阅读说明：本技术 镜头模组及电子装置 (Lens module and electronic device ) 是由 王宏坤 于 2020-06-10 设计创作，主要内容包括：本发明提出一种镜头模组,包括一电路板及设置于电路板一表面的一承载座以及一感光芯片,承载座包括朝向电路板设置的第一表面以及远离第一表面设置的第二表面,承载座开设有贯穿第一表面和第二表面的一开窗,感光芯片容置于开窗内,承载座、感光芯片以及电路板共同形成一密闭空间,密闭空间内设有填充胶,填充胶中开设有至少一贯穿填充胶的逃气孔,每一所述逃气孔将密闭空间与外界连通。本发明提供的镜头模组能够避免电路板与承载座之间发生信赖性失效,进而提高了镜头模组的质量。另外,本发明还提供一种应用所述镜头模组的电子装置。(The invention provides a lens module, which comprises a circuit board, a bearing seat and a photosensitive chip, wherein the bearing seat and the photosensitive chip are arranged on one surface of the circuit board, the bearing seat comprises a first surface and a second surface, the first surface is arranged towards the circuit board, the second surface is arranged far away from the first surface, the bearing seat is provided with a window penetrating through the first surface and the second surface, the photosensitive chip is contained in the window, the bearing seat, the photosensitive chip and the circuit board jointly form a closed space, filling glue is arranged in the closed space, at least one air escaping hole penetrating through the filling glue is formed in the filling glue, and each air escaping hole enables the closed space to be communicated with the outside. The lens module provided by the invention can avoid the occurrence of reliability failure between the circuit board and the bearing seat, thereby improving the quality of the lens module. In addition, the invention also provides an electronic device applying the lens module.)

1. A lens module comprises a circuit board, a bearing seat and a photosensitive chip, wherein the bearing seat and the photosensitive chip are arranged on one surface of the circuit board, the lens module is characterized in that the bearing seat comprises a first surface and a second surface, the first surface is arranged towards the circuit board, the second surface is arranged far away from the first surface, the bearing seat is provided with a window penetrating through the first surface and the second surface, the photosensitive chip is contained in the window, the bearing seat, the photosensitive chip and the circuit board jointly form a closed space, filling glue is arranged in the closed space, at least one escape hole penetrating through the filling glue is arranged in the filling glue, and each escape hole enables the closed space to be communicated with the outside.

2. The lens module as claimed in claim 1, wherein the window has a central axis, the carrier includes a sidewall and a protrusion extending from the sidewall toward the central axis, and the air escape hole further opens in the protrusion and extends through the protrusion in the direction of the central axis.

3. The lens module as claimed in claim 2, wherein the window includes a first window portion and a second window portion connected to the first window portion, the sidewall is defined to form the first window portion, the photo sensor chip is located in the first window portion, and the protrusion is defined to form the second window portion.

4. The lens module as claimed in claim 3, wherein the photo-sensing chip includes a photo-sensing area exposed to the second window and a non-photo-sensing area surrounding the photo-sensing area, and the photo-sensing area has a width less than or equal to a width of the second window.

5. The lens module as claimed in claim 1, wherein the carrier further comprises at least one pad on the first surface, each pad has a conductive film thereon, and the circuit board is disposed on the first surface of the carrier through the conductive film.

6. The lens module as recited in claim 5, wherein the conductive film comprises an anisotropic conductive film.

7. The lens module as claimed in claim 1, wherein the surface of the photo sensor chip away from the circuit board is provided with at least one electrode for electrically connecting the photo sensor chip and the circuit in the carrier.

8. The lens module as claimed in claim 1, wherein the lens module further includes a lens, the lens is mounted on the second surface of the carrier, the lens includes a first lens portion and a second lens portion connected to the first lens portion, the first lens portion is located between the carrier and the second lens portion, and the diameter of the first lens portion is larger than that of the second lens portion.

9. The lens module as claimed in claim 8, wherein the first lens portion and the second lens portion are formed by assembling or integrally forming.

10. An electronic device using the lens module according to any one of claims 1 to 9.

Technical Field

The present disclosure relates to the field of electronic and optical devices, and particularly to a lens module and an electronic device.

Background

With the development of multimedia technology, electronic products such as digital cameras and video cameras are increasingly popular with consumers, and people also put higher demands on the quality of photographic devices such as digital cameras and video cameras. Since the lens module is an essential component of devices such as a digital camera and a video camera, the quality of the lens module has an important influence on the quality of imaging devices such as a digital camera and a video camera.

The conventional lens module generally includes a lens, a carrying seat, a photosensitive chip, a circuit board, and other components. At present, in the manufacturing process of a lens module, after an Anisotropic Conductive Film (ACF) is attached to a pad of a carrier, the circuit board needs to be attached to the other side of the ACF by alignment, and the circuit board is attached by a hot-pressing head and a silica gel tape. However, in the above process, the ACF is spread by the expansion of the gas in the enclosed space formed by the circuit board, the carrying seat and the photo sensor chip due to heating, so that the reliability between the circuit board and the carrying seat is lost, thereby affecting the quality of the lens module.

Disclosure of Invention

Accordingly, the present invention provides a lens module with improved reliability.

In addition, an electronic device having the lens module is also needed.

The invention provides a lens module, which comprises a circuit board, a bearing seat and a photosensitive chip, wherein the bearing seat and the photosensitive chip are arranged on one surface of the circuit board, the bearing seat comprises a first surface and a second surface, the first surface is arranged towards the circuit board, the second surface is arranged far away from the first surface, the bearing seat is provided with a window penetrating through the first surface and the second surface, the photosensitive chip is contained in the window, the bearing seat, the photosensitive chip and the circuit board jointly form a closed space, filling glue is arranged in the closed space, at least one escape hole penetrating through the filling glue is arranged in the filling glue, and each escape hole communicates the closed space with the outside.

Furthermore, the fenestration has a center axis, it includes the lateral wall and by the lateral wall to the boss that the center axis extends and forms to bear the seat, the gas escape hole further sets up in the boss and extends the center axis direction runs through the boss.

Further, the windowing includes first windowing portion and intercommunication the second windowing portion of first windowing portion, the lateral wall encloses to establish and forms first windowing portion, the sensitization chip is located in the first windowing portion, the boss encloses to establish and forms the second windowing portion.

Further, the photosensitive chip comprises a photosensitive area exposed to the second windowing part and a non-photosensitive area arranged around the photosensitive area, and the width of the photosensitive area is smaller than or equal to that of the second windowing part.

Furthermore, the bearing seat further comprises at least one welding pad positioned on the first surface, each welding pad is provided with a conductive film, and the circuit board is arranged on the first surface of the bearing seat through the conductive film.

Further, the conductive film comprises an anisotropic conductive film.

Furthermore, the surface of the photosensitive chip far away from the circuit board is provided with at least one electrode, and the electrode is used for electrically connecting the photosensitive chip with a circuit in the bearing seat.

Further, the lens module further comprises a lens, the lens is mounted on the second surface of the bearing seat, the lens comprises a first lens part and a second lens part connected with the first lens part, the first lens part is located between the bearing seat and the second lens part, and the diameter of the first lens part is larger than that of the second lens part.

Further, the first lens part and the second lens part are formed by assembling or integrally forming.

The invention also provides an electronic device applying the lens module.

Compared with the prior art, the bearing seat is provided with the air escaping holes which are communicated with the outside of the closed space, so that the air and heat in the closed space can be released in time, the pressure in the closed space is reduced, the reliability failure between the circuit board and the bearing seat is avoided, and the quality of the lens module is improved.

Drawings

Fig. 1 is a top view of a carrier in a lens module according to a preferred embodiment of the invention.

Fig. 2 is a schematic sectional view of the carrier of fig. 1 along line II-II.

Fig. 3 is a top view of a lens module according to a preferred embodiment of the invention.

Fig. 4 is a schematic cross-sectional view along line IV-IV of the lens module shown in fig. 3.

Fig. 5 is a schematic view of an electronic device of a lens module according to a preferred embodiment of the invention.

Fig. 6 is a schematic structural diagram of a lens module according to another embodiment of the invention.

Description of the main elements

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

To further explain the technical means and effects of the present invention adopted to achieve the intended purpose, the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.

Referring to fig. 1 to 4, a lens module 100 according to a preferred embodiment of the present invention includes a circuit board 50, a carrying seat 10 disposed on a surface of the circuit board 50, a photo sensor chip 30, and a lens 70.

The carrying seat 10 is substantially a hollow rectangular parallelepiped frame-shaped structure. The carrier 10 includes a first surface 101 disposed toward the circuit board 50 and a second surface 102 disposed away from the first surface 101. The middle of the carrier 10 is provided with a window 11 penetrating through the first surface 101 and the second surface 102. The window 11 is substantially rectangular, but may have other shapes, specifically, according to the shape of the photosensitive chip 30. The window 11 has a central axis a, and the carrier 10 includes a sidewall 104 and a boss 14 extending from the sidewall 104 to the central axis a. Windowing 11 includes first windowing portion 111 and intercommunication second windowing portion 112 of first windowing portion 111, lateral wall 104 encloses to establish and forms first windowing portion 111, sensitization chip 30 is located in first windowing portion 111, boss 14 encloses to establish and forms second windowing portion 112. The carrier 10 further includes at least one solder pad 103 on the first surface 101. A conductive film 20 is disposed on each of the pads 103. In the present embodiment, the conductive film 20 includes an Anisotropic Conductive Film (ACF).

The photosensitive chip 30 is accommodated in the first windowing portion 111 and is disposed on the boss 14. A circle of filling glue 40 is arranged between the photosensitive chip 30 and the bearing seat 10 and used for fixing the photosensitive chip 30 on the bearing seat 10 and improving the stability of the photosensitive chip 30 in the first windowing part 111.

At least one electrode 31 is disposed on a side of the photosensitive chip 30 away from the circuit board 50, and the electrode 31 is used for electrically connecting the photosensitive chip 30 and a circuit (not shown) in the bearing seat 10, and may be a gold ball. The photosensitive chip 30 includes a photosensitive region 301 exposed to the second window 112 and a non-photosensitive region 302 surrounding the photosensitive region 301. The width of the photosensitive region 301 may be slightly smaller than the width of the second window 112, and may also be equal to the width of the second window 112.

The circuit board 50 is disposed on the first surface 101 of the carrier 10 through the conductive film 20, and the circuit board 50, the carrier 10, the photo sensor chip 30 and the filling adhesive 40 together form a closed space 60.

The lens 70 is mounted on the second surface 102 of the carrier 10 through an adhesive layer 71. The lens 70 includes a first lens portion 701 and a second lens portion 702 connected to the first lens portion 701, and the first lens portion 701 is located between the carrier 10 and the second lens portion 702. The diameter of the first lens portion 701 is larger than that of the second lens portion 702. The lens 70 is formed by assembling (i.e., the first lens portion 701 and the second lens portion 702 are assembled with each other) or integrally formed. Preferably, the first lens portion 701 and the second lens portion 702 of the lens 70 are formed by integral molding of the lens 70. The lens 70 is made of metal or plastic.

In this embodiment, in order to disperse the heat and gas generated in the enclosed space 60 and prevent the collected gas from expanding by heating to expand the circuit board 50, in this embodiment, at least one air escape hole 13 penetrating through the filling adhesive 40 is formed at the filling adhesive 40, each air escape hole 13 communicates the enclosed space 60 with the outside (where the outside is relative to the enclosed space 60, that is, the space outside the enclosed space 60 is the outside), and the heat and gas in the enclosed space 60 can be released to the outside through the air escape hole 13, so that the heat and gas in the enclosed space 60 are released, the internal pressure of the enclosed space 60 is reduced, the circuit board 50 is prevented from expanding, and the reliability of the lens module 100 is improved.

In this embodiment, the filling adhesive 40 is filled between the photosensitive chip 30 and the sidewall 104, and meanwhile, the filling adhesive 40 laterally extends between the upper surface of the boss 14 and the photosensitive chip 30 to form an L-shaped structure, and since the electrode 31 is disposed between the photosensitive chip 30 and the boss 14, the filling adhesive 40 bypasses the electrode 31. In this case, the air escape holes 13 may be formed at corners of the side walls 104, and in this case, the air escape holes 13 penetrate the filling paste 40, so that the air escape holes 13 are also L-shaped, and it is necessary to avoid the electrodes 31 when the air escape holes 13 are opened. In this way, the L-shaped air escape hole 13 can communicate the sealed space 60 with the second windowing portion 112, and release the heat and air inside the sealed space 60, so as to relieve the pressure inside the sealed space 60 without affecting the stability of the photosensitive chip 30.

Specifically, the release of the pressure in the closed space 60 by the air escape hole 13 is classified into the following three cases:

one situation is: in the process of attaching the conductive film 20 and the circuit board 50, after the conductive film 20 is attached to the pad 103, the circuit board 50 is attached to the first surface 101 of the carrier 10 through the conductive film 20, and the conductive film 20 and the circuit board 50 are fixed to the carrier 10 by pressing in a high temperature and high pressure manner, when the lens module is heated, the gas in the enclosed space 60 expands in volume due to heating, and at this time, the escape hole 13 can timely release the gas and heat in the enclosed space 60 to the outside through the light-passing hole 12, so that the reliability failure between the circuit board 50 and the carrier 10 is avoided, and the quality of the lens module 100 is improved. Due to the existence of the air escape holes 13, the usage amount of the conductive film 20 can be effectively reduced, the circuit board 50 can be stably fixed on the bearing seat 10 by using a small amount of the conductive film 20, and the bonding precision in the above process is improved. The flowing direction of the gas and heat in the closed space 60 is shown in fig. 4, in the above process, the light hole 12 is communicated with the outside, and the lens 70 is not assembled yet.

The second case is: after the above-mentioned manufacturing process, a destructive Test (PCT) needs to be performed on the semi-finished module with the conductive film 20 and the circuit board 50 attached thereon, the destructive Test condition is 100% humidity/121 ℃/2CC, in this environment, the gas in the enclosed space 60 is also easily heated to expand, and at this time, the air escape hole 13 can timely release the gas and heat in the enclosed space 60 to the outside through the light through hole 12, so as to avoid the occurrence of reliability failure between the circuit board 50 and the carrier 10, improve the PCT time of the semi-finished module, and improve the reliability of the product.

The third case is: after the finished product is assembled, in the testing or using process, the gas in the closed space 60 is also expanded due to heating, and at this time, the air escape hole 13 can timely release the gas and heat in the closed space 60 into the light through hole 12, so that the reliability failure between the circuit board 50 and the bearing seat 10 is avoided. At this time, since the amount of gas in the sealed space 60 is not large and the amount of heat generated during use is limited, a small amount of heat and expansion gas are released into the space of the light through hole 12 through the air escape hole 13, so that the long-term gas pressure in the sealed space 60 can be relieved, thereby preventing the circuit board 50 from being spread and improving the reliability of the camera module 100.

Referring to fig. 6, a second embodiment of the lens module according to the present invention is mainly different from the first embodiment in that the air escape hole 8 is formed in the boss 14 and extends through the boss 14 in the direction of the central axis a, the filling adhesive 40 is not disposed on the side of the air escape hole 8 close to the sealed space 60, and the adhesive layer 9 is disposed on the side of the air escape hole 8 for increasing the air exhausting effect, and the thickness of the adhesive layer 9 may be set to be thicker. It should be noted that, within the scope of the spirit or the basic features of the present invention, each specific solution applicable to the first embodiment may also be correspondingly applicable to the second embodiment, and for the sake of brevity and avoidance of repetition, the detailed description thereof is omitted here. In this embodiment, the air escape holes 8 are directly opened on the bosses 14, so that the air escape holes can be prevented from being bent, and the efficiency of releasing air is improved.

Referring to fig. 5, the lens module 100 can be applied to various electronic devices having a camera module, such as mobile phones, wearable devices, vehicles, cameras or monitoring devices. In the present embodiment, the lens module 100 is applied to a mobile phone 200.

According to the invention, the air escape holes 13 are formed in the bearing seat 10, and the air escape holes 13 communicate the closed space 60 with the outside, so that the air and heat in the closed space 60 can be released in time, thereby avoiding the reliability failure between the circuit board 50 and the bearing seat 10, and further improving the quality of the lens module 100.

The above embodiments are merely illustrative of the present invention, but the present invention is not limited to only such embodiments in practical applications. Other modifications and changes to the technical idea of the present invention should be made by those skilled in the art within the scope of the claims of the present invention.