阅读说明：本技术 光半导体密封用树脂成型物 (Resin molded article for sealing optical semiconductor ) 是由 生田润 藤井宏中 木村龙一 于 2021-05-31 设计创作，主要内容包括：本发明提供一种光半导体密封用树脂成型物,其能够得到耐热性、耐温度循环性和耐回流焊性优异的光半导体密封材料。一种光半导体密封用树脂成型物,其满足下述关系式(1)：0.0005≤E’-(265℃)/E’-(100℃)≤0.0050(1)(式中,E’-(265℃)和E’-(100℃)分别表示通过下述方法得到的固化物(尺寸：宽度5mm×长度35mm×厚度1mm)在265℃和100℃下的储能模量(Pa)。)(固化物的制作方法)将树脂成型物在150℃下加热4分钟而进行成型,然后在150℃下加热3小时,从而得到固化物。(The invention provides a resin molding for sealing an optical semiconductor, which can obtain an optical semiconductor sealing material with excellent heat resistance, temperature cycle resistance and reflow resistance. A resin molded article for sealing an optical semiconductor, which satisfies the following relational expression (1): e 'is more than or equal to 0.0005' 265℃ /E’ 100℃ 0.0050(1) or less (wherein, E' 265℃ And E' 100℃ The storage modulus (Pa) at 265 ℃ and 100 ℃ of a cured product (dimension: width 5 mm. times. length 35 mm. times. thickness 1mm) obtained by the following method is shown, respectively. ) (method for producing cured product) the molded resin product was heated at 150 ℃ for 4 minutes to mold the product, and then heated at 150 ℃ for 3 hours to obtain a cured product.)

1. A resin molded product for sealing an optical semiconductor, wherein the resin molded product for sealing an optical semiconductor satisfies the following relational expression (1):

0.0005≤E’_265℃/E’_100℃≤0.0050 (1)

of formula (II) to'_265℃And E'_100℃The storage modulus (Pa) at 265 ℃ and 100 ℃ of a cured product (dimension: width: 5 mm. times. length: 35 mm. times. thickness: 1mm) obtained by the following method,

the preparation method of the condensate comprises the following steps:

the resin molded article was heated at 150 ℃ for 4 minutes to mold the article, and then heated at 150 ℃ for 3 hours to obtain a cured article.

2. The molded resin article for optical semiconductor encapsulation according to claim 1, wherein the glass transition temperature of the molded resin article for optical semiconductor encapsulation as a cured product (dimension: width 5 mm. times. length 35 mm. times. thickness 1mm) is 130 ℃ or higher, and the molded resin article for optical semiconductor encapsulation satisfies the following relational expression (2):

Y＜160000X-14500000 (2)

wherein X represents a glass transition temperature (DEG C) of the cured product, and Y represents a storage modulus (Pa) of the cured product at 265 ℃.

3. The resin molded article for optical semiconductor sealing according to claim 1 or 2, wherein the resin molded article for optical semiconductor sealing satisfies the following relational expressions (3) and (4):

Y＜6300000(130≤X＜150) (3)

Y＜160000X-17000000(150≤X≤190) (4)

in each formula, X represents the glass transition temperature (. degree. C.) of a cured product (dimension: 5mm in width. times.35 mm in length. times.1 mm in thickness) obtained by the above method, and Y represents the storage modulus (Pa) of the cured product at 265 ℃.

4. The resin molded article for optical semiconductor sealing according to any one of claims 1 to 3, wherein the resin molded article for optical semiconductor sealing satisfies the following relational expression (5):

0.70＜R_450nm＜1.00 (5)

in the formula, R_450nmThe linear transmittance ratio (after implementation/before implementation) at a wavelength of 450nm before and after implementation when reflow soldering was performed 3 times at 265 ℃ on a cured product (dimension: width 50 mm. times. length 50 mm. times. thickness 1mm) obtained by the above method is shown.

5. The resin molded article for optical semiconductor sealing according to any one of claims 1 to 4, wherein the resin molded article for optical semiconductor sealing satisfies the following relational expressions (6) and (7):

0.80＜R_400nm/R_450nm＜1.00 (6)

0.10＜R_300nm/R_450nm＜0.50 (7)

in the formulae, R_300nm、R_400nmAnd R_450nmThe linear transmittance ratios (after implementation/before implementation) at wavelengths of 300nm, 400nm and 450nm before and after implementation in 3 times of reflow soldering at 265 ℃ for the cured product (dimension: width 50 mm. times. length 50 mm. times. thickness 1mm) obtained by the above method are shown.

6. The molded resin article for sealing an optical semiconductor according to any one of claims 1 to 5, wherein the linear transmittance at a wavelength of 450nm of the molded resin article for sealing an optical semiconductor as a cured product (dimension: width 50 mm. times. length 50 mm. times. thickness 1mm) is 70% or more.

7. The shaped resin article for sealing an optical semiconductor according to any one of claims 1 to 6, which comprises a thermosetting resin, a curing agent, a reaction product of the thermosetting resin and the curing agent, and a curing accelerator.

8. The shaped resin article for sealing an optical semiconductor according to claim 7, further comprising a polyol and a reaction product of the polyol and a curing agent.

9. The molded resin article for sealing an optical semiconductor according to any one of claims 1 to 8, wherein the molded resin article for sealing an optical semiconductor comprises at least one compound selected from the group consisting of a compound having a structural unit (I) represented by the following formula (I), a compound having a structural unit (II) represented by the following formula (II), and a compound having a structural unit (III) represented by the following formula (III),

formula (I):

in the formula, A¹Represents an organic group having 2 or more ring structures; r^1aRepresents a site containing an epoxy resin residue; r^1bRepresents a hydrogen atom or with R^1aThe bond of the linkage is such that,

formula (II):

in the formula, A²Represents an organic group; r^2aRepresents a site containing an epoxy resin residue having 2 or more continuous ring structures (excluding an oxirane ring); r^2bRepresents a hydrogen atom or with R^2aThe bond of the linkage is such that,

formula (III):

in the formula, A³Represents an organic group; r^3aRepresents an organic group having a non-aromatic ring.

10. An optical semiconductor sealing material obtained by molding the resin molding for optical semiconductor sealing according to any one of claims 1 to 9.

11. An optical semiconductor device comprising an optical semiconductor element and the optical semiconductor sealing material according to claim 10 for sealing the optical semiconductor element.

Technical Field

The present invention relates to a resin molded article for sealing an optical semiconductor.

Background

The optical semiconductor element is sealed with a ceramic package or a plastic package and fabricated into a device. Here, since the constituent materials of the ceramic package are relatively expensive and have poor mass productivity, the use of the plastic package has become the mainstream. Among them, from the viewpoint of workability, mass productivity, and reliability, a technique of molding an epoxy resin composition sheet into a small piece in advance and then performing transfer molding has become the mainstream.

Patent document 1 discloses a technique of granulating an epoxy resin composition into granules and then tabletting the granules.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2011-9394

Disclosure of Invention

Problems to be solved by the invention

In recent years, with the advancement of functions and high output of electronic devices, higher reliability is required for optical semiconductors. For example, when the sealing material is used in a high-temperature environment or an environment in which the temperature repeatedly changes from low to high temperatures, or in a reflow step in a device manufacturing stage, the sealing material may be cracked, peeled, discolored, or the like, and it is required to reduce damage to the optical semiconductor element caused by the cracking.

The purpose of the present invention is to provide a resin molding for sealing an optical semiconductor, which can provide an optical semiconductor sealing material having excellent heat resistance, temperature cycle resistance, and reflow resistance.

Means for solving the problems

The present invention relates to a resin molded product for sealing an optical semiconductor, which satisfies the following relational expression (1).

0.0005≤E’_265℃/E’_100℃≤0.0050 (1)

(in the formula, E'_265℃And E'_100℃The storage modulus (Pa) at 265 ℃ and 100 ℃ of a cured product (dimension: width 5 mm. times. length 35 mm. times. thickness 1mm) obtained by the following method is shown, respectively. )

(method for producing cured product)

The resin molded article was heated at 150 ℃ for 4 minutes to mold the article, and then heated at 150 ℃ for 3 hours to obtain a cured article.

The molded resin for sealing an optical semiconductor preferably comprises: the glass transition temperature of the cured product (dimension: width: 5 mm. times. length: 35 mm. times. thickness: 1mm) obtained by the above method is 130 ℃ or higher, and the following relational expression (2) is satisfied.

Y＜160000X-14500000 (2)

(wherein X represents the glass transition temperature (DEG C) of the cured product, and Y represents the storage modulus (Pa) of the cured product at 265 ℃)

The molded resin for sealing an optical semiconductor preferably satisfies the following relational expressions (3) and (4).

Y＜6300000(130≤X＜150) (3)

Y＜160000X-17000000(150≤X≤190) (4)

(wherein X represents the glass transition temperature (. degree. C.) of a cured product (dimension: 5mm in width, 35mm in length, 1mm in thickness) obtained by the above method, and Y represents the storage modulus (Pa) of the cured product at 265 ℃)

The resin molded article for sealing an optical semiconductor preferably satisfies the following relational expression (5).

0.70＜R_450nm＜1.00 (5)

(in the formula, R_450nmThe linear transmittance ratio (after implementation/before implementation) at a wavelength of 450nm before and after implementation when reflow soldering was performed 3 times at 265 ℃ on a cured product (dimension: width 50 mm. times. length 50 mm. times. thickness 1mm) obtained by the above method is shown. )

The molded resin for sealing an optical semiconductor preferably satisfies the following relational expressions (6) and (7).

0.80＜R_400nm/R_450nm＜1.00 (6)

0.10＜R_300nm/R_450nm＜0.50 (7)

(in the formulae, R_300nm、R_400nmAnd R_450nmThe linear transmittance ratios (after implementation/before implementation) at wavelengths of 300nm, 400nm and 450nm before and after implementation in 3 times of reflow soldering at 265 ℃ for the cured product (dimension: width 50 mm. times. length 50 mm. times. thickness 1mm) obtained by the above method are shown. )

The molded resin for sealing an optical semiconductor preferably comprises: the linear transmittance at a wavelength of 450nm when the cured product is produced by the above method (dimension: width: 50 mm. times. length: 50 mm. times. thickness: 1mm) is 70% or more.

The molded resin article for sealing an optical semiconductor preferably contains a thermosetting resin, a curing agent, a reaction product of the thermosetting resin and the curing agent, and a curing accelerator.

The molded resin for sealing an optical semiconductor preferably further contains a polyol and a reaction product of the polyol and a curing agent.

The resin molded article for sealing an optical semiconductor preferably contains at least one compound selected from the group consisting of a compound having a structural unit (I) represented by the following formula (I), a compound having a structural unit (II) represented by the following formula (II), and a compound having a structural unit (III) represented by the following formula (III).

Formula (I):

(in the formula, A)¹Represents an organic group having 2 or more ring structures; r^1aRepresents a site containing an epoxy resin residue; r^1bRepresents a hydrogen atom or with R^1aA bonded bond. )

Formula (II):

(in the formula, A)²Represents an organic group; r^2aRepresents a site containing an epoxy resin residue having 2 or more continuous ring structures (excluding an oxirane ring); r^2bRepresents a hydrogen atom or with R^2aA bonded bond. )

Formula (III):

(in the formula, A)³Represents an organic group; r^3aRepresents an organic group having a non-aromatic ring. )

The present invention also relates to an optical semiconductor sealing material obtained by molding the above optical semiconductor sealing resin molding.

The present invention also relates to an optical semiconductor device comprising an optical semiconductor element and the optical semiconductor sealing material for sealing the optical semiconductor element.

Effects of the invention

According to the resin molding for encapsulating an optical semiconductor of the present invention, since an optical semiconductor encapsulating material excellent in heat resistance, temperature cycle resistance and reflow resistance can be obtained, the optical semiconductor encapsulating material is less likely to cause cracks, peeling, discoloration and the like even when used in a high-temperature environment or in a reflow step, and damage to an optical semiconductor element caused by these factors can be reduced.

Drawings

Fig. 1 is a schematic view showing an evaluation package used in examples and comparative examples.

Detailed Description

The present invention will be specifically described below.

The resin molded article for sealing an optical semiconductor of the present invention satisfies the following relational expression (1).

0.0005≤E’_265℃/E’_100℃≤0.0050 (1)

(in the formula, E'_265℃And E'_100℃The storage modulus (Pa) at 265 ℃ and 100 ℃ of a cured product (dimension: width 5 mm. times. length 35 mm. times. thickness 1mm) obtained by the following method is shown, respectively. )

(method for producing cured product)

The resin molded article was heated at 150 ℃ for 4 minutes to mold the article, and then heated at 150 ℃ for 3 hours to obtain a cured article.

The resin molded article satisfying the relational expression (1) can provide a cured product having a high glass transition temperature and a low elastic modulus at high temperatures, and therefore can provide an optical semiconductor sealing material having excellent heat resistance, temperature cycle resistance and reflow resistance. Further, an optical semiconductor sealing material excellent in yellowing resistance, dimensional stability against temperature change, impact absorbability and impact resistance can be obtained. Such an optical semiconductor sealing material is less likely to cause cracks, peeling, discoloration, and the like even when used in a high-temperature environment or in a reflow step, and therefore damage to the optical semiconductor element due to these defects can be reduced.

Further, the resin molded article does not become excessively hard at the time of thermoforming, and therefore is excellent in handleability, moldability, and mold releasability.

E’_265℃/E’_100℃Is 0.0050 or less, preferably 0.0030 or less, more preferably 0.0010 or less, and further preferably 0.0008 or less.

E’_265℃/E’_100℃If the content is less than 0.0005 or more than 0.0050, the heat resistance, temperature cycle resistance and reflow resistance of the obtained optical semiconductor sealing material may be lowered.

E’_265℃And E'_100℃The respective cured products obtained by the above methods were measured for dynamic viscoelasticity at 265 ℃ and 100 ℃ (mode: stretching, scanning temperature: 0 ℃ to 270 ℃, frequency: 1Hz, and temperature rising rate: 10 ℃/min).

The resin molded article for sealing an optical semiconductor of the present invention preferably comprises: the glass transition temperature (Tg) of a cured product (dimension: 5mm in width, 35mm in length, 1mm in thickness) produced by the above method is 130 ℃ or higher, and satisfies the following relational expression (2).

Y＜160000X-14500000(2)

(wherein X represents the glass transition temperature (. degree. C.) of the cured product, and Y represents the storage modulus (Pa) of the cured product at 265 ℃)

When such a resin molded product is cured, a cured product having a high glass transition temperature and a low elastic modulus at high temperatures can be obtained, and therefore an optical semiconductor sealing material having further excellent heat resistance, temperature cycle resistance, reflow resistance, yellowing resistance, dimensional stability against temperature change, impact absorption properties, and impact resistance can be obtained.

The glass transition temperature is preferably 130 ℃ or higher, more preferably 140 ℃ or higher, still more preferably 145 ℃ or higher, and particularly preferably 155 ℃ or higher. The glass transition temperature is preferably 200 ℃ or lower, more preferably 190 ℃ or lower, and still more preferably 180 ℃ or lower.

When the glass transition temperature of the cured product is within the above range, an optical semiconductor sealing material having excellent heat resistance, temperature cycle resistance, yellowing resistance, dimensional stability against temperature change, and impact absorption can be obtained.

The glass transition temperature is determined as follows: the storage modulus E 'and the loss modulus E' were obtained by performing dynamic viscoelasticity measurement (mode: stretching, scanning temperature: 0 ℃ C. -270 ℃ C., frequency: 1Hz, temperature-raising rate: 10 ℃/min) using the cured product (dimension: width: 5 mm. times. length: 35 mm. times. thickness: 1mm) obtained by the above-mentioned method, a curve of tan δ (═ E "/E ') was obtained from the storage modulus E' and the loss modulus E ″, and the glass transition temperature was obtained from the peak top temperature of tan δ.

The resin molded article for sealing an optical semiconductor of the present invention preferably satisfies the following relational expressions (3) and (4), and more preferably satisfies the following relational expressions (3 ') and (4').

Y＜6300000(130≤X＜150) (3)

Y＜160000X-17000000(150≤X≤190) (4)

Y＜1400000(130≤X＜150) (3’)

Y＜160000X-22000000(150≤X≤190) (4’)

(in each formula, X represents the glass transition temperature (. degree. C.) of a cured product (dimension: 5mm in width. times.35 mm in length. times.1 mm in thickness) obtained by the above method, and Y represents the storage modulus (Pa) of the cured product at 265 ℃

Thus, an optical semiconductor sealing material having excellent heat resistance, temperature cycle resistance, reflow resistance, yellowing resistance, dimensional stability against temperature change, impact absorption, and impact resistance can be obtained.

The molded resin for sealing an optical semiconductor of the present invention has a storage modulus (E ') at 265 ℃ when a cured product (dimension: width: 5 mm. times.length: 35 mm. times.thickness: 1mm) is produced by the above-mentioned method'_265℃) Preferably 1.5X 10⁷Pa or less, more preferably 1.0X 10⁷Pa or less.

The resin molded article for sealing an optical semiconductor of the present invention preferably satisfies the following relational expression (5).

0.70＜R_450nm＜1.00 (5)

(in the formula, R_450nmThe linear transmittance ratio (after implementation/before implementation) at a wavelength of 450nm before and after implementation when reflow soldering was performed 3 times at 265 ℃ on the cured product (dimension: width 50 mm. times. length 50 mm. times. thickness 1mm) obtained by the above method is shown. )

R_450nmMore preferably 0.80 or more, and R is_450nmMore preferably 0.95 or less.

When R is_450nmWhen the content is within the above range, a decrease in transmittance at a specific wavelength of a cured product after reflow soldering can be suppressed, and therefore an optical semiconductor sealing material having more excellent reflow soldering resistance and yellowing resistance can be obtained.

The resin molded article for sealing an optical semiconductor of the present invention preferably satisfies the following relational expression (5').

0.60＜R_400nm＜0.90 (5’)

(in the formula, R_400nmRepresents the solid obtained by the above methodThe ratio of linear transmittances at a wavelength of 400nm before and after reflow soldering (after application/before application) of a material (dimension: width 50 mm. times. length 50 mm. times. thickness 1mm) at 265 ℃ for 3 times of reflow soldering. )

R_400nmMore preferably 0.70 or more, and R is_400nmMore preferably 0.85 or less.

When R is_400nmWhen the content is within the above range, a decrease in transmittance at a specific wavelength of a cured product after reflow soldering can be suppressed, and therefore an optical semiconductor sealing material having more excellent reflow soldering resistance and yellowing resistance can be obtained.

The resin molded article for sealing an optical semiconductor of the present invention preferably satisfies the following relational expression (5 ").

0.10＜R_300nm＜0.50 (5”)

(in the formula, R_300nmThe linear transmittance ratio (after implementation/before implementation) at a wavelength of 300nm before and after implementation in 3 times of reflow soldering at 265 ℃ of the cured product (dimension: width 50 mm. times. length 50 mm. times. thickness 1mm) obtained by the above method is shown. )

R_300nmMore preferably 0.15 or more, and R is_300nmMore preferably 0.40 or less.

When R is_300nmWhen the content is within the above range, a decrease in transmittance at a specific wavelength of a cured product after reflow soldering can be suppressed, and therefore an optical semiconductor sealing material having more excellent reflow soldering resistance and yellowing resistance can be obtained.

The resin molded article for sealing an optical semiconductor of the present invention preferably satisfies the following relational expressions (6) and (7).

0.80＜R_400nm/R_450nm＜1.00 (6)

0.10＜R_300nm/R_450nm＜0.50 (7)

(in the formulae, R_300nm、R_400nmAnd R_450nmThe ratios of linear transmittances at wavelengths of 300nm, 400nm and 450nm before and after the solder reflow at 265 ℃ in the case where the cured product (dimension: width 50 mm. times. length 50 mm. times. thickness 1mm) obtained by the above method was subjected to 3 times of solder reflow (after implementation/before implementation) are shown.)

R_400nm/R_450nmMore preferably 0.95 or less.

R_300nm/R_450nmMore preferably 0.20 or more, and R is_300nm/R_450nmMore preferably 0.40 or less.

When R is_400nm/R_450nmAnd R_300nm/R_450nmWhen the content is within the above range, a decrease in transmittance at a specific wavelength of a cured product after reflow soldering can be suppressed, and therefore an optical semiconductor sealing material having more excellent reflow soldering resistance and yellowing resistance can be obtained.

The linear transmittance at each wavelength was determined by preparing a cured product by the above method, and measuring the transmission spectrum of the cured product with a spectrophotometer before and after reflow soldering.

The reflow was performed using the cured product at a peak temperature of 265 ℃ for 10 seconds in a reflow furnace.

The molded resin for sealing an optical semiconductor of the present invention has a linear transmittance at a wavelength of 450nm of preferably 70% or more, more preferably 90% or more, and even more preferably 95% or more, when a cured product (dimension: width 50 mm. times. length 50 mm. times. thickness 1mm) is produced by the above method.

This makes it possible to obtain an optical semiconductor sealing material having excellent light transmittance (transparency).

The linear transmittance was determined by measuring the transmittance spectrum of the cured product at a wavelength of 450nm using a spectrophotometer.

The resin molded article for sealing an optical semiconductor of the present invention includes: a tablet (タブレット), a sheet (シート), and the like.

When the molded resin for sealing an optical semiconductor is a small piece, the volume thereof is not particularly limited, but is preferably 1cm³～100cm³More preferably 10cm³～100cm³。

The molded resin article for sealing an optical semiconductor of the present invention preferably contains a reaction product of a thermosetting resin and a curing agent. Further, it is preferable to further contain a thermosetting resin, a curing agent, a reaction product of the thermosetting resin and the curing agent, and a curing accelerator. In addition to the above, it is preferable to include a polyol and a reaction product of the polyol and a curing agent. The resin molded product for sealing an optical semiconductor of the present invention may be in a so-called B-stage (semi-cured) state.

As the thermosetting resin, an epoxy resin is preferable. As the epoxy resin, an epoxy resin with little coloring is preferable.

The epoxy resin is preferably an epoxy resin having 2 or more continuous ring structures (not including an oxirane ring) because a resin molded product satisfying the respective relational expressions can be easily obtained. Here, 2 or more ring structures being continuous means that 2 or more ring structures are directly connected, in other words, that no atom that does not constitute a ring exists between 1 ring structure and an adjacent ring structure. Preferably, 1 ring structure and an adjacent ring structure share 2 or more atoms among 2 or more continuous ring structures.

The ring structure is preferably a non-aromatic ring, and more preferably a non-aromatic carbocyclic ring. The epoxy resin may be an alicyclic epoxy resin.

The above-mentioned ring structure may have an unsaturated bond, but preferably has no unsaturated bond.

The epoxy resin preferably has a hydrocarbon group having a bridge structure, more preferably a bicyclic or tricyclic hydrocarbon group having a bridge structure, and still more preferably a bicyclic hydrocarbon group having a 6-membered ring provided with a bridge structure.

The above-mentioned hydrocarbon group having a bridging structure is particularly preferably a group represented by the following formula:

(in the formula, R¹¹Represents an oxygen atom or an alkylene group. R¹²～R¹⁷Each independently represents a hydrogen atom or an alkyl group).

This makes it possible to more easily obtain a resin molded product that satisfies the relational expressions.

In the above formula, R¹¹Represents an oxygen atom or an alkylene group. The number of carbon atoms of the alkylene group is preferably 1 to 5, more preferably 1 to 3, further preferably 1 to 2, and particularly preferably 1.

R¹¹Preferably an alkylene group.

In the above formula, R¹²～R¹⁷Each independently represents a hydrogen atom or an alkyl group. As R¹²～R¹⁷The alkyl group has preferably 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms, and still more preferably 1 to 2 carbon atoms.

R¹²～R¹⁷Preferably a hydrogen atom.

The epoxy resin may be exemplified by the following, but is not limited thereto. When a stereoisomer is present, each stereoisomer and a mixture of two or more stereoisomers are also included in the examples.

Epoxy resins other than those described above may also be used. Examples thereof include: examples of the epoxy resin include a heterocyclic ring-containing epoxy resin such as a bisphenol a type epoxy resin, a bisphenol F type epoxy resin, a phenol novolac type epoxy resin, an alicyclic epoxy resin, triglycidyl isocyanurate, and a hydantoin epoxy resin, a hydrogenated bisphenol a type epoxy resin, an aliphatic epoxy resin, and a glycidyl ether type epoxy resin. The epoxy resin may be used in combination with the above-mentioned epoxy resin having 2 or more continuous ring structures (wherein, the oxirane ring is not included).

The epoxy resin may be used singly or in combination of two or more.

The curing agent is preferably an acid anhydride which hardly colors a cured product of the resin molded product during or after curing. Among them, the acid anhydride (a) represented by the following formula (a) is preferable because a resin molded product satisfying the above respective relational expressions can be easily obtained.

(in the formula, A)¹Represents an organic group having 2 or more ring structures).

In the formula (a), A¹Is an (polycyclic) organic group having 2 or more ring structures. The organic group is a divalent organic group.

The number of carbon atoms of the organic group is preferably 5 or more, more preferably 6 or more, further preferably 7 or more, and the number of carbon atoms of the organic group is preferably 20 or less, more preferably 15 or less, further preferably 10 or less, particularly preferably 7 or less.

The organic group is preferably a hydrocarbon group, and may contain a hetero atom such as an oxygen atom or an unsaturated bond such as a double bond.

The organic group is preferably a hydrocarbon group having a bridge structure, more preferably a bicyclic hydrocarbon group having a bridge structure, and still more preferably a bicyclic hydrocarbon group having a bridge structure provided on a 6-membered ring.

A¹Particularly preferred is a group represented by the following formula (a 1):

(in the formula, R²Represents an oxygen atom or an alkylene group. R³Represents a hydrocarbon group having 2 or more carbon atoms. R⁴～R⁷Each independently represents a hydrogen atom or an alkyl group. )

This makes it possible to more easily obtain a resin molded product that satisfies the relational expressions.

In the formula (A1), R²Represents an oxygen atom or an alkylene group. The number of carbon atoms of the alkylene group is preferably 1 to 5, more preferably 1 to 3, further preferably 1 to 2, and particularly preferably 1.

R²Preferably an alkylene group.

In the formula (A1), R³Represents a hydrocarbon group having 2 or more carbon atoms. The hydrocarbon group is a divalent hydrocarbon group. The above-mentioned hydrocarbon group has 2 or more carbon atoms, more preferably 2 to 5 carbon atoms, still more preferably 2 to 4 carbon atoms, and particularly preferablyIs selected as 2.

As R³The hydrocarbon group of (A) is preferably-CX¹ ₂-CX² ₂- (in the formula, X)¹And X²Independently a hydrogen atom or an alkyl group) or-CX¹＝CX²- (in the formula, X)¹And X²As described above).

As X¹And X²The alkyl group has preferably 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms, and still more preferably 1 to 2 carbon atoms.

In the presence of a plurality of X¹Or a plurality of X²In the case of (2), these plural xs¹Or a plurality of X²May be the same or different.

X¹And X²Preferably a hydrogen atom.

In the formula (A1), R⁴～R⁷Each independently represents a hydrogen atom or an alkyl group. As R⁴～R⁷The alkyl group has preferably 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms, and still more preferably 1 to 2 carbon atoms.

R⁴And R⁵Preferably a hydrogen atom or an alkyl group, more preferably a hydrogen atom.

R⁶And R⁷Preferably a hydrogen atom.

Examples of the group represented by the formula (a1) include the following groups, but are not limited thereto. When a stereoisomer is present, each stereoisomer and a mixture of two or more stereoisomers are also included in the examples.

Among the groups represented by the formula (a1), the following groups are preferable.

Anhydrides other than those described above may also be used. Examples thereof include: phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, glutaric anhydride, and the like. The acid anhydride (a) may be used in combination.

The curing agent may be used singly or in combination of two or more.

The amount of the curing agent is not particularly limited, and is preferably 20 to 200 parts by mass, for example, per 100 parts by mass of the thermosetting resin. When the amount of the curing agent is less than 20 parts by mass, the curing rate is lowered, and when the amount of the curing agent is more than 200 parts by mass, the curing agent is excessively added to the curing reaction, which may result in deterioration of various physical properties.

When the thermosetting resin is an epoxy resin and the curing agent is an acid anhydride, the equivalent ratio (a/E) of the equivalent (a) of the acid anhydride group to the equivalent (E) of the epoxy group is preferably 0.5 to 1.5, more preferably 0.8 to 1.2, and most preferably 0.9 to 1.0. When the equivalent ratio is less than 0.5 or more than 1.5, the reactivity may be lowered, and the strength and heat resistance of the cured product may be impaired.

In the case where the resin molded article for sealing an optical semiconductor of the present invention contains a curing agent, a part of the curing agent may react with a thermosetting resin.

Examples of the curing accelerator include: tertiary amines such as triethanolamine and dimethylbenzylamine; imidazoles such as 2-methylimidazole and 2-ethyl-4-methylimidazole; tetraphenyl radicalOrganic phosphorus compounds such as tetraphenylborate and triphenylphosphine; 1, 8-diazabicyclo [5.4.0 ]]Undec-7-ene, 1, 5-diazabicyclo [4.3.0]Diazabicyclo-olefin compounds such as non-5-ene. These curing accelerators may be used alone or in combination of 2 or more.

The amount of the curing agent to be blended is not particularly limited, and may be appropriately selected from the range of, for example, 0.1 to 5 parts by mass, preferably 0.5 to 3 parts by mass, and more preferably 1 to 2 parts by mass, based on 100 parts by mass of the thermosetting resin. When the amount of the curing accelerator is too small, the curing rate becomes slow, and the productivity is lowered, while when the amount of the curing accelerator is too large, the curing reaction rate becomes fast, and the control of the reaction state becomes difficult, and there is a concern that the reaction may fluctuate.

In the case where the resin molded article for sealing an optical semiconductor of the present invention contains a curing accelerator, a part of the curing accelerator may react with the thermosetting resin and/or the curing agent.

The molded resin for sealing an optical semiconductor of the present invention preferably further contains a polyol. This makes it possible to obtain a cured product having a lower elastic modulus and to obtain an optical semiconductor sealing material having more excellent impact absorption and impact resistance.

The polyol may be a compound having 2 or more hydroxyl groups, but is preferably a diol (diol).

As the polyol, a polyol having a non-aromatic ring is preferable from the viewpoint that a resin molded product satisfying each of the relational expressions can be easily obtained. The polyol may be an alicyclic polyol. The number of carbon atoms of the polyol is preferably 3 or more, more preferably 5 or more, and further preferably 6 or more, and the number of carbon atoms of the polyol is preferably 30 or less, and more preferably 20 or less.

The non-aromatic ring is more preferably a non-aromatic carbocyclic ring. The non-aromatic ring may have an unsaturated bond, but preferably has no unsaturated bond. The non-aromatic ring may be monocyclic or polycyclic.

The non-aromatic ring may be a hydrocarbon ring having a bridge structure. The hydrocarbon ring having a bridged structure is preferably a bicyclic or tricyclic hydrocarbon ring having a bridged structure, and more preferably a tricyclic hydrocarbon ring having a bridged structure.

The non-aromatic ring is particularly preferably a cyclohexane ring.

Examples of the polyol include, but are not limited to, the following polyols. When a stereoisomer is present, each stereoisomer and a mixture of two or more stereoisomers are also included in the examples.

Polyols other than those described above may also be used. Examples thereof include: a diol having 2 to 10 carbon atoms, more preferably 2 to 6 carbon atoms, and still more preferably 2 to 5 carbon atoms. Examples of the above-mentioned dihydric alcohol include: ethylene glycol, propylene glycol, neopentyl glycol, pentanediol, butanediol, etc., and among them, neopentyl glycol is preferable. The polyol having a non-aromatic ring may be used in combination with the above-mentioned polyol.

The polyhydric alcohol may be used singly or in combination of two or more.

The amount of the polyol to be blended is not particularly limited, and may be selected from the range of, for example, 5 parts by mass to 200 parts by mass per 100 parts by mass of the thermosetting resin.

When the curing agent is an acid anhydride, the molar ratio (B/C) of the number of moles (B) of the polyol compound to the number of moles (C) of the acid anhydride is preferably 0.01 to 0.70, more preferably 0.05 to 0.60, and most preferably 0.10 to 0.50.

When the amount of the polyol to be blended is too small, the elastic modulus of the obtained cured product may become too high, while when the amount of the polyol to be blended is too large, the glass transition temperature and the elastic modulus of the obtained cured product may become too low.

When the molded resin article for sealing an optical semiconductor of the present invention contains a polyol, a part of the polyol may react with the thermosetting resin and/or the curing agent.

The resin molded article for sealing an optical semiconductor of the present invention preferably contains an epoxy resin, an acid anhydride, a polyol, a reaction product of an epoxy resin and an acid anhydride, a reaction product of a polyol and an acid anhydride, and a curing accelerator, and satisfies at least one of the following (i) to (iii).

(i) The epoxy resin is an epoxy resin having 2 or more continuous ring structures (not including an oxirane ring).

(ii) The acid anhydride is an acid anhydride (a) represented by the above formula (a).

(iii) The polyol is a polyol having a non-aromatic ring.

Such a resin molded product can give a cured product having a high glass transition temperature and a low elastic modulus at high temperatures, and therefore can give an optical semiconductor sealing material having excellent heat resistance, temperature cycle resistance, and reflow resistance. Further, an optical semiconductor sealing material excellent in yellowing resistance, dimensional stability against temperature change, impact absorbability and impact resistance can be obtained.

In general, as the glass transition temperature increases, the elastic modulus also tends to increase, but by satisfying at least one of the above (i) to (iii), the following resin molded article can be obtained: the resin molded product can obtain a cured product having a high glass transition temperature and a low elastic modulus at a higher temperature than the glass transition temperature. The reason is not clear, but it is presumed that: in the reaction product of an epoxy resin and an acid anhydride or the reaction product of a polyol and an acid anhydride, the steric repulsive force between side chains generated by a ring structure of the epoxy resin, the acid anhydride or the polyol is large, so that the glass transition temperature increases due to an increase in the rigidity of the main chain of the reaction product, and the elastic modulus decreases due to an increase in the free volume of the reaction product.

The resin molded article for sealing an optical semiconductor of the present invention preferably contains at least one compound selected from the group consisting of a compound having a structural unit (I) represented by the following formula (I), a compound having a structural unit (II) represented by the following formula (II), and a compound having a structural unit (III) represented by the following formula (III).

Formula (I):

(in the formula, A)¹Represents an organic group having 2 or more ring structures. R^1aRepresents a site containing an epoxy resin residue. R^1bRepresents a hydrogen atom or with R^1aA bonded bond. )

Formula (II):

(in the formula, A)²Represents an organic group. R^2aThe term "site" refers to a site containing an epoxy resin residue having 2 or more continuous ring structures (excluding an oxirane ring). R^2bRepresents a hydrogen atom or with R^2aA bonded bond. )

Formula (III):

(in the formula, A)³Represents an organic group. R^3aRepresents an organic group having a non-aromatic ring. )

The resin molded product containing such a compound can give a cured product having a high glass transition temperature and a low elastic modulus at high temperatures, and therefore can give an optical semiconductor sealing material having excellent heat resistance, temperature cycle resistance, and reflow resistance. Further, an optical semiconductor sealing material excellent in yellowing resistance, dimensional stability against temperature change, impact absorbability and impact resistance can be obtained.

The compound having the structural unit (I) may be a reaction product of an epoxy resin and the above-mentioned acid anhydride (a). The epoxy resin used for forming the structural unit (I) may be the above-described epoxy resin having 2 or more continuous ring structures (in which an oxirane ring is not included), or may be an epoxy resin other than these.

In the formula (I), A¹Represents an organic group having 2 or more ring structures. A in the formula (I)¹And A in the above formula (a)¹The same is true.

In the formula (I), R^1aRepresents a site containing an epoxy resin residue. In the present specification, an epoxy resin residue is a structure obtained by removing at least 1 epoxy group (oxirane ring) from an epoxy resin.

R^1aMay further contain one or more unreacted ringsThe oxy group may further contain a structure obtained by reacting an epoxy group with another compound (a curing agent, a curing accelerator, another additive, etc.).

In the formula (I), R^1bRepresents a hydrogen atom or with R^1aA bonded bond. At R^1bIn the case of a bond, with R^1aBonded to form a ring.

In the compounds having the structural unit (I), adjacent A¹The number of atoms in the main chain is preferably 6 to 17. The number of atoms is more preferably 13 or less, and still more preferably 9 or less. The number of atoms may be 10 or more, or 14 or more.

The above adjacent A¹The number of atoms in the main chain between refers to from one A¹To the nearest other A¹The number of atoms present on the shortest path along the bond. The atoms in the main chain do not include the constituent A¹Atom of (2), oxygen atom of carbonyl group, constituent R^1aAnd R^1bThe atom (c) of (a).

By adjacent A¹The number of atoms in the main chain between (a) and (b) is in the above range, and the rigidity and free volume of the main chain of the compound are further increased, so that a cured product having a higher glass transition temperature and a lower elastic modulus at high temperatures can be obtained, and an optical semiconductor sealing material having excellent heat resistance, temperature cycle resistance, reflow resistance, yellowing resistance, dimensional stability against temperature change, impact absorption properties, and impact resistance can be obtained.

The compound having the structural unit (II) may be a reaction product of the above-described epoxy resin having 2 or more continuous ring structures (wherein, an oxirane ring is not included) and an acid anhydride. The acid anhydride used for forming the structural unit (II) may be the acid anhydride (a) described above, or may be other acid anhydrides.

In the formula (II), A²Represents an organic group. The organic group is a divalent organic group.

The number of carbon atoms of the organic group is preferably 2 or more, more preferably 6 or more, and the number of carbon atoms of the organic group is preferably 20 or less, more preferably 15 or less, and further preferably 10 or less.

The organic group is preferably a hydrocarbon group, and may contain a hetero atom such as an oxygen atom or an unsaturated bond such as a double bond.

The organic group may have a ring structure, and preferably has a ring structure.

In the formula (II), R^2aThe term "site" refers to a site containing an epoxy resin residue having 2 or more continuous ring structures (excluding an oxirane ring). The epoxy resin having 2 or more continuous ring structures (wherein, the oxirane ring is not included) is as described above.

R^2aThe epoxy resin composition may further contain 1 or more unreacted epoxy groups, or may further contain a structure obtained by reacting an epoxy group with another compound (a curing agent, a curing accelerator, another additive, or the like).

In the formula (II), R^2bRepresents a hydrogen atom or with R^2aA bonded bond. At R^2bIn the case of a bond, with R^2aBonded to form a ring. R^2bPreferably with R^2aA bonded bond.

The compound having the structural unit (III) may be a reaction product of a polyol having a non-aromatic ring and an acid anhydride. The acid anhydride for forming the structural unit (III) may be the acid anhydride (a) described above, or may be other acid anhydrides.

In the formula (III), A³Represents an organic group. As A³The organic group of (A) may be mentioned as above²The same applies to the organic group of (1).

In the formula (III), R^3aRepresents an organic group having a non-aromatic ring. The organic group is a divalent organic group. The number of carbon atoms of the organic group is preferably 3 or more, more preferably 5 or more, and still more preferably 6 or more, and the number of carbon atoms of the organic group is preferably 30 or less, and more preferably 20 or less.

The organic group is preferably a hydrocarbon group, and may contain a hetero atom such as an oxygen atom or an unsaturated bond such as a double bond.

Examples of the non-aromatic ring of the organic group include the same non-aromatic rings as those of the non-aromatic ring-containing polyol described above.

R^3aThe hydroxyl group may be a group obtained by removing 2 hydroxyl groups from the above-mentioned polyol having a non-aromatic ring.

When the molded resin for sealing an optical semiconductor of the present invention contains a compound having a structural unit (III), it preferably further contains a compound having a structural unit (IV) represented by the following formula (IV).

Formula (IV):

(in the formula, A)³As described above. R^4aRepresents a site containing an epoxy resin residue. R^4bRepresents a hydrogen atom or with R^4aA bonded bond. )

The compound having the structural unit (IV) may be a reaction product of an epoxy resin and an acid anhydride. The epoxy resin used for forming the structural unit (IV) may be the above-described epoxy resin having 2 or more continuous ring structures (in which an oxirane ring is not included), or may be an epoxy resin other than these. The acid anhydride for forming the structural unit (IV) may be the acid anhydride (a) or other acid anhydrides.

In the formula (IV), R^4aRepresents a site containing an epoxy resin residue. R^4aThe epoxy resin composition may further contain 1 or more unreacted epoxy groups, or may further contain a structure obtained by reacting an epoxy group with another compound (a curing agent, a curing accelerator, another additive, or the like).

In the formula (IV), R^4bRepresents a hydrogen atom or with R^4aA bonded bond. At R^4bIn the case of a bond, with R^4aBonded to form a ring.

In addition to the above components, the resin molded product for sealing an optical semiconductor of the present invention may contain additives such as a coloring inhibitor, a lubricant, a modifier, a deterioration inhibitor, a release agent, a phosphor for changing the wavelength of light, and an inorganic/organic filler for diffusing light, if necessary. A filler such as silica powder may be added to the composition to such an extent that the light transmission is not impaired.

As the stain-proofing agent, there can be mentioned: phenolic compounds, amine compounds, organic sulfur compounds, phosphine compounds, and the like.

As the lubricant, there may be mentioned: waxes such as stearic acid, magnesium stearate, and calcium stearate; talc, and the like. When the lubricant is blended, the blending amount is appropriately set according to molding conditions, and is preferably set to 0.1 to 0.4 mass% of the entire resin molded product, for example.

Examples of the phosphor for changing the wavelength of light and the inorganic/organic filler for diffusing light include: silica powders such as quartz glass powder, talc, fused silica powder, and crystalline silica powder; alumina; silicon nitride; aluminum nitride; silicon carbide, and the like. When the phosphor and the inorganic/organic filler are blended, the blending amount is appropriately set according to molding conditions. Specifically, in the case of the phosphor, the blending amount of the phosphor can be appropriately set from the range of 1 mass% to 60 mass% of the entire resin molded product. On the other hand, in the case of a light-diffusing filler (organic/inorganic), the amount of the light-diffusing filler to be blended may be appropriately set within a range of 0.5 to 25 mass% of the entire resin molded product.

The resin molded product for sealing an optical semiconductor of the present invention is used for resin sealing of an optical semiconductor element such as a light receiving element, and therefore, a transparent molded product is preferable from the optical viewpoint. The term "transparent" as used herein means that the cured product of the molded product has a transmittance of 90% or more at 400 nm. The transmittance in the case where an additive such as the above-described phosphor that changes the wavelength of light and an inorganic/organic filler that diffuses light is contained means the transmittance of the resin portion after the additive is removed.

The resin molded article for sealing an optical semiconductor of the present invention can be suitably produced, for example, by a production method comprising the steps of:

a step of kneading a thermosetting resin, a curing agent, a curing accelerator, and, if necessary, a polyol to obtain a curable resin composition;

a step of heat-treating the curable resin composition;

granulating the curable resin composition to obtain a granular curable resin composition; and

and a step of molding the particulate curable resin composition.

The method of kneading is not particularly limited, and examples thereof include a method using an extruder. The kneading temperature is not particularly limited, and may be appropriately changed depending on the properties of the thermosetting resin.

The shape of the curable resin composition obtained by kneading is not particularly limited, and examples thereof include: film, flake, granule, block, etc.

The curable resin composition obtained by kneading is subjected to a heat treatment to obtain a B-stage (semi-cured) resin composition for sealing an optical semiconductor. The heat treatment temperature and the heat treatment time are not particularly limited and may be appropriately changed according to the characteristics of the thermosetting resin.

The resin composition after the heat treatment was pelletized to obtain a pellet-shaped curable resin composition. Before the granulation, the raw material may be pulverized by using a ball mill, a turbo mill, or the like. The granulation method is not particularly limited, and a method using a dry compression granulator and the like can be exemplified. The average particle diameter of the granules obtained by granulation is not particularly limited, but is preferably 1 to 5000 μm, and more preferably 100 to 2000 μm. When the average particle diameter is larger than 5000. mu.m, the compressibility tends to decrease.

The obtained particulate curable resin composition was molded to obtain a molded article. Examples of the molded article include: the molding method of the chip or sheet includes: tablet molding to obtain a tablet, extrusion molding to obtain a sheet, and the like. The molded article thus obtained satisfies the specific relational expression as described above, and therefore, a cured product having a high glass transition temperature and a low elastic modulus can be obtained, and an optical semiconductor sealing material having excellent heat resistance, temperature cycle resistance and reflow resistance can be obtained.

When the molded article is a pellet, conditions for tableting and molding the pellet may be appropriately adjusted depending on the composition, average particle diameter, particle size distribution, and the like of the particulate curable resin composition, and the compressibility in tableting and molding is preferably set to 90% to 96%. That is, when the compressibility value is less than 90%, the density of the small pieces may decrease and the small pieces may be easily broken, whereas when the compressibility value is more than 96%, cracks may occur during tabletting, and defects or fractures may occur during demolding.

The resin molded article for sealing an optical semiconductor of the present invention can seal an optical semiconductor element by a molding method such as transfer molding. An optical semiconductor sealing material obtained by molding the resin molding for sealing an optical semiconductor of the present invention is also one aspect of the present invention. The optical semiconductor sealing material of the present invention is obtained from the resin molded product of the present invention, and therefore, is excellent in heat resistance, temperature cycle resistance and reflow resistance. Further, the resin composition is excellent in yellowing resistance, dimensional stability against temperature change, impact absorbability and impact resistance. Therefore, even when the optical semiconductor device is used in a high-temperature environment or in a reflow step, cracks and peeling are reduced, and damage to the optical semiconductor element to be sealed can be reduced.

In this specification, the optical semiconductor sealing material is a member which is formed so as to cover an optical semiconductor element constituting an optical semiconductor device and seals the element.

An optical semiconductor device comprising an optical semiconductor element and the optical semiconductor sealing material of the present invention for sealing the optical semiconductor element is also one aspect of the present invention. Since the optical semiconductor device of the present invention includes the optical semiconductor sealing material of the present invention, the sealing material is less likely to crack or peel even when operated in a high-temperature environment, and the optical semiconductor element is less likely to be damaged.

The resin molding for sealing an optical semiconductor of the present invention is particularly suitable for sealing an optical semiconductor mounted on a vehicle, which is often used in a high-temperature environment and is often supplied to a reflow step.

[ examples ]

The present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.

The materials used are as follows.

Epoxy resin A: triglycidyl isocyanurate (TEPIC-S manufactured by Nissan chemical Co., Ltd., epoxy equivalent 100)

Epoxy resin B: bisphenol A type epoxy resin (JER-1002W, epoxy equivalent 650, Mitsubishi chemical corporation)

Epoxy resin C: an epoxy resin represented by the following formula (DE-102, epoxy equivalent 111 manufactured by JXTG Co., Ltd.)

Epoxy resin D: an epoxy resin represented by the following formula (DE-103, epoxy equivalent 174, manufactured by JXTG Co., Ltd.)

Acid anhydride A: a mixture of bicyclo [2.2.1] heptane-2, 3-dicarboxylic anhydride and 5-methylbicyclo [2.2.1] heptane-2, 3-dicarboxylic anhydride represented by the following formula (RIKACID HNA-100, acid anhydride equivalent 179, manufactured by Nissian chemical and physical Co., Ltd.)

Acid anhydride B: cis-5-norbornene-exo-2, 3-dicarboxylic anhydride represented by the following formula

Acid anhydride C: hexahydrophthalic anhydride (RIKACID HH manufactured by Nissi chemical Co., Ltd.)

Glycol additive a: neopentyl glycol (manufactured by Mitsubishi gas chemical Co., Ltd.)

Glycol additive B: hydrogenated bisphenol A (RIKABINOL HB, a product of Xinri chemical and physical Co., Ltd.)

Curing accelerator: 2-ethyl-4-methylimidazole

Examples 1 to 16 and comparative examples 1 to 2

The components shown in tables 1 and 2 were melt-mixed at 50 to 140 ℃ in the proportions shown in the tables, and then cooled to obtain epoxy resin compositions. The obtained epoxy resin composition was subjected to reactivity adjustment at 40 to 80 ℃, and then pulverized, tableted and molded to prepare a resin tablet for encapsulating an optical semiconductor.

Using the chips prepared in the examples and comparative examples, various physical properties were measured by the methods shown below, and reflow resistance and hot hardness were evaluated. The results are shown in tables 1 and 2.

< preparation of test piece (cured product) >

The thus-prepared small pieces were molded using a dedicated mold (curing conditions: heating at 150 ℃ C. for 4 minutes), to prepare cured products for test pieces having dimensions corresponding to the measurement method. The cured product for a test piece was heated at 150 ℃ for 3 hours to complete the curing, thereby obtaining a test piece.

< storage modulus E' >

Using the test piece (dimension: width: 5 mm. times. length: 35 mm. times. thickness: 1mm) thus prepared, the storage modulus E' of the test piece was obtained under the measurement conditions of tensile mode, frequency 1Hz, scanning temperature of 0 to 270 ℃ and temperature rising rate of 10 ℃/min by using RSA-II manufactured by RHEOMETRIC SCIENTIFIC, and the storage modulus of the cured product was derived at the measurement temperature of 265 ℃ and 100 ℃.

< glass transition temperature (Tg) >

The storage modulus E 'and the loss modulus E' of the test piece (dimension: width: 5 mm. times. length: 35 mm. times. thickness: 1mm) produced above were obtained under the measurement conditions of a stretching mode, a frequency of 1Hz, a scanning temperature of 0 to 270 ℃ and a temperature rise rate of 10 ℃/min by using RSA-II produced by RHEOMETRIC scienfic corporation, and tan δ (═ E "/E ') was obtained from the storage modulus E' and the loss modulus E ″, and the glass transition temperature (Tg) was obtained from the peak top temperature of tan δ.

< Linear transmittance >

First, a quartz cell was filled with fuji film and liquid paraffin manufactured by wako pure chemical industries, and a baseline was measured using a spectrophotometer V-670 manufactured by japan spectrochemical industries. Then, the test pieces (dimensions: width: 50 mm. times. length: 50 mm. times. thickness: 1mm) prepared as described above before and after reflow were immersed in liquid paraffin in a quartz cell, and the light transmittance at each wavelength (wavelength 300nm, wavelength 400nm, wavelength 450nm) was measured.

< reflow soldering >

The above test piece was passed through a reflow oven (peak top 265 ℃ C.. times.10 seconds) 3 times.

< evaluation of production of Package >

As shown in fig. 1, the above-prepared chips were molded into dimensions so as to cover the end portions of reliability evaluation frames (Ag) manufactured by flat-well precision industries: width 5mm x length 6mm x thickness 2mm (curing conditions: heating at 150 ℃ C. for 4 minutes). The curing was completely completed by heating it at 150 ℃ for 3 hours, thereby obtaining an evaluation package. For each of the examples and comparative examples, 20 packages described above were produced.

< reflow soldering resistance >

The package was passed through a reflow oven (peak 265 ℃ C. times.10 seconds) 3 times. Next, the package was immersed in red ink manufactured by sun products, and the pressure was reduced for 10 minutes, and then the package was taken out, and the immersion of the ink was visually observed, and the package immersed with the ink was judged to have a defective peeling. The number of packages having a defective peeling out among the 20 packages was counted, and reflow resistance was evaluated according to the following criteria.

Good: 0 to 5

X: more than 6

< Temperature Cycle Test (TCT) >

The above packages were exposed to high temperature (130 ℃) and low temperature (-40 ℃) for 15 minutes, respectively. The recovery of each temperature was completed within 5 minutes. The package was subjected to a temperature cycle test of 1000 cycles using this as one cycle. Then, the packages were taken out, the presence or absence of cracks was observed, and the number of packages having cracks among 20 packages was counted and evaluated according to the following criteria.

Good: 0 to 5

X: more than 6

< Heat hardness >

The test piece (size: width 50 mm. times. length 50 mm. times. thickness 3mm) produced as described above was evaluated by measuring the thermal hardness at 200 ℃ with a Shore A hardness tester according to the following criteria.

O: hot hardness less than 70

X: a hot hardness of 70 or more

Industrial applicability

The present invention relates to a resin molded product for optical semiconductor encapsulation used for encapsulating an optical semiconductor element, an optical semiconductor encapsulating material, and an optical semiconductor device.