding portions 12 are brought together (in other words, a relative posture in which the respective front surfaces 14F are opposed to each other in a back-to-back manner), it is possible to perform the kelvin test by simultaneously bringing the two probes into contact with the extremely small dimpled terminal portions 81.

[ 2 nd embodiment ]

Next, embodiment 2 will be explained. The same elements as those in embodiment 1 are denoted by the same reference numerals as those in embodiment 1, and redundant description thereof is omitted.

FIG. 9 is an enlarged perspective view of the distal end portion 11B of the contact probe 10 according to embodiment 2.

Fig. 10 is a front view (a view showing a plane facing the X-axis direction) of the distal end portion 11B of the touch probe 10 according to embodiment 2, as viewed from a direction (X-axis direction) orthogonal to the probe axis Sp (an axis in the longitudinal direction of the touch probe 10).

The tip portion 11B is also formed in the following shape: similarly to the tip end portion 11A, when the protruding portion 12 is moved toward the dimple 82, the shoulder portion 13B contacts the periphery of the dimple 82 of the dimpled terminal portion 81 before the protruding end of the protruding portion 12 reaches the bottom of the dimple 82.

Specifically, the distal end portion 11B has a shape such that the cross-sectional area of the probe cross-section S decreases toward the distal end. The protruding end of the protruding portion 12 is flat with a normal line parallel to the probe axis Sp. However, the tip of the shoulder 13B of the tip portion 11B is inclined. The shoulder portion 13B has an inclination direction and an inclination angle parallel to the inclined surface 15, and an intersection with the front surface 14F, i.e., a front end, is inclined. The maximum value of the difference between the projection height of the projecting end of the projecting portion 12 and the projection height of the shoulder portion 13B is set smaller than the maximum depth of the dimple 82. The shoulder portion 13B may be inclined in a direction opposite to the inclined direction of the inclined surface 15.

Fig. 11 is a diagram showing a state where the tip end portion 11B is brought into contact with the terminal portion 81 with a dimple in a positional relationship where the protruding portion 12 enters the dimple 82, and is a diagram of the terminal portion 81 with a dimple as viewed from the outer peripheral direction of the package (the back surface side of the tip end portion 11B).

The protrusion 12 enters the dimple 82 without contacting the inner surface of the dimple 82, but the shoulder 13B makes point contact with the outer peripheral edge of the dimple 82 to ensure conduction. Thus, embodiment 2 can also obtain the same effects as embodiment 1. While the shoulder portion 13 is in surface contact or line contact with the dimpled terminal portion 81 in embodiment 1, the shoulder portion 13B is in point contact in embodiment 2, and therefore the possibility of trapping foreign matter is lower than in embodiment 1. Therefore, in embodiment 2, there is a possibility that more accurate inspection results than in embodiment 1 can be obtained. Embodiment 2 can also perform the kelvin test as in embodiment 1.

[ 3 rd embodiment ]

Next, embodiment 3 will be described. The same elements as those in embodiment 1 or embodiment 2 are denoted by the same reference numerals, and redundant description thereof is omitted.

FIG. 12 is an enlarged perspective view of the distal end portion 11C of the contact probe 10 according to embodiment 3.

Fig. 13 is a front view (a view showing a surface facing the X-axis direction) of the distal end portion 11C of the touch probe 10 as viewed from a direction (X-axis direction) orthogonal to the probe axis Sp (an axis in the longitudinal direction of the touch probe 10).

The tip portion 11C is also formed in the following shape: similarly to the tip end portion 11A and the tip end portion 11B, when the protruding portion 12C is moved toward the dimple 82, the shoulder portion 13C contacts the periphery of the dimple 82 of the dimpled terminal portion 81 before the protruding end of the protruding portion 12C reaches the bottom of the dimple 82. That is, the maximum value of the difference between the projection height of the projecting end of the projecting portion 12C and the projection height of the shoulder portion 13C is set smaller than the maximum depth of the dimple 82.

The distal end portion 11C has a shape in which the cross-sectional area of the probe cross-section decreases toward the distal end. When the projection 12C is viewed from the front in the X-axis direction, the projection end thereof has a mountain shape, and the tip end thereof forms one ridge line in the front-rear direction (direction along the X-axis direction). When the shoulder portion 13C is viewed from the front, the projecting end thereof is also in a mountain shape, and the tip thereof is also formed with one ridge line in the front-rear direction.

Fig. 14 is a diagram showing a state where the tip end portion 11C is brought into contact with the dimpled terminal portion 81 in a positional relationship where the protruding portion 12C enters the dimple 82, and is a diagram of the dimpled terminal portion 81 as viewed from the package outer circumferential direction (the back surface side of the tip end portion 11C).

The protrusion 12C enters the dimple 82 without contacting the inner surface of the dimple 82, but the shoulder 13C makes point contact with the outer edge portion of the dimple 82 (the flat surface of the periphery of the dimple 82) to ensure conduction. Thus, embodiment 3 can also obtain the same effects as embodiment 1. In addition, also in embodiment 3, the shoulder portion 13C is in point contact with the dimpled terminal portion 81 as in embodiment 2, and therefore the possibility of trapping foreign matter is lower than in embodiment 1. Therefore, in embodiment 3, there is a possibility that more accurate inspection results than in embodiment 1 can be obtained. Embodiment 3 can also perform the kelvin test as in embodiment 1 and embodiment 2.

While several embodiments have been described above, the embodiments to which the present invention can be applied are not limited to the above-described embodiments, and addition, omission, and modification of the components can be appropriately performed.

For example, in the tip portion 11A of embodiment 1, the area of the protruding portion 12D may be made smaller than that of the protruding portion 12 of embodiment 1, as in the tip portion 11D shown in fig. 15. Further, the tip of the protruding portion 12D may be tapered to have a tapered shape so as to eliminate the flat surface.

Further, for example, in the distal end portion 11A of embodiment 1, a V-shaped cutout portion 125 along the front-rear direction (X-axis direction) may be provided in the center portion in the left-right direction (Y-axis direction center portion) of the protruding portion 12E, as in the distal end portion 11E shown in fig. 16. The left and right projecting end surfaces 121 with the cutouts 125 therebetween are end surfaces obtained by removing the cutouts 125 from the projecting portions 12 of embodiment 1. The area of the leading end when the protruding portion 12E enters the dimple 82 (concave portion) is the area of the protruding end surface 121, and thus is smaller than the end surface of the protruding portion 12 of embodiment 1. The volume of the projection 12E is smaller than that of the projection 12 of embodiment 1, corresponding to the portion of the cutout 125. Therefore, when foreign matter remains in the dimples 82, the protruding portions 12E do not interfere with each other even when the protruding portions 12 of embodiment 1 interfere with each other due to the size and amount of the foreign matter. The protruding portion 12E is less susceptible to the influence of foreign matter than the protruding portion 12 of embodiment 1.

In the positional relationship in which the protruding portion 12E is disengaged from the dimple 82, when the tip end portion 11E contacts the dimpled terminal portion 81, the contact area is the area of the protruding end surface 121, and therefore, in this case, the protruding portion 12E has a lower possibility of trapping foreign matter than the protruding portion 12 of embodiment 1.

Similarly, for example, in the distal end portion 11B of embodiment 2, a V-shaped cutout portion 125 extending in the front-rear direction (X-axis direction) may be provided in the center portion in the left-right direction (Y-axis direction center portion) of the protruding portion 12F, as in the distal end portion 11F shown in fig. 17. The left and right projecting end surfaces 121 with the cutouts 125 therebetween are end surfaces obtained by removing the cutouts 125 from the projecting portions 12 of embodiment 2.

The shape of the cutout 125 is not limited to the V shape, and may be an arc shape in cross section. The shape of the cutout 125 may be applied as long as it is a groove shape in the longitudinal direction (X-axis direction) of the protruding portions 12E and 12F.

In the distal end portion 11E shown in fig. 16 and the distal end portion 11F shown in fig. 17, the projecting end surface 121 may be a flat surface or may be a ridge-like shape in which the width in the Y-axis direction is extremely reduced depending on the size of the cutout portion 125.

Similarly, the cutout 125 may be provided also in the protruding portion 12D in fig. 15.

Further, for example, in the tip portion 11C of embodiment 3, the ridge of the protruding end of the protruding portion 12H may be narrowed to a point and the protruding portion 12H may be tapered as in the tip portion 11H shown in fig. 18.

Similarly, in the tip portion 11E shown in fig. 16, the length in the X axis direction of both the projecting end surfaces 121 (ridge line portions) of the projecting end of the projecting portion 12E may be shortened, and the projecting end surfaces 121 may be tapered like the projecting portion 12H of the tip portion 11H shown in fig. 18. The width of the protruding end surface 121 in the Y-axis direction and the length of the protruding end surface in the X-axis direction are narrowed to the limit.

Similarly, in the tip portion 11F shown in fig. 17, the length in the X axis direction of both the projecting end surfaces 121 (ridge line portions) of the projecting end of the projecting portion 12F may be shortened, and the projecting end surfaces 121 may be tapered like the projecting portion 12H of the tip portion 11H shown in fig. 18. The width of the protruding end surface 121 in the Y-axis direction and the length of the protruding end surface in the X-axis direction are narrowed to the limit.

Further, the protrusion 12 may be provided on an extension line of the probe shaft Sp as in the distal end portion 11L in fig. 19 and the distal end portion 11M in fig. 20. In the distal end portion 11L of fig. 19, the protrusion 12 has a conical shape such that the apex is located on the extension of the probe axis Sp. In the distal end portion 11M of fig. 20, the protrusion portion 12 has a truncated cone shape in which an extension line of the probe axis Sp is a rotation axis.

The disclosure of the present specification can be summarized as follows.

An aspect of the present disclosure is a contact probe usable for an inspection of a semiconductor package having a recessed portion formed in a terminal portion, the contact probe including a plunger having a distal end portion that contacts the terminal portion, the distal end portion including: a protrusion portion protruding toward the terminal portion; and a shoulder portion having a height of projection to the terminal portion lower than the projection portion.

According to this aspect, when the contact probe is brought into contact with the terminal portion, the protruding portion enters the recessed portion, and the shoulder portion comes into contact with the outer peripheral portion of the recessed portion of the terminal portion (the flat surface around the recessed portion of the terminal portion). Thus, even if foreign matter such as dust and cutting powder remains in the recessed portion, and the foreign matter is sandwiched between the protruding portion and the recessed portion, the shoulder portion and the terminal portion can be brought into contact with each other, whereby conduction (electrical connection) between the contact probe and the terminal portion can be ensured, and accurate inspection can be performed. Further, according to this aspect, the shoulder portion is less likely to come into contact with the mold around the terminal portion, and thus the life of the contact probe can be extended. A contact probe suitable for inspection of a semiconductor package having a recessed portion formed in a terminal portion can be realized.

In addition, even when the contact probe according to the present embodiment is used for inspection of a semiconductor package having a flat terminal portion without a recessed portion, the protruding portion is brought into contact with the terminal portion to secure conduction, and thus accurate inspection can be performed.

The difference between the projection height of the projecting end of the projecting portion and the projection height of the shoulder portion may be smaller than the depth of the recess.

Thus, even if foreign matter is present in the recess, conduction by the shoulder can be ensured.

The distal end portion may have a shape in which the cross-sectional area of the probe cross-section decreases toward the distal end.

Thus, the tip of the contact probe can be formed into a shape having a smaller cross-sectional area toward the tip. If the number of the protruding portions at the tip is one, the tip becomes narrower as a whole. Since the area of contact between the contact probe and the terminal portion is reduced, the contact pressure per unit area can be increased to achieve reliable contact. Further, by disposing the projecting portions offset from the probe centers when the tip is viewed from the front, it is easy to perform a so-called kelvin test in which the projecting portions of two contact probes are brought into contact with one terminal portion to measure.

The shoulder may be provided in plurality and may be located around the projection.

This makes it easy to ensure conduction by the shoulder portion regardless of the direction in which the protruding portion is displaced with respect to the recessed portion.

The protruding end of the protruding portion may have a flat shape.

Thus, the contact probe can be used for inspection of a semiconductor package having a flat terminal portion without a recessed portion, and the protruding portion can be easily brought into surface contact or line contact with the terminal portion, thereby easily securing conduction.

The protruding end of the protruding portion may have a mountain shape.

The protruding end of the protruding portion may have a tapered shape.

The protrusion may have a cutout.

The front end of the shoulder may have a flat shape.

This facilitates surface contact or line contact between the shoulder and the outer periphery of the recessed portion of the terminal portion, thereby facilitating secure conduction.

The front end of the shoulder may be inclined.

The tip of the shoulder may have a chevron shape.

This facilitates point contact in contact between the shoulder portion and the outer peripheral portion of the recessed portion of the terminal portion, and reduces the possibility of foreign matter being caught at the contact position as compared with the case of surface contact and line contact.

Description of the reference numerals

10 … contact probe

11A, 11B, 11C, 11D, 11E, 11J, 11K, 11L, 11M … Top end portion

12, 12C, 12D, 12E … projection

Shoulder 13, 13B, 13C …

14B … back

14F … front surface 14L … plane 14R … plane 15 … inclined plane 80 … semiconductor package 81 … dimpled terminal portions 82 … dimple (recess) S … Probe Cross section Sp … Probe shaft.