阅读说明：本技术 一种基于cps的辐射监测设备 (Radiation monitoring equipment based on CPS ) 是由 张晶 杨洋 冯勇 李英娜 于 2021-08-25 设计创作，主要内容包括：本发明涉及一种基于CPS的辐射监测设备,属于工业安全保障技术领域。本发明包括降压稳压电源模块、STM32L MCU模块、通信模块、LoRa网关、LCD1602显示模块和M4011盖革计数器模块。STM32L MCU模块分别与通信模块、M4011盖革计数器模块,LCD1602显示模块连接,STM32L MCU模块与通信模块通信连接,降压稳压电源模块为STM32L MCU模块、通信模块、M4011盖革计数器模块、LCD1602显示模块供电。本发明能够通过M4011盖革管测量辐射脉冲和STM32L MCU模块处理辐射脉冲信号然后实时显示当前辐射量,并通过LoRa通信模块或NB-IOT通信模块与云端相连,云端同时支持LoRa WLAN协议和电信CoAP/NB-IoT协议,并把云端数据显示至远程用户端WEB和微信,在一定程度上可以在辐射高危地带提供远程监控,同时携带人员也能探知辐射量具体大小。(The invention relates to radiation monitoring equipment based on CPS, and belongs to the technical field of industrial safety guarantee. The invention comprises a voltage reduction and voltage stabilization power supply module, an STM32L MCU module, a communication module, an LoRa gateway, an LCD1602 display module and an M4011 Geiger counter module. The STM32L MCU module respectively with communication module, M4011 Geiger counter module, LCD1602 display module is connected, STM32L MCU module and communication module communication connection, voltage reduction and voltage stabilization power supply module is STM32L MCU module, communication module, M4011 Geiger counter module, LCD1602 display module power supply. The invention can measure radiation pulse through the M4011 Geiger tube and process a radiation pulse signal through the STM32L MCU module, then display the current radiation quantity in real time, and is connected with the cloud end through the LoRa communication module or the NB-IOT communication module, the cloud end simultaneously supports the LoRa WLAN protocol and the telecom CoAP/NB-IoT protocol, and displays the cloud end data to the WEB and the WeChat of a remote user end, thereby providing remote monitoring in radiation high-risk areas to a certain extent, and simultaneously, carrying personnel can also find out the specific size of the radiation quantity.)

1. A CPS-based radiation monitoring device, characterized by: the device comprises a voltage reduction and voltage stabilization power supply module (2-1), an STM32LMCU module (1-2), a communication module, an LoRa gateway, an LCD1602 display module (1-4) and an M4011 Geiger counter module (1-1);

STM32L MCU module (1-2) respectively with communication module, M4011 Geiger counter module (1-1), LCD1602 display module (1-4) is connected, STM32L MCU module (1-2) and communication module communication connection, voltage reduction and voltage stabilization power supply module (2-1) is STM32L MCU module (1-2), communication module, M4011 Geiger counter module (1-1), LCD1602 display module (1-4) power supply.

2. The CPS-based radiation monitoring device of claim 1 wherein: the M4011 Geiger counter module (1-1) comprises an M4011 Geiger tube U11, a resistor R11, a resistor R12, a rheostat R13, a resistor R14, a resistor R15, a resistor R16, a resistor R17, a capacitor C11, a capacitor C12, a capacitor C13, a CMOS11 transistor and a HVW5P-500NG1 voltage transformation and stabilization chip;

the M4011 Geiger tube circuit is formed by HVW5P-500NG1 voltage transformation and stabilization chip to complete voltage transformation and conversion, wherein pin 1 is connected with R12, the other end of R12 is connected with 5V power supply terminal, pin 2 is connected with rheostat R13, the other end of R13 is connected with 400V + voltage output, a capacitor C12 of branch circuit is grounded, pin 3 is grounded, the anode of M4011 Geiger tube U11 is connected with capacitor C11 and resistor R11 in parallel and then connected with 400V + voltage, the cathode of Geiger tube is connected with resistor R14, the parallel circuit of resistor R14 series resistor R15 and capacitor C13 is pulled down and grounded, R16 is connected in parallel between R14 and R15, R16 is connected with CMOS11 base of CMOS tube, CMOS11 emitter is grounded, collector resistor R17 is connected with 5V voltage and then forms Schmidt trigger with 5G-555 chip, wherein pin IC2 is grounded, pin 2 and pin 3 is connected with MOS tube source electrode 3, STM3 is connected with single chip microcomputer L151 as SPI 8 voltage communication pin, STM 151 and SPI 8, pin 5 and pin 7 are floating.

3. The CPS-based radiation monitoring device of claim 1 wherein: the STM32L MCU module (1-2) comprises an STM32L151C8T6 singlechip, a crystal oscillator circuit, a reset circuit and a mode selection circuit;

the crystal oscillator circuit comprises a capacitor C21, a capacitor C22, a capacitor C23, a capacitor C24, a resistor R21, a crystal oscillator Y21 and a crystal oscillator Y22; the negative pole of the power supply is simultaneously connected with one end of the capacitor C21, the capacitor C22, the capacitor C23 and the capacitor C24; the other end of the capacitor C21 is connected with one end of a crystal oscillator Y1 and a pin 3 of an STM32L151C8T6 singlechip; the other end of the capacitor C22 is connected with the other end of the crystal oscillator Y1 and a pin 4 of the STM32L151C8T6 singlechip; the other end of the capacitor C23 is connected with one end of a crystal oscillator Y2 and one end of a resistor R22, and the C23 is simultaneously connected with a pin 5 of an STM32L151C8T6 singlechip; the other end of the capacitor C24 is connected with the other end of the crystal oscillator Y2 and the other end of the resistor R22, and is simultaneously connected with a pin 6 of an STM32L151C8T6 singlechip;

the reset circuit comprises a capacitor C25, a resistor R21 and a tact switch S1; one end of the resistor R24 is connected in series with the resistor R25 and then connected with the anode of a 3.3V power supply, meanwhile, the R24 and the R25 are combined into the capacitor C26, and the other end of the C26 is connected with the 48 pins of the STM32L151C8T6 in parallel and then grounded; one end of the tact switch S1 and one end of the capacitor C25 are simultaneously connected with the negative electrode of the 3.3V power supply; the other end of the resistor R21, the other end of the switch S1 and the other end of the capacitor C25 are simultaneously connected with a pin 7 of the STM32L151C8T6 singlechip;

the mode selection circuit includes a resistor R24, a resistor R25; one end of the resistor R25 is connected with the negative electrode of a 3.3V power supply, and the other end of the resistor R24 is connected with a pin 44 of an STM32L151C8T6 singlechip; pin 1, pin 9, pin 24, pin 36 and pin 47 of the STM32L151C8T6 singlechip are connected with the anode of a 3.3V power supply; pin 8, pin 23, pin 35 and pin 48 of the STM32L151C8T6 singlechip are connected with the cathode of a 3.3V power supply; pin 11 of STM32L151C8T6 singlechip connects the 14 pin SI end of 74HC595 chip, pin 12 of STM32L151C8T6 singlechip connects the 12 pin RCK end of 74HC595 chip, pin 13 of STM32L151C8T6 singlechip connects the 11 pin SCK end of 74HC595 chip, pin 25 of STM32L151C8T6 singlechip connects the pin 3 of the 5G-555 chip in the M4011 circuit.

4. The CPS-based radiation monitoring device of claim 1 wherein: the communication module is an NB-IoT communication module (1-3), and comprises a WH-NB73, a SIM card, a capacitor C31, a capacitor C32, a resistor R31, a resistor R32 and an inductor L31;

pin 1 and pin 2 of WH-NB73 are connected with one end of an inductor L31 and a capacitor C31, the other end of C31 is grounded, pin 3 and pin 4 of WH-NB73 are simultaneously connected with one end of R31, the other end of R31 is connected with C31, the other end of R31 is pulled down and grounded at the same node, L31 and C32 are connected with a 3.3V power supply, one end of C32 is connected with one end of a resistor R32, the other end of R32 is connected with a pull-down node of R31, and the other end of R32, R31 and C31 are pulled down and grounded at the same node; pin 36 and pin 35 of WH-NB73 are connected with pin 31 and pin 30 of STM32L151C8T6 singlechip chip, and pin 17, pin 42, pin 40 and pin 39 of WH-NB73 are grounded;

the SIM card slot circuit comprises a resistor R33, a resistor R34, a resistor R35, a capacitor C33, a capacitor C34, a card slot chip C749 and an over-current protection chip ESDA6V8AV 6; pin 2 of the card slot chip C749 is connected with pin 23 of WH-NB73, pin 4 of ESDA6V8AV6 is connected with the external edge of pin 2 of the card slot chip C749 after being externally connected with R34, pin 4 of ESDA6V8AV6 is connected with pull-down capacitor C33 and then is grounded, pin 3 of the card slot chip C749 is connected with pin 24 of WH-NB73, meanwhile, the pin 3 of the over-current protection chip ESDA6V8AV6 is externally connected with the R33 and then is connected with the outer edge of the pin 3 of the card slot chip C749, the pin 6 of the card slot chip C749 is connected with the pin 22 of the WH-NB73, meanwhile, the pin 1 of the overvoltage protection chip ESDA6V8AV6 is externally connected with the R35 and then is connected with the outer edge of the pin 6 of the card slot chip C749, an external capacitor C34 is grounded at the same node of R35, a pin 7 of a card slot chip C749 is grounded, a pin 8 of the card slot chip C749 is connected with a pin 25 of WH-NB73, meanwhile, a pin 5 of the over-current protection chip ESDA6V8AV6 is externally connected to the outer edge of a pin 8 of the card slot chip C749, and a pin 2 of the over-current protection chip ESDA6V8AV6 is grounded.

5. The CPS-based radiation monitoring device of claim 1 wherein: the communication module is an LoRa communication module (1-3) and comprises a LoRa SX1278 and a LoRa crystal oscillator circuit;

the outer edges of a pin 1 and a pin 28 of the LoRa SX1278 are used as communication ends for radio frequency output and output, the pin 1 is externally connected with a resistor R48 and is grounded in parallel with a resistor R47, a capacitor C412 is connected behind the R48 and is externally connected with a pin 5 of a Filter chip SAW Filter, the C412 is connected between the C413 and the R48 and grounded and is simultaneously connected with a pin 1 and a pin 6 of the Filter chip SAW Filter, pins 3 and 4 of the Filter chip SAW Filter are grounded, a pin 2 is externally connected with an RF1 port of a C413 radio frequency conversion chip RF Switch PE4259, and a pin 2 of the radio frequency conversion chip RF Switch PE4259 is grounded; a pin 28 of the LoRa SX1278 is used as a radio frequency output end and is connected with a pin 27, the pins 28 and 27 are externally connected with R41 and R42 and then connected with a capacitor C46 after being connected in parallel, and meanwhile, an external pull resistor R43 is connected with a capacitor C45 and is grounded; a capacitor C419 is pulled down to be grounded between C46 and R43, a circuit grid formed by connecting a capacitor C46 with R44 and then connecting C49, C411, C410, C48, C47, R46 and R45 in a crossed and serial-parallel mode is grounded at the positions of C47, C48 and C49, C49, C410 and R46 output are connected to an RF2 port of a radio frequency conversion chip RF Switch PE4259, a port 4 external resistor R410 of the radio frequency conversion chip RF Switch PE4259 is connected to be grounded with C416, and simultaneously connected with a port 34 of an STM32L151C8T6 singlechip, a port 5 external C417 of the radio frequency conversion chip RF Switch PE4259 is connected to be connected with R49, two ends of the capacitors C418 and C419 are respectively pulled down to be grounded, finally, an external antenna coaxial port ANT _ LF is connected to be grounded simultaneously, and a pin 6 external voltage stabilizing circuit of the radio frequency conversion chip RF Switch PE4259 is connected to be grounded with a capacitor C415 and then grounded;

the LoRa crystal oscillator circuit comprises Y41, capacitors C423 and C424, a LoRaSX1278 with two ends externally connected with Y41 and Y41 crystal self-grounded simultaneously, Y41 with two ends externally connected with capacitors C423 and C424 grounded, LoRa SX1278 with pin 2, pin 3 and pin 4 externally connected with capacitors C420, C421 and C422 and then grounded simultaneously, pin 3 externally connected with a digital-analog voltage-stabilized power supply, LoRa SX1278 with pin 8, pin 9, pin 10, pin 11, pin 12 and pin 13 externally connected with pin 14, pin 15, pin 16, pin 17, pin 18 and pin 19, LoRa SX1278 with pin 14 externally connected with a digital-analog voltage-stabilizing circuit and then connected with C425 grounded, LoRa SX1278 with pin 15 grounded, LoSX 1278 with pin 16, pin 17, pin 18, pin 19, pin 20 externally connected with STM32L151C8T6 singlechip 27, pin 28, pin 29, pin 30, pin 29, pin 8621 and pin 8623, and pin 8623 externally connected with pins 3 and ground simultaneously, the pin 25 is externally connected between the R43 and the C45, and is simultaneously pulled down to be connected to the ground of the C44 and the C43.

6. The CPS-based radiation monitoring device of claim 1 wherein: the LCD1602 display module (1-4) comprises a 74HC595 serial-parallel conversion chip, an LCD1602 display, and chip pins 15, 1, 2, 3, 4, 5, 6 and 7 of the 74HC595 serial-parallel conversion chip are externally connected with pins 7, 8, 9, 10, 11, 12, 13 and 14 of the LCD1602 display;

pin 8 of the 74HC595 series-parallel conversion chip is grounded, pins 10, 13 and 16 are connected with 5V voltage, pin 11 of the STM32L151C8T6 singlechip is connected with pin 14 of the 74HC595 series-parallel conversion chip, pin 12 of the STM32L151C8T6 singlechip is connected with RCK end of pin 12 of the 74HC595 series-parallel conversion chip, pin 13 of the STM32L151C8T6 singlechip is connected with SCK end of pin 11 of the 74HC595 series-parallel conversion chip;

pin 1 of the LCD1602 display is grounded, pin 2 is connected to 5V voltage and then connected to the capacitor C51 ground, pin 3 is connected to the varistor R51 as load ground, pin 4, pin 5, pin 6 are connected to the pin 41, pin 40, pin 39 of the STM32L151C8T6 single chip microcomputer, pin 15 of the LCD1602 display is connected to the C52 and simultaneously connected to the 5V high level ground, and pin 16 is connected to the resistor R52 ground.

Technical Field

The invention relates to radiation monitoring equipment based on CPS, and belongs to the technical field of industrial safety guarantee.

Background

Regarding the harm of radiation influence, small marble radiation and electromagnetic radiation, large nuclear radiation and various high-risk industries (industrial production with large exposure to radiation), it is known that radiation exposure for a long time causes discomfort to human body, and serious injury to human organs and systems can cause various diseases, such as: leukemia, aplastic anemia, various tumors, fundus oculi lesion, reproductive system diseases, senilism, etc. Yet another study published in the U.S. journal shows that radiology remote monitoring is safer than real-life personnel close-range measurements.

If the geiger counter is manually used for routine inspection of areas with higher radiation, a certain amount of radiation can be absorbed by the protection of protective clothing (part of the protective clothing is expensive in manufacturing cost and short in service life), and the geiger counter can cause harm to the body in the past.

The technology of the invention is from the key project of the basic research plan of Yunnan province (202001AS 070064); technical innovation talent project of Yunnan province (2019HB 113); the technical and technical leadership project (cloud issue modified personnel [2019] 1096) of the industry of 'Wanren plan' in Yunnan province is funded.

Disclosure of Invention

The invention aims to solve the technical problem of providing the CPS-based radiation monitoring embedded real-time transmission equipment and system, so as to realize miniaturization and low power consumption, solve the problems of radiation detection and monitoring safety, simultaneously achieve the possibility of judging whether equipment which can generate radiation in remote areas runs perfectly or not and whether overload operation exists or not, and avoid the influence on human bodies caused by long-term manual detection of high radiation areas.

The technical scheme of the invention is as follows: a radiation monitoring device based on CPS comprises a voltage reduction and voltage stabilization power supply module, an STM32L MCU module, a communication module, a LoRa gateway, an LCD1602 display module and an M4011 Geiger counter module.

The STM32L MCU module respectively with communication module, M4011 Geiger counter module, LCD1602 display module is connected, STM32L MCU module and communication module communication connection, voltage reduction and voltage stabilization power supply module is STM32L MCU module, communication module, M4011 Geiger counter module, LCD1602 display module power supply.

The M4011 Geiger counter module can detect various ionizing radioactive sources, such as particles like alpha, beta, neutrons and gamma rays, and comprises an M4011 Geiger tube U11, a resistor R11, a resistor R12, a rheostat R13, a resistor R14, a resistor R15, a resistor R16, a resistor R17, a capacitor C11, a capacitor C12, a capacitor C13, a CMOS11 transistor and a HVW5P-500NG1 voltage transformation and stabilization chip.

The conventional geiger circuit generally employs a multi-stage amplifying circuit, such as a plurality of MOS devices, which complicates the overall structure of the circuit and increases the instability factor.

The M4011 Geiger counter module is characterized in that voltage transformation and conversion are completed by HVW5P-500NG1 voltage transformation and stabilization chips, a pin 1 is connected with an R12, the other end of the R12 is connected with a 5V power supply end, a pin 2 is connected with a rheostat R13, the other end of the R13 is connected with 400V + voltage output, a capacitor C12 of a branch is grounded, a pin 3 is grounded, the anode of an M4011 Geiger tube U11 is connected with a capacitor C11 and a resistor R11 in parallel and then connected with 400V + voltage, the cathode of the Geiger tube is connected with a resistor R14, a resistor R14 is connected with a parallel circuit of a resistor R15 and a capacitor C13 in series and then pulled down to be grounded, an R16 is connected between the R14 and the R15 in parallel, the R16 is connected with the base of a CMOS tube CMOS11, the emitter of the CMOS11 is grounded, a collector is connected with a resistor R17 and then connected with 5V voltage to be connected with a 5G-555 chip to form a Schmitt trigger, and the M4011 output pulse shaping module is completed. Compared with the traditional counting circuit, the counting circuit does not use a Schmitt trigger to carry out digital-to-analog shaping on the counting data, so that the problem that part of the sampling data possibly has distortion due to the conversion process so as to cause inaccurate measurement counting structure is solved.

Wherein pin 1 ground connection of 5G-555 chip, pin 2 links together with pin 3 and merges into the MOS pipe source electrode, and pin 3 connects the STM32L151 singlechip and is used for SPI communication, and pin 4 and pin 8 connect 5V voltage, and pin 5 and pin 7 are unsettled.

The STM32L MCU module includes STM32L151C8T6 singlechip, crystal oscillator circuit, reset circuit, mode selection circuit.

The crystal oscillator circuit comprises a capacitor C21, a capacitor C22, a capacitor C23, a capacitor C24, a resistor R21, a crystal oscillator Y21 and a crystal oscillator Y22; the negative pole of the power supply is simultaneously connected with one end of the capacitor C21, the capacitor C22, the capacitor C23 and the capacitor C24; the other end of the capacitor C21 is connected with one end of a crystal oscillator Y1 and a pin 3 of an STM32L151C8T6 singlechip; the other end of the capacitor C22 is connected with the other end of the crystal oscillator Y1 and a pin 4 of the STM32L151C8T6 singlechip; the other end of the capacitor C23 is connected with one end of a crystal oscillator Y2 and one end of a resistor R22, and the C23 is simultaneously connected with a pin 5 of an STM32L151C8T6 singlechip; the other end of the capacitor C24 is connected with the other end of the crystal oscillator Y2 and the other end of the resistor R22, and is simultaneously connected with a pin 6 of the STM32L151C8T6 singlechip.

The reset circuit comprises a capacitor C25, a resistor R21 and a tact switch S1; one end of the resistor R24 is connected in series with the resistor R25 and then connected with the anode of a 3.3V power supply, meanwhile, the R24 and the R25 are combined into the capacitor C26, and the other end of the C26 is connected with the 48 pins of the STM32L151C8T6 in parallel and then grounded; one end of the tact switch S1 and one end of the capacitor C25 are simultaneously connected with the negative electrode of the 3.3V power supply; the other end of the resistor R21, the other end of the switch S1 and the other end of the capacitor C25 are simultaneously connected with a pin 7 of the STM32L151C8T6 singlechip.

The mode selection circuit includes a resistor R24, a resistor R25; one end of the resistor R25 is connected with the negative electrode of a 3.3V power supply, and the other end of the resistor R24 is connected with a pin 44 of an STM32L151C8T6 singlechip; pin 1, pin 9, pin 24, pin 36 and pin 47 of the STM32L151C8T6 singlechip are connected with the anode of a 3.3V power supply; pin 8, pin 23, pin 35 and pin 48 of the STM32L151C8T6 singlechip are connected with the cathode of a 3.3V power supply; pin 11 of STM32L151C8T6 singlechip connects the 14 pin SI end of 74HC595 chip, pin 12 of STM32L151C8T6 singlechip connects the 12 pin RCK end of 74HC595 chip, pin 13 of STM32L151C8T6 singlechip connects the 11 pin SCK end of 74HC595 chip, pin 25 of STM32L151C8T6 singlechip connects the pin 3 of the 5G-555 chip in the M4011 circuit.

The communication module can be an NB-IoT communication module and comprises a WH-NB73, a SIM card, a capacitor C31, a capacitor C32, a resistor R31, a resistor R32 and an inductor L31.

Pin 1 and pin 2 of WH-NB73 are connected with one end of an inductor L31 and a capacitor C31, the other end of C31 is grounded, pin 3 and pin 4 of WH-NB73 are simultaneously connected with one end of R31, the other end of R31 is connected with C31, the other end of R31 is pulled down and grounded at the same node, L31 and C32 are connected with a 3.3V power supply, one end of C32 is connected with one end of a resistor R32, the other end of R32 is connected with a pull-down node of R31, and the other end of R32, R31 and C31 are pulled down and grounded at the same node; pin 36 and pin 35 of WH-NB73 are connected to pin 31 and pin 30 of STM32L151C8T6 monolithic chip, and pin 17, pin 42, pin 40, and pin 39 of WH-NB73 are grounded.

And the SIM card is inserted into the SIM card slot, and the SIM card slot circuit comprises a resistor R33, a resistor R34, a resistor R35, a capacitor C33, a capacitor C34, a card slot chip C749 and an over-current protection chip ESDA6V8AV 6. Pin 2 of the card slot chip C749 is connected with pin 23 of WH-NB73, pin 4 of the over-current protection chip ESDA6V8AV6 is connected with the external edge of pin 2 of the card slot chip C749 after being externally connected with R34, and pin 4 of the over-current protection chip ESDA6V8AV6 is connected with the external pull-down capacitor C33 and then is grounded. Pin 3 of the card slot chip C749 is connected with pin 24 of WH-NB73, and pin 3 of the over-current protection chip ESDA6V8AV6 is externally connected with R33 and then connected with the outer edge of pin 3 of the card slot chip C749. The pin 6 of the card slot chip C749 is connected with the pin 22 of the WH-NB73, and meanwhile, the pin 1 of the overvoltage protection chip ESDA6V8AV6 is externally connected with the R35 and then is connected with the outer edge of the pin 6 of the card slot chip C749, and the same node of the R35 is externally connected with the capacitor C34 and is grounded. Pin 7 of the card slot chip C749 is grounded. Pin 8 of card slot chip C749 is connected to pin 25 of WH-NB73, pin 5 of over-current protection chip ESDA6V8AV6 is externally connected to the outer edge of pin 8 of card slot chip C749, and pin 2 of over-current protection chip ESDA6V8AV6 is grounded.

The communication module can also be an LoRa communication module, and comprises a LoRa SX1278, a digital-to-analog voltage stabilizing circuit, a radio frequency conversion filter circuit and a LoRa crystal oscillator circuit; the radio frequency conversion Filter circuit mainly aims at the frequency band filtering of the communication stability and the input and output of a LoRa SX1278 chip, and mainly comprises a Filter chip SAW Filter and an RF Switch PE4259, wherein the LoRa crystal oscillator circuit provides stable working frequency for the Filter chip SAW Filter and has the following specific structure:

the outer edges of a pin 1 and a pin 28 of the LoRa SX1278 are used as communication ends for radio frequency output and output, the pin 1 is externally connected with a resistor R48 and is grounded by a parallel connection R47, a capacitor C412 is connected behind the R48 and is externally connected with a pin 5 of a Filter chip SAW Filter, the C412 is connected between the C413 and the R48 and grounded, the pin 1 and the pin 6 of the Filter chip SAW Filter are connected, and pins 3 and 4 of the Filter chip SAW Filter are grounded; pin 2 is externally connected with an RF1 port of the capacitor C413 RF Switch PE4259, pin 1 is used as an RF signal input end, and pin 2 of the RF Switch PE4259 is grounded; the pin 28 of the LoRa SX1278 is used as a radio frequency output end and is connected with the pin 27, the pins 28 and 27 are externally connected with R41 and R42 and then connected with the capacitor C46, and meanwhile, the pull-out resistor R43 is connected with the capacitor C45 and is grounded; a capacitor C419 is pulled down to be grounded between C46 and R43, a circuit grid formed by connecting a capacitor C46 with R44 and then connecting C49, C411, C410, C48, C47, R46 and R45 in a crossed, serial and parallel mode is grounded at C47, C48 and C49, C49, C410 and R46 output are connected to an RF2 port of an RF Switch PE4259 to serve as radio frequency signal output ends, a resistor R410 externally connected to a port 4 of the RF Switch PE4259 is connected to be grounded to C416 and then connected to a port 34 of an STM32L151C8T6, a C417 externally connected to a port 5 of the RF Switch PE4259 is connected to be connected to R49 and simultaneously connected to capacitors C418 and C419 to be pulled down to be grounded, finally, an external antenna coaxial port ANT _ LF is simultaneously grounded, and a pin 6 of the RF Switch PE4259 is connected to be connected to a digital-analog-to be grounded and then connected to a voltage regulator circuit C415;

the LoRa crystal oscillator circuit comprises Y41, capacitors C423 and C424, a pin 5 and a pin 6 of an SX1278 are externally connected with two ends of a Y41 crystal and are connected with the ground by a Y41 crystal, two ends of the Y41 are externally connected with the capacitors C423 and C424 and are grounded, a pin 2, a pin 3 and a pin 4 of the LoRa SX1278 are externally connected with capacitors C420, C421 and C422 and are grounded, a pin 3 is externally connected with a digital-analog voltage-stabilizing power supply, a pin 8, a pin 9, a pin 10, a pin 11, a pin 12 and a pin 13 of the LoRa SX1278 are externally connected with a pin 14, a pin 15, a pin 16, a pin 17, a pin 18 and a pin 19 of the LoRa SX1278 are externally connected with a digital-analog voltage-stabilizing power supply and are externally connected with a C425 and are grounded, a pin 15 of the LoRa SX1278 is grounded, a pin 16, a pin 17, a pin 18, a pin 19, a pin 20, a pin 21 and a pin 22 of the LoRa SX 1278T 6 (IC3) are externally connected with a pin 27, 28, 29, 30, 23, the pin 24 circumscribed VDD3.3V merges into both the C42 and C41 grounds. The pin 25 is externally connected between the R43 and the C45, and is simultaneously pulled down to be connected to the ground of the C44 and the C43.

The method supports selection of two different data transmission modes, and when an NB-IoT type communication mode is used, the pin 31 and the pin 30 of the STM32L151C8T6 singlechip are used as the pin 36 and the pin 35 of the external WH-NB73 for synchronous and asynchronous duplex communication.

When the LoRa type communication mode is selected, the pins 14, 15, 16, 17, 18 and 19 of the STM32L151C8T6 singlechip are used as the pins 8, 9, 10, 11, 12 and 13 of the external LoRaSX1278 of serial port communication, and the pins 27, 28, 29 and 30 of the STM32L151C8T6 singlechip are connected with the pins 16, 17, 18 and 20 of the external LoRaSX 1278. Pin 34 of the STM32L151C8T6 singlechip is externally connected with a pin 4 extending end of a PE4259 radio frequency transceiving converter in a LoRaSX1278 circuit.

Compared with the prior art, the module is added with the radio frequency conversion filtering equipment, improves the traditional single-frequency or double-frequency communication, can carry out full-band large-frequency-spectrum communication depending on the antenna characteristic, and simultaneously keeps high-level.

The LCD1602 display module includes 74HC595 series-parallel conversion chip, LCD1602 display, and chip pin 15, pin 1, pin 2, pin 3, pin 4, pin 5, pin 6, pin 7 of 74HC595 series-parallel conversion chip (IC10) are externally connected with pin 7, pin 8, pin 9, pin 10, pin 11, pin 12, pin 13, pin 14 of the LCD1602 display.

Pin 8 of the 74HC595 series-parallel conversion chip is grounded, pins 10, 13 and 16 are connected with 5V voltage, pin 11 of the STM32L151C8T6 singlechip is connected with pin 14 of the 74HC595 series-parallel conversion chip, pin 12 of the STM32L151C8T6 singlechip is connected with RCK end of pin 12 of the 74HC595 series-parallel conversion chip, pin 13 of the STM32L151C8T6 singlechip is connected with SCK end of pin 11 of the 74HC595 series-parallel conversion chip;

pin 1 of the LCD1602 display is grounded, pin 2 is connected to 5V voltage and then connected to the capacitor C51, pin 3 is connected to the varistor R51 for load grounding, pin 4, pin 5, pin 6 are connected to the pin 41, pin 40, pin 39 of the STM32L single chip microcomputer, pin 15 of the LCD1602 display is connected to the C52 and simultaneously connected to the 5V high level ground, and pin 16 is connected to the resistor R52 for grounding.

Compared with the traditional design of directly connecting the LCD and the single chip microcomputer, the serial-parallel converter is used instead, parallel data is changed into serial data, on one hand, a chip is used, the use of pins of the chip can be optimized, and the expansion space is larger.

The voltage reduction and stabilization module and the storage battery module provide 3.3V and 5V voltage output and also have voltage stabilization and protection effects on the power supply of the whole system, the partial modules comprise a6V battery, a fuse F1 and a voltage stabilization output chip dual-output circuit, and the voltage stabilization output chip dual-output circuit consists of XC6206-3.3 and XC 6206-5.0; the positive electrode of the battery box is connected with a fuse F1 and is pulled out to be used as a6V voltage source, a pin 1 of XC6206-3.3 is externally connected with a power supply positive electrode, a pin 1 of XC6206-5.0 is simultaneously connected, a pin 3 of XC6206-3.3 is connected with a resistor R61 and grounded, a pin 2 outputs 3.3V voltage, the pin 1 of XC6206-5.0 is connected with a capacitor C61 and is connected with a pin 3 of XC6206-5.0 and is grounded, a pin 2 is externally connected with a C63 and is grounded, and simultaneously merged into a C62 and a diode D61 and is merged into a pin 2 end of XC6206-3.3 and is pulled down to be used as a 5V voltage source.

The NB-IoT base station is laid based on a telecom operator, can convert data, transmits the converted data to the Internet through an access port of the operator, and transmits the data to the cloud server through a CoAP/NB-IoT protocol.

The cloud server uses a person transparent transmission cloud system, the cloud server system provides network access registration of the NB-IoT module and communication of AT instructions, the cloud server system can be monitored by the cloud end when being powered on after the cloud end registers and uploads IMEI and SN codes on a film of hardware equipment, and meanwhile, the uploading data type is set, so that the monitoring numerical value of the sensor can be displayed in real time.

The invention has the beneficial effects that:

1. the invention can effectively measure the radiation generated by the house outdoors or various communication base stations and industrial equipment, whether the radiation threatens the human body or not, and simultaneously, the invention plays a role in monitoring the radiation generated by the house ionizing radiation or decoration materials such as marble and the like.

2. The invention provides a feasible scheme for effectively ensuring the radiation monitoring of the operation in the radiation high-risk area for a long time and the fixed-point radiation monitoring, is a better application of the bottom information acquisition equipment of the physical information fusion system in the industrial safety monitoring, and has certain development prospect and market demand.

3. The radiation monitoring equipment provides effective data for real-time radiation monitoring of carriers or layout nodes, achieves low power consumption and low manufacturing cost through LoRa communication, and is in accordance with the design concept of safe production and energy conservation through long-distance reliable communication.

Drawings

FIG. 1 is a circuit diagram of a voltage-reducing and voltage-stabilizing power supply of the present invention;

FIG. 2 is a circuit diagram of an STM32L MCU module of the present invention;

fig. 3 is a circuit diagram of an NB-IoT communications module of the present invention;

FIG. 4 is a circuit diagram of a LoRaSX1278 communication module of the present invention;

FIG. 5 is a circuit diagram of the M4011 Geiger tube of the present invention;

FIG. 6 is a circuit diagram of an LCD1602 module according to the present invention;

fig. 7 is a block diagram of the architecture of the present invention.

In the figure: the mobile phone comprises a 1-1-M4011 Geiger tube circuit module, a 1-2-STM32L MCU module circuit, a 1-3-NB-IoT communication module, a 3-1-NB-IoT base station, a 1-3-LoRaSX 1278 communication module, a 3-2-manned transparent transmission cloud server, a 3-1-LoRa base station and a 3-3 user mobile phone WeChat terminal.

Detailed Description

The invention is further described with reference to the following drawings and detailed description.

Example 1: as shown in FIG. 7, the CPS-based radiation monitoring device comprises a voltage reduction and voltage stabilization power supply module 2-1, an STM32L MCU module 1-2, a communication module, a LoRa gateway, an LCD1602 display module 1-4 and an M4011 Geiger counter module 1-1.

STM32L MCU module 1-2 respectively with communication module, M4011 Geiger counter module 1-1, LCD1602 display module 1-4 is connected, STM32L MCU module 1-2 and communication module communication connection, voltage reduction and voltage stabilization power supply module 2-1 is that STM32L MCU module 1-2, communication module, M4011 Geiger counter module 1-1, LCD1602 display module 1-4 supply power.

As shown in fig. 5, the M4011 geiger counter module 1-1 can detect various ionizing radioactive sources, such as particles of α, β, neutron, and γ rays, and has a general structure in which a metal tube sealed at both ends with an insulating material is filled with a dilute gas, typically a rare gas doped with a halogen, such as helium, neon, argon, and the like. A wire electrode is mounted along the axis of the tube and a voltage slightly below the breakdown voltage of the gas in the tube is applied between the wall of the tube and the wire electrode. Thus, under normal conditions, the gas in the tube does not discharge; when high-speed particles are injected into the tube, the energy of the particles ionizes and conducts the gas in the tube, and a rapid gas discharge phenomenon is generated between the filament and the tube wall, so that a pulse current signal is output. By appropriate selection of the voltage applied between the filament and the wall of the tube, the lowest energy of the detected particle and thus its type can be selected and the geiger counter can be used to detect gamma rays.

The conventional Geiger circuit usually adopts a multi-stage amplifying circuit, such as a plurality of MOS (metal oxide semiconductor) elements, which can cause the complexity of the whole circuit structure and also increase the unstable factors, and the M4011 Geiger counter module 1-1 comprises an M4011 Geiger tube U11, a resistor R11, a resistor R12, a rheostat R13, a resistor R14, a resistor R15, a resistor R16, a resistor R17, a capacitor C11, a capacitor C12, a capacitor C13, a CMOS11 transistor and a voltage transformation and stabilization chip of HVW5P-500NG 1.

The M4011 Geiger tube circuit is formed by HVW5P-500NG1 voltage transformation and stabilization chip IC1, wherein pin 1 is connected with R12, the other end of R12 is connected with a 5V power supply terminal, pin 2 is connected with a rheostat R13, the other end of R13 is connected with 400V + voltage output, a branch of a capacitor C12 is grounded, pin 3 is grounded, the anode of M4011 Geiger tube U11 is connected with a capacitor C11 and a resistor R11 in parallel and then connected with 400V + voltage, the cathode of the Geiger tube is connected with a resistor R14, a resistor R14 is connected with a parallel circuit of a resistor R15 and a capacitor C13 in series and pulled down to ground, R16 is connected between R14 and R15 in parallel, R16 is connected with the base of CMOS tube CMOS11, the emitter of CMOS11 is grounded, a collector resistor R17 is connected with 5V voltage and then forms a Schmitt trigger with a 5G-555 chip (IC2) to complete the analog-digital-analog-digital analog-digital counting circuit, thus the analog-digital counting circuit is not used for counting and accurate data sampling and counting and data sampling and conversion can not occur, and the result in a data measurement process is not distorted data conversion process, pin 1 of the 5G-555 chip IC2 is grounded, pin 2 and pin 3 are connected together and are merged into the source electrode of the MOS tube, pin 3 is connected with the STM32L151 single chip microcomputer and is used for SPI communication, pin 4 and pin 8 are connected with 5V voltage, and pin 5 and pin 7 are suspended.

As shown in FIG. 2, after the Geiger tube circuit forms current pulses, the current pulses are input into an STM32L MCU module 1-2, and because the situation that the pins of the single chip microcomputer are limited is considered, a serial-parallel converter is selected to optimize the used pins in order to facilitate later function expansion. STM32L MCU module 1-2 is low-power consumption singlechip module, STM32L MCU module 1-2 includes STM32L151C8T6 singlechip, crystal oscillator circuit, reset circuit, mode selection circuit.

The crystal oscillator circuit comprises a capacitor C21, a capacitor C22, a capacitor C23, a capacitor C24, a resistor R21, a crystal oscillator Y21 and a crystal oscillator Y22. The negative pole of the power supply is connected with one end of the capacitor C21, the capacitor C22, the capacitor C23 and the capacitor C24 at the same time. The other end of the capacitor C21 is connected with one end of the crystal oscillator Y1 and a pin 3 of the STM32L151C8T6 singlechip. The other end of the capacitor C22 is connected with the other end of the crystal oscillator Y1 and a pin 4 of the STM32L151C8T6 singlechip. The other end of the capacitor C23 is connected with one end of a crystal oscillator Y2 and one end of a resistor R22, and the C23 is simultaneously connected with a pin 5 of an STM32L151C8T6 singlechip. The other end of the capacitor C24 is connected with the other end of the crystal oscillator Y2 and the other end of the resistor R22, and is simultaneously connected with a pin 6 of the STM32L151C8T6 singlechip.

The reset circuit comprises a capacitor C25, a resistor R21 and a tact switch S1. One end of the resistor R24 is connected in series with the resistor R25 and then connected with the anode of a 3.3V power supply, meanwhile, the R24 and the R25 are combined into the capacitor C26, and the other end of the C26 is connected with the 48 pins of the STM32L151C8T6 in parallel and then grounded. One end of the tact switch S1 and one end of the capacitor C25 are simultaneously connected with the negative electrode of the 3.3V power supply. The other end of the resistor R21, the other end of the switch S1 and the other end of the capacitor C25 are simultaneously connected with a pin 7 of the STM32L151C8T6 singlechip.

The mode selection circuit includes a resistor R24 and a resistor R25. One end of the resistor R25 is connected with the negative electrode of a 3.3V power supply, and the other end of the resistor R24 is connected with a pin 44 of an STM32L151C8T6 singlechip. Pin 1, pin 9, pin 24, pin 36, pin 47 of STM32L151C8T6 singlechip are connected with the positive pole of 3.3V power. And pin 8, pin 23, pin 35 and pin 48 of the STM32L151C8T6 singlechip are connected with the cathode of a 3.3V power supply. Pin 11 of STM32L151C8T6 singlechip connects the 14 pin SI end of 74HC595 chip, pin 12 of STM32L151C8T6 singlechip connects the 12 pin RCK end of 74HC595 chip, pin 13 of STM32L151C8T6 singlechip connects the 11 pin SCK end of 74HC595 chip, pin 25 of STM32L151C8T6 singlechip connects the pin 3 of the 5G-555 chip in the M4011 circuit.

Meanwhile, the invention considers the problems of energy consumption and cost due to intercity monitoring and remote monitoring, the NB-IoT modules 1-3 can be considered to be used in short-range communication and monitoring, and a 1-3 communication scheme constructed by using the LoRa module is also provided when remote long-distance communication is needed.

That is, the module design supports the selection of two different data transmission modes, and when an NB-IoT type communication mode is used, the pins 31 and 30 of the STM32L151C8T6 singlechip are used as the pins 36 and 35 of the external NB-IoT WH-NB73 for synchronous and asynchronous duplex communication.

When the LoRa type communication mode is selected, the pins 14, 15, 16, 17, 18 and 19 of the STM32L151C8T6 singlechip are used as the pins 8, 9, 10, 11, 12 and 13 of the external LoRaSX1278 of serial port communication, and the pins 27, 28, 29 and 30 of the STM32L151C8T6 singlechip are connected with the pins 16, 17, 18 and 20 of the external LoRaSX 1278. Pin 34 of the STM32L151C8T6 singlechip is externally connected with a pin 4 extending end of a PE4259 radio frequency transceiving converter in a LoRaSX1278 circuit.

As shown in fig. 3, when the communication module is an NB-IoT communication module 1-3, the communication module includes a WH-NB73, a SIM card, a capacitor C31, a capacitor C32, a resistor R31, a resistor R32, and an inductor L31.

Pin 1 and pin 2 of WH-NB73 are connected with one end of an inductor L31 and a capacitor C31, the other end of C31 is grounded, pin 3 and pin 4 of WH-NB73 are simultaneously connected with one end of R31, the other end of R31 is connected with C31, the other end of R31 is pulled down to the ground at the same node, L31 and C32 are connected with a 3.3V power supply, one end of C32 is connected with one end of a resistor R32, the other end of R32 is connected with a pull-down node of R31, and the other end of R32, R31 and C31 are pulled down to the ground at the same node. Pin 36 and pin 35 of WH-NB73 are connected to pin 31 and pin 30 of STM32L151C8T6 monolithic chip, and pin 17, pin 42, pin 40, and pin 39 of WH-NB73 are grounded.

The SIM card slot circuit comprises a resistor R33, a resistor R34, a resistor R35, a capacitor C33, a capacitor C34, a card slot chip C749 and an over-current protection chip ESDA6V8AV 6. Pin 2 of the card slot chip C749 is connected with pin 23 of WH-NB73, pin 4 of ESDA6V8AV6 is connected with the external edge of pin 2 of the card slot chip C749 after being externally connected with R34, pin 4 of ESDA6V8AV6 is connected with pull-down capacitor C33 and then is grounded, pin 3 of the card slot chip C749 is connected with pin 24 of WH-NB73, meanwhile, the pin 3 of the over-current protection chip ESDA6V8AV6 is externally connected with the R33 and then is connected with the outer edge of the pin 3 of the card slot chip C749, the pin 6 of the card slot chip C749 is connected with the pin 22 of the WH-NB73, meanwhile, the pin 1 of the overvoltage protection chip ESDA6V8AV6 is externally connected with the R35 and then is connected with the outer edge of the pin 6 of the card slot chip C749, an external capacitor C34 is grounded at the same node of R35, a pin 7 of a card slot chip C749 is grounded, a pin 8 of the card slot chip C749 is connected with a pin 25 of WH-NB73, meanwhile, a pin 5 of the over-current protection chip ESDA6V8AV6 is externally connected to the outer edge of a pin 8 of the card slot chip C749, and a pin 2 of the over-current protection chip ESDA6V8AV6 is grounded.

As shown in fig. 4, when the communication module is an LoRa communication module 1-3, the communication module includes an LoRa SX1278, a digital-to-analog voltage regulator circuit, a radio frequency conversion filter circuit, and an LoRa crystal oscillator circuit. The radio frequency conversion Filter circuit mainly aims at the frequency band filtering of the communication stability and the input and output of a LoRa SX1278 chip, and mainly comprises a Filter chip SAW Filter and an RF Switch PE4259, wherein the LoRa crystal oscillator circuit provides stable working frequency for the Filter chip SAW Filter and has the following specific structure:

the outer edges of a pin 1 and a pin 28 of the LoRa SX1278 are used as communication ends of radio frequency output and output, the pin 1 is externally connected with a resistor R48 and is grounded with a parallel connection R47, a capacitor C412 is connected behind R48 and is externally connected with a pin 5 of a Filter chip SAW Filter, the C412 is connected between the C413 and the R48 and grounded, the pin 1 and the pin 6 of the Filter chip SAW Filter are connected simultaneously, pins 3 and 4 of the Filter chip SAW Filter are grounded, a pin 2 is externally connected with an RF1 port of a capacitor C413 radio frequency conversion chip RF Switch PE4259, and a pin 2 of the radio frequency conversion chip RF Switch PE4259 is grounded. Pin 28 of LoRa SX1278 is connected with pin 27 as a radio frequency output terminal, pins 28 and 27 are externally connected with R41 and R42 and then connected with capacitor C46 after being connected in parallel, and simultaneously, a pull-out resistor R43 is connected with capacitor C45 and grounded. The method comprises the steps that a capacitor C419 is pulled down to be grounded between C46 and R43, a capacitor C46 is connected with R44 and then connected to C49, C411, C410, C48, C47, R46 and R45 in a crossed, serial and parallel mode, circuit grids connected with C47, C48 and C49 are grounded, outputs of C49, C410 and R46 are connected to an RF2 port of a radio frequency conversion chip RF Switch PE4259, a port 4 external resistor R410 of the radio frequency conversion chip RF Switch PE4259 is connected to C416 ground, meanwhile, a port 34 of an STM32L151C8T6 single chip microcomputer is connected, a port 5 external C417 of the radio frequency conversion chip RF Switch PE4259 is connected to R49 in an external mode, two ends of the capacitors C418 and C419 are respectively connected to be pulled down to ground, finally, an external antenna coaxial port ANT _ LF is connected to ground at the same time, a pin 6 external voltage stabilizing circuit of the radio frequency conversion chip RF Switch PE4259 is connected to a capacitor C415 and then connected to ground.

The LoRa crystal oscillator circuit comprises Y41, capacitors C423 and C424, two ends of pins 5 and 6 of LoRaSX1278 are externally connected with Y41 and Y41 crystal are automatically grounded, two ends of Y41 are externally connected with capacitors C423 and C424 and are grounded, pin 2, pin 3 and pin 4 of LoRa SX1278 are externally connected with capacitors C420, C421 and C422 and are grounded and pin 3 is externally connected with a digital-analog voltage-stabilized power supply, pin 8, pin 9, pin 10, pin 11, pin 12 and pin 13 of LoRa SX1278 are externally connected with pin 14, pin 15, pin 16, pin 17, pin 18 and pin 19 of the module of a 32151C8T6 singlechip, pin 14, pin 9, pin 10, pin 11, pin 12 and pin 13 of the module of LoRa SX1278 are externally connected with a digital-analog voltage-stabilizing circuit and are grounded, pin 15, pin 17, pin 18, pin 19 and pin 20 is externally connected with a singlechip 27, pin 28, pin 29, pin 30, pin 29, pin 21, pin 1278, pin 22 and pin 12723 of a singlechip module of an external of a LoRa 32L151C8T6, the pin 24 externally connected VDD3.3V is simultaneously merged into C42 and C41 ground, and the pin 25 externally connected between R43 and C45 is simultaneously pulled down to be connected with C44 and C43 ground.

As shown in fig. 6, STM32L MCU module 1-2 will perform serial-to-parallel conversion on the obtained pulse signal through 74HC595 serial-to-parallel conversion chip, and output 8 parallel outputs for digital display of LCD module. The LCD1602 display module 1-474HC595 series-parallel conversion chip, the LCD1602 display, 74HC595 series-parallel conversion chip pin 15, pin 1, pin 2, pin 3, pin 4, pin 5, pin 6, pin 7 external LCD1602 display pin 7, pin 8, pin 9, pin 10, pin 11, pin 12, pin 13, pin 14.

Pin 8 of the 74HC595 series-parallel conversion chip is grounded, pins 10, 13 and 16 are connected with 5V voltage, pin 11 of the STM32L151C8T6 singlechip is connected with pin 14 of the 74HC595 series-parallel conversion chip, pin 12 of the STM32L151C8T6 singlechip is connected with RCK end of pin 12 of the 74HC595 series-parallel conversion chip, and pin 13 of the STM32L151C8T6 singlechip is connected with SCK end of pin 11 of the 74HC595 series-parallel conversion chip.

Pin 1 of the LCD1602 display is grounded, pin 2 is connected to 5V voltage and then connected to the capacitor C51 ground, pin 3 is connected to the varistor R51 as load ground, pin 4, pin 5, pin 6 are connected to the pin 41, pin 40, pin 39 of the STM32L151C8T6 single chip microcomputer, pin 15 of the LCD1602 display is connected to the C52 and simultaneously connected to the 5V high level ground, and pin 16 is connected to the resistor R52 ground.

Compared with the traditional design of directly connecting the LCD and the single chip microcomputer, the serial-parallel converter is used instead, parallel data is changed into serial data, on one hand, a chip is used, the use of pins of the chip can be optimized, and the expansion space is larger.

As shown in FIG. 1, the buck-boost voltage-stabilizing module and the storage battery module provide outputs of 3.3V and 5V voltages and also play roles in stabilizing and protecting the power supply of the whole system, the partial modules comprise a6V battery, a fuse F1 and a voltage-stabilizing output chip dual-output circuit, and the voltage-stabilizing output chip dual-output circuit is composed of XC6206-3.3 and XC 6206-5.0. The positive electrode of the battery box is connected with a fuse F1 and is pulled out to be used as a6V voltage source, a pin 1 of XC6206-3.3 is externally connected with a power supply positive electrode, a pin 1 of XC6206-5.0 is simultaneously connected, a pin 3 of XC6206-3.3 is connected with a resistor R61 and grounded, a pin 2 outputs 3.3V voltage, the pin 1 of XC6206-5.0 is connected with a capacitor C61 and is connected with a pin 3 of XC6206-5.0 and is grounded, a pin 2 is externally connected with a C63 and is grounded, and simultaneously merged into a C62 and a diode D61 and is merged into a pin 2 end of XC6206-3.3 and is pulled down to be used as a 5V voltage source.

The working principle of the invention is as follows:

in the practical process, in order to save energy consumption, the STM32L MCU module 1-2 is used for receiving pulse signals sent by the M4011 Geiger counter module 1-4, the on-off counting function is carried out by depending on pins of the STM32L MCU module 1-2, the ionization occurrence frequency of a Geiger tube is formed into electric signals, the electric signals are firstly passed through a Schmidt trigger formed by a 555 chip to complete the process of digital-to-analog conversion, the electric signals are converted into the pulse signals which are easy to monitor high and low levels, the specific numerical value is calculated by the MCU, the pulse signals are uploaded to a communication module in the ways of SPI and asynchronous synchronous serial communication to carry out uplink data transmission, the calculated numerical value is simultaneously transmitted to a 74HC595 conversion chip, and serial output data of the STM32 are converted into parallel output of eight single-chip microcomputer ports to realize the numerical value display of the LCD 1602. Meanwhile, the cloud end can observe real-time data in a WeChat small program or a public number, and is also suitable for integrated monitoring analysis of a data center.

While the present invention has been described in detail with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, and various changes can be made without departing from the spirit and scope of the present invention.