阅读说明：本技术 一种电路板的液压铣切装置及铣切方法 (Hydraulic milling device and method for circuit board ) 是由 周进群 唐昌胜 于 2020-05-29 设计创作，主要内容包括：本申请公开了一种电路板的液压铣切装置及铣切方法。液压铣切装置包括：耦接的第一控制器、供液机构以及铣切组件,供液机构经第一控制器与铣切组件耦接；供液机构包括至少两个容置空间,其中两个容置空间分别用于容置不同的切割液；铣切组件包括铣切喷头,铣切喷头与供液机构相连通,铣切喷头用于将供液机构提供的切割液喷向待加工电路板,以对待加工电路板进行铣切；第一控制器用于根据待加工电路板的铣切信息确定与铣切信息相匹配的切割液,并将铣切喷头与设置有与铣切信息相匹配的切割液的容置空间相连通。本申请通过上述液压铣切装置,可以对待加工电路板匹配相适应的切割液,从而提高对待加工电路板的铣切效果。(The application discloses a hydraulic milling device and a hydraulic milling method for a circuit board. The hydraulic milling device comprises: the milling assembly is coupled with the liquid supply mechanism through the first controller; the liquid supply mechanism comprises at least two accommodating spaces, wherein the two accommodating spaces are respectively used for accommodating different cutting liquids; the milling assembly comprises a milling spray head, the milling spray head is communicated with the liquid supply mechanism, and the milling spray head is used for spraying cutting liquid provided by the liquid supply mechanism to the circuit board to be processed so as to mill the circuit board to be processed; the first controller is used for determining cutting fluid matched with the milling information according to the milling information of the circuit board to be processed, and communicating the milling spray head with the accommodating space provided with the cutting fluid matched with the milling information. This application can treat the cutting fluid that the processing circuit board matches and suit through above-mentioned hydraulic milling device to the milling effect of processing circuit board is treated in the improvement.)

1. A hydraulic milling apparatus for a circuit board, the hydraulic milling apparatus comprising:

the milling device comprises a first controller, a liquid supply mechanism and a milling assembly which are coupled, wherein the liquid supply mechanism is coupled with the milling assembly through the first controller;

the liquid supply mechanism comprises at least two accommodating spaces, wherein the two accommodating spaces are respectively used for accommodating different cutting liquids;

the milling assembly comprises a milling spray head, the milling spray head is communicated with the liquid supply mechanism, and the milling spray head is used for spraying the cutting liquid provided by the liquid supply mechanism to a circuit board to be processed so as to perform milling operation on the circuit board to be processed;

the first controller is used for determining cutting fluid matched with the milling information according to the milling information of the circuit board to be processed, and communicating the milling sprayer with the accommodating space provided with the cutting fluid matched with the milling information.

2. The hydraulic milling apparatus of claim 1, further comprising a sensing mechanism disposed adjacent the milling assembly;

the induction mechanism is used for detecting the circuit board to be processed so as to acquire the milling information;

the milling information comprises at least one of the thickness and the material of the circuit board to be processed and whether the milling position of the circuit board to be processed is provided with a conductive circuit.

3. Hydraulic milling apparatus according to claim 1,

the cutting fluid comprises water or a suspension of water and an additive; the two accommodating spaces are respectively used for accommodating water and suspension liquid of water and additives;

wherein the additive comprises any one of brown corundum, white corundum, microcrystalline corundum, silicon carbide and cubic boron nitride; or

The additive comprises a mixture of at least two of brown corundum, white corundum, microcrystalline corundum, silicon carbide and cubic boron nitride.

4. Hydraulic milling apparatus according to claim 3,

and a stirring mechanism is arranged in the accommodating space for accommodating the suspension of the water and the additive, and is used for stirring the suspension of the water and the additive.

5. Hydraulic milling apparatus according to claim 4,

the liquid supply mechanism comprises a plurality of accommodating spaces, the suspension of the water and the additive forms a plurality of different cutting liquids, the plurality of different cutting liquids are respectively arranged in the different accommodating spaces, and each accommodating space is internally provided with a stirring mechanism which is used for stirring the cutting liquids in the accommodating spaces;

the stirring mechanism in each accommodating space is in communication connection with the first control device, and the first control device is used for controlling the operation of the stirring mechanism.

6. Hydraulic milling apparatus according to any one of claims 1-5,

the hydraulic milling device further comprises a liquid pumping device, a second controller and a valve;

the liquid supply mechanism is communicated with the milling spray head through the first controller, the liquid pumping device, the second controller and a valve in sequence;

the liquid pumping device is used for pressurizing the cutting liquid passing through the liquid pumping device;

the second controller is used for calling preset control parameters according to the milling information so as to control the milling spray head to perform milling operation on the circuit board to be processed according to the control parameters;

the valve is used for controlling the on-off of a liquid conveying pipeline between the second controller and the milling sprayer.

7. The hydraulic milling apparatus of claim 6, wherein the control parameters include: the height of the milling spray head from the circuit board to be processed, the diameter of a nozzle of the milling spray head, the jet pressure of the milling spray head, the moving speed of the milling spray head and the jet incident angle of the milling spray head.

8. Hydraulic milling apparatus according to claim 7,

the hydraulic milling device also comprises a supercharger and a hydraulic device, wherein the supercharger is connected to the second controller and is used for increasing the liquid flow pressure of the cutting liquid; the hydraulic device is connected between the second controller and the pressure booster, the second controller is connected with the pressure booster through the hydraulic device, and the second controller is used for detecting the pressure of the liquid flow.

9. A hydraulic milling method for a circuit board is characterized by comprising the following steps:

acquiring milling information of a circuit board to be processed through an induction mechanism;

matching cutting fluid matched with the milling information according to the milling information through a first controller;

and controlling a liquid supply mechanism to provide cutting liquid matched with the milling information through a first controller to mill the circuit board to be processed.

10. Hydraulic milling method according to claim 9,

the acquiring of the milling information of the circuit board to be processed through the sensing mechanism specifically comprises:

and acquiring at least one of the thickness, the laminated board layer number and the material of the circuit board to be processed and whether the milling position of the circuit board to be processed is provided with a conductive circuit.

Technical Field

The application relates to the technical field of hydraulic milling devices, in particular to a hydraulic milling device and a hydraulic milling method for a circuit board.

Background

The water jet cutter is a cutting technique using water as a cutting tool, which is a tool for cutting an article by pressurizing water in one direction and jetting high-pressure water flow, and has been originally originated in the united states and used in the aerospace military industry. It is preferred that the cold cutting does not change the physicochemical properties of the material.

In the existing circuit board production process, a water jet cutter is also often adopted to mill the circuit board. However, the existing printed circuit board is usually formed by sequentially and alternately stacking a plurality of base layers and conductive circuit layers, and because the base layers and the conductive circuit layers are made of different materials, when the printed circuit board is cut, the cutting efficiency and the cutting ability of the water jet cutter to the base layers and the conductive circuit layers are different, so that sawteeth of a certain degree can be formed on the cut surface of the circuit board.

Disclosure of Invention

The application provides a hydraulic milling device and a hydraulic milling method for a circuit board, which aim to solve the problems.

In order to solve the technical problem, the application adopts a technical scheme that: there is provided a hydraulic milling apparatus for a circuit board, the hydraulic milling apparatus comprising:

the milling device comprises a first controller, a liquid supply mechanism and a milling assembly which are coupled, wherein the liquid supply mechanism is coupled with the milling assembly through the first controller;

the liquid supply mechanism comprises at least two accommodating spaces, wherein the two accommodating spaces are respectively used for accommodating different cutting liquids;

the milling assembly comprises a milling spray head, the milling spray head is communicated with the liquid supply mechanism, and the milling spray head is used for spraying the cutting liquid provided by the liquid supply mechanism to a circuit board to be processed so as to perform milling operation on the circuit board to be processed;

the first controller is used for determining cutting fluid matched with the milling information according to the milling information of the circuit board to be processed, and communicating the milling sprayer with the accommodating space provided with the cutting fluid matched with the milling information.

Optionally, the hydraulic milling device further comprises a sensing mechanism, and the sensing mechanism is arranged adjacent to the milling assembly;

the induction mechanism is used for detecting the circuit board to be processed so as to acquire the milling information;

the milling information comprises at least one of the thickness and the material of the circuit board to be processed and whether the milling position of the circuit board to be processed is provided with a conductive circuit.

Optionally, the cutting fluid comprises water or a suspension of water and an additive; the two accommodating spaces are respectively used for accommodating water and suspension liquid of water and additives;

wherein the additive comprises any one of brown corundum, white corundum, microcrystalline corundum, silicon carbide and cubic boron nitride; or

The additive comprises a mixture of at least two of brown corundum, white corundum, microcrystalline corundum, silicon carbide and cubic boron nitride.

Optionally, a stirring mechanism is disposed in the accommodating space for accommodating the suspension of the water and the additive, and the stirring mechanism is configured to stir the suspension of the water and the additive.

Optionally, the liquid supply mechanism includes a plurality of the accommodating spaces, the suspension of the water and the additive forms a plurality of different cutting liquids, the plurality of different cutting liquids are respectively disposed in the different accommodating spaces, and a stirring mechanism is disposed in each accommodating space and is used for stirring the cutting liquids in the accommodating spaces;

the stirring mechanism in each accommodating space is in communication connection with the first control device, and the first control device is used for controlling the operation of the stirring mechanism.

Optionally, the hydraulic milling device further comprises a liquid pumping device, a second controller and a valve;

the liquid supply mechanism is communicated with the milling spray head through the first controller, the liquid pumping device, the second controller and a valve in sequence;

the liquid pumping device is used for pressurizing the cutting liquid passing through the liquid pumping device;

the second controller is used for calling preset control parameters according to the milling information so as to control the milling spray head to perform milling operation on the circuit board to be processed according to the control parameters;

the valve is used for controlling the on-off of a liquid conveying pipeline between the second controller and the milling sprayer.

Optionally, the control parameters include: the height of the milling spray head from the circuit board to be processed, the diameter of a nozzle of the milling spray head, the jet pressure of the milling spray head, the moving speed of the milling spray head and the jet incident angle of the milling spray head.

Optionally, the hydraulic milling device further comprises a pressure booster and a hydraulic device, wherein the pressure booster is connected to the second controller and is used for increasing the liquid flow pressure of the cutting liquid; the hydraulic device is connected between the second controller and the pressure booster, the second controller is connected with the pressure booster through the hydraulic device, and the second controller is used for detecting the pressure of the liquid flow.

In order to solve the technical problem, the application adopts a technical scheme that: provided is a hydraulic milling method of a circuit board, comprising the following steps:

acquiring milling information of a circuit board to be processed through an induction mechanism;

matching cutting fluid matched with the milling information according to the milling information through a first controller;

and controlling a liquid supply mechanism to provide cutting liquid matched with the milling information through a first controller to mill the circuit board to be processed.

Optionally, the obtaining of the milling information of the circuit board to be processed by the sensing mechanism specifically includes:

and acquiring at least one of the thickness, the laminated board layer number and the material of the circuit board to be processed and whether the milling position of the circuit board to be processed is provided with a conductive circuit.

The beneficial effect of this application is: be different from prior art's condition, the corresponding cutting fluid of the milling information matching that the hydraulic pressure milling device that this application provided can be based on waiting to process the circuit board, wherein can add the additive that has corresponding particle diameter in this cutting fluid, and the additive that has this particle diameter can with wait to process the milling information phase-match of circuit board, consequently can improve the milling effect to waiting to process the circuit board of difference to ensure that the cut surface of waiting to process the circuit board can reach required milling precision requirement.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:

fig. 1 is a schematic structural diagram of an embodiment of a hydraulic milling device for a circuit board provided by the present application;

fig. 2 is a schematic flow chart of an embodiment of a hydraulic milling method provided in the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are referred to in the embodiments of the present application, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present application, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a hydraulic milling device for a circuit board according to the present application.

The hydraulic milling apparatus 10 includes: the first controller 100, the liquid supply mechanism 200 and the milling assembly 300 are coupled, and the liquid supply mechanism 200 is coupled with the milling assembly 300 through the first controller 100;

the liquid supply mechanism 200 includes at least two accommodating spaces 210, wherein the two accommodating spaces 210 are respectively used for accommodating different cutting liquids. The milling assembly 300 comprises a milling spray head 310, the milling spray head 310 is communicated with the liquid supply mechanism 200, and the milling spray head 310 is used for spraying the cutting liquid provided by the liquid supply mechanism 200 to the circuit board to be processed, so as to form a hydraulic water jet cutter for performing milling operation on the circuit board to be processed. The first controller 100 is configured to determine, according to the milling information of the circuit board to be processed, the cutting fluid matched with the milling information, and communicate the milling nozzle 310 with the accommodating space 210 provided with the cutting fluid matched with the milling information, so as to mill the circuit board to be processed.

In this embodiment, the hydraulic milling apparatus 10 further includes a sensing mechanism (not shown), which is disposed adjacent to the milling assembly; the induction mechanism is used for detecting the circuit board to be processed to acquire milling information; the milling information comprises at least one of the thickness, the number of stacked board layers and the material of the circuit board to be processed and whether the milling position of the circuit board to be processed is provided with a conductive circuit.

Therefore, the milling information of the circuit board to be processed is acquired by the sensing mechanism, and then the acquired milling information of the circuit board to be processed is matched with the corresponding cutting liquid, so that the cutting effect of the hydraulic water jet cutter formed by the cutting liquid is matched with the cutting effect of the circuit board to be processed, and the cutting effect of milling the circuit board to be processed can be ensured.

In this embodiment, the cutting fluid may comprise water or a suspension of water and additives; two accommodating spaces 210 of the liquid supply mechanism 200 are respectively used for accommodating water and suspension of water and additives; wherein, the additive comprises any one of brown corundum, white corundum, microcrystalline corundum, silicon carbide and cubic boron nitride; or the additive comprises a mixture of at least two of brown corundum, white corundum, microcrystalline corundum, silicon carbide and cubic boron nitride.

For the circuit board to be processed with different milling information, whether the additive is added to the cutting fluid or not and the particle size (radius or diameter of additive particles) of the added additive can be determined according to the milling information. Since the additive is generally a material with low solubility, in order to ensure the cutting effect of the hydraulic water jet, a stirring mechanism (not shown) may be provided in each of the spaces for accommodating the suspension of water and the additive, and the suspension of water and the additive in the spaces may be stirred by the stirring mechanism, thereby improving the uniformity of the distribution of the additive particles in the solvent such as water.

Further, in this embodiment, the liquid supply mechanism 200 may further include a plurality of accommodating spaces 210, wherein the plurality of accommodating spaces 210 may be used to respectively set different cutting liquids; wherein, the different cutting fluids described herein can be different suspensions formed by water, water and additives respectively. According to the concentration of the additive, the material or the particle size, the water and the additive may form different cutting fluids, and thus the different cutting fluids formed by the water and the additive may be respectively disposed in the different accommodating spaces 210.

In this embodiment, for the plurality of accommodating spaces 210 for accommodating the cutting fluid formed by the water and the additive, the stirring mechanism as described above may be disposed in each of the plurality of accommodating spaces 210, so as to maintain the uniformity of the distribution of the particles of the cutting fluid formed by the water and the additive.

In this embodiment, whether to add the additive to the cutting fluid is determined according to the milling information, and the specific corresponding relationship between the particle sizes of the added additive may be shown in the following table:

the milling information of the circuit board to be processed may include the thickness of the circuit board to be processed, the number of stacked circuit boards of the circuit board to be processed, and whether the conductive metal layer is laid on the milling path of the milling nozzle. Thereby can realize waiting to process the circuit board or the polylith that different layers stack set up to the difference and treat that the cutting fluid of processing circuit board adoption different components forms the hydraulic pressure water sword and mill the operation, thereby can make the cutting effect of hydraulic pressure water sword can treat according to the polylith that the circuit board that waits to process circuit board or different layers stack set up and treat that the circuit board carries out corresponding adjustment, consequently can realize treating that the cut surface that forms after processing circuit board cutting has the same cutting effect, can improve the milling precision of treating the cut surface of processing circuit board simultaneously.

In this embodiment, the circuit board to be processed may be a multilayer circuit board in which a plurality of conductive metal layers and a plurality of base layers are sequentially stacked and alternately disposed. The thickness of the circuit board to be processed may refer to the stacked thickness of the plurality of conductive metal layers and the plurality of base layers. In the milling process of the circuit boards to be processed, after a plurality of identical circuit boards to be processed are generally stacked, the circuit boards to be processed, stacked and arranged in a stack, are milled and processed simultaneously through the milling spray heads, wherein the number of stacked layers of the circuit boards to be processed refers to the number of stacked circuit boards to be processed.

In this embodiment, each conductive metal layer of the circuit board to be processed may include a plurality of conductive traces, and the plurality of conductive traces may form a predetermined conductive trace pattern for forming a desired functional circuit. When the milling sprayer performs milling operation along a preset path, if a hydraulic water jet cutter sprayed by the milling sprayer does not pass through a conductive circuit in the conductive metal layer, the fact that the milling path of the milling sprayer does not have the conductive metal layer is indicated; on the contrary, if the hydraulic water jet blade sprayed by the milling nozzle passes through the conductive circuit in the conductive metal layer, it indicates that the conductive metal layer exists in the milling path of the milling nozzle at this time.

Furthermore, in this embodiment, the base layer of the circuit board to be processed may also be formed by using different materials, and for the circuit board to be processed in which the base layer is formed by using different materials, the concentration of the additive in the cutting fluid needs to be adjusted according to the material of the base layer of the circuit board to be processed, so as to ensure the cutting effect of the formed cutting fluid.

The corresponding relationship between the concentration of the additive and the material of the base layer of the circuit board to be processed can be shown in the following table:

furthermore, in this embodiment, if only the conductive circuit layer (formed by copper or aluminum) on the surface of the circuit board to be processed is milled, the concentration of the additive can be controlled within the range of [ 10%, 30% ].

Further, in this embodiment, the hydraulic milling apparatus 10 further includes a fluid pumping device 400, a second controller 500, and a valve 600.

The liquid supply mechanism 200 is connected to the milling nozzle 310 sequentially via the first controller 100, the liquid pumping device 400, the second controller 500 and the valve 600. The fluid pumping device 400 may be an accumulator or a supercharger, etc. for pressurizing the cutting fluid passing through the fluid pumping device; the second controller 100 is configured to invoke a preset control parameter according to the milling information, so as to control the milling nozzle 310 to perform milling operation on the circuit board to be processed according to the preset control parameter; the valve 600 is used for controlling the on-off of the liquid conveying pipeline between the second controller 500 and the milling spray head 310. The valve 600 may be a manual valve, or may be an automatic valve such as a solenoid valve.

In this embodiment, the preset control parameters may include: the height of the milling nozzle 310 from the circuit board to be processed, the nozzle diameter of the milling nozzle 310, the jet pressure of the milling nozzle 310, the moving speed of the milling nozzle 310, the jet incident angle of the milling nozzle 310 and the like.

Specifically, the second controller 500 may adjust the height of the milling nozzle 310 from the circuit board to be processed, replace the milling nozzle 310 with a different nozzle diameter, and adjust the moving speed of the milling nozzle 310 according to the control parameters.

Wherein the jet angle of incidence to the milling jet 310; the milling assembly 300 may further include an angle adjustment device (not shown), the milling nozzle 310 may be connected to the angle adjustment device, and the second controller 500 may control the angle adjustment device to control the jet incident angle of the milling nozzle 310.

The jet pressure to the milling jet 310; the milling device 10 further comprises a pressure booster 700 and a hydraulic device 800, wherein the pressure booster 700 is connected with the second controller 500 through the hydraulic device 800 to increase the liquid flow pressure of the cutting liquid; wherein the hydraulic device 800 is connected between the second controller 500 and the pressure booster 700 for detecting the pressure of the flow of the cutting fluid. Therefore, in this embodiment, the second controller 500 may control the pressure booster 700 according to the pressure of the cutting fluid flow detected by the hydraulic device 800, so as to ensure that the pressure of the cutting fluid flow flowing into the milling head 310 through the second controller 500 is within a desired range.

Further, the application also provides a hydraulic milling method. Referring to fig. 2, fig. 2 is a schematic flow chart illustrating an embodiment of a hydraulic milling method according to the present disclosure.

The hydraulic milling method in this embodiment may be implemented by using the hydraulic milling apparatus 10, where, with reference to fig. 1, the specific steps of the hydraulic milling method may include:

s110: and acquiring milling information of the circuit board to be processed through the sensing mechanism.

The sensing mechanism may be a sensing mechanism arranged adjacent to the milling nozzle 310, wherein the sensing mechanism may be used to detect milling information of the circuit board to be processed; the milling information of the circuit board to be processed comprises at least one of the thickness of the circuit board to be processed, the lamination layer number and the material of the circuit board to be processed and whether the milling position of the circuit board to be processed is provided with a conductive circuit.

S120: and matching the cutting fluid matched with the milling information according to the milling information through the first controller.

In this step, the first controller 100 may match the cutting fluid matched with the milling information according to the milling information of the circuit board to be processed, and specifically, may select the accommodating space 210 of the liquid supply mechanism 200 corresponding to the milling information of the circuit board to be processed according to the milling information of the circuit board to be processed.

Similarly, the liquid supply mechanism 200 includes a plurality of accommodating spaces 210, wherein the plurality of accommodating spaces 210 can be used for respectively accommodating different cutting liquids; wherein, the different cutting fluids described herein can be suspensions of water, water and additives, respectively. According to the concentration of the additive, the material or the particle size, the water and the additive may form different cutting fluids, and thus the different cutting fluids formed by the water and the additive may be respectively disposed in the different accommodating spaces 210.

The step of the first controller 100 matching the cutting fluid matched with the milling information according to the milling information of the circuit board to be processed specifically includes: the accommodating space 210 accommodating the corresponding cutting fluid is matched according to the milling information of the circuit board to be processed. For the correspondence between the cutting fluid and the milling information of the circuit board to be processed, please refer to the above table, which is not described herein.

S130: and the first controller controls the liquid supply mechanism to provide cutting liquid matched with the milling information to mill the circuit board to be processed.

After the accommodating space 210 matched with the milling information of the circuit board to be processed is determined, the first controller 100 further controls the accommodating space 210 to be communicated with the milling nozzle 310, so that the cutting fluid in the accommodating space 210 can form a hydraulic water jet through the milling nozzle 310 to perform milling operation on the circuit board to be processed.

In this embodiment, the first controller 100 may also be used to control the stirring mechanism in the accommodating space 210. After the first controller 100 determines the accommodating space 210 matched with the milling information of the circuit board to be processed, the first controller 100 may first control the stirring mechanism in the accommodating space 210 to stir the cutting fluid in the accommodating space 210, and after stirring for a preset time, the first controller 100 further controls the accommodating space 210 to communicate with the milling nozzle 310.

To sum up, the application provides a hydraulic milling device and a milling method of a circuit board, wherein, can match corresponding cutting fluid according to the milling information of the circuit board to be processed through the hydraulic milling device, can add the additive with corresponding particle size in the cutting fluid, the additive with corresponding particle size then can match with the milling information of the circuit board to be processed, consequently, can improve the milling effect to different circuit boards to be processed, thereby ensure that the cut surface of the circuit board to be processed can reach the required milling precision requirement.

The above embodiments are merely examples and are not intended to limit the scope of the present disclosure, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present disclosure or those directly or indirectly applied to other related technical fields are intended to be included in the scope of the present disclosure.