阅读说明：本技术 用于涂覆衬底的系统及方法 (System and method for coating a substrate ) 是由 T·戈伊克赫曼 A·阿哈加尼 于 2020-01-06 设计创作，主要内容包括：一种用于将施主材料涂覆到激光辐射透明衬底上的系统,所述系统包含：施主材料施加器,其将施主材料施加到所述激光辐射透明衬底；多遍次精确施主材料厚度确定器,其用于在所述激光辐射透明衬底上提供所要厚度的所述施主材料且包含：线性可移位叶片支架；层厚度均匀化叶片,其绕枢转轴可锁定地可枢转地安装到所述线性可移位叶片支架上,所述叶片具有直边缘；及叶片位置维持器,其可操作以将所述直边缘维持在距所述激光辐射透明衬底的所要分开距离处,所述分开距离沿着所述层厚度均匀化叶片的所述直边缘是均匀的。(A system for coating a donor material onto a laser-irradiated transparent substrate, the system comprising: a donor material applicator that applies a donor material to the laser-irradiated transparent substrate; a multi-pass precision donor material thickness determiner for providing a desired thickness of the donor material on the laser-radiation transparent substrate and comprising: a linearly displaceable vane carrier; a layer thickness homogenizing vane lockably pivotably mounted to the linearly displaceable vane carrier about a pivot axis, the vane having a straight edge; and a blade position maintainer operable to maintain the straight edge at a desired separation distance from the laser-radiation transparent substrate, the separation distance being uniform along the straight edge of the layer thickness homogenizing blade.)

1. A method for coating a donor material onto a laser-irradiated transparent substrate having a straight surface portion, the method comprising:

providing a layer thickness homogenizing vane pivotably mounted about a pivot axis to a linearly displaceable vane support, the vane having a straight edge;

initially positioning the linearly displaceable blade mount relative to the laser radiation transparent substrate such that the straight edge lies coplanar with the straight surface portion of the laser radiation transparent substrate, wherein the straight surface portion lies along a blade engagement axis perpendicular to the pivot axis;

thereafter locking the layer thickness homogenizing vane against pivotable movement about the pivot axis relative to the linearly displaceable vane carrier;

thereafter repositioning the linearly displaceable vane support and the layer thickness homogenizing vane about a linear displacement axis perpendicular to the vane engagement axis and perpendicular to the pivot axis to a position where the straight edge is separated from the straight surface portion of the laser radiation transparent substrate by a separation distance that is uniform along the straight edge of the layer thickness homogenizing vane;

applying the donor material to the laser-irradiated transparent substrate;

providing a mutual displacement between said layer thickness homogenizing blade and said laser radiation transparent substrate along an axis parallel to said pivot axis, thereby to reduce the thickness of said initial layer of said donor material; and

maintaining the separation distance.

2. The method of claim 1, and further comprising sequentially repeating the repositioning and the providing a mutual displacement steps at least once thereby to sequentially reduce the thickness of the donor material.

3. A method according to claim 1 or claim 2, and wherein said providing a mutual displacement comprises reducing the thickness of the donor material to a thickness of between 10 and 2000 microns.

4. A method according to any of the preceding claims, and wherein said initially positioning said linearly displaceable blade holder comprises measuring the force exerted by said layer thickness homogenizing blade on said laser radiation transparent substrate.

5. A method according to any of the preceding claims, and wherein said initially positioning comprises initially positioning the layer thickness homogenizing vane such that a portion of the straight edge of the vane contacts the laser radiation transparent substrate while the vane is free to pivot about the pivot axis.

6. A method as claimed in claim 5, and wherein said initially positioning further comprises thereafter lowering said layer thickness homogenizing vane such that said straight edge is placed in parallel contacting engagement with said laser radiation transparent substrate while said vane is free to pivot about said pivot axis.

7. The method as defined in claim 6, and wherein the initially positioning further comprises thereafter further lowering the layer thickness homogenizing blade until a measured force of the layer thickness homogenizing blade on the laser radiation transparent substrate is about 150 grams, while the straight edge of the layer thickness homogenizing blade is placed in parallel contacting engagement with the laser radiation transparent substrate and the layer thickness homogenizing blade remains free to pivot about the pivot axis.

8. A method according to any of the preceding claims, and wherein said locking of said layer thickness homogenizing blade to prevent it from pivotally moving about said pivot axis relative to said linearly displaceable blade support is provided by operation of an electromagnet mounted to said linearly displaceable blade support attracting a locking arm fixed to said layer thickness homogenizing blade.

9. A method according to any of the preceding claims, and wherein said repositioning occurs when said layer thickness homogenizing vanes are not free to pivot about said pivot axis.

10. A system for applying a donor material onto a laser-irradiated transparent substrate, the system comprising:

a donor material applicator that applies a donor material to the laser-irradiated transparent substrate;

a multi-pass precision donor material thickness determiner for providing a desired thickness of the donor material onto the laser-radiation transparent substrate and comprising:

a linearly displaceable vane carrier;

a layer thickness homogenizing vane lockably pivotably mounted to the linearly displaceable vane carrier about a pivot axis, the vane having a straight edge; and

a blade position maintainer operable to maintain the straight edge at a desired separation distance from the laser-radiation transparent substrate, the separation distance being uniform along the straight edge of the layer thickness homogenizing blade.

11. A system as claimed in claim 10, and wherein the desired thickness of the donor material on the laser-irradiated transparent substrate is between 10 microns and 2000 microns.

12. A system as claimed in claim 10 or claim 11, and wherein the linearly displaceable vane carrier is linearly displaceable perpendicular to the pivot axis.

13. A system according to any of claims 10-12, and wherein said linearly displaceable blade support also supports an electromagnet.

14. A system as claimed in claim 13, and wherein the electromagnets are selectively actuatable to lock the layer thickness homogenizing blade relative to the linearly displaceable blade support to prevent rotation of the layer thickness homogenizing blade about the pivot axis when the straight edges of the layer thickness homogenizing blade are positioned at a desired separation distance from the laser radiation transparent substrate.

15. A system according to any of claims 10-14, and wherein said blade position maintainer includes a force sensor for sensing the force exerted by the layer thickness homogenizing blade on the laser radiation transparent substrate.

16. A system according to any one of claims 10-15, and wherein the multi-pass precise donor material thickness determiner also includes a linear shifter for linearly shifting the linearly displaceable blade supports between sequential passes to sequentially reduce the thickness of the donor material until the desired thickness is reached.

Technical Field

The present invention relates to a system and method for accurately coating a substrate with a highly viscous material.

Background

Various types of systems and methods for coating substrates are known in the art.

Disclosure of Invention

The present invention seeks to provide an improved system and method for coating a substrate with a highly viscous material.

There is thus provided in accordance with a preferred embodiment of the present invention, a method for coating a donor material onto a laser-irradiated transparent substrate having a straight surface portion, the method including: providing a layer thickness homogenizing vane pivotably mounted about a pivot axis to a linearly displaceable vane support, the vane having a straight edge; initially positioning the linearly displaceable blade mount relative to the laser radiation transparent substrate such that the straight edge lies coplanar with the straight surface portion of the laser radiation transparent substrate, wherein the straight surface portion lies along a blade engagement axis perpendicular to the pivot axis; thereafter locking the layer thickness homogenizing vane against pivotable movement about the pivot axis relative to the linearly displaceable vane carrier; thereafter repositioning the linearly displaceable vane support and the layer thickness homogenizing vane about a linear displacement axis perpendicular to the vane engagement axis and perpendicular to the pivot axis to a position where the straight edge is separated from the straight surface portion of the laser radiation transparent substrate by a separation distance that is uniform along the straight edge of the layer thickness homogenizing vane; applying the donor material to the laser-irradiated transparent substrate; providing a mutual displacement between said layer thickness homogenizing blade and said laser radiation transparent substrate along an axis parallel to said pivot axis, thereby reducing the thickness of said initial layer of said donor material; and maintaining the separation distance.

Preferably, the method also includes sequentially repeating the repositioning and providing the mutual displacement steps at least once thereby to sequentially reduce the thickness of the donor material.

According to a preferred embodiment of the invention, said providing a mutual displacement comprises reducing the thickness of the donor material to a thickness between 10 and 2000 microns.

According to a preferred embodiment of the invention, said initially positioning said linearly displaceable blade holder comprises measuring a force exerted by said layer thickness homogenizing blade on said laser radiation transparent substrate. Additionally or alternatively, the initially positioning includes initially positioning the layer thickness homogenizing vane such that a portion of the straight edge of the vane contacts the laser radiation transparent substrate while the vane is free to pivot about the pivot axis. In addition, the initially positioning further includes thereafter lowering the layer thickness homogenizing vane such that the straight edge is placed in parallel contacting engagement with the laser radiation transparent substrate while the vane is free to pivot about the pivot axis. Preferably, the initially positioning further comprises thereafter further lowering the layer thickness homogenizing blade until the measured force of the layer thickness homogenizing blade on the laser radiation transparent substrate is about 150 grams, while the straight edge of the layer thickness homogenizing blade is placed in parallel contacting engagement with the laser radiation transparent substrate and the layer thickness homogenizing blade remains free to pivot about the pivot axis.

According to a preferred embodiment of the invention, said locking of the layer thickness homogenizing blade against pivotable movement about the pivot axis relative to the linearly displaceable blade holder is provided by the operation of an electromagnet mounted to the linearly displaceable blade holder attracting a locking arm fixed to the layer thickness homogenizing blade.

Preferably, said repositioning occurs when said layer thickness homogenizing vanes are not free to pivot about said pivot axis.

There is also provided in accordance with another preferred embodiment of the present invention a system for coating a donor material onto a laser-irradiated transparent substrate, the system including: a donor material applicator that applies a donor material to the laser-irradiated transparent substrate; a multi-pass precision donor material thickness determiner for providing a desired thickness of the donor material on the laser-radiation transparent substrate and comprising: a linearly displaceable vane carrier; a layer thickness homogenizing vane lockably pivotably mounted to the linearly displaceable vane carrier about a pivot axis, the vane having a straight edge; and a blade position maintainer operable to maintain the straight edge at a desired separation distance from the laser-radiation transparent substrate, the separation distance being uniform along the straight edge of the layer thickness homogenizing blade.

According to a preferred embodiment of the invention, the desired thickness of the donor material on the laser-irradiated transparent substrate is between 10 and 2000 microns.

According to a preferred embodiment of the invention, the linearly displaceable blade carrier is linearly displaceable perpendicular to the pivot axis.

According to a preferred embodiment of the invention, the linearly displaceable blade support also supports an electromagnet. In addition, when the straight edges of the layer thickness homogenizing blade are positioned at desired separation distances from the laser radiation transparent substrate, the electromagnets can be selectively actuated to lock the layer thickness homogenizing blade relative to the linearly displaceable blade support to prevent rotation of the layer thickness homogenizing blade about the pivot axis.

Preferably, the blade position maintainer includes a force sensor for sensing a force exerted by the layer thickness homogenizing blade on the laser radiation transparent substrate.

According to a preferred embodiment of the present invention, the multi-pass precise donor material thickness determiner also includes a linear shifter for linearly shifting the linearly displaceable blade support between sequential passes to sequentially reduce the thickness of the donor material until the desired thickness is reached.

Drawings

The present invention will be more fully understood and appreciated from the following detailed description taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a simplified diagrammatic illustration of a coating system constructed and operative in accordance with a preferred embodiment of the present invention, along with a typical substrate to be coated;

FIG. 2 is a simplified diagrammatic partially exploded view illustration of the coating system of FIG. 1;

FIGS. 3A and 3B are simplified diagrammatic illustrations of layer thickness homogenizing blade positioning subsystems forming part of the coating systems of FIGS. 1 and 2, taken in mutually different directions;

FIGS. 4A and 4B are simplified graphical illustrations of the layer thickness homogenizing blade positioning subsystem of FIGS. 3A and 3B taken in mutually different directions;

FIGS. 5A, 5B and 5C are simplified respective front plan views and first and second cross-sectional illustrations of the layer thickness homogenizing blade positioning sub-system of FIGS. 3A-4B, FIGS. 5B and 5C being taken along lines 5B-5B and 5C-5C in FIG. 5A;

6A, 6B and 6C are simplified respective first and second illustrations and side view illustrations of a layer thickness homogenizing blade forming part of the layer thickness homogenizing blade positioning subsystem of FIGS. 3A-4B;

FIGS. 7A and 7B are simplified first and second illustrations of a vane and electromagnet mounting bracket that form part of the layer thickness homogenizing vane positioning subsystem of FIGS. 3A-5C;

FIGS. 8A, 8B and 8C are simplified respective diagrammatic, front plan and cross-sectional view illustrations of a blade mounting shaft forming part of the layer thickness homogenizing blade positioning subsystem of FIGS. 3A-5C, with FIG. 8C being taken along line 8C-8C in FIG. 8B;

FIGS. 9A and 9B are simplified schematic illustrations of a typical initial step in positioning a layer thickness homogenizing blade relative to a substrate, FIGS. 9A and 9B being taken in mutually perpendicular directions;

FIG. 10 is a simplified schematic illustration corresponding to FIG. 9A illustrating a further step in positioning the layer thickness homogenizing blade relative to the substrate;

FIG. 11 is a simplified schematic illustration corresponding to FIG. 9A illustrating a still further step in positioning the layer thickness homogenizing blade relative to the substrate;

FIG. 12 is a simplified schematic illustration corresponding to FIG. 9A illustrating a still further step in positioning the layer thickness homogenizing blade relative to the substrate;

FIG. 13 is a simplified schematic illustration corresponding to FIG. 9A illustrating an additional step in positioning the layer thickness homogenizing blade relative to the substrate;

FIG. 14 is a simplified schematic illustration of a further additional step in positioning the layer thickness homogenizing blade relative to the substrate corresponding to that illustrated in FIG. 9A;

FIG. 15 is a simplified schematic illustration of an exemplary initial step in coating a substrate with a highly viscous material using the system of FIGS. 1 through 14;

FIG. 16 is a simplified schematic illustration of a further step in coating a substrate with a highly viscous material using the system of FIGS. 1 through 14;

FIG. 17 is a simplified schematic illustration of still a further step in coating a substrate with a highly viscous material using the system of FIGS. 1 through 14; and

fig. 18 is a simplified schematic illustration of yet a further step in coating a substrate with a highly viscous material using the system of fig. 1 through 14.

Detailed Description

Reference is now made to fig. 1 and 2, which are simplified pictorial illustrations of a coating system 100, along with a typical substrate to be coated, constructed and operative in accordance with a preferred embodiment of the present invention.

As seen in fig. 1 and 2, the coating system preferably includes a base assembly 110, which base assembly 110 is generally stationary and may include a conventional vacuum chuck 112 for selectively holding a flat substrate 114 (preferably a laser-irradiated transparent substrate, preferably including a straight surface portion to be coated) securely thereon. Base assembly 110 is preferably formed from a 6061T6 aluminum plate and machined to a high degree of parallelism between the substrate plane and the Y-stage mounting plate.

Preferably mounted on base assembly 110 is a Y-axis positioner 120, such as Thorlabs NRT-100, which in turn supports a Y-Z adapter arm 130 typically formed from 6061T6 aluminum sheet.

Preferably mounted to the Y-Z adapter arm 130 is a precision Z-axis positioner 140, such as a Thorlabs MTS25-Z8-25mm, which in turn supports a mounting bracket 150 typically formed of 6061T6 aluminum plate. The mounting bracket 150 supports a layer thickness homogenizing blade positioning subsystem 160.

Referring additionally now to FIGS. 3A-5C, a layer thickness homogenizing blade positioning subsystem 160 is illustrated. As seen in FIGS. 3A-5C, the layer thickness homogenizing blade positioning subsystem 160 preferably includes a layer thickness homogenizing blade 170, preferably formed of 17-4HP steel, which will be described in more detail below with reference to FIGS. 6A-6C.

The layer thickness homogenizing blade 170 is rotatably mounted for rotation about an axis 175 by means of a shaft 182 described in greater detail below with reference to fig. 8A and 8B, onto a blade and electromagnet mounting bracket 180 described in greater detail below with reference to fig. 7A and 7B, thereby engaging a pair of rotating bearings 184, such as NSK angular contact 7900 bearings. The shaft 182 is secured to the blade 170 along the shaft 175 by means of screws 186.

The blade and electromagnet mounting bracket 180 also supports an electromagnet 190, such as Magnetech R-0515-12, which electromagnet 190 may selectively lockably engage a latch arm 200 preferably formed from a ferromagnetic sheet steel (such as 1020 and 1030). The locking arms 200 are selectively securable to the layer thickness homogenizing blade assembly 170 by fasteners, not shown, such that the locking arms 200 are magnetically engaged by the electromagnet 190 to lock the angular orientation of the fixed layer thickness homogenizing blade 170 about the shaft 175.

The blade and electromagnet mounting bracket 180 is mounted to a force sensor 210, such as VISHAY LPS Loadcell, by fasteners not shown, the force sensor 210 in turn being supported by the mounting bracket 150.

Reference is now made to fig. 6A to 6C, which illustrate a layer thickness homogenizing blade 170. As seen in fig. 6A to 6C, the layer thickness homogenizing blade 170 preferably comprises a metal or plastic block having a generally flat back surface 300 with a generally circular disk-shaped protrusion 302 formed with a threaded hole 303 for receiving the screw 186 extending from the back surface 300; a substantially flat bottom surface 304, which is angled with respect to the surface 300; and a generally planar blade front surface 306 angled relative to the bottom surface 304 and defining a blade engagement edge 308 with the bottom surface 304.

The vane front surface 306 terminates upwardly at a transverse projection 310 over which is located a locking arm mounting surface (including an attachment surface 312, including a threaded locking mounting arm fastener attachment aperture 314 and a recessed locking arm engagement surface 316). The surfaces 312 and 316 terminate at a blade top surface 320, the blade top surface 320 preferably being perpendicular to the surfaces 312 and 316 and perpendicular to the surface 300.

Referring now to fig. 7A and 7B, blade and electromagnet mounting bracket 180 is illustrated. As seen in fig. 7A and 7B, the blade and electromagnet mounting bracket 180 comprises a generally rectangular block of aluminum defining a generally planar top surface 350, the top surface 350 extending from a first end surface 352 to a slightly raised mounting surface 354, generally parallel to the top surface 350 and having a threaded aperture 356 to mount the blade and electromagnet mounting bracket 180 to the force sensor 210 via fasteners (not shown). The mounting surface 354 terminates in a channel 358 at the level of the top surface 350 and separates the mounting surface from a raised edge surface 360, the edge surface 360 being slightly higher than the level of the mounting surface 354.

The raised edge surface 360 terminates in a second end surface 362, the second end surface 362 extending generally perpendicular to the top surface 350 to an inclined surface 364, the inclined surface 364 terminating in an intermediate bottom surface 366, the intermediate bottom surface 366 being generally parallel to the top surface 350. The bottom surface 366 terminates in a third end surface 367, which third end surface 367 in turn terminates in a sloped surface 368. The inclined surface 368 terminates in a bottom surface 390, the bottom surface 390 being parallel to the top surface 350. The bottom surface 390 terminates in an inclined surface 392, which inclined surface 392 terminates in the first end surface 352. The blade and solenoid mounting bracket 180 is formed with a generally flat front surface 394, best seen in FIG. 7B, and a generally flat rear surface 396, best seen in FIG. 7A.

The blade and electromagnetic mounting bracket 180 is formed with a through bearing receiving bore 400, the through bearing receiving bore 400 having an inwardly directed rim 402 at a front surface 394 and being configured for receiving and retaining the bearing 184 therein. The blade and electromagnet mounting bracket 180 is also formed with a through electromagnet receiving hole 410 and is configured for receiving the electromagnet 190.

The slot 420 extends between the aperture 410 and the top surface 350. The slot 420 enables clamping of the electromagnet 190 within the hole 410 by tightening the hole via tightening screws, not shown, that engage threaded apertures 422 on opposite sides of the slot 420.

A recess 430 extends between bores 400 and 410 and is formed with a threaded bore 432. The recess 440 is located beside the aperture 410 and is formed with an aperture 442. The notches 430 and 440 and corresponding apertures 432 and 442 are provided to receive bearing retaining screws, not shown, that hold the bearing 184 in place in the bore 400 of the blade and electromagnetic mounting bracket 180.

Reference is now made to fig. 8A through 8C, which illustrate the shaft 182. As seen in fig. 8A-8C, the shaft 182 is a circularly symmetric, generally cylindrical hollow object preferably formed of aluminum, and has a circular cylindrical body 500 and an annular flange 502 at a first end thereof. A through central bore 504 extends through the flange 502 and the body 500 and has a tapered opening 506 at the flange 502. The screws 186 (FIG. 4B) extend through the holes 504 and threadably engage the threaded apertures 303 of the thickness uniformity blade 170.

Reference is now made to fig. 9A and 9B, which are simplified schematic illustrations of a typical initial step in positioning a layer thickness homogenizing blade relative to a substrate, fig. 9A and 9B being taken in mutually perpendicular directions. As seen in fig. 9A and 9B, the blade 170 is located above the substrate 114 and is not in contact with the substrate 114 and is free to pivot on the bearing 184 about the shaft 175 due to the fact that the electromagnet 190 is not operable to lock the position of the locking arm 200 secured to the blade 170.

FIG. 10 illustrates lowering blade 170 until blade engagement edge 308 contacts substrate 114, typically at a corner of blade 170. The blade 170 remains free to pivot on the bearing 184 about the shaft 175 due to the fact that the electromagnet 190 is not operable to lock the position of the locking arm 200 secured to the blade 170.

Fig. 11 illustrates further lowering of the paddle 170 until the paddle engagement edge 308 is placed in parallel contacting engagement with the substrate 114. The blade 170 remains free to pivot on the bearing 184 about the shaft 175 due to the fact that the electromagnet 190 is not operable to lock the position of the locking arm 200 secured to the blade 170.

Fig. 12 illustrates further lowering of the blade 170 until the measured force of the blade 170 on the substrate 114, as measured by the force sensor 150, is preferably about 150 grams, while the lower edge 308 is placed in parallel contact engagement with the substrate 114 and the blade 170 remains free to pivot about the shaft 175 on the bearing 184 due to the position of the electromagnet 190 being inoperable to latch the latch arm 200 secured to the blade 170.

Fig. 13 illustrates the position of the locking arm 200 secured to the blade 170 when the blade 170 is in the operative orientation described above with reference to fig. 12, thereby locking the blade from pivoting about the axis 175 and maintaining the blade in an orientation about the axis 175 with the lower edge 308 placed in parallel contacting engagement with the substrate 114, by operation of the electromagnet 190.

FIG. 14 shows the blade 170 and pivot axis 175 being raised along the Z-axis to define a predetermined desired separation distance 505, typically 2mm, between the blade engaging edge 308 and the substrate 114. Due to the fact that the electromagnet 190 is operable to lock the position of the locking arm 200 secured to the blade 170, the blade 170 is not free to pivot on the bearing 184 about the shaft 175.

Reference is now made to fig. 15, which is a simplified schematic illustration of typical steps in coating a substrate, preferably a laser-irradiated transparent substrate, with a donor material, preferably a highly viscous material, using the system of fig. 1 to 14. As seen in fig. 15, a donor material 510, preferably a highly viscous material having a viscosity of 20,000 centipoise, such as Henkel 8143, is deposited onto the substrate 114 downstream of the blade 170, the direction of movement of the blade 170 along the Y axis being indicated by arrow 520.

As seen in fig. 16, 17 and 18, multiple passes of the blade 170 occur and between each pass, the separation distance between the blade engagement edge 308 and the substrate 114 is reduced by lowering the blade and pivot axis 175 along the Z-axis so that, corresponding to the desired final thickness of the material 510, typically in fig. 16, a separation distance 530 of typically 1mm is defined between the blade engagement edge 308 and the substrate 114, and typically in fig. 17, a separation distance 540 of typically 0.3mm is defined between the blade engagement edge 308 and the substrate 114, and typically in fig. 18, a separation distance 550 of typically 0.05mm (but for lower viscosity materials 510, it may also be as low as 10 μm) is defined between the blade engagement edge 308 and the substrate 114.

It should be appreciated that the separation distance between the blade bonding edge 308 and the substrate 114 described above (which reduces the thickness of the donor material on the substrate 114 to the desired final thickness) is uniform along the entire blade bonding edge 308. As described above, the separation distance varies as the blade 170 is lowered relative to the substrate 114. By reducing the separation distance, the thickness of the donor material 510 is preferably reduced to a final thickness defined by the final separation distance, preferably between 10 and 2000 microns.

It will be apparent to those skilled in the art that the present invention is not limited to what is specifically described and shown herein, but also includes combinations and sub-combinations of the features described herein and modifications thereof that are not in the prior art.