阅读说明：本技术 显示面板及其制备方法 (Display panel and preparation method thereof ) 是由 杨宗鹏 于 2021-09-02 设计创作，主要内容包括：本申请公开了一种显示面板及其制备方法,其制备方法包括：提供一阵列基板,阵列基板包括中间区和围绕中间区设置的第一外围区；在第一外围区,在阵列基板上形成第一挡墙和第二挡墙,第一挡墙位于第二挡墙靠近中间区的一侧；在中间区,在阵列基板上形成发光结构；在第二挡墙的遮挡下,在阵列基板和第一挡墙上依次层叠沉积第一无机层、有机层和第二无机层,第一无机层和第二无机层形成于第二挡墙围设的区域内；有机层形成于第一挡墙围设的区域内,得到显示面板；其中,在第一外围区,第一无机层和第二无机层的端部均具有一凸部和一与凸部相邻设置的凹部,凸部位于凹部远离发光结构的一侧。提高显示面板的封装效果。(The application discloses a display panel and a preparation method thereof, wherein the preparation method comprises the following steps: providing an array substrate, wherein the array substrate comprises a middle area and a first peripheral area arranged around the middle area; forming a first retaining wall and a second retaining wall on the array substrate in the first peripheral area, wherein the first retaining wall is positioned on one side, close to the middle area, of the second retaining wall; forming a light emitting structure on the array substrate in the middle region; sequentially stacking and depositing a first inorganic layer, an organic layer and a second inorganic layer on the array substrate and the first retaining wall under the shielding of a second retaining wall, wherein the first inorganic layer and the second inorganic layer are formed in an area surrounded by the second retaining wall; the organic layer is formed in the area surrounded by the first retaining wall to obtain the display panel; in the first peripheral region, the end portions of the first inorganic layer and the second inorganic layer are respectively provided with a convex portion and a concave portion arranged adjacent to the convex portion, and the convex portion is positioned on one side of the concave portion far away from the light-emitting structure. The packaging effect of the display panel is improved.)

1. A method for manufacturing a display panel, comprising:

providing an array substrate, wherein the array substrate comprises a middle area and a first peripheral area arranged around the middle area;

forming a first retaining wall and a second retaining wall on the array substrate in the first peripheral area, wherein the first retaining wall is positioned on one side, close to the middle area, of the second retaining wall;

forming a light emitting structure on the array substrate in the middle region;

depositing a first inorganic layer on the array substrate and the first retaining wall under the shielding of the second retaining wall, wherein the first inorganic layer is formed in an area surrounded by the second retaining wall;

forming an organic layer on the first inorganic layer, wherein the organic layer is formed in an area surrounded by the first retaining wall; and

depositing a second inorganic layer on the first inorganic layer and the organic layer under the shielding of the second retaining wall, wherein the second inorganic layer is formed in an area surrounded by the second retaining wall, and thus the display panel is obtained; in the first peripheral region, the end portions of the first inorganic layer and the second inorganic layer are respectively provided with a convex portion and a concave portion arranged adjacent to the convex portion, and the convex portion is positioned on one side of the concave portion far away from the light-emitting structure.

2. The method according to claim 1, wherein the step of depositing a first inorganic layer on the array substrate and the first retaining wall under the shielding of the second retaining wall, wherein the first inorganic layer is formed in the region surrounded by the second retaining wall, comprises:

and patterning the second retaining wall, wherein the second retaining wall is provided with a body part and a protruding part connected with the body part, the protruding part is positioned on one side of the body part close to the first retaining wall, and the protruding part is positioned on one side of the body part far away from the array substrate.

3. The method according to claim 1, wherein the array substrate further includes a second peripheral region surrounding the first peripheral region, and the step of depositing a first inorganic layer on the array substrate and the first retaining wall under the shielding of the second retaining wall after the step of forming the light emitting structure on the array substrate in the middle region, wherein the first inorganic layer is formed in the region surrounded by the second retaining wall comprises:

set up the light shield on the second peripheral zone, the light shield includes a plurality of light shield strips, the light shield strip includes first shielding portion and sets up the second shielding portion of first shielding portion both sides, the thickness of first shielding portion is less than the thickness of second shielding portion, first shielding portion is located second shielding portion keeps away from one side of array substrate, second shielding portion is located first peripheral zone is close to one side of middle zone, first shielding portion is located first peripheral zone keeps away from one side of middle zone.

4. The method according to claim 3, wherein a distance between the mask strip and the second retaining wall is smaller than a distance between the second retaining wall and the first retaining wall.

5. The method according to claim 1, wherein a second inorganic layer is deposited on the first inorganic layer and the organic layer under the shielding of the second retaining wall, and the second inorganic layer is formed in the region surrounded by the second retaining wall, and the method further comprises:

and removing the second retaining wall.

6. A display panel, comprising:

the array substrate comprises a middle area and a first peripheral area arranged around the middle area;

the first retaining wall is arranged in the first peripheral area and is arranged on the array substrate;

a light emitting structure disposed on the array substrate in the middle region;

a first inorganic layer covering the light emitting structure, the array substrate and the first dam in the first peripheral region and the middle region;

the organic layer is arranged on the first inorganic layer and is positioned in an area surrounded by the first retaining wall; and

a second inorganic layer disposed on the first inorganic layer and the organic layer; in the first peripheral region, the end portions of the first inorganic layer and the second inorganic layer are respectively provided with a convex portion and a concave portion arranged adjacent to the convex portion, and the convex portion is positioned on one side of the concave portion far away from the light-emitting structure.

7. The display panel according to claim 6, wherein the display panel further comprises a second retaining wall, the second retaining wall is located on a side of the first retaining wall away from the light emitting structure, and the first inorganic layer and the second inorganic layer are located in an area surrounded by the second retaining wall.

8. The display panel according to claim 7, wherein the second wall has a body portion and a protrusion portion connected to the body portion, the protrusion portion is located on a side of the body portion close to the first wall, and the protrusion portion is located on a side of the body portion away from the array substrate.

9. The display panel according to claim 8, wherein the second retaining wall further comprises a bank portion, and the bank portion is disposed on a side of the protrusion portion close to the array substrate and a side of the first retaining wall.

10. The display panel according to claim 7, wherein the thickness of the second retaining wall is greater than the thickness of the first retaining wall.

Technical Field

The application relates to the technical field of display, in particular to a display panel and a preparation method thereof.

Background

Organic Light Emitting Diode (OLED) displays are being actively developed by various large display manufacturers due to their advantages of simple structure, self-luminescence, fast response speed, ultra-lightness, thinness, low power consumption, etc. At present, the OLED display panel is usually packaged by using a flexible packaging structure. The flexible packaging structure is usually a multilayer film stack of an inorganic film + an organic film + an inorganic film, but the tail of the edge of the packaging structure prepared by the existing process is too long, and the film thickness of the edge is too thin relative to the film thickness of the middle area, so that the packaging effect of the display panel is poor, and the performance of the display panel is affected.

Disclosure of Invention

The embodiment of the application provides a display panel and a preparation method thereof, and aims to solve the problem that the packaging effect of the display panel in the prior art is poor.

The application provides a preparation method of a display panel, which comprises the following steps:

providing an array substrate, wherein the array substrate comprises a middle area and a first peripheral area arranged around the middle area;

forming a first retaining wall and a second retaining wall on the array substrate in the first peripheral area, wherein the first retaining wall is positioned on one side, close to the middle area, of the second retaining wall;

forming a light emitting structure on the array substrate in the middle region;

depositing a first inorganic layer on the array substrate and the first retaining wall under the shielding of the second retaining wall, wherein the first inorganic layer is formed in an area surrounded by the second retaining wall;

forming an organic layer on the first inorganic layer, wherein the organic layer is formed in an area surrounded by the first retaining wall; and

depositing a second inorganic layer on the first inorganic layer and the organic layer under the shielding of the second retaining wall, wherein the second inorganic layer is formed in an area surrounded by the second retaining wall, and thus the display panel is obtained; in the first peripheral region, the end portions of the first inorganic layer and the second inorganic layer are respectively provided with a convex portion and a concave portion arranged adjacent to the convex portion, and the convex portion is positioned on one side of the concave portion far away from the light-emitting structure.

Optionally, in some embodiments of the present application, under the shielding of the second retaining wall, after the step of depositing a first inorganic layer on the array substrate and the first retaining wall, the step of forming the first inorganic layer in the area surrounded by the second retaining wall includes:

and patterning the second retaining wall, wherein the second retaining wall is provided with a body part and a protruding part connected with the body part, the protruding part is positioned on one side of the body part close to the first retaining wall, and the protruding part is positioned on one side of the body part far away from the array substrate.

Optionally, in some embodiments of the present application, the array substrate further includes a second peripheral area disposed around the first peripheral area, and in the intermediate area, after the step of forming the light emitting structure on the array substrate, under the shielding of the second retaining wall, a first inorganic layer is deposited on the array substrate and the first retaining wall, and before the step of forming the first inorganic layer in the area surrounded by the second retaining wall, the method includes:

set up the light shield on the second peripheral zone, the light shield includes a plurality of light shield strips, the light shield strip includes first shielding portion and sets up the second shielding portion of first shielding portion both sides, the thickness of first shielding portion is less than the thickness of second shielding portion, first shielding portion is located second shielding portion keeps away from one side of array substrate, second shielding portion is located first peripheral zone is close to one side of middle zone, first shielding portion is located first peripheral zone keeps away from one side of middle zone.

Optionally, in some embodiments of the present application, a distance between the mask strip and the second retaining wall is smaller than a distance between the second retaining wall and the first retaining wall.

Optionally, in some embodiments of the present application, under the shielding of the second retaining wall, after the step of depositing a second inorganic layer on the first inorganic layer and the organic layer, the second inorganic layer is formed in the region surrounded by the second retaining wall, the method further includes:

and removing the second retaining wall.

Correspondingly, the present application further provides a display panel, comprising:

the array substrate comprises a middle area and a first peripheral area arranged around the middle area;

the first retaining wall is arranged in the first peripheral area and is arranged on the array substrate;

a light emitting structure disposed on the array substrate in the middle region;

a first inorganic layer covering the light emitting structure, the array substrate and the first dam in the first peripheral region and the middle region;

the organic layer is arranged on the first inorganic layer and is positioned in an area surrounded by the first retaining wall; and

a second inorganic layer disposed on the first inorganic layer and the organic layer; in the first peripheral region, the end portions of the first inorganic layer and the second inorganic layer are respectively provided with a convex portion and a concave portion arranged adjacent to the convex portion, and the convex portion is positioned on one side of the concave portion far away from the light-emitting structure.

Optionally, in some embodiments of the present application, the display panel further includes a second retaining wall, the second retaining wall is located on a side of the light emitting structure away from the first retaining wall, and the first inorganic layer and the second inorganic layer are located in an area surrounded by the second retaining wall.

Optionally, in some embodiments of the present application, the second retaining wall has a body portion and a protrusion portion connected to the body portion, the protrusion portion is located on a side of the body portion close to the first retaining wall, and the protrusion portion is located on a side of the body portion away from the array substrate.

Optionally, in some embodiments of the present application, the second retaining wall further includes a bank, and the bank is disposed on one side of the protruding portion close to the array substrate and one side of the protruding portion close to the first retaining wall.

Optionally, in some embodiments of the present application, the thickness of the second retaining wall is greater than the thickness of the first retaining wall.

The application discloses a display panel and a preparation method thereof, wherein the preparation method comprises the following steps: providing an array substrate, wherein the array substrate comprises a middle area and a first peripheral area arranged around the middle area; forming a first retaining wall and a second retaining wall on the array substrate in the first peripheral area, wherein the first retaining wall is positioned on one side, close to the middle area, of the second retaining wall; forming a light emitting structure on the array substrate in the middle region; sequentially stacking and depositing a first inorganic layer, an organic layer and a second inorganic layer on the array substrate and the first retaining wall under the shielding of a second retaining wall, wherein the first inorganic layer and the second inorganic layer are formed in an area surrounded by the second retaining wall; the organic layer is formed in the area surrounded by the first retaining wall to obtain the display panel; in the first peripheral region, the end portions of the first inorganic layer and the second inorganic layer are respectively provided with a convex portion and a concave portion arranged adjacent to the convex portion, and the convex portion is positioned on one side of the concave portion far away from the light-emitting structure. Through the first retaining wall and the second retaining wall, the end parts of the first inorganic layer and the second inorganic layer are respectively provided with a convex part and a concave part which is arranged adjacent to the convex part, so that the thickness of the edge of the first inorganic layer and the second inorganic layer is improved, the shadow effect of the first inorganic layer and the second inorganic layer is reduced, and the packaging effect of the display panel is improved. The mask strip is etched by adopting a back etching process, so that the mask strip forms a first shielding part and a second shielding part, the thickness of the first shielding part is smaller than that of the second shielding part, the appearance of the mask strip is matched with that of the array substrate, and therefore the gap between the array substrate and the mask strip is reduced, the shadow effect of the first inorganic layer and the shadow effect of the second inorganic layer are further reduced, and the narrow frame design is realized; because of the light shield strip comprises first occlusion part and the second occlusion part that sets up in first occlusion part both sides, and the thickness of first occlusion part is less than the thickness of second occlusion part, make the appearance phase-match of light shield strip and array substrate, thereby reduce the clearance between array substrate and the light shield strip, thereby make the tip of first inorganic layer and second inorganic layer all form convex part and one with the concave part of the adjacent setting of convex part, and make the thickness of convex part be greater than the thickness of concave part, avoid the edge of first inorganic layer and second inorganic layer too thin, thereby improve the water oxygen barrier property of encapsulation layer, and then reduce the risk of encapsulation inefficacy, and then improve display panel's performance. The distance between the light shield strip and the second retaining wall is set to be smaller than the distance between the second retaining wall and the first retaining wall, the shadow effect of the first inorganic layer and the shadow effect of the second inorganic layer are further limited in the area surrounded by the second retaining wall, and therefore the film thickness of the edges of the first inorganic layer and the second inorganic layer is further improved, the packaging effect of the display panel is improved, and the performance of the display panel is further improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic top view of a motherboard provided with a display panel according to an embodiment of the present application.

Fig. 2 is a first structural diagram of the display panel of fig. 1 along line AB.

Fig. 3 is an enlarged schematic view of the display panel C in fig. 2.

FIG. 4 is a second structural diagram of the display panel of FIG. 1 along line AB.

FIG. 5 is a third schematic diagram of the display panel of FIG. 1 along line AB.

Fig. 6 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application.

Fig. 7 is a structural flow chart of a method for manufacturing a display panel according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiment is only an embodiment of a shielding portion of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device. In the present application, the "reaction" may be a chemical reaction or a physical reaction.

The embodiment of the application provides a display panel and a preparation method thereof. The following are detailed below.

Referring to fig. 1 and 2, fig. 1 is a schematic top view of a motherboard provided with a display panel according to an embodiment of the present application. Fig. 2 is a first structural diagram of the display panel of fig. 1 along line AB. The present application provides a display panel 10. The display panel 10 includes an array substrate 100, a first bank 200, a light emitting structure 300, a first inorganic layer 400, an organic layer 500, and a second inorganic layer 600.

The array substrate 100 includes a substrate and a transistor. The transistor is disposed on the substrate. The array substrate 100 includes a middle region 101 and a first peripheral region 102 disposed around the middle region 101.

In the first peripheral region 102, the first retaining wall 200 is disposed on the array substrate 100.

In one embodiment, the display panel 10 further includes a second retaining wall 700. The second retaining wall 700 is located on a side of the first retaining wall 200 away from the middle region 101.

In one embodiment, the thickness H of the second wall 700 is greater than the thickness W of the first wall 200. Specifically, the difference between the thickness H of the second retaining wall 700 and the thickness W of the first retaining wall 200 is 3 micrometers to 5 micrometers. Specifically, the difference between the thickness H of the second retaining wall 700 and the thickness W of the first retaining wall 200 may be 3 micrometers, 3.5 micrometers, 4.3 micrometers, 4.8 micrometers, or 5 micrometers, etc.

In one embodiment, the thickness H of the first retaining wall 200 is 5 micrometers to 10 micrometers. Specifically, the thickness H of the first retaining wall 200 may be 5 micrometers, 6 micrometers, 7.5 micrometers, 8.4 micrometers, 9 micrometers, 10 micrometers, or the like. The thickness W of the second retaining wall 700 is 8 micrometers to 15 micrometers. Specifically, the thickness W of the second barrier wall 700 is 8 micrometers, 9 micrometers, 11 micrometers, 13 micrometers, 15 micrometers, or the like.

In this application, set up the thickness H of second barricade 700 to be greater than the thickness W of first barricade 200, and the thickness H of first barricade 200 sets up to 5 microns-10 microns, the thickness W of second barricade 700 sets up to 8 microns-15 microns, improve the blocking effect when first barricade 200 and the follow-up encapsulated layer that forms of second barricade 700, reduce the shadow effect (shadow effect) of first inorganic layer 400 and second inorganic layer 600, and then improve the encapsulation effect of display panel 10, and then reduce the risk that water oxygen corrodes rete in display panel 10, reduce cost simultaneously, and then improved the encapsulation effect of display panel 10, and reduce cost.

In one embodiment, the second retaining wall 700 has a body portion 721 and a protrusion portion 722 connected to the body portion 721. The protrusion 722 is located on a side of the body portion 721 close to the first retaining wall 200, and the protrusion 722 is located on a side of the body portion 721 away from the array substrate 100. That is, the vertical sectional shape of the second barrier 700 is similar to an inverted L-shape.

In another embodiment, the first retaining wall 200 has a body portion 721 and a protrusion portion 722 connected to the body portion 721. The protrusion 722 is located on a side of the body portion 721 close to the light emitting structure 300, and the protrusion 722 is located on a side of the body portion 721 away from the array substrate 100. That is, the vertical sectional shapes of the first retaining walls 200 are all similar to an inverted L shape.

In another embodiment, each of the first retaining wall 200 and the second retaining wall 700 has a body portion 721 and a protrusion portion 722 connected to the body portion 721. The protrusion 722 is located on a side of the body portion 721 close to the light emitting structure 300, and the protrusion 722 is located on a side of the body portion 721 away from the array substrate 100. That is, the vertical sectional shapes of the second retaining wall 700 and the first retaining wall 200 are similar to an inverted L shape.

In one embodiment, each of the first retaining wall 200 and the second retaining wall 700 is formed by sequentially stacking a planarization layer, a pixel defining layer, and an isolation layer.

In the middle region 101, the light emitting structure 300 is disposed on the array substrate 100. The light emitting structure 300 is a light emitting diode, which may be a mini light emitting diode or an organic light emitting diode.

Referring to fig. 3, fig. 3 is an enlarged schematic view of the display panel C in fig. 2. In the first peripheral region 102 and the middle region 101, the first inorganic layer 400 is disposed on the light emitting structure 300, the array substrate 100 and the first retaining walls 200, and the first inorganic layer 400 is located in a region surrounded by the second retaining walls 700. The organic layer 500 is disposed on the first inorganic layer 400 and located in the region surrounded by the first retaining wall 200. The second inorganic layer 600 is disposed on the organic layer 500 and the first inorganic layer 400, and the second inorganic layer 600 is located in a region surrounded by the second barrier wall 700. The first inorganic layer 400, the organic layer 500, and the second inorganic layer 600 constitute an encapsulation layer 699.

In one embodiment, the material of the first inorganic layer 400 and the second inorganic layer 600 is selected from one or more of silicon nitride, silicon oxide, silicon oxynitride, and aluminum oxide.

In the first peripheral region 102, the end portions of the first inorganic layer 400 and the second inorganic layer 600 each have a convex portion 401 and a concave portion 402 disposed adjacent to the convex portion 401. The convex portion 401 is located on a side of the concave portion 402 away from the light emitting structure 300. The thickness Y of the convex portion 401 is larger than the thickness Q of the concave portion 402. Specifically, the end portions of the first inorganic layer 400 and the second inorganic layer 600 each have a convex portion 401 and a concave portion 402 disposed adjacent to the convex portion 401.

In this application, on the first peripheral region, a second retaining wall 700 is disposed on a side of the first retaining wall 200 away from the light emitting structure 300, thereby blocking the first inorganic layer 400 and the second inorganic layer 600 within the area surrounded by the second barrier wall 700, and the end portions of the first inorganic layer 400 and the second inorganic layer 600 are formed with a convex portion 401 and a concave portion 402 disposed adjacent to the convex portion 401, the convex portion 401 is located on a side of the concave portion 402 away from the light emitting structure 300, thereby preventing the edges of the first inorganic layer 400 and the second inorganic layer 600 from being too thin, so that the thickness Y of the convex portion 401 is greater than the thickness Q of the concave portion 402, and reduces a shadow effect (shadow effect) of the first inorganic layer 400 and the second inorganic layer 600, further, the packaging effect of the display panel 10 is improved, and the risk of water and oxygen corroding the film layer in the display panel 10 is reduced, so that the display effect of the display panel 10 is improved, and the performance of the display panel 10 is improved. The second retaining wall 700 is composed of a main body 721 and a protrusion 722 connected to the main body 721, so that the protrusion can block the carrier gas and the material particles of the first inorganic layer 400 and the second inorganic layer 600 during the process of forming the first inorganic layer 400 and the second inorganic layer 600, thereby forming a protrusion 401 and a recess 402 disposed adjacent to the protrusion 401 at the end of the first inorganic layer 400 and the second inorganic layer 600, further avoiding the edge of the first inorganic layer 400 and the second inorganic layer 600 from being too thin, i.e. making the thickness Y of the protrusion 401 greater than the thickness Q of the recess 402, further improving the encapsulation effect of the display panel 10, further reducing the risk of water and oxygen erosion of the film layer in the display panel 10, further improving the display effect of the display panel 10, and further improving the performance of the display panel 10. The thickness H of the second retaining wall 700 is set to be greater than the thickness W of the first retaining wall 200, and the difference between the thickness H of the second retaining wall 700 and the thickness W of the first retaining wall 200 is set to be 3 micrometers to 5 micrometers, so that the second retaining wall 700 can block the first inorganic layer 400 and the second inorganic layer 600 overflowing the first retaining wall 200 in front of the second retaining wall 700, and further prevent the edges of the first inorganic layer 400 and the second inorganic layer 600 from being too thin, thereby improving the packaging effect of the display panel 10.

In one embodiment, the thickness Y of the protrusion 401 is 50% to 80% of the thickness T of the first inorganic layer 400 and the second inorganic layer 600 of the middle region 101. Specifically, the thickness Y of the protrusion 401 may be 50%, 60%, 65%, 75%, 80%, or the like of the thickness T of the first inorganic layer 400 and the second inorganic layer 600 of the intermediate region 101. In the present application, the thickness Y of the protrusion 401 is set to 50% to 80% of the thickness T of the first inorganic layer 400 and the second inorganic layer 600 of the middle region 101, and the thickness Y of the protrusion 401 is increased, so that the water and oxygen barrier performance of the edges of the first inorganic layer 400 and the second inorganic layer 600 is increased, and the risk of package failure of the first inorganic layer 400 and the second inorganic layer 600 is reduced, and the performance of the display panel 10 is improved.

Referring to fig. 4, fig. 4 is a second structural diagram of the display panel of fig. 1 along line AB. It should be noted that the second structure is different from the first structure in that:

the display panel 10 is not provided with a second dam. Other structures are as described in the first structure, and are not described herein again.

In the present application, the second retaining wall is not provided in the display panel 10, so that the frame can be reduced, and the narrow frame design can be realized. The first retaining wall 200 is configured to be composed of a body portion 721 and a protrusion portion 722 connected to the body portion 721, so as to further reduce a shadow effect (shadow effect) of the first inorganic layer 400 and the second inorganic layer 600, further improve the edge film thickness of the first inorganic layer 400 and the second inorganic layer 600, and further improve the encapsulation effect of the display panel 10.

Referring to fig. 5, fig. 5 is a schematic view of a third structure of the display panel of fig. 1 along line AB. It should be noted that the third structure is different from the first structure in that:

the second barrier 700 further includes a bank 723. The bank 723 is disposed on one side of the protrusion 722 close to the array substrate 100 and one side of the first retaining wall 200.

In the present application, the second barrier 700 is configured to be composed of the body portion 721, the protrusion portion 722 and the bank portion 723, and the bank portion 723 is disposed on the side of the protrusion portion 722 close to the array substrate 100 and the side close to the first retaining wall 200, so that the bank portion 723 can further block the carrier gas and the material particles of the first inorganic layer 400 and the second inorganic layer 600, so that the end portions of the first inorganic layer 400 and the second inorganic layer 600 form the protrusion 401 and the recess 402 disposed adjacent to the protrusion 401, thereby further avoiding the edge of the first inorganic layer 400 and the second inorganic layer 600 from being too thin, i.e. the thickness Y of the protrusion 401 is greater than the thickness Q of the recess 402, further improving the encapsulation effect of the display panel 10, further reducing the risk of water and oxygen erosion of the film layers in the display panel 10, further improving the display effect of the display panel 10, and further improving the performance of the display panel 10.

The present application provides a display panel 10, the display panel 10 includes an array substrate 100, a first barrier 200, a light emitting structure 300, a first inorganic layer 400, an organic layer 500, and a second inorganic layer 600. In the first peripheral region, the second retaining wall 700 is disposed on a side of the first retaining wall 200 away from the light emitting structure 300, so as to block the first inorganic layer 400 and the second inorganic layer 600 in an area surrounded by the second retaining wall 700, and end portions of the first inorganic layer 400 and the second inorganic layer 600 form a convex portion 401 and a concave portion 402 disposed adjacent to the convex portion 401, the convex portion 401 is located on a side of the concave portion 402 away from the light emitting structure 300, so as to prevent edges of the first inorganic layer 400 and the second inorganic layer 600 from being too thin, so that a thickness Y of the convex portion 401 is greater than a thickness Q of the concave portion 402, and reduce a shadow effect (shadow effect) of the first inorganic layer 400 and the second inorganic layer 600, thereby improving an encapsulation effect of the display panel 10, further reducing a risk of water and oxygen attacking a film layer in the display panel 10, further improving a display effect of the display panel 10, and improving performance of the display panel 10. The second barrier wall 700 is configured to be composed of the body portion 721 and the protrusion portion 722 connected to the body portion 721, so that the protrusion portion 722 can block the carrier gas, the material particles of the first inorganic layer 400 and the second inorganic layer 600 in the process of forming the first inorganic layer 400 and the second inorganic layer 600, thereby forming the protrusion portion 401 and the concave portion 402 disposed adjacent to the protrusion portion 401 at the end portion of the first inorganic layer 400 and the second inorganic layer 600, the protrusion portion 401 is located at the side of the concave portion 402 away from the light emitting structure 300, and further avoiding the edges of the first inorganic layer 400 and the second inorganic layer 600 from being too thin, even if the thickness Y of the protrusion portion 401 is greater than the thickness Q of the concave portion 402, further improving the encapsulation effect of the display panel 10, further reducing the risk of water and oxygen attacking the film layers in the display panel 10, further improving the display effect of the display panel 10, and further improving the performance of the display panel 10. The thickness H of the second retaining wall 700 is set to be greater than the thickness W of the first retaining wall 200, and the difference between the thickness H of the second retaining wall 700 and the thickness W of the first retaining wall 200 is set to be 3 micrometers to 5 micrometers, so that the second retaining wall 700 can block the first inorganic layer 400 and the second inorganic layer 600 overflowing the first retaining wall 200 in front of the second retaining wall 700, and further prevent the edges of the first inorganic layer 400 and the second inorganic layer 600 from being too thin, thereby improving the packaging effect of the display panel 10.

Referring to fig. 6 and 7, fig. 6 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure. Fig. 7 is a structural flow chart of a method for manufacturing a display panel according to an embodiment of the present application. The application also provides a preparation method of the display panel, which comprises the following steps:

example 1

Please continue to refer to fig. 1 and 2.

And B11, providing an array substrate, wherein the array substrate comprises a middle area and a first peripheral area arranged around the middle area.

Specifically, a substrate is provided, and a transistor is formed on the substrate. The transistors and the substrate constitute an array substrate 100.

And B12, forming a first retaining wall and a second retaining wall on the array substrate in the first peripheral area, wherein the first retaining wall is positioned on one side of the second retaining wall close to the middle area.

Specifically, the retaining walls 200 include a first retaining wall 200 and a second retaining wall 700, the first retaining wall 200 is formed on one side of the array substrate 100 close to the middle region 101 in the first peripheral region 102, and the second retaining wall 700 is formed on one side of the first retaining wall 200 far away from the middle region 101; then, the second blocking wall 700 is processed using a side etching, laser, or 3D printing process, so that the formed second blocking wall 700 has a body portion 721 and a protrusion portion 722 connected to the body portion 721. The protrusion 722 is located on a side of the body portion 721 close to the first retaining wall 200, and the protrusion 722 is located on a side of the body portion 721 away from the array substrate 100. Wherein, the thickness H of the second retaining wall 700 is greater than the thickness W of the first retaining wall 200.

In another embodiment, the first retaining wall 200 and the second retaining wall 700 are processed by a side etching, laser or 3D printing process, so that the first retaining wall 200 and the second retaining wall 700 each have a body portion 721 and a protrusion 722 connected to the body portion 721, the protrusion 722 is located on a side of the body portion 721 close to the light emitting structure 300, and the protrusion 722 is located on a side of the body portion 721 away from the array substrate 100. That is, the vertical sectional shapes of the first retaining wall 200 and the second retaining wall 700 are made to be similar to an inverted L shape.

In one embodiment, the difference between the thickness H of the second retaining wall 700 and the thickness W of the first retaining wall 200 is 3 micrometers to 5 micrometers. Specifically, the difference between the thickness H of the second retaining wall 700 and the thickness W of the first retaining wall 200 may be 3 micrometers, 3.5 micrometers, 4.3 micrometers, 4.8 micrometers, or 5 micrometers, etc. In this embodiment, the difference between the thickness H of the second retaining wall 700 and the thickness W of the first retaining wall 200 is 3 μm. If the thickness W of the first wall 200 is 6 micrometers, the thickness H of the second wall 700 is 9 micrometers.

In the present application, the difference between the thickness H of the second retaining wall 700 and the thickness W of the first retaining wall 200 is set to be 3 micrometers to 5 micrometers, so that the second retaining wall 700 can block the first inorganic layer 400 and the second inorganic layer 600, which subsequently overflow the first retaining wall 200, in front of the second retaining wall 700, thereby preventing the thicknesses of the first inorganic layer 400 and the second inorganic layer 600 at the edges from being too thin, and further improving the packaging effect of the display panel 10.

In one embodiment, the thickness H of the first retaining wall 200 is 5 micrometers to 10 micrometers. Specifically, the thickness H of the first retaining wall 200 may be 5 micrometers, 6 micrometers, 7.5 micrometers, 8.4 micrometers, 9 micrometers, 10 micrometers, or the like. The thickness W of the second retaining wall 700 is 8 micrometers to 15 micrometers. Specifically, the thickness W of the second barrier wall 700 is 8 micrometers, 9 micrometers, 11 micrometers, 13 micrometers, 15 micrometers, or the like. In this embodiment, the thickness W of the first retaining wall 200 is 6 micrometers, and the thickness H of the second retaining wall 700 is 9 micrometers.

And B13, forming a light emitting structure on the array substrate in the middle area.

In an embodiment, after step B13, the method further includes:

please refer to fig. 7. The array substrate 100 further includes a second peripheral region 103 disposed around the first peripheral region 102; providing a photomask 800, wherein the photomask 800 comprises a plurality of photomask strips 810, performing back half etching on the photomask strips 810, the formed photomask strips 810 comprise a first shielding part 811 and second shielding parts 812 arranged at two sides of the first shielding part 811, the thickness d1 of the first shielding part 811 is smaller than the thickness d2 of the second shielding part 812, the first shielding part 811 is positioned at one side of the second shielding part 812 far away from the array substrate 100, the second shielding part 812 is positioned at one side of the first peripheral area 102 near the middle area 101, and the first shielding part 811 is positioned at one side of the first peripheral area 102 far away from the middle area 101. That is, the first shielding portion 811 and the second shielding portion 812 constitute a groove-like shape.

Then, in the second peripheral region 103, the mask strips 810 are clamped on the array substrate 100, wherein a distance between the mask strips 810 and the second retaining walls 700 is smaller than a distance between the second retaining walls 700 and the first retaining walls 200.

In the application, the mask strip 810 is etched by adopting a back etching process, so that the mask strip 810 forms a first shielding part 811 and a second shielding part 812, and the thickness d1 of the first shielding part 811 is smaller than the thickness d2 of the second shielding part 812, so that the appearance of the mask strip 810 is matched with that of the array substrate 100, the gap between the array substrate 100 and the mask strip 810 is reduced, the shadow effect of the subsequent first inorganic layer 400 and the second inorganic layer 600 is reduced, and the narrow-frame design is realized. The mask bar 810 forms a first shielding portion 811 and a second shielding portion 812, and the thickness d1 of the first shielding portion 811 is less than the thickness d2 of the second shielding portion 812, so that the profile of the mask strip 810 matches the profile of the array substrate 100, thereby reducing the gap between the array substrate 100 and the mask strip 810, so that the end portions of the first inorganic layer 400 and the second inorganic layer 600 form a protrusion 401 and a recess 402 disposed adjacent to the protrusion 401, the protrusion 401 is located on the side of the recess 402 away from the light emitting structure 300, thereby further preventing the edges of the first and second inorganic layers 400 and 600 from being too thin, that is, the thickness Y of the convex portion 401 is larger than the thickness Q of the concave portion 402, and thus the sealing effect of the display panel 10 is further improved, the risk of water and oxygen attacking the film layer in the display panel 10 is further reduced, the display effect of the display panel 10 is further improved, and the performance of the display panel 10 is further improved.

In one embodiment, the thickness d1 of the first shielding portion 811 is 40% -70% of the thickness d2 of the second shielding portion 812. Specifically, the thickness d1 of the first shielding portion 811 may be 40%, 50%, 60%, 65%, 70%, or the like of the thickness d2 of the second shielding portion 812. In the present embodiment, the thickness d1 of the first shielding portion 811 is 45% of the thickness d2 of the second shielding portion 812.

And B14, depositing a first inorganic layer on the array substrate and the first retaining wall under the shielding of the second retaining wall, wherein the first inorganic layer is formed in the area surrounded by the second retaining wall.

Specifically, under the shielding of the second retaining wall 700, a first inorganic layer 400 is formed by disposing a first inorganic layer 400 material on the light-emitting structure 300, the array substrate 100 and the first retaining wall 200 by a chemical vapor deposition method in the first peripheral region 102 and the middle region 101, and the formed first inorganic layer 400 is located in the region surrounded by the second retaining wall 700.

And B15, forming an organic layer on the first inorganic layer, wherein the organic layer is formed in the region surrounded by the first retaining wall.

The organic layer 500 is formed on the first inorganic layer 400 by inkjet printing, and the formed organic layer 500 is located in the region surrounded by the first bank 200.

B16, depositing a second inorganic layer on the first inorganic layer and the organic layer under the shielding of the second retaining wall, wherein the second inorganic layer is formed in the area surrounded by the second retaining wall, and obtaining the display panel; in the first peripheral region, the end portions of the first inorganic layer and the second inorganic layer are respectively provided with a convex portion and a concave portion arranged adjacent to the convex portion, and the convex portion is positioned on one side of the concave portion far away from the light-emitting structure.

Under the shielding of the second retaining wall 700, a second inorganic layer 600 is formed by disposing a second inorganic layer 600 material on the first inorganic layer 400 and the organic layer 500 by using a chemical vapor deposition method, and the formed second inorganic layer 600 is located in the region surrounded by the second retaining wall 700, i.e., the second inorganic layer 600 is located in the first peripheral region 102 and the middle region 101. The first inorganic layer 400, the organic layer 500, and the second inorganic layer 600 constitute an encapsulation layer 699.

In the first peripheral region 102, the end of the packaging layer 699 has a convex portion 401 and a concave portion 402 disposed adjacent to the convex portion 401. The convex portion 401 is located on a side of the concave portion 402 away from the light emitting structure 300. The thickness Y of the convex portion 401 is larger than the thickness Q of the concave portion 402. Specifically, the end portions of the first inorganic layer 400 and the second inorganic layer 600 each have a convex portion 401 and a concave portion 402 disposed adjacent to the convex portion 401.

Wherein the thickness Y of the protrusion 401 is 50% to 80% of the thickness T of the first inorganic layer 400 and the second inorganic layer 600 of the intermediate region 101. Specifically, the thickness Y of the protrusion 401 may be 50%, 60%, 65%, 75%, 80%, or the like of the thickness T of the first inorganic layer 400 and the second inorganic layer 600 of the intermediate region 101.

In the present application, the thickness Y of the protrusion 401 is set to 50% to 80% of the thickness T of the first inorganic layer 400 and the second inorganic layer 600 of the middle region 101, and the thickness Y of the protrusion 401 is increased, so that the water and oxygen barrier performance of the edges of the first inorganic layer 400 and the second inorganic layer 600 is increased, and the risk of package failure of the first inorganic layer 400 and the second inorganic layer 600 is reduced, and the performance of the display panel 10 is improved.

In the present application, the first inorganic layer 400 and the second inorganic layer 600 are formed under the shielding of the second retaining wall 700, so that the end portions of the first inorganic layer 400 and the second inorganic layer 600 are both formed with a convex portion 401 and a concave portion 402 adjacent to the convex portion 401, and the thickness Y of the convex portion 401 is greater than the thickness Q of the concave portion 402, which avoids the too thin edge of the first inorganic layer 400 and the second inorganic layer 600, thereby improving the water-oxygen barrier performance of the encapsulation layer 699, further reducing the risk of package failure, and further improving the performance of the display panel 10. By forming the first inorganic layer 400 and the second inorganic layer 600 under the shielding of the second retaining wall 700, the shadow effect of the first inorganic layer 400 and the second inorganic layer 600 is limited in the area surrounded by the second retaining wall 700, that is, the shadow effect of the first inorganic layer 400 and the second inorganic layer 600 is reduced, so that the encapsulation effect of the display panel 10 is improved, and the performance of the display panel 10 is further improved. Etching the mask strip 810 by adopting a back etching process to enable the mask strip 810 to form a first shielding part 811 and a second shielding part 812, wherein the thickness d1 of the first shielding part 811 is smaller than the thickness d2 of the second shielding part 812, so that the appearance of the mask strip 810 is matched with that of the array substrate 100, the gap between the array substrate 100 and the mask strip 810 is reduced, the shadow effect of the first inorganic layer 400 and the second inorganic layer 600 is further reduced, and the narrow-frame design is further realized; because the mask strip 810 is composed of the first shielding portion 811 and the second shielding portions 812 arranged at two sides of the first shielding portion 811, and the thickness d1 of the first shielding portion 811 is smaller than the thickness d2 of the second shielding portion 812, the shapes of the mask strip 810 and the array substrate 100 are matched, so that the gap between the array substrate 100 and the mask strip 810 is reduced, further, a convex portion 401 and a concave portion 402 adjacent to the convex portion 401 are formed at the end portions of the first inorganic layer 400 and the second inorganic layer 600, and the thickness Y of the convex portion 401 is larger than the thickness Q of the concave portion 402, so that the edges of the first inorganic layer 400 and the second inorganic layer 600 are prevented from being too thin, the water and oxygen barrier performance of the encapsulation layer 699 is improved, the risk of encapsulation failure is reduced, and the performance of the display panel 10 is improved. The distance between the light shield strips 810 and the second retaining wall 700 is set to be smaller than the distance between the second retaining wall 700 and the first retaining wall 200, and the shadow effect of the first inorganic layer 400 and the second inorganic layer 600 is further limited in the area surrounded by the second retaining wall 700, so that the film thickness of the edges of the first inorganic layer 400 and the second inorganic layer 600 is further improved, the packaging effect of the display panel 10 is improved, and the performance of the display panel 10 is further improved.

In an embodiment, after step B16, the method further includes:

the second barrier 700 is etched away.

In this application, the second barrier 700 is etched away, reducing the bezel, and then implementing a narrow bezel design.

The present application provides a method for manufacturing a display panel 10, wherein a second retaining wall 700 is disposed on a side of a first retaining wall 200 away from a light emitting structure 300 in a first peripheral region, so as to retain a first inorganic layer 400 and a second inorganic layer 600 in a region surrounded by the second retaining wall 700, and end portions of the first inorganic layer 400 and the second inorganic layer 600 form a convex portion 401 and a concave portion 402 disposed adjacent to the convex portion 401, the convex portion 401 is disposed on a side of the concave portion 402 away from the light emitting structure 300, so as to prevent edges of the first inorganic layer 400 and the second inorganic layer 600 from being too thin, so that a thickness Y of the convex portion 401 is greater than a thickness Q of the concave portion 402, and reduce a shadow effect (shadow effect) of the first inorganic layer 400 and the second inorganic layer 600, thereby improving a packaging effect of the display panel 10, further reducing a risk of water-oxygen erosion of a film layer in the display panel 10, and further improving a display effect of the display panel 10, the performance of the display panel 10 is improved. The second barrier wall 700 is configured to be composed of the body portion 721 and the protrusion portion 722 connected to the body portion 721, so that the protrusion portion 722 can block the carrier gas, the material particles of the first inorganic layer 400 and the second inorganic layer 600 in the process of forming the first inorganic layer 400 and the second inorganic layer 600, thereby forming the protrusion portion 401 and the concave portion 402 disposed adjacent to the protrusion portion 401 at the end portion of the first inorganic layer 400 and the second inorganic layer 600, the protrusion portion 401 is located at the side of the concave portion 402 away from the light emitting structure 300, and further avoiding the edges of the first inorganic layer 400 and the second inorganic layer 600 from being too thin, even if the thickness Y of the protrusion portion 401 is greater than the thickness Q of the concave portion 402, further improving the encapsulation effect of the display panel 10, further reducing the risk of water and oxygen attacking the film layers in the display panel 10, further improving the display effect of the display panel 10, and further improving the performance of the display panel 10. The thickness H of the second retaining wall 700 is set to be greater than the thickness W of the first retaining wall 200, and the difference between the thickness H of the second retaining wall 700 and the thickness W of the first retaining wall 200 is set to be 3 micrometers to 5 micrometers, so that the second retaining wall 700 can block the first inorganic layer 400 and the second inorganic layer 600 overflowing the first retaining wall 200 in front of the second retaining wall 700, and further prevent the edges of the first inorganic layer 400 and the second inorganic layer 600 from being too thin, thereby improving the packaging effect of the display panel 10. The mask strip 810 is etched by adopting a back etching process, so that the mask strip 810 forms a first shielding part 811 and a second shielding part 812, the thickness d1 of the first shielding part 811 is smaller than the thickness d2 of the second shielding part 812, the appearance of the mask strip 810 is matched with that of the array substrate 100, the gap between the array substrate 100 and the mask strip 810 is reduced, the shadow effect of the packaging layer 699 is reduced, and the narrow-frame design is realized; because the mask strip 810 is composed of the first shielding portion 811 and the second shielding portions 812 arranged at two sides of the first shielding portion 811, and the thickness d1 of the first shielding portion 811 is smaller than the thickness d2 of the second shielding portion 812, the shapes of the mask strip 810 and the array substrate 100 are matched, so that the gap between the array substrate 100 and the mask strip 810 is reduced, a convex portion 401 and a concave portion 402 adjacent to the convex portion 401 are formed at the end portions of the first inorganic layer 400 and the second inorganic layer 600, and the thickness Y of the convex portion 401 is larger than the thickness Q of the concave portion 402, so that the edges of the first inorganic layer 400 and the second inorganic layer 600 are prevented from being too thin, the water and oxygen barrier performance of the encapsulation layer 699 is improved, the risk of encapsulation failure is reduced, and the performance of the display panel 10 is improved. The distance between the light shield strip 810 and the second retaining wall 700 is set to be smaller than the distance between the second retaining wall 700 and the first retaining wall 200, and the shadow effect of the encapsulating layer 699 is further limited in the area surrounded by the second retaining wall 700, so that the film thickness of the edges of the first inorganic layer 400 and the second inorganic layer 600 is further improved, the encapsulating effect of the display panel 10 is improved, and the performance of the display panel 10 is further improved.

The display panel and the manufacturing method thereof provided by the embodiments of the present application are described in detail above, and the principle and the embodiment of the present application are explained herein by applying specific examples, and the description of the embodiments above is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.