阅读说明：本技术 一种陶瓷基板的金属镀膜方法 (Metal coating method of ceramic substrate ) 是由 张官星 张龙 李俊 徐林 于 2021-09-06 设计创作，主要内容包括：本发明公开了陶瓷基板镀膜工艺技术领域内的一种陶瓷基板的金属镀膜方法。该方法包括以下步骤：S1:清洗待加工的陶瓷基板的正面和背面；S2:在陶瓷基板的背面蒸镀背面金属膜；S3:在陶瓷基板的正面使用光刻胶制作图形；S4:在陶瓷基板的正面蒸镀正面金属膜；S5:剥离光刻胶,完成陶瓷基板的镀膜操作。该方法减去了对陶瓷基板的二次清洗,从而避免酸洗对已镀金属膜粘附性的影响,保障产品质量。(The invention discloses a metal coating method of a ceramic substrate in the technical field of ceramic substrate coating processes. The method comprises the following steps: s1, cleaning the front and back of the ceramic substrate to be processed; s2, evaporating a back metal film on the back of the ceramic substrate; s3, making a pattern on the front surface of the ceramic substrate by using photoresist; s4, evaporating a front metal film on the front surface of the ceramic substrate; and S5, stripping the photoresist to finish the film coating operation of the ceramic substrate. The method eliminates the secondary cleaning of the ceramic substrate, thereby avoiding the influence of acid cleaning on the adhesion of the plated metal film and ensuring the product quality.)

1. A metal plating method of a ceramic substrate is characterized by comprising the following steps:

s1, cleaning the front and back of the ceramic substrate to be processed;

s2, evaporating a back metal film on the back of the ceramic substrate;

s3, manufacturing a pattern on the front surface of the ceramic substrate by using photoresist;

s4, evaporating a front metal film on the front surface of the ceramic substrate;

and S5, stripping the photoresist to finish the film coating operation of the ceramic substrate.

2. The metal plating method according to claim 1, wherein: the manner of cleaning in step S1 is as follows: and sequentially placing the ceramic substrate in acetone and alcohol for ultrasonic cleaning for 5-15min respectively, flushing water and spin-drying, then placing the ceramic substrate in sulfuric acid with the temperature of 100-120 ℃ for cleaning for 5-15min, and flushing water and spin-drying.

3. The metal plating method according to claim 2, characterized in that: the manner of cleaning in step S1 further includes: after the ceramic substrate is cleaned by sulfuric acid at 110 ℃, flushed by water and dried by spin-drying, the ceramic substrate is placed in dilute hydrofluoric acid for cleaning for 20-40s, and then flushed by water and dried by spin-drying.

4. The metal plating method according to claim 3, characterized in that: HF in the dilute hydrofluoric acid: h₂0＝1:50。

5. The metal plating method according to claim 1, wherein: in the step S1, the ceramic substrate needs to be marked on the front or back surface thereof before being cleaned.

6. The metal plating method according to claim 1, wherein: in step S2, attaching a blue film to the surface of the back metal film; in step S4, the method further includes tearing off the blue film before evaporating the front metal film.

7. The metal plating method according to claim 1, wherein: the back metal film and the front metal film sequentially comprise three layers of metals of Ti, Pt and Au in the direction far away from the ceramic substrate.

8. The metal plating method according to claim 7, wherein:the thicknesses of the three layers of metal of Ti, Pt and Au are respectively

Technical Field

The invention relates to the technical field of ceramic substrate coating processes, in particular to a metal coating method of a ceramic substrate.

Background

In the manufacturing process of semiconductors, metal coating is required to be sequentially carried out on the front surface and the back surface of a ceramic substrate, and the basic surface of the ceramic is required to be clean before coating. At present, the plating sequence is to perform metal plating on the front surface of the ceramic substrate and then perform metal plating on the back surface of the ceramic substrate.

Since the photoresist is used to make a pattern before the metal coating is performed on the front surface of the ceramic substrate, and the photoresist can cause organic pollution to the back surface of the ceramic substrate, the back surface of the ceramic substrate needs to be acid-washed before the back surface is coated. In the prior art, when the back surface of the ceramic substrate is pickled after the metal plating on the front surface of the ceramic substrate is finished, the adhesiveness of the metal on the front surface is affected due to the undercutting of acid traces in the pickling process because the ceramic substrate material has certain air permeability, so that the product quality is affected.

Disclosure of Invention

The application provides a metal coating method of a ceramic substrate, so that the problem that the metal film of the ceramic substrate is not high in adhesion in the prior art is solved, the adhesion of the metal film of the ceramic substrate is improved, and the product quality is guaranteed.

The embodiment of the application provides a metal coating method of a ceramic substrate, which comprises the following steps:

s1, cleaning the front and back of the ceramic substrate to be processed;

s2, evaporating a back metal film on the back of the ceramic substrate;

s3, manufacturing a pattern on the front surface of the ceramic substrate by using photoresist;

s4, evaporating a front metal film on the front surface of the ceramic substrate;

and S5, stripping the photoresist to finish the film coating operation of the ceramic substrate.

The beneficial effects of the above embodiment are as follows: the order of evaporating the metal film of the ceramic substrate is adjusted, after cleaning, the metal film on the back of the ceramic substrate is evaporated, then the photoresist is used for manufacturing a pattern on the front of the ceramic substrate, and the metal film on the back is easy to clean when being stained with the photoresist, so that organic pollution to the back of the ceramic substrate when the photoresist is used is prevented. Since photoresist is not required for vapor deposition of the back metal film, the front surface of the ceramic substrate does not need to be cleaned again before vapor deposition of the metal film on the front surface of the ceramic substrate. By the method, secondary cleaning of the ceramic substrate is omitted, so that the influence of acid cleaning on the adhesion of the plated metal film is avoided, and the product quality is guaranteed.

On the basis of the above embodiments, the present application can be further improved, specifically as follows:

in one embodiment of the present application, the manner of the cleaning in step S1 is as follows: and sequentially placing the ceramic substrate in acetone and alcohol for ultrasonic cleaning for 5-15min respectively, flushing water and spin-drying, then placing the ceramic substrate in sulfuric acid with the temperature of 100-120 ℃ for cleaning for 5-15min, and flushing water and spin-drying. The acetone is easy to dissolve in water, organic impurities on the surface of the ceramic substrate are removed through the acetone, the ceramic substrate is convenient to wash clean, due to the fact that the surface of the ceramic substrate is rough, the addition of the ultrasonic wave is beneficial to the better contact of the acetone and the ceramic substrate, and the cleaning effect is improved; organic impurities and residual acetone are removed through alcohol, and the effect of alcohol cleaning is also improved by adding ultrasound; the sulfuric acid has strong oxidizing property, can remove organic matters which cannot be removed by cleaning acetone and alcohol, and can intensify the reaction of the sulfuric acid at the high temperature of 100-120 ℃ to increase the effect of removing the organic matters; by the cleaning method, the surface of the ceramic substrate can be conveniently and quickly cleaned, the production efficiency is improved, and the product quality is guaranteed.

In one embodiment of the present application, the manner of cleaning in step S1 further includes: after the ceramic substrate is cleaned by sulfuric acid at 110 ℃, flushed by water and dried by spin-drying, the ceramic substrate is placed in dilute hydrofluoric acid for cleaning for 20-40s, and then flushed by water and dried by spin-drying. F ions in the hydrofluoric acid HF can remove a natural oxide layer and metal ions on the surface of the ceramic substrate, so that the adhesion between a metal film plated subsequently and the ceramic substrate is improved, and the product quality is further ensured.

In one embodiment of the present application, the diluted hydrofluoric acid has an HF: h₂0＝1:50。

In one embodiment of the present application, in step S1, the ceramic substrate needs to be marked on the front or back surface of the ceramic substrate before being cleaned. The marks such as the model, the batch number, the sheet number and the like are engraved on the front surface of the ceramic substrate by using a laser marking machine, and the front surface and the back surface are convenient to identify.

In one embodiment of the present application, in the step S2, a blue film is attached to the surface of the back metal film, and in the step S4, the blue film is torn off before the front metal film is evaporated. And the back metal film after evaporation is protected by film sticking, so that the back metal film is prevented from being stained, scratched and the like in the subsequent processing process.

In one embodiment of the present application, the back metal film and the front metal film each sequentially include three layers of metals of Ti, Pt, and Au in a direction away from the ceramic substrate. The Ti metal is used for wetting between the ohmic contact metal and the ceramic substrate, and the thickness requirement is thinner; the Pt metal is used for playing a role of a barrier layer and preventing the Au metal from diffusing to the ceramic substrate, and the thickness requirement is also thinner; the Au metal has excellent stability and bonding property and strong electromigration resistance, is used for subsequent packaging bonding, and simultaneously requires thicker thickness; the metal film formed by superposing the three layers of metal has higher stability.

In one embodiment of the present application, the thicknesses of the three metals of Ti, Pt and Au are respectively

One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

1. the method omits the secondary cleaning of the ceramic substrate, thereby avoiding the influence of acid cleaning on the adhesion of the plated metal film and ensuring the product quality;

2. the cleaning method can conveniently and quickly clean the surface of the ceramic substrate, improve the production efficiency and ensure the product quality;

3. f ions in the hydrofluoric acid HF can remove a natural oxide layer and metal ions on the surface of the ceramic substrate, so that the adhesion between a metal film plated subsequently and the ceramic substrate is improved, and the product quality is further ensured.

Drawings

In order to more clearly illustrate the detailed description of the invention or the technical solutions in the prior art, the drawings that are needed in the detailed description of the invention or the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

FIG. 1 is a flow chart of a method for plating a metal on a ceramic substrate according to the present invention;

FIG. 2 is a first schematic view of a metal coating of a ceramic substrate;

FIG. 3 is a second schematic view of a structure of a metal coating film of a ceramic substrate;

FIG. 4 is a third schematic view of a structure of a metal coating film of a ceramic substrate;

fig. 5 is a fourth schematic structural view of the metal plating film of the ceramic substrate.

The solar cell comprises a ceramic substrate 1, a Ti metal layer 2, a Pt metal layer 3, an Au metal layer 4, a blue film 5 and a photoresist 6.

Detailed Description

The present invention is further illustrated by the following detailed description, which is to be construed as merely illustrative and not limitative of the remainder of the disclosure, and modifications and variations such as those ordinarily skilled in the art are intended to be included within the scope of the present invention as defined in the appended claims.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In describing the invention, it is not necessary for a schematic representation of the above terminology to be directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples of the invention and features of different embodiments or examples described herein may be combined and combined by those skilled in the art without contradiction.

The embodiment of the application provides a metal coating method of a ceramic substrate, so that the problem of low adhesion of the metal film of the ceramic substrate in the prior art is solved, the adhesion of the metal film of the ceramic substrate is improved, and the product quality is guaranteed.

In order to solve the above problems, the technical solution in the embodiment of the present application has the following general idea:

example (b):

as shown in fig. 1, a method for plating a metal on a ceramic substrate includes the steps of:

and S1, cleaning the front and back surfaces of the ceramic substrate to be processed.

Before cleaning, the ceramic substrate needs to be marked with marks such as models, batch numbers, sheet numbers and the like on the front surface of the ceramic substrate by using a laser marking machine, so that the front surface and the back surface can be conveniently identified.

The cleaning method comprises the following steps: sequentially placing the ceramic substrate in acetone and alcohol for ultrasonic cleaning for 5-15min (preferably 10min), flushing water and spin-drying, then placing the ceramic substrate in sulfuric acid with the temperature of 100-: h₂0＝1:50。

S2, depositing a back metal film on the back of the ceramic substrate.

As shown in FIG. 2, a back metal film is formed by depositing three layers of metals, Ti, Pt and Au in this order, successively on the back surface of a ceramic substrate 1 by an evaporation process, wherein the thicknesses of a Ti metal layer 2, a Pt metal layer 3 and an Au metal layer 4 are set to be respectivelyAfter the back metal film evaporation is finished, an SPV-225RB Ridong blue film 5 is attached for protection.

S3, a pattern is formed on the front surface of the ceramic substrate by using photoresist.

As shown in fig. 3, a pattern is directly formed on the front surface of the ceramic substrate 1 by using Lift off photoresist 6 without secondary acid cleaning, and at this time, a back metal film is deposited on the back surface of the ceramic substrate 1 by evaporation, and a blue film 5 is further attached on the back metal film for protection, so that the photoresist 6 does not pollute the back surface of the ceramic substrate 1.

S4, depositing a front metal film on the front surface of the ceramic substrate.

As shown in FIG. 4, the blue film 6 on the back metal film surface is peeled off, and the photoresist 6 is carried on the front surface of the ceramic substrate 1Performing a second metal evaporation to form a front metal film, a back metal film, a Ti metal layer 2, a Pt metal layer 3, and an Au metal layer 4 in sequence with a thickness of Ti metal layer 2, Pt metal layer 3, and Au metal layer 4

And S5, stripping the photoresist to finish the film coating operation of the ceramic substrate.

As shown in fig. 5, the photoresist 6 is ultrasonically stripped using an organic stripping solution to form a front complete pattern. And finishing the metal coating operation of the ceramic substrate.

The technical scheme in the embodiment of the application at least has the following technical effects or advantages:

1. the method omits the secondary cleaning of the ceramic substrate, thereby avoiding the influence of acid cleaning on the adhesion of the plated metal film and ensuring the product quality;

2. the cleaning method can conveniently and quickly clean the surface of the ceramic substrate, improve the production efficiency and ensure the product quality;

3. f ions in the hydrofluoric acid HF can remove a natural oxide layer and metal ions on the surface of the ceramic substrate, so that the adhesion between a metal film plated subsequently and the ceramic substrate is improved, and the product quality is further ensured.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.