阅读说明：本技术 一种磨头与工件对零的方法及打磨设备 (Method for aligning grinding head and workpiece and grinding equipment ) 是由 李帅 姜栋 郑倩倩 于 2021-09-26 设计创作，主要内容包括：本发明涉及零部件加工技术领域,具体涉及一种磨头与工件对零的方法。所述磨头与工件对零的方法包括：移动工件至第一预设位置(S1,0)；获取工件厚度值D；基于工件厚度值D确定磨头的下降速率,以使工件移动至第二预设位置(S1+S2,0)的同时磨头下降至打磨起始位置(S1+S2,D)。本发明提供的磨头与工件对零的方法,通过基于工件厚度值D确定磨头的下降速率,以使工件移动至第二预设位置(S1+S2,0)的同时磨头下降至打磨起始位置(S1+S2,D),实现当工件运输至打磨区时,磨头即可与工件表面齐平,恰好完成粗对零,节约了对零时间,提升了对零效率,不影响生产节奏。(The invention relates to the technical field of part processing, in particular to a method for zero alignment of a grinding head and a workpiece. The method for aligning the grinding head with the workpiece comprises the following steps: moving the workpiece to a first preset position (S1, 0); acquiring a workpiece thickness value D; the lowering rate of the grinding head is determined based on the workpiece thickness value D so that the grinding head is lowered to the grinding start position (S1+ S2, D) while the workpiece is moved to the second preset position (S1+ S2, 0). According to the zero alignment method of the grinding head and the workpiece, provided by the invention, the descending rate of the grinding head is determined based on the thickness value D of the workpiece, so that the grinding head descends to the grinding starting position (S1+ S2, D) while the workpiece moves to the second preset position (S1+ S2, 0), and when the workpiece is transported to the grinding area, the grinding head can be flush with the surface of the workpiece, the rough zero alignment is just completed, the zero alignment time is saved, the zero alignment efficiency is improved, and the production rhythm is not influenced.)

1. A method for aligning a grinding head with a workpiece is characterized by comprising the following steps:

moving the workpiece to a first preset position (S1, 0);

acquiring a workpiece thickness value D;

determining a lowering rate of the grinding head based on the workpiece thickness value D such that the grinding head is lowered to a grinding start position (S1+ S2, D) while the workpiece is moved to a second preset position (S1+ S2, 0).

2. The grinding head and workpiece zero-alignment method of claim 1, characterized in that a travel switch (12) is provided at the first preset position (S1, 0), and the workpiece thickness value D is obtained by a thickness measuring sensor (11) located at coordinates (0, H);

moving the workpiece to a first preset position (S1, 0), and obtaining a workpiece thickness value D, including:

driving the workpiece to move along a preset direction;

and when the workpiece touches the travel switch (12), starting the thickness measuring sensor (11) to acquire the workpiece thickness value D of the workpiece.

3. The method of aligning a grinding head with a workpiece according to claim 2, wherein said obtaining a workpiece thickness value D further comprises:

judging whether the radiation range of the thickness measuring sensor (11) is on the upper surface of the workpiece or not;

when (H-d)₁)tan(α/2)<S1, and (H-d)₁)tan(α/2)<L-S1, determining that the radiation range of the thickness measuring sensor (11) is on the upper surface of the workpiece completely;

wherein H is the height of the thickness measuring sensor (11) from a reference plane (X,0), d₁The minimum value of the thickness value of the workpiece is defined, alpha is the full emission angle of the thickness measuring sensor (11), S1 is the horizontal distance between the thickness measuring sensor (11) and the travel switch (12), and L is the minimum length of the workpiece.

4. The method of zero-alignment of a grinding head and a workpiece according to claim 2, wherein said determining a lowering rate of the grinding head based on the workpiece thickness value D so that the grinding head is lowered to a grinding start position (S1+ S2, D) while the workpiece is moved to a second preset position (S1+ S2, 0) comprises:

determining the rate of decline as: v. of₁＝(h-d₂)/(s/v₂)，

Wherein h is the height difference between the grinding head and a reference surface (X,0), and d₂Is the maximum value of the thickness value of the workpiece, s is the horizontal distance between the travel switch (12) and the grinding head, v₂Is the speed of travel of the workpiece.

5. The method of aligning a grinding head with a workpiece of any one of claims 1 to 4, further comprising, after the lowering of the grinding head to a grinding start position (S1+ S2, D):

continuously downwards regulating the grinding head until the positive pressure of the grinding head and the workpiece reaches a preset threshold value;

and starting the grinding head to operate.

6. An abrading apparatus for carrying out the method of aligning a grinding head with a workpiece as claimed in any one of claims 1 to 5, said abrading apparatus comprising: an epitaxial transport table (1), the epitaxial transport table (1) comprising: a transport unit (16) adapted to support and transport the workpiece; and the thickness measuring sensor (11) is arranged right above the conveying unit (16) and is suitable for measuring the thickness value D of the workpiece.

7. The grinding apparatus according to claim 6, characterized in that the extension conveyor table (1) further comprises: and the travel switch (12) is arranged in front of the thickness measuring sensor (11) along the workpiece conveying direction and is suitable for controlling the starting of the thickness measuring sensor (11).

8. The abrading apparatus of claim 7, further comprising: the grinding assembly (3) is suitable for grinding the workpiece, and a grinding head (33) is arranged on the grinding assembly (3);

a lifting assembly (2) adapted to control the lifting of the sanding assembly (3).

9. The sharpening apparatus as claimed in claim 8, characterized in that said lifting assembly (2) comprises: a force sensor (23) connected to the grinding assembly (3) and adapted to monitor a positive pressure between the grinding assembly (3) and the workpiece;

a floating joint (24) adapted to connect the grinding assembly (3) and to provide a cushion when the grinding assembly (2) contacts the workpiece.

10. The abrading apparatus of claim 8, further comprising: the polishing platform (5) is arranged right below the polishing assembly (3), and the polishing platform (5) is connected with the conveying unit (16) and is suitable for supporting the workpiece.

Technical Field

The invention relates to the technical field of part processing, in particular to a method for zero alignment of a grinding head and a workpiece.

Background

In industrial production, in order to improve the performance of part products, workpieces need to be polished, wherein zero alignment is an important step in polishing, the relative position of a grinding head and the workpiece when polishing is started is found in zero alignment, zero alignment is not accurate, too heavy polishing or too light polishing can occur, and the polishing quality is directly determined. However, in the actual process, zero alignment operation is influenced by two factors of workpiece thickness and abrasive loss, and aiming at the problem that the thickness difference of the workpiece is large and the equipment cannot be adjusted in a self-adaptive thickness mode, the thickness is usually calibrated manually in the traditional technology, then the relative position of a grinding belt and the workpiece is adjusted, and the zero point position of sanding is judged manually, so that the efficiency is low, the human factors are large, and the precision and the consistency cannot be guaranteed; the grinding head is gradually worn and continuously affects the relative position of the grinding head and the workpiece, so that the zero offset is gradually increased, and the grinding quality slides downwards. In order to solve the problems, in the prior art, a work piece is sent to the position below a sanding contact roller, a work conveying table is lifted, when the surface of the work piece is in contact with an abrasive belt and drives the sanding contact roller to rotate, a signal of the rotation of the sanding contact roller is output to a controller, the controller instructs the work conveying table to stop lifting, and at the moment, the zero alignment action of the work piece and the abrasive belt is completed. However, the whole zero-aligning process of the method is carried out in the sanding area, and the time is long; and the contact roller is driven by friction to judge zero alignment, the standard is solidified, the polishing force and the polishing effect cannot be adjusted, and different polishing requirements cannot be met.

Disclosure of Invention

Therefore, the technical problem to be solved by the invention is to overcome the defects that zero alignment is long in time consumption and cannot meet different polishing precision requirements in the prior art, so that the grinding head and workpiece zero alignment method capable of improving efficiency and meeting different polishing precision requirements is provided.

The invention aims to solve another technical problem of overcoming the defects that the zero alignment time of the polishing equipment in the prior art is long and the polishing equipment cannot meet different polishing precision requirements, thereby providing the polishing equipment capable of realizing efficient and accurate zero alignment.

In order to solve the technical problem, the invention provides a method for aligning a grinding head and a workpiece, which comprises the following steps:

moving the workpiece to a first preset position (S1, 0);

acquiring a workpiece thickness value D;

determining a lowering rate of the grinding head based on the workpiece thickness value D such that the grinding head is lowered to a grinding start position (S1+ S2, D) while the workpiece is moved to a second preset position (S1+ S2, 0).

Optionally, a travel switch is arranged at the first preset position (S1, 0), and the workpiece thickness value D is obtained by a thickness measuring sensor located at the coordinate (0, H);

moving the workpiece to a first preset position (S1, 0), and obtaining a workpiece thickness value D, including:

driving the workpiece to move along a preset direction;

and when the workpiece touches the travel switch, starting the thickness measuring sensor to acquire the workpiece thickness value D of the workpiece.

Optionally, before the obtaining the workpiece thickness value D, the method further includes:

judging whether the radiation range of the thickness measuring sensor is on the upper surface of the workpiece or not;

when (H-d)₁)tan(α/2)<S1, and (H-d)₁)tan(α/2)<L-S1, determining that the radiation range of the thickness measuring sensor is all on the upper surface of the workpiece;

wherein H is the height of the thickness measuring sensor from a reference plane (X,0), d₁The minimum value of the thickness value of the workpiece is defined, alpha is the full emission angle of the thickness measuring sensor, S1 is the horizontal distance between the thickness measuring sensor and the travel switch, and L is the minimum length of the workpiece.

Optionally, the determining a lowering rate of the grinding head based on the workpiece thickness value D such that the grinding head is lowered to a grinding start position (S1+ S2, D) while the workpiece is moved to a second preset position (S1+ S2, 0), comprises:

determining the rate of decline as: v. of₁＝(h-d₂)/(s/v₂)，

Wherein h is the height difference between the grinding head and a reference surface (X,0), and d₂Is the maximum value of the thickness value of the workpiece, s is the horizontal distance between the travel switch and the grinding head, v₂Is the speed of travel of the workpiece.

Optionally, after the grinding head descends to the grinding start position (S1+ S2, D), the method further includes:

continuously downwards regulating the grinding head until the positive pressure of the grinding head and the workpiece reaches a preset threshold value;

and starting the grinding head to operate.

The invention provides a grinding device, comprising:

a method for carrying out the alignment of a grinding head with a workpiece as described above, the grinding apparatus comprising: an epitaxial transport table, the epitaxial transport table comprising: a conveying unit adapted to support and convey a workpiece; and the thickness measuring sensor is arranged right above the conveying unit and is suitable for measuring the thickness value D of the workpiece.

Optionally, the epitaxial conveying table further includes: and the travel switch is arranged in front of the thickness measuring sensor along the workpiece conveying direction and is suitable for controlling the starting of the thickness measuring sensor.

Optionally, the grinding apparatus further comprises: the grinding assembly is suitable for grinding the workpiece and is provided with a grinding head;

and the lifting assembly is suitable for controlling the lifting of the grinding assembly.

Optionally, the lifting assembly comprises: a force sensor coupled to the grinding assembly and adapted to monitor a positive pressure between the grinding assembly and the workpiece;

a floating joint adapted to connect the abrading assembly and adapted to provide cushioning when the abrading assembly contacts the workpiece.

Optionally, the grinding apparatus further comprises: and the polishing platform is arranged right below the polishing assembly, is connected with the conveying unit and is suitable for supporting the workpiece.

The technical scheme of the invention has the following advantages:

1. according to the method for zero alignment of the grinding head and the workpiece, provided by the invention, the descending rate of the grinding head is determined based on the thickness value D of the workpiece, so that the grinding head descends to the grinding starting position (S1+ S2, D) while the workpiece moves to the second preset position (S1+ S2, 0), and when the workpiece is conveyed to a grinding area, the grinding head can be flush with the surface of the workpiece, the rough zero alignment is just completed, the zero alignment time is saved, the zero alignment efficiency is improved, and the production rhythm is not influenced.

2. According to the zero alignment method of the grinding head and the workpiece, provided by the invention, the thickness measuring sensor is started to obtain the workpiece thickness value D of the workpiece when the workpiece touches the travel switch, and the thickness measuring sensor is started again when the workpiece moves to the preset position (S1, 0), so that the condition that the radiation range is out of the workpiece due to the fact that the thickness measuring sensor is started in advance is avoided, the condition that the value out of the workpiece thickness value is prevented from being obtained, and the reliability and the stability of the measuring result are ensured.

3. According to the method for zero alignment of the grinding head and the workpiece, after the grinding head descends to the grinding initial position (S1+ S2, D), the grinding head is continuously adjusted downwards until the positive pressure of the grinding head and the workpiece reaches a preset threshold value, the method is stopped, whether zero alignment is completed or not is judged by utilizing the positive pressure feedback of the grinding head and the workpiece, and when the force reaches the set threshold value, precise zero alignment is completed, so that the grinding force is directly ensured, the grinding effect is ensured, and the loss of the grinding head can be automatically compensated.

4. According to the polishing equipment provided by the invention, the conveying unit is arranged to support and convey the workpiece, the thickness measuring sensor and the travel switch are arranged, the travel switch is used for controlling the starting of the thickness measuring sensor, the automatic detection of the thickness of the workpiece is realized, and the travel switch is arranged in front of the thickness measuring sensor along the conveying direction of the workpiece, so that when the travel switch is touched and started, the workpiece is positioned in the radiation range of the thickness measuring sensor, and the accuracy of thickness measurement is ensured.

5. According to the polishing equipment provided by the invention, the lifting assembly is connected with the polishing assembly through the force sensor, so that the positive pressure between the polishing assembly and the workpiece is collected, the polishing assembly is controlled to be started or stopped according to the fact that the positive pressure reaches a preset threshold value, the accurate zero alignment is realized, meanwhile, the floating joint is arranged, the buffer is provided when the polishing assembly contacts the workpiece, and the polishing assembly is prevented from being directly touched to cause impact damage to the polishing assembly.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural view of the sanding apparatus of the present invention.

Description of reference numerals:

1. an epitaxial transport table; 11. a thickness measuring sensor; 12. a travel switch; 13. a caster wheel; 14. a ground brake; 15. a delivery stent; 16. a conveying unit;

2. a lifting assembly; 21. a lifting motor; 22. a lifter; 23. a force sensor; 24. a floating joint;

3. polishing the assembly; 31. polishing the motor; 32. a belt; 33. grinding heads; 34. a bearing; 35. a guide shaft;

4. a support; 5. a polishing table.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

The grinding head and workpiece zero alignment method provided by the embodiment comprises the following steps:

moving the workpiece to a first preset position (S1, 0);

acquiring a workpiece thickness value D;

determining a lowering rate of the grinding head based on the workpiece thickness value D such that the grinding head is lowered to a grinding start position (S1+ S2, D) while the workpiece is moved to a second preset position (S1+ S2, 0).

The workpiece is a product component which needs to be polished, and is horizontally placed on polishing equipment and is transferred and moved in a certain direction in a horizontal plane; constructing a rectangular coordinate system by taking a horizontal plane for placing the workpiece as a reference plane, wherein the origin of the rectangular coordinate system is a projection point of the thickness measuring sensor on the reference plane, the X-axis direction is the advancing direction of the workpiece, and the Y-axis direction is the vertical direction perpendicular to the horizontal plane; the thickness measuring sensor is used for acquiring the thickness value of the workpiece.

According to the method for zero alignment of the grinding head and the workpiece, provided by the embodiment, the lowering rate of the grinding head is determined based on the workpiece thickness value D, so that the workpiece is moved to the second preset position (S1+ S2, 0) and the grinding head is lowered to the grinding starting position (S1+ S2, D), when the workpiece is conveyed to the grinding area, the grinding head can be flush with the surface of the workpiece, the rough zero alignment is just completed, the zero alignment time is saved, the zero alignment efficiency is improved, and the production rhythm is not influenced.

Specifically, a travel switch 12 is arranged at the first preset position (S1, 0), and the workpiece thickness value D is acquired by a thickness measuring sensor 11 located at coordinates (0, H);

moving the workpiece to a first preset position (S1, 0), and obtaining a workpiece thickness value D, including:

driving the workpiece to move along a preset direction;

when the workpiece touches the travel switch 12, the thickness measuring sensor 11 is started to acquire the workpiece thickness value D of the workpiece.

It should be noted that the preset direction refers to an advancing direction of the workpiece.

According to the zero alignment method of the grinding head and the workpiece, provided by the invention, when the workpiece touches the travel switch 12, the thickness measuring sensor 11 is started to obtain the workpiece thickness value D of the workpiece, and the thickness measuring sensor 11 is started again when the workpiece moves to the preset position (S1, 0), so that the condition that the radiation range is out of the workpiece due to the fact that the thickness measuring sensor 11 is started in advance is avoided, and the condition that the value is out of the workpiece thickness value is prevented from being obtained, and the reliability and the stability of the measuring result are ensured.

Specifically, the obtaining the workpiece thickness value D further comprises:

judging whether the radiation range of the thickness measuring sensor 11 is on the upper surface of the workpiece;

when (H-d)₁)tan(α/2)<S1, and (H-d)₁)tan(α/2)<L-S1, determining that the radiation range of the thickness measuring sensor 11 is all on the upper surface of the workpiece;

wherein H is the height of the thickness measuring sensor 11 from a reference plane (X,0), d₁The minimum value of the thickness value of the workpiece is shown, alpha is the full emission angle of the thickness measuring sensor 11, S1 is the horizontal distance between the thickness measuring sensor 11 and the travel switch 12, and L is the minimum length of the workpiece.

Preferably, the upper surface of the workpiece is uneven, so that the workpiece thickness values D of the workpiece at different positions are not completely consistent, and the minimum value of the workpiece thickness values D is D₁The maximum value of the workpiece thickness value D is D₂。

Preferably, the radiation range of the thickness measuring sensor 11 is a conical radiation range with the thickness measuring sensor as an emission point, and the formula (H-d)₁)tan(α/2)<S1, ensuring that the radiation range of the right side of the thickness measuring sensor 11 is all on the upper surface of the workpiece; the formula (H-d)₁)tan(α/2)<The L-S1 is used to ensure that the radiation range of the left side of the thickness sensor 11 is all on the upper surface of the workpiece, thereby ensuring that the radiation range of the thickness sensor 11 is all on the upper surface of the workpiece.

Wherein, referring to fig. 1, the right side refers to the right side of the thickness sensor 11 indicated by an arrow in fig. 1, and the left side refers to the left side of the thickness sensor 11 indicated by an arrow in fig. 1.

Specifically, the determining a lowering rate of the grinding head based on the workpiece thickness value D such that the grinding head is lowered to a grinding start position (S1+ S2, D) while the workpiece is moved to a second preset position (S1+ S2, 0) includes:

determining the rate of decline as: v. of₁＝(h-d₂)/(s/v₂)，

Wherein h is the height difference between the grinding head and a reference surface (X,0), and d₂Is the maximum value of the thickness value of the workpiece, s isThe horizontal distance between the travel switch 12 and the grinding head is S2 v₂Is the speed of travel of the workpiece.

It should be noted that when the workpiece is moved to the second preset position (S1+ S2, 0), the rightmost side of the grinding head is located at the start position of the ground region of the workpiece.

Preferably, the workpiece thickness value D of the dressing start position (S1+ S2, D) is a maximum value D of the workpiece thickness values₂That is, when the grinding head is lowered to the grinding start position (S1+ S2, D), the grinding head is lowered to be flush with the highest point of the upper surface of the workpiece, completing coarse zero alignment.

Preferably, the time taken for the workpiece to move from the position of the travel switch 12 to the grinding start position is t₁＝s/v₂The distance of the grinding head descending is h-d in the same time₂Then the rate of descent of the grinding head is v₁＝(h-d₂)/t₁＝(h-d₂)/(s/v₂)。

Specifically, after the grinding head descends to the grinding start position (S1+ S2, D), the method further comprises the following steps:

continuously downwards regulating the grinding head until the positive pressure of the grinding head and the workpiece reaches a preset threshold value;

and starting the grinding head to operate.

According to the method for zero alignment of the grinding head and the workpiece, after the grinding head descends to the grinding starting position (S1+ S2, D), the grinding head is continuously adjusted downwards, the method is stopped when the positive pressure of the grinding head and the workpiece reaches a preset threshold value, whether zero alignment is completed or not is judged by utilizing the positive pressure feedback of the grinding head and the workpiece, and when the force reaches the set threshold value, precise zero alignment is completed, so that the grinding force is directly ensured, the grinding effect is ensured, and the loss of the grinding head can be automatically compensated.

Example two

As shown in fig. 1, the present embodiment provides a polishing apparatus, including:

a method for carrying out the alignment of a grinding head with a workpiece as described above, the grinding apparatus comprising: an epitaxial transport table 1, the epitaxial transport table 1 comprising: a conveying unit 16 adapted to support and convey the workpiece; and the thickness measuring sensor 11 is arranged right above the conveying unit 16 and is suitable for measuring the thickness value D of the workpiece.

Preferably, the conveyor unit 16 comprises a roller or a belt.

Preferably, the conveying unit 16 drives the workpiece to move on the extension conveying table 1, and when the workpiece touches the travel switch 12, the thickness measuring sensor 11 is started.

Specifically, the epitaxial transport table 1 further includes: and the travel switch 12 is arranged in front of the thickness measuring sensor 11 along the workpiece conveying direction and is suitable for controlling the starting of the thickness measuring sensor 11.

The front direction refers to the direction indicated by the arrow in fig. 1, and is the same direction as the right side.

Preferably, the epitaxial transport table 1 further includes: the caster 13 and the ground brake 14 are arranged at the lower end of the extension conveying table 1 and are in contact with the ground, the extension conveying table is an independent device, the caster 13 is suitable for freely moving the extension conveying table 1, and the ground brake 14 is suitable for stably placing the extension conveying table 1;

a transport support 15 adapted to support the transport unit 16.

The equipment of polishing that this embodiment provided, through setting up conveying unit 16, it is right to realize the support and the conveying of work piece to through setting up thickness measurement sensor 11 and travel switch 12, through travel switch 12 control thickness measurement sensor 11's start-up, it is right to realize work piece thickness automated inspection, and through setting up travel switch is located thickness measurement sensor 11's edge the place ahead of work piece direction of transfer is guaranteed when travel switch 12 is touched the start-up, the work piece is located thickness measurement sensor 11's radiation range to guarantee the accuracy of thickness measurement.

Specifically, the grinding apparatus further comprises: a grinding assembly 3, adapted to grind said workpiece, on which a grinding head 33 is arranged;

and the lifting assembly 2 is suitable for controlling the lifting of the grinding assembly 3.

Specifically, the lifting assembly 2 comprises: a force sensor 23 connected to the grinding assembly 3 and adapted to monitor a positive pressure between the grinding assembly 3 and the workpiece;

a floating joint 24 adapted to connect the grinding assembly 3 and to provide a cushion when the grinding assembly 3 contacts the workpiece.

Preferably, the lifting assembly 2 further comprises: the lifter 22 is connected with the grinding assembly 3 sequentially through the force sensor 23 and the floating joint 24 and is suitable for driving the grinding assembly 3 to lift;

and the lifting motor 21 is connected with the lifter 22 and is suitable for driving the lifter 22 to move.

Preferably, the rotating speed of the lifting motor 21 is n, and the descending speed of the grinding head is v when the stroke of the lifter 22 per revolution is p₁Np, i.e. v₁＝np＝(h-d₂)/(s/v₂)。

Preferably, the grinding apparatus further comprises: and the central control system is suitable for commanding the lifting motor 21 to start after receiving the workpiece thickness value signal of the thickness measuring sensor 11, so that the lifting motor 21 drives the lifter 22 to move downwards to drive the grinding assembly 3 to move downwards.

Preferably, when the grinding head 33 of the grinding assembly 3 is lowered to be level with the highest point of the upper surface of the workpiece, the rough zero alignment is completed; after rough zero alignment is completed, the grinding head 33 is continuously adjusted downwards, the grinding head 33 is abutted against the workpiece, positive pressure of the grinding head 33 and the workpiece is fed back to the force sensor 23, when the positive pressure reaches a set threshold value, accurate zero alignment is completed, the lifting motor 21 stops, the grinding component 3 stops descending, the grinding motor 31 is started, the grinding head 33 is driven to rotate, and the workpiece is ground.

Preferably, the threshold of the force sensor 23 is adjusted according to the actual sanding effect, and an empirical value is input into the system, so that the sanding effect is more flexible.

Preferably, the grinding assembly 3 further comprises: a belt 32, wherein the grinding head 33 is arranged on the belt 32;

a grinding motor 31, which is suitable for driving the belt 32 to rotate, thereby driving the grinding head 33 to rotate and grinding the workpiece;

a guide shaft 35 adapted to guide the elevation of the sanding assembly 3;

the bearing 34 is fixedly connected with the supporting structure of the polishing assembly 3, sleeved on the guide shaft 35 and suitable for driving the supporting structure of the polishing assembly 3 to slide up and down along the guide shaft 35;

the grinding device provided by the embodiment is connected with the grinding component 3 through the force sensor 23 by arranging the lifting component 2, so that the grinding component 3 and the positive pressure between the workpieces are collected, the grinding component 3 is controlled to start and stop according to the positive pressure, the accurate zero alignment is realized, meanwhile, the grinding component 3 is in contact with the workpieces through the floating joint 24, the grinding component 3 is buffered, and the grinding component 3 is prevented from being directly touched by the workpieces and causing impact damage to the grinding component 3.

Specifically, the grinding apparatus further comprises: and the polishing platform 5 is arranged right below the polishing assembly 3, and the polishing platform 5 is connected with the conveying unit 16 and is suitable for supporting the workpiece.

Preferably, the grinding apparatus further comprises: a support 4 adapted to support the grinding apparatus.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.