阅读说明：本技术 一种提升sop型封装产品生产效率的生产方法 (Production method for improving production efficiency of SOP type packaging product ) 是由 陈勇 汪婷 黄乙为 梁大钟 冯学贵 熊丽萍 高爽 王晓斌 于 2021-09-07 设计创作，主要内容包括：本发明涉及一种提升SOP型封装产品生产效率的生产方法,包括以下步骤：S1:制作引线框架,采用100mm*300mm大尺寸的引线框架,引线框架内的引线框架单元采用48*16的阵列排布方式；S2:装片,将芯片固定在引线框架上；S3:键合；S4：塑封,利用塑封模具将引线框架进行塑封,塑封模具包括6条注塑流道,每条注塑流道上设有16个主浇口,每个主浇口用于冲注左右两侧各4个产品；S5：切筋。由于大幅减少了流道的设计数量,引线框架上为流道预留的空间在宽度上也得到了缩减,从而可以进一步增加引线框架单元的布置密度,单位面积上产品为目前业界最高密度,提高了设备生产效率,同时提高了塑封料和引线框架的材料利用率。(The invention relates to a production method for improving the production efficiency of an SOP type packaging product, which comprises the following steps: s1, manufacturing a lead frame, wherein the lead frame adopts a 100 mm-300 mm large-size lead frame, and lead frame units in the lead frame adopt a 48-16 array arrangement mode; s2, mounting, namely fixing the chip on the lead frame; s3, bonding; s4: plastic packaging, namely performing plastic packaging on the lead frame by using a plastic packaging mold, wherein the plastic packaging mold comprises 6 injection runners, each injection runner is provided with 16 main gates, and each main gate is used for punching and injecting 4 products on the left side and the right side; s5: and (6) cutting ribs. Because the design quantity of the flow channels is greatly reduced, the space reserved for the flow channels on the lead frame is also reduced in width, the arrangement density of the lead frame units can be further increased, the product is the highest density in the industry at present in unit area, the production efficiency of equipment is improved, and the material utilization rate of the plastic package material and the lead frame is improved.)

1. A production method for improving the production efficiency of SOP type packaging products is characterized by comprising the following steps:

s1, manufacturing a lead frame, namely, manufacturing a 100 mm-300 mm large-size lead frame, wherein lead frame units in the lead frame are arranged in a 48-16 array mode, each 4 rows of lead frame units form a group, and intervals are reserved among the groups;

s2, mounting, namely fixing the chip on the lead frame;

s3, bonding, fixing the lead frame by using a bonding clamp, and electrically connecting the chip with the lead of the lead frame unit by using a metal wire;

s4: plastic packaging, namely performing plastic packaging on the lead frame by using a plastic packaging mold, wherein the plastic packaging mold comprises 6 injection runners, each injection runner is provided with 16 main gates, and each main gate is used for punching and injecting 4 products on the left side and the right side;

s5: and (5) cutting ribs, namely punching the plastic package product of the whole plate into single products by using a rib cutting forming die.

2. The production method for improving the production efficiency of the SOP type packaged product according to claim 1, wherein the plastic package mold upper and lower molds are provided with ejector pins at the outer pin positions of the lead frame unit, and the ejector pins are used for abutting against the outer pins of the lead frame unit during demolding so as to provide auxiliary demolding force.

3. The production method for improving the production efficiency of the SOP type packaged product according to claim 1, wherein the pressing width of the pressing panel of the plastic package mold is 0.13 mm.

4. The production method for improving the production efficiency of the SOP type packaged product according to claim 1, wherein the demolding angles of the upper mold cavity and the lower mold cavity of the plastic package mold are both 17 degrees, and the inner side surfaces of the upper mold cavity and the lower mold cavity are smooth surfaces.

5. The production method for improving the production efficiency of the SOP type packaged product according to claim 1, wherein the two sets of stamping dies for manufacturing the lead frame are provided and processed by step stamping, the first set of stamping dies is used for processing the lead frame units in odd-numbered rows, and the second set of stamping dies is used for processing the lead frame units in even-numbered rows.

6. The production method for improving the production efficiency of the SOP type packaged products as claimed in claim 5, wherein the leads of the lead frame units of two adjacent products in the same row of products form a cross structure by IDF design.

7. The production method for improving the production efficiency of the SOP type packaged product according to claim 1, wherein the inner pins of the lead frame unit are designed with glue locking round holes, the upper and lower surfaces of the inner pins are designed with V-shaped groove structures close to the edges of the plastic package body, and the peripheries of the base islands of the lead frame unit are designed with U-shaped groove structures which are all used for increasing the bonding force with the plastic package material.

8. The production method for improving the production efficiency of the SOP-type packaged product according to claim 1, wherein in step S5, the rib-cutting forming mold adopts a step-by-step feeding scheme, a pre-positioning station is designed on the rib-cutting forming mold, and the step-by-step feeding scheme has the following processing actions: the first step is that the 1 st and 3 rd rows cut the tie rod; second step 2, the 2 nd and 4 th row cutting connecting rods; thirdly, cutting connecting rods in the 5 th and 7 th rows, preforming in the 2 nd and 4 th rows and forming pins in the 1 st and 3 rd rows; fourthly, cutting a connecting rod at the 6 th and 8 th rows, preforming at the 5 th and 7 th rows, forming pins at the 2 nd and 4 th rows and cutting off the pins at the 1 st and 3 rd rows; the fifth step is that the 9 th row and the 11 th row are cut and connected, the 6 th row and the 8 th row are preformed, the 5 th row and the 7 th row are formed by pins, the 2 nd row and the 4 th row are cut, and the 1 st row and the 3 rd row are separated, and the sequence is carried out until all the products in the 16 th row are completely separated.

9. The production method for improving the production efficiency of the SOP type packaged product according to the claim 1, wherein in the step S3, the periphery of the upper end of the boss on the heating block of the bonding fixture is provided with an inclined surface.

10. The production method for improving the production efficiency of the SOP type packaged product according to any one of claims 1 to 9, wherein the SOP type packaged product is an SOP8 or SOP7 type packaged product.

Technical Field

The invention relates to the technical field of chip packaging, in particular to a production method for improving the production efficiency of SOP type packaged products.

Background

The existing chip packaging technology mainly comprises the following steps of firstly manufacturing a lead frame, wherein a plurality of lead frame units are arrayed on the lead frame, each lead frame unit comprises a base island and a pin, and each pin also comprises an inner pin and an outer pin which are generally completed by a stamping die; then, a chip mounting procedure is carried out, and the chip is fixed on the base island of the lead frame unit; then, a bonding procedure is carried out, wherein the lead frame is fixed by a bonding clamp, and the chip is electrically connected with the inner pin of the lead frame unit by a metal wire; then, performing plastic packaging, namely performing plastic packaging on the lead frame by using a plastic packaging mold, and wrapping and protecting the lead frame, the chip and the metal wire by using a formed plastic packaging body; and finally, a rib cutting procedure, namely, punching the plastic package product of the whole plate into single products by using a rib cutting forming die.

In order to further improve the production efficiency of the package, the technical personnel in the field continuously increase the external dimensions of the lead frame, so that more lead frame units can be arrayed, and the arrangement density of the lead frame units is improved as much as possible, so that the lead frame can occupy market advantages in material cost, production efficiency and labor cost, for example, for the existing SOP8/7 product, the maximum dimension of the lead frame has reached 100mm × 300mm, which is almost the limit that an injection mold can bear, the arrangement density of the lead frame units reaches 15 rows × 40 columns, the number of products arranged on each lead frame reaches 600pcs, the plastic mold needs to be provided with at least 10 runners, each runner is provided with 15 main gates, each main gate is used for injecting two products on the left side and the right side, and because the main gates need to ensure a certain width, sufficient space needs to be reserved at the corresponding position on the lead frame, the lead frame units on the lead frame cannot be further increased in density, the existing arrangement density is almost developed to the limit, various manufacturers are gradually applied to actual production, and the production efficiency tends to be the same. Only ever further increases in product quality and production efficiency have led to a breakthrough in intense market competition.

Disclosure of Invention

The invention aims to provide a production method for improving the production efficiency of an SOP type packaging product, so that the production efficiency is further improved on the basis of the prior art.

The invention is realized by the following steps: a production method for improving the production efficiency of SOP type packaging products comprises the following steps:

s1, manufacturing a lead frame, namely, manufacturing a 100 mm-300 mm large-size lead frame, wherein lead frame units in the lead frame are arranged in a 48-16 array mode, each 4 rows of lead frame units form a group, and intervals are reserved among the groups;

s2, mounting, namely fixing the chip on the lead frame;

s3, bonding, fixing the lead frame by using a bonding clamp, and electrically connecting the chip with the lead of the lead frame unit by using a metal wire;

s4: plastic packaging, namely performing plastic packaging on the lead frame by using a plastic packaging mold, wherein the plastic packaging mold comprises 6 injection runners, each injection runner is provided with 16 main gates, and each main gate is used for punching and injecting 4 products on the left side and the right side;

s5: and (5) cutting ribs, namely punching the plastic package product of the whole plate into single products by using a rib cutting forming die.

The plastic package mold upper and lower dies are provided with ejector pins at the outer pin positions of the lead frame units, and the ejector pins are used for ejecting the outer pins of the lead frame units during demolding so as to provide auxiliary demolding force.

And the pressing width of the pressing inlaid strip of the plastic package mold is 0.13 mm.

The demolding angles of the upper mold cavity and the lower mold cavity of the plastic package mold are both 17 degrees, and the inner side surfaces of the upper mold cavity and the lower mold cavity are polished surfaces.

The stamping die for manufacturing the lead frame is provided with two sets and is processed in a step-by-step stamping mode, the first set of stamping die is used for processing odd-numbered rows of lead frame units, and the second set of stamping die is used for processing even-numbered rows of lead frame units.

The pins of the lead frame units of two adjacent products on the upper and lower sides of the same row of products adopt IDF design to form a cross structure.

The plastic packaging structure is characterized in that the inner pin of the lead frame unit is provided with a glue locking round hole, the upper surface and the lower surface of the inner pin are provided with a V-shaped groove structure close to the edge of the plastic packaging body, and the periphery of the base island of the lead frame unit is provided with a U-shaped groove structure which is used for increasing the binding force with a plastic packaging material.

Wherein, in step S5, the bar cutting forming die adopts a step-by-step feeding scheme, a station in place is designed on the bar cutting forming die in advance, and the processing action of the step-by-step feeding scheme is as follows: the first step is that the 1 st and 3 rd rows cut the tie rod; second step 2, the 2 nd and 4 th row cutting connecting rods; thirdly, cutting connecting rods in the 5 th and 7 th rows, preforming in the 2 nd and 4 th rows and forming pins in the 1 st and 3 rd rows; fourthly, cutting a connecting rod at the 6 th and 8 th rows, preforming at the 5 th and 7 th rows, forming pins at the 2 nd and 4 th rows and cutting off the pins at the 1 st and 3 rd rows; the fifth step is that the 9 th row and the 11 th row are cut and connected, the 6 th row and the 8 th row are preformed, the 5 th row and the 7 th row are formed by pins, the 2 nd row and the 4 th row are cut, and the 1 st row and the 3 rd row are separated, and the sequence is carried out until all the products in the 16 th row are completely separated.

In step S3, an inclined surface is provided around the upper end of the upper boss of the heating block of the bonding jig.

Wherein the SOP type packaging product is SOP8 or SOP7 type packaging product.

The invention has the beneficial effects that: the production method for improving the production efficiency of the SOP type packaging product still adopts a lead frame with the size of 100mm x 300mm, but the arrangement density of the lead frame units is higher (the self size of the lead frame units is not changed), a 48 x 16 array arrangement mode is adopted, every 4 rows of lead frame units form one group, and a space is formed between the groups (the space is mainly used for arranging and reserving a flow passage of a plastic packaging mold), 768PCS products can be molded at one time, and the production efficiency is improved by 28% compared with the original 600PCS products; the plastic package mold comprises 6 injection runners, each injection runner is provided with 16 main gates, each main gate is used for punching and injecting 4 products on the left side and the right side, the design quantity of the runners is greatly reduced, the width of a space reserved for the runners on the lead frame is also reduced, and therefore the arrangement density of lead frame units can be further increased, the product has the highest density in the industry at present in unit area, the production efficiency of equipment is improved, the material utilization rate of a plastic package material and the lead frame is improved, and the material cost is reduced; the packaging cost of a single product is reduced, so that the product competitiveness of an enterprise is improved.

Drawings

Fig. 1 is a plan view of an SOP8 type packaged product to be produced by the production method of the present invention;

fig. 2 is a side view of an SOP8 type packaged product to be produced by the production method of the present invention;

FIG. 3 is a schematic structural diagram of a lead frame in the production method of the present invention;

FIG. 4 is a schematic structural view of the first 8 columns of the lead frame in the manufacturing method of the present invention;

FIG. 5 is a schematic structural diagram of a lead frame unit in the manufacturing method of the present invention;

FIG. 6 is a sectional view taken along line A-A of FIG. 5;

FIG. 7 is a schematic view of the fitting relationship between the press-fit gib of the plastic mold and the lead frame in the production method of the present invention;

FIG. 8 is a schematic cross-sectional view of a feed bottom rail for loading sheets in the production process of the present invention;

FIG. 9 is a schematic view showing the fitting relationship between the upper platen of the bonding jig and the lead frame in the manufacturing method of the present invention;

FIG. 10 is a schematic half-sectional view of an upper platen of the bonding jig in the production method of the present invention;

FIG. 11 is a top view of a heating block of the bonding jig in the manufacturing method of the present invention;

FIG. 12 is a schematic view showing the fitting relationship between the boss of the heating block of the bonding jig and the lead frame in the production method of the present invention;

FIG. 13 is a schematic view showing the relationship between the distribution of the ejector pins of the plastic mold and the partial fitting of the lead frame in the production method of the present invention;

fig. 14 is a partial schematic view of a runner structure of a plastic package mold in the production method of the invention.

1. Producing a product; 11. molding the body; 12. a pin; 2. a lead frame; 21. a lead frame unit; 211. a base island; 212. an inner pin; 213. locking the rubber round hole; 214. a "V" groove; 215. a U-shaped groove; 3. injection molding a runner; 31. a main gate; 32. a thimble; 4. pressing the inlaid strips; 5. feeding a bottom rail; 51. a groove; 52. chamfering; 6. an upper pressure plate; 61. connecting the ribs; 7. a heating block; 71. an upper boss; 72. a bevel.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

As an embodiment of the production method for improving the production efficiency of the SOP type packaged product according to the present invention, as shown in fig. 1 to 14, the method includes the following steps:

s1, manufacturing a lead frame 2, wherein the lead frame 2 with the large size of 100 mm-300 mm is adopted, lead frame units 21 in the lead frame 2 are arranged in an array mode of 48-16, each 4 columns of lead frame units 21 form a group, and intervals are reserved among the groups;

s2, mounting, namely fixing the chip on the lead frame;

s3, bonding, fixing the lead frame by using a bonding clamp, and electrically connecting the chip with the lead of the lead frame unit 21 by using a metal wire;

s4: plastic packaging, namely performing plastic packaging on the lead frame by using a plastic packaging mold, wherein the plastic packaging mold comprises 6 injection runners 3, each injection runner 3 is provided with 16 main gates 31, and each main gate 31 is used for punching and injecting 4 products 1 on the left side and the right side;

s5: and (5) cutting ribs, namely punching the plastic package product of the whole plate into single products by using a rib cutting forming die.

In the present invention, the SOP type packaged product may be an SOP8 or SOP7 type packaged product.

The production method for improving the production efficiency of the SOP type packaging product still adopts the lead frame 2 with the large size of 100mm x 300mm, but the arrangement density of the lead frame units 21 is higher (the self size of the lead frame units is not changed), a 48 x 16 array arrangement mode is adopted, every 4 rows of lead frame units 21 form one group, and a space is formed between the groups (the space is mainly used for arranging and reserving a space for a plastic packaging mold runner), 768PCS products can be molded at one time, and the production efficiency is improved by 28% compared with the original 600PCS products; the plastic package mold comprises 6 injection molding runners 3, each injection molding runner 3 is provided with 16 main gates 31, each main gate 31 is used for punching and injecting 4 products 1 on the left side and the right side, the design quantity of the runners is greatly reduced, and the space reserved for the runners on the lead frame 2 is also reduced in width, so that the arrangement density of the lead frame units 21 can be further increased, the products are the highest density in the industry at present in unit area, the production efficiency of equipment is improved, the material utilization rate of the plastic package material and the lead frame is improved, and the material cost is reduced; the packaging cost of a single product is reduced, so that the product competitiveness of an enterprise is improved.

In the present embodiment, as shown in fig. 13, the plastic mold upper and lower molds are each provided with an ejector pin 32 at the outer lead position of the lead frame unit, for abutting against the outer lead of the lead frame unit 21 during demolding, so as to provide an auxiliary demolding force.

In this embodiment, as shown in fig. 7, the pressing width of the pressing insert 4 of the plastic mold is 0.13 mm. In the prior art, the pressing width of the pressing panel of the plastic package mold is 0.2mm, the conventional method is broken through, the pressing width of the pressing panel 4 is adjusted to be 0.13mm to reduce the pressure requirement of a product and a lead frame on a plastic package system, the maximum efficiency of equipment is exerted under the condition that the service life of the equipment is not influenced, and the production efficiency of the equipment is improved by about 30%.

In this embodiment, the demolding angles of the upper mold cavity and the lower mold cavity of the plastic package mold are both 17 degrees, and the inner side surfaces of the upper mold cavity and the lower mold cavity are polished surfaces. The separation of the product from the upper die cavity and the lower die cavity during injection molding can be improved, the product is prevented from being cracked and layered, and the reliability of the product is improved.

In this embodiment, the stamping dies for manufacturing the lead frame have two sets, and are processed by step stamping, the first set of stamping dies is used for processing the lead frame units in odd columns (1, 3, 5, 7 … … columns), and the second set of stamping dies is used for processing the lead frame units in even columns (2, 4, 6, 8 … … columns). The method is used for solving the problems of high product density, difficult arrangement of die cutters and deformation of lead frames in processing, and the utilization rate of the lead frame material is improved by about 28 percent compared with the traditional 15-row lead frame.

In this embodiment, the leads of the lead frame units of two adjacent products in the same row of products form a cross structure by using an IDF design. The strength of the lead frame can be increased to a certain extent, and the lead frame cannot be deformed due to being too soft; meanwhile, more lead frame units can be arranged, and 16 rows of x48 columns can be arranged, so that the material utilization rate of the lead frame is improved.

In this embodiment, as shown in fig. 5 and fig. 6, the inner lead 212 of the lead frame unit 21 is designed with a glue locking circular hole 213, so that the punching and punching forces of the punching tool to the outer lead during the molding of the lead frame can be reduced during the processing, and the bonding strength with the plastic package material can be increased, and a "V" groove structure 214 is designed on the upper and lower surfaces of the inner lead 212 near the edge of the plastic package body for increasing the bonding force with the plastic package material and preventing the occurrence of delamination caused by punching and pulling; the periphery of the lead frame unit base island 211 is provided with a U-shaped groove structure 215 for increasing the bonding force between the base island and the plastic package material and improving the reliability of the product.

In this embodiment, in step S5, the rib cutting forming mold adopts a step-by-step feeding scheme, a pre-positioning station is designed on the rib cutting forming mold, and the processing actions of the step-by-step feeding scheme are as follows: the first step is that the 1 st and 3 rd rows cut the tie rod; second step 2, the 2 nd and 4 th row cutting connecting rods; thirdly, cutting connecting rods in the 5 th and 7 th rows, preforming in the 2 nd and 4 th rows and forming pins in the 1 st and 3 rd rows; fourthly, cutting a connecting rod at the 6 th and 8 th rows, preforming at the 5 th and 7 th rows, forming pins at the 2 nd and 4 th rows and cutting off the pins at the 1 st and 3 rd rows; the fifth step is that the 9 th row and the 11 th row are cut and connected, the 6 th row and the 8 th row are preformed, the 5 th row and the 7 th row are formed by pins, the 2 nd row and the 4 th row are cut, and the 1 st row and the 3 rd row are separated, and the sequence is carried out until all the products in the 16 th row are completely separated. Adopt step-by-step feeding scheme, through design station of taking one's place in advance on the muscle forming die that cuts, solved effectively because of the step-by-step and the difficult problem in the design of muscle forming die that cuts that product density leads to greatly, equipment efficiency has promoted 113% simultaneously, and the cost of labor has practiced thrift about 50%.

In this embodiment, in step S3, as shown in fig. 9 and 10, the upper platen 6 of the bonding fixture is added with the connecting ribs 61, the connecting ribs 61 are used for pressing four sides of each lead frame unit 21 and exposing the middle part to-be-welded wire working part of each lead frame unit 21 (in the prior art, the upper platen presses only four sides of the to-be-welded wire working part of the lead frame, and the connecting ribs 61 are not arranged in the middle), the connecting ribs 61 are matched with the periphery of the upper platen 6, so that four sides of each lead frame unit 21 can be pressed, and the width of the connecting ribs should be increased as much as possible, so as to prevent and reduce poor pressing. As shown in fig. 11 and 12, the heating block 7 of the bonding jig is provided with an inclined surface 72 at the periphery of the upper end of the upper boss 71, and the height of the upper boss is properly increased, so that poor press-fit can be reduced and prevented.

In this embodiment, in step S2, in the die bonding process, a chamfer design is added to the upper edge of the feeding bottom rail groove of the die bonding, so as to prevent the lead frame from being deformed during the conveying process.

The embodiment is correspondingly improved from the lead frame design, the chip mounting process, the bonding process, the plastic packaging process to the rib cutting process, and through the innovative design of the five aspects, the design scheme is innovative, the bottleneck of the prior art is broken through, a solution is provided for the expected risk, the stable batch production of the lead frame is ensured, and the stable batch production of SOP8/7 packaging is carried out by utilizing the lead frame.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.