阅读说明：本技术 主机系统与存储器子系统之间的输入/输出大小控制 (Input/output size control between host system and memory subsystem ) 是由 S·苏巴拉奥 M·伊什 于 2020-05-05 设计创作，主要内容包括：一种存储器子系统经配置以基于存储器子系统的媒体物理布局而动态地确定写入命令的输入/输出大小。所述存储器子系统可响应于选择写入命令以供在所述存储器子系统的媒体单元中执行而动态地识别媒体布局的一部分,所述部分从由所述写入命令在逻辑地址空间中识别的逻辑地址映射到所述媒体单元中的存储器单元的物理地址。基于所述媒体布局,识别下一写入命令的输入/输出大小,且将其在响应中发射到所述主机系统。所述主机系统产生所述下一写入命令,且基于基于在所述响应中识别的所述输入/输出大小而配置待经由所述下一写入命令写入的数据量。(A memory subsystem is configured to dynamically determine an input/output size of a write command based on a media physical layout of the memory subsystem. The memory subsystem may dynamically identify a portion of a media layout that maps from a logical address identified by the write command in a logical address space to a physical address of a memory cell in a media unit of the memory subsystem in response to selecting the write command for execution in the media unit. Based on the media layout, the input/output size of the next write command is identified and transmitted to the host system in a response. The host system generates the next write command and configures an amount of data to be written via the next write command based on the input/output size identified in the response.)

1. A method, comprising:

receiving a write command in the memory subsystem from a host system;

identifying a first input/output size of a next write command from the host system based on a media physical layout;

transmitting, from the memory subsystem to the host system, a response configured to identify at least the first input/output size, wherein the host system is configured to generate the next write command based on the first input/output size identified in the response; and

receiving the next write command in the memory subsystem instructing the memory subsystem to write an amount of data configured according to the first input/output size into the memory subsystem.

2. The method of claim 1, further comprising:

Dynamically generating and storing a portion of the media physical layout in response to selecting the write command for execution in a media unit of the memory subsystem, the portion mapping from a logical address identified in a logical address space by the write command to a physical address of a memory unit in the media unit;

wherein the response is configured to include a status of a first write command processed in the memory subsystem.

3. The method of claim 2, further comprising:

determining that the first write command has a second input/output size different from the first input/output size, wherein the response is configured to indicate that the second input/output size is incorrect.

4. The method of claim 3, wherein the next write command is transmitted from the host system to the memory subsystem to replace the first write command.

5. The method of claim 2, wherein the first input/output size is determined based on the media physical layout as a size of data that may be written into one of the media units in an atomic write operation.

6. The method of claim 2, wherein the first input/output size is determined to be a minimum size of next available memory pages, each of the next available memory pages being writable in one of the media units in an atomic write operation based on the media physical layout.

7. The method of claim 6, wherein the minimum size is based on a pattern in which data is programmed in a next available page of memory that is atomically programmable in one of the media units.

8. The method of claim 7, wherein the mode is one of a plurality of modes supported in the memory subsystem; and the plurality of modes includes:

single Level Cell (SLC) mode;

a multi-level cell (MLC) mode;

three level unit (TLC) mode; and

four level cell (QLC) mode.

9. The method of claim 8, wherein the next available page of memory is a NAND flash memory page that is programmable via a multi-pass programming technique.

10. The method of claim 9, wherein the NAND flash memory page includes multiple planes of NAND memory cells.

11. The method of claim 10, wherein the portion of the media physical layout includes a mapping between Logical Block Addressing (LBA) addresses in a namespace and blocks of NAND memory in separate integrated circuit dies; and the input/output size is determined based on an entry of a page map that identifies the pattern of the next available page in a block of NAND memory cells.

12. A non-transitory computer storage medium storing instructions that, when executed in a memory subsystem, cause the memory subsystem to perform a method, the method comprising:

receiving a write command in the memory subsystem from a host system;

identifying a first input/output size of a next write command from the host based on a media physical layout;

transmitting, from the memory subsystem to the host system, a response configured to identify at least the first input/output size, wherein the host system is configured to generate the next write command based on the first input/output size identified in the response; and

receiving the next write command in the memory subsystem instructing the memory subsystem to write an amount of data configured according to the first input/output size into the memory subsystem.

13. The non-transitory computer storage medium of claim 12, wherein the method further comprises:

dynamically generating and storing a portion of the media physical layout in response to selecting the write command for execution in a media unit of the memory subsystem, the portion mapping from a logical address identified in a logical address space by the write command to a physical address of a memory unit in the media unit;

Wherein the logical address space is defined in a namespace of the memory subsystem; the namespace is configured with a plurality of zones; and the write commands are configured to be written in the multiple zones simultaneously.

14. A memory subsystem, comprising:

a plurality of media units capable of simultaneously writing data; and

at least one processing device configured to:

receiving a first write command in the memory subsystem from the host system;

identifying a first input/output size of a second write command from the host based on a media physical layout;

transmitting a response to the first write command from the memory subsystem to the host system, wherein the response is configured to identify at least the first input/output size, and wherein the host system is configured to generate the second write command based on the first input/output size identified in the response; and

receiving, in the memory subsystem, the second write command instructing the memory subsystem to write an amount of data configured according to the first input/output size into the memory subsystem.

15. The memory subsystem of claim 14, wherein the response is configured to include a status of the first write command processed in the memory subsystem; and the processing device is further configured to:

Dynamically generating and storing a portion of the media physical layout that maps from a logical address identified by the first command in a logical address space to a physical address of a memory cell in a media unit of the memory subsystem in response to selecting the first write command for execution in the media unit;

determining that the first write command has a second input/output size different from the first input/output size; and

configuring the response to indicate that the second input/output size is incorrect.

16. The memory subsystem of claim 14, wherein the first input/output size is determined based on the media physical layout as a size of data that may be written into one of the media units in an atomic write operation.

17. The memory subsystem of claim 14, wherein the first input/output size is determined to be a minimum size of next available memory pages, each of the next available memory pages being writable in one of the media units in an atomic write operation based on the media physical layout.

18. The memory subsystem of claim 17, wherein the minimum size is based on a pattern of programming data in a next available page that is atomically programmable in one of the media units; the mode is one of a plurality of modes supported in the memory subsystem; and the plurality of modes includes:

Single Level Cell (SLC) mode;

a multi-level cell (MLC) mode;

three level unit (TLC) mode; and

four level cell (QLC) mode.

19. The memory subsystem of claim 17, wherein the next available page is a NAND flash memory page that is programmable via a multi-pass programming technique; and the NAND flash memory page includes a plurality of planes of NAND memory cells.

20. The memory subsystem of claim 19, wherein the portion of the media physical layout includes a mapping between Logical Block Addressing (LBA) addresses in a namespace and blocks of NAND memory in separate integrated circuit dies; and the input/output size is determined based on an entry of a page map that identifies the pattern of the next available page in a block of NAND memory cells.

Technical Field

At least some embodiments disclosed herein relate generally to memory systems, and more particularly, but not limited to, input/output size control between a host system and a memory subsystem.

Background

The memory subsystem may include one or more memory devices that store data. The memory devices may be, for example, non-volatile memory devices and volatile memory devices. In general, a host system may utilize a memory subsystem to store data at and retrieve data from a memory device.

Drawings

Embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings in which like references indicate similar elements.

FIG. 1 illustrates an example computing system including a memory subsystem, according to some embodiments of the present disclosure.

FIG. 2 shows an input/output size manager that controls the granularity of input/output between a host system and a memory subsystem.

FIG. 3 shows an example of a memory subsystem with dynamic data placement and input/output size control.

FIG. 4 illustrates an example of a data structure configured to support dynamic data placement and input/output size control.

Fig. 5 shows a method of input/output size control.

FIG. 6 is a block diagram of an example computer system in which embodiments of the present disclosure may operate.

Detailed Description

At least some aspects of the present disclosure relate to input/output size control for a host system writing data into a memory subsystem. The memory subsystem may be a storage device, a memory module, or a mix of storage devices and memory modules. Examples of memory devices and memory modules are described below in connection with FIG. 1. In general, host systems may utilize a memory subsystem that includes one or more components (e.g., memory devices) that store data. The host system may provide data for storage at the memory subsystem and may request retrieval of data from the memory subsystem.

Traditionally, the host system may send write commands to the memory subsystem to write data at a fixed predetermined size or granularity. For example, the data to be stored into the memory subsystem via each write command from the host system is for the same, fixed, predetermined amount/size of data. However, in some cases, fixing the input/output size may result in significant performance loss, increased life of data buffered in the memory subsystem, and/or use of alternative, less efficient methods of data programming in the memory subsystem.

At least some aspects of the present disclosure address the above and other deficiencies via an input/output size control mechanism implemented between a host system and a memory subsystem. For example, based on the current state of the media layout used to place the data in the media of the memory subsystem, the input/output size controller may determine a preferred size of input/output for the next write command. The preferred size is equal to the amount of data that the memory subsystem can program into the media unit in a single atomic operation. For example, the memory subsystem may have NAND flash memory. Using single-pass programming techniques, an atomic write operation in a NAND device can program/store data into a single-plane page, a dual-plane page, a four-plane page, or a multi-plane page. Using a multi-pass programming technique, an atomic write operation in a NAND device can program/store data into a page in SLC (single level cell) mode, a page in MLC (multi-level cell) mode, a page in TLC (three level cell) mode, or a page in QLC (four level cell) mode. The pages programmed in an atomic write operation may have different sizes in different modes. For example, using a multi-pass programming approach, SLC pages may have a size of 64 Kilobytes (KB), TLC pages may have a size of 128KB, and QLC pages may have a size of 64 KB. When pages of data for different write streams for different programming modes are interleaved in a NAND device, the host system may not be able to predict the size that will be appropriate for the next write command in the write stream. The memory subsystem may determine a preferred input/output size based on the state of the media layout and communicate that size to the host system (e.g., via a status field in response to a current command). The input/output size provided in the response may be used to configure the next write command. In some cases, when the input/output size of a write command from the host system is not preferred (e.g., does not match the preferred size for the next write operation), the memory subsystem may communicate an error status with the preferred size to the host system to cause the host system to adjust its write command to the preferred size.

FIG. 1 illustrates an example computing system 100 including a memory subsystem 110, according to some embodiments of the present disclosure. Memory subsystem 110 may include media, such as one or more volatile memory devices (e.g., memory device 102), one or more non-volatile memory devices (e.g., memory device 104), or a combination of these.

Memory subsystem 110 may be a storage device, a memory module, or a mix of storage devices and memory modules. Examples of storage devices include Solid State Drives (SSDs), flash drives, Universal Serial Bus (USB) flash drives, embedded multimedia controller (eMMC) drives, Universal Flash Storage (UFS) drives, Secure Digital (SD) cards, and Hard Disk Drives (HDDs). Examples of memory modules include dual in-line memory modules (DIMMs), small outline DIMMs (SO-DIMMs), and various types of non-volatile dual in-line memory modules (NVDIMMs).

Computing system 100 may be a computing device such as: a desktop computer, a laptop computer, a network server, a mobile device, a vehicle (e.g., an airplane, drone, train, automobile, or other conveyance), an internet of things (IoT) enabled device, an embedded computer (e.g., a computer included in a vehicle, industrial equipment, or networked commercial device), or a computing device including memory and a processing device.

The computing system 100 may include a host system 120 coupled to one or more memory subsystems 110. FIG. 1 illustrates one example of a host system 120 coupled to one memory subsystem 110. As used herein, "coupled to" or "and.

Host system 120 may include a processor chipset (e.g., processing device 118) and a software stack executed by the processor chipset. The processor chipset may include one or more cores, one or more caches, a memory controller (e.g., controller 116) (e.g., NVDIMM controller), and a storage protocol controller (e.g., Peripheral Component Interconnect Express (PCIe) controller, Serial Advanced Technology Attachment (SATA) controller). The host system 120 uses the memory subsystem 110, for example, to write data to the memory subsystem 110 and to read data from the memory subsystem 110.

The host system 120 may be coupled to the memory subsystem 110 via a physical host interface. Examples of physical host interfaces include, but are not limited to, a Serial Advanced Technology Attachment (SATA) interface, a peripheral component interconnect express (PCIe) interface, a Universal Serial Bus (USB) interface, a fibre channel, a serial attached SCSI (sas), a Double Data Rate (DDR) memory bus, a Small Computer System Interface (SCSI), a dual in-line memory module (DIMM) interface (e.g., a DIMM socket interface supporting Double Data Rate (DDR)), an Open NAND Flash Interface (ONFI), a Double Data Rate (DDR), a Low Power Double Data Rate (LPDDR), or any other interface. The physical host interface may be used to transmit data between the host system 120 and the memory subsystem 110. When the memory subsystem 110 is coupled with the host system 120 over a PCIe interface, the host system 120 may further use an NVM express (NVMe) interface to access components (e.g., the memory device 104). The physical host interface may provide an interface for transferring control, address, data, and other signals between the memory subsystem 110 and the host system 120. FIG. 1 illustrates memory subsystem 110 as an example. In general, host system 120 may access multiple memory subsystems via the same communication connection, multiple separate communication connections, and/or a combination of communication connections.

The processing device 118 of the host system 120 may be, for example, a microprocessor, a Central Processing Unit (CPU), a processing core of a processor, an execution unit, or the like. In some cases, the controller 116 may be referred to as a memory controller, a memory management unit, and/or an initiator. In one example, the controller 116 controls communication over a bus coupled between the host system 120 and the memory subsystem 110. In general, the controller 116 may send commands or requests to the memory subsystem 110 for desired access to the memory devices 102, 104. The controller 116 may additionally include interface circuitry for communicating with the memory subsystem 110. The interface circuitry may convert responses received from the memory subsystem 110 into information for the host system 120.

The controller 116 of the host system 120 may communicate with the controller 115 of the memory subsystem 110 to perform operations such as reading data, writing data, or erasing data at the memory devices 102, 104, among other such operations. In some cases, the controller 116 is integrated within the same package as the processing device 118. In other cases, the controller 116 is separate from the packaging of the processing device 118. The controller 116 and/or the processing device 118 may include hardware, such as one or more Integrated Circuits (ICs) and/or discrete components, cache memory, or a combination thereof. The controller 116 and/or the processing device 118 may be a microcontroller, special purpose logic circuitry (e.g., a Field Programmable Gate Array (FPGA), an Application Specific Integrated Circuit (ASIC), etc.), or another suitable processor.

The memory devices 102, 104 may include different types of non-volatile memory components and/or any combination of volatile memory components. Volatile memory devices, such as memory device 102, may be, but are not limited to, Random Access Memory (RAM), such as Dynamic Random Access Memory (DRAM) and Synchronous Dynamic Random Access Memory (SDRAM).

Some examples of non-volatile memory components include NAND (NAND) type flash memory and write-in-place memory, such as three-dimensional cross-point ("3D cross-point") memory. A cross-point array of non-volatile memory may store bits based on changes in body resistance in conjunction with a stackable cross-meshed data access array. In addition, in contrast to many flash-based memories, cross-point non-volatile memories may perform a write-in-place operation in which non-volatile memory cells may be programmed without pre-erasing the non-volatile memory cells. NAND type flash memory includes, for example, two-dimensional NAND (2D NAND) and three-dimensional NAND (3D NAND)

Each of the memory devices 104 may include one or more arrays of memory cells. One type of memory cell, such as a Single Level Cell (SLC), can store one bit per cell. Other types of memory cells, such as multi-level cells (MLC), three-level cells (TLC), four-level cells (QLC), and five-level cells (PLC), may store multiple bits per cell. In some embodiments, each of the memory devices 104 may include one or more arrays of memory cells, such as SLC, MLC, TLC, QLC, or any combination of such memory cell arrays. In some embodiments, a particular memory device may include an SLC portion, and an MLC portion, a TLC portion, or a QLC portion of a memory cell. The memory cells of the memory device 104 may be grouped into pages, which may refer to logical units of the memory device for storing data. For some types of memory (e.g., NAND), the pages may be grouped to form blocks.

Although non-volatile memory devices are described, such as 3D cross-point and NAND-type memories (e.g., 2DNAND, 3D NAND), memory device 104 may be based on any other type of non-volatile memory, such as Read Only Memory (ROM), Phase Change Memory (PCM), self-selection memory, other chalcogenide based memories, ferroelectric transistor random access memory (FeTRAM), ferroelectric random access memory (FeRAM), Magnetic Random Access Memory (MRAM), Spin Transfer Torque (STT) -MRAM, conductive bridge ram (cbram), Resistive Random Access Memory (RRAM), oxide based RRAM (oxram), "NOR" (NOR) flash memory, and electrically programmable erasable read only memory (EEPROM).

Memory subsystem controller 115 (or controller 115 for simplicity) may communicate with memory device 104 to perform operations such as reading data, writing data, or erasing data at memory device 104 and other such operations (e.g., in response to commands scheduled by controller 116 on a command bus). The controller 115 may include hardware, such as one or more Integrated Circuits (ICs) and/or discrete components, cache memory, or a combination thereof. The hardware may comprise digital circuitry with dedicated (i.e., hard-coded) logic to perform the operations described herein. The controller 115 may be a microcontroller, a special purpose logic circuit (e.g., a Field Programmable Gate Array (FPGA), an Application Specific Integrated Circuit (ASIC), etc.), or another suitable processor.

The controller 115 may include a processing device 117 (processor) configured to execute instructions stored in a local memory 119. In the illustrated example, the local memory 119 of the memory subsystem controller 115 includes embedded memory configured to store instructions for executing various processes, operations, logic flows, and routines that control the operation of the memory subsystem 110, including handling communications between the memory subsystem 110 and the host system 120.

In some embodiments, local memory 119 may include memory registers for memory pointers, fetched data, and so forth. Local memory 119 may also include Read Only Memory (ROM) for storing microcode. Although the example memory subsystem 110 in fig. 1 has been illustrated as including a memory subsystem controller 115, in another embodiment of the present disclosure, the memory subsystem 110 does not include a controller 115, but instead relies on external control (e.g., provided by an external host or by a processor or controller separate from the memory subsystem).

In general, the controller 115 may receive commands or operations from the host system 120, and may convert the commands or operations into instructions or appropriate commands to achieve the desired access to the memory device 104. The controller 115 may be responsible for other operations, such as wear leveling operations, garbage collection operations, error detection and Error Correction Code (ECC) operations, encryption operations, cache operations, and address translation between logical addresses (e.g., Logical Block Addresses (LBAs), namespaces) and physical addresses (e.g., physical block addresses) associated with the memory device 104. The controller 115 may further include host interface circuitry to communicate with the host system 120 via a physical host interface. Host interface circuitry may convert commands received from a host system into command instructions to access memory device 104 and convert responses associated with memory device 104 into information for host system 120.

Memory subsystem 110 may also include additional circuits or components not illustrated. In some embodiments, the memory subsystem 110 may include a cache or buffer (e.g., DRAM) and address circuitry (e.g., row decoder and column decoder) that may receive addresses from the controller 115 and decode the addresses to access the memory devices 104.

In some embodiments, the memory device 104 includes a local media controller 105 that operates in conjunction with a memory subsystem controller 115 to perform operations on one or more memory units of the memory device 104. An external controller (e.g., memory subsystem controller 115) may externally manage memory device 104 (e.g., perform media management operations on memory device 104). In some embodiments, memory device 104 is a managed memory device, which is an original memory device combined with a local controller (e.g., local controller 105) for media management within the same memory device package. An example of a managed memory device is a managed nand (mnand) device.

Computing system 100 includes an input/output size manager 113 in memory subsystem 110 that determines a preferred input/output size for storing/programming/committing/writing data atomically in the media of memory subsystem 110. In some embodiments, controller 115 in memory subsystem 110 includes at least a portion of input/output size manager 113. In other embodiments, or in combination, the controller 116 and/or the processing device 118 in the host system 120 include at least a portion of the input/output size manager 113. For example, the controller 115, the controller 116, and/or the processing device 118 may include logic circuitry that implements the input/output size manager 113. For example, the controller 115 or processing device 118 (processor) of the host system 120 may be configured to execute instructions stored in memory for performing the operations of the input/output size manager 113 described herein. In some embodiments, the input/output size manager 113 is implemented in an integrated circuit chip disposed in the memory subsystem 110. In other embodiments, the input/output size manager 113 is part of an operating system, a device driver, or an application of the host system 120.

The input/output size manager 113 may determine the preferred size of the next write command from the host system from the media physical layout of the mapped logical addresses in the media units/memory devices 102-104. For example, based on whether the next page is to be programmed in SLC mode, MLC mode, TLC mode or QLC mode, the input/output size manager 113 may determine that the preferred size is 64KB or 128 KB. In general, there may be many causes of page size non-uniformity that are applicable to atomic write operations. The disclosed techniques to address the non-uniformity are not limited to a particular cause of non-uniformity of the memory pages that may be used for atomic write operations. The input/output size manager 113 may provide the preferred size to the host system 120 in response to the completed command. In response, the host system 120 adjusts the size of the next write command transmitted to the memory subsystem 110. Additional details regarding the operation of the input/output size manager 113 are described below.

FIG. 2 shows an input/output size manager 113 that controls the granularity of input/output between a host system 120 and a memory subsystem 110. For example, the techniques of input/output size control of FIG. 2 may be implemented in the computer system 100 of FIG. 1.

In fig. 2, host system 120 sends commands 121, 123 to store data in media 203 of memory subsystem 110. The command (e.g., 121 or 123) includes the size of the data to be written to the media 203 (e.g., 141 or 143) and the logical address (e.g., 142 or 144) used to store the data in the media 203.

The memory system 110 has a media layout 130 that specifies a mapping between addresses (e.g., 142 and 144) used in commands (123) received in the memory subsystem 110 from the host system 120 and physical memory locations in the memory subsystem's memory media 203.

In some implementations, the media layout 130 is dynamically generated in response to a write command from the host system 120. For example, media 203 may have multiple media units 109A-109N (e.g., memory devices 102 and/or 104 illustrated in FIG. 1) capable of writing data in parallel. At least some of the parallel streams of write commands from the host system 120 may be executed in parallel in the memory subsystem 110 when the date is committed into the memory media 203 of the memory subsystem 110. However, one media unit may support one write operation at a time. Thus, if two write commands are mapped by the media layout 130 to operate on the same media unit (e.g., 109A or 109N), an access conflict may occur. Each conflict increases the time to buffer data in the memory subsystem before the data can be written to the medium 203. To avoid conflicts, the media layout 130 may be dynamically determined when it is determined that media units (e.g., 109A and 109N) are available for execution of the write command.

For example, determination of portions of the media layout for logical addresses (e.g., 142) used in an incoming write command (e.g., 121) may be deferred until the write command (e.g., 121) can be executed without conflict. When the memory media 203 is configured on an integrated circuit die (e.g., as NAND memory cells), the media layout determination may be based on the identification of the integrated circuit die that is available to perform write operations at the time of input/output scheduling. The media layout 130 is determined such that logical addresses of commands to be executed in parallel are mapped to different integrated circuit dies that can be used for simultaneous/parallel operation without conflict. Thus, media access conflicts between write commands from different active streams can be completely avoided.

In general, a write stream contains a set of commands that write, trim, and rewrite data sets together as a group. In the group, data may be written sequentially, randomly, or pseudo-sequentially in the logical space. Preferably, the data in the group is written into a set of erase blocks, where the memory cells in the set of erase blocks store the data of the stream, but not the data from the other streams. The set of erase blocks may be erased to remove data of the stream without erasing data of other streams. In some cases, when logical addresses of different streams map into the same set of erase blocks, the data of the different streams cannot be erased individually, and a conflict may occur. Such conflicts may also be avoided by dynamic media layout techniques.

Different write streams may be configured to store data in the medium 203 in different modes. For example, one write stream may store data in memory cells in medium 203 in SLC mode or MLC mode; and another write stream may store data in memory cells in medium 203 in TLC mode or QLC mode. As a result, the host system 120 may not be able to predict the preferred size or granularity of data for configuring the write command.

The memory subsystem 110 has an input/output size manager 113 configured to determine a preferred input/output size or granularity of data for a write command. The input/output size manager 113 is configured to communicate the preferred size to the host system 120 via a response (e.g., 143 or 145) transmitted from the memory subsystem 110 to the host system 120.

For example, after execution/processing of command 121, response 131 is transmitted from memory subsystem 110 to host system 120. Response 131 is configured to include a preferred size 143 for the next command 123. After receiving response 131, host system 120 may configure next command 123 to have preferred size 143. After execution/processing of the command 123, the input/output size manager 113 may provide the preferred size 145 for the next command in a response 133 to the command 123 that is transmitted from the memory subsystem 110 to the host system 120.

In some implementations, when a command (e.g., 121) received in memory subsystem 110 has an input/output size (e.g., 141) that is different from a preferred size (e.g., 143) determined from media layout 130, input/output size manager 113 can generate a response (e.g., 131) to the command (e.g., 121) indicating an error in the input/output size of the command (e.g., 121) and provide the correct input/output size (e.g., 143). In view of the response (e.g., 131), host system 120 may correct the command (e.g., 121) and generate a replacement command (e.g., 123) having the correct size (e.g., 143).

In alternative implementations, memory subsystem 110 may execute commands (e.g., 121) having a non-preferred size (e.g., having reduced performance and/or extended buffer time for data of command 121). The response (e.g., 131) allows the host system 120 to correct the input/output size for the subsequent command (e.g., 123).

FIG. 3 shows an example of a memory subsystem with dynamic data placement and input/output size control. For example, the memory subsystem of FIG. 3 may be implemented in the memory subsystem 110 of FIG. 1 using the input/output size manager 113 of FIG. 2. However, the techniques of FIGS. 1 and 2 are not limited to the implementation of the memory subsystem illustrated in FIG. 3. For example, the collision avoidance techniques may implement a flat block device (plane block device), a namespace enabled device, or a partition namespace enabled device (e.g., the memory subsystem illustrated in FIG. 3). Accordingly, the disclosure presented herein is not limited to the example of fig. 3.

In fig. 3, namespace 201 is configured on the media storage capacity of memory subsystem 110. Namespace 201 provides a logical block addressing space that can be used by host system 120 to specify memory locations for read or write operations. Namespace 201 may be allocated over a portion of the media storage capacity of memory subsystem 110 or the entire media storage capacity of memory subsystem 110. In some cases, multiple namespaces may be allocated on separate, non-overlapping portions of the media storage capacity of memory subsystem 110.

In FIG. 3, namespace 201 is configured to have a plurality of regions 211, 213, …, 219. Each zone (e.g., 211) in the namespace allows random read access to LBA addresses in the zone (e.g., 211) and sequential write access to LBA addresses in the zone (e.g., 211) but no random write access to random LBA addresses in the zone (211). Thus, data is written to the zone (e.g., 211) in a predetermined sequential order in the LBA address space of namespace 201.

When configuring a region (e.g., 211) in the namespace 201, the media layout may be predetermined (e.g., for simplicity) for the region (e.g., 211). LBA addresses in a zone (e.g., 211) may be pre-mapped to media 203 of memory subsystem 110. However, as discussed above, such a predetermined media layout may cause media access conflicts when there are multiple parallel write streams. Randomizing the mapping from LBA addresses in a zone (e.g., 211) to memory locations in media 203 can reduce, but not eliminate, conflicts.

Preferably, the dynamic data placer 153 is configured in the memory subsystem 110 to create portions of the media layout 130 when scheduling write commands for execution, thereby completely eliminating conflicts. In some embodiments, dynamic data placer 153 is part of input/output size manager 113.

For example, the media 203 of the memory subsystem 110 may have multiple integrated circuit dies 205. Each of the integrated circuit dies (e.g., 205) may have multiple planes 221, ·, 223 of memory cells (e.g., NAND memory cells). Each of the planes (e.g., 221) may have a plurality of blocks 231,. Each of the blocks (e.g., 231) may have a plurality of pages 241, ·, 243 of memory cells (e.g., NAND memory cells). The memory cells in each page (e.g., 241) are configured to be programmed to store/write/commit data together in an atomic operation; and the memory cells in each block (e.g., 231) are configured to erase data together in an atomic operation.

When a write command (e.g., 121) to store data in one zone (e.g., 211) and another write command (e.g., 123) to store data in another zone (e.g., 213) are scheduled for parallel execution, resulting in two integrated circuit dies (e.g., 205 and 207) being available for concurrent operation, dynamic data placer 153 maps LBA addresses (e.g., 131 and 133) of the write commands (e.g., 121 and 123) into pages located in different dies (e.g., 205 and 207). Thus, medium access collisions may be avoided.

FIG. 4 illustrates an example of a data structure configured to support dynamic data placement and input/output size control. For example, the data structure of FIG. 4 may be used to implement the media layout 130 of FIG. 2 or 3.

In FIG. 4, a zone map 301 is configured to provide media layout information for a zone (e.g., 211) in a namespace (e.g., 201). The zone map 301 may have multiple entries. Each entry in the zone map 301 identifies information about a zone (e.g., 211), such as a starting LBA address 311 of the zone (e.g., 211), a block set identifier 313 of the zone (e.g., 211), a cursor value 315 of the zone (e.g., 211), a status 317 of the zone (e.g., 211), and so forth.

The host system 120 begins writing data in the zone (e.g., 211) at the zone start LBA address 311. The host system 120 writes data in zones (e.g., 211) sequentially in LBA space. After a certain amount of data has been written into the region (e.g., 211), the current starting LBA address for writing subsequent data is identified by the cursor value 315. Each write command for a zone moves the cursor value 315 to the new starting LBA address for the next write command for the zone. State 317 may have a value indicating that the region (e.g., 211) is empty, full, implicitly open, explicitly open, closed, etc.

In fig. 4, logical-to-physical block mapping 303 is configured to facilitate translation of LBA addresses (e.g., 331) to physical addresses in the medium (e.g., 203).

Logical-to-physical block mapping 303 may have multiple entries. The LBA address (e.g., 331) may be used as or translated to an index to an entry in the logical-to-physical block mapping 303. The index may be used to look up an entry (e.g., 331) for the LBA address. Each entry in logical-to-physical block mapping 303 identifies, for an LBA address (e.g., 331), a physical address of a block of memory in a medium (e.g., 203). For example, the physical address of a memory block in the medium (e.g., 203) may include a die identifier 333, a block identifier 335, a page map entry identifier 337, and so on.

Die identifier 333 identifies a particular integrated circuit die (e.g., 205 or 207) in media 203 of memory subsystem 110.

The block identifier 335 identifies a particular memory block (e.g., NAND flash memory) within an integrated circuit die (e.g., 205 or 207) identified using the die identifier 333.

Page map entry identifier 337 identifies an entry in page map 305.

The page map 305 may have multiple entries. Each entry in the page map 305 may include a page identifier 351 that identifies a page of memory cells within a block of memory cells (e.g., NAND memory cells). For example, the page identifier 351 may include a word line number of a page and a sub-block number of a page in a block of NAND memory cells. Further, the entry for the page may include a programming mode 353 for the page. For example, a page may be programmed in SLC mode, MLC mode, TLC mode, or QLC mode. When configured in SLC mode, each memory cell in a page will store one bit of data. When configured in MLC mode, each memory cell in a page will store two bits of data. When configured in TLC mode, each memory cell in a page will store three bits of data. When configured in the QLC mode, each memory cell in the page will store four bits of data. Different pages in an integrated circuit die (e.g., 205 or 207) may have different modes for data programming.

In FIG. 4, the block set table 307 stores data control aspects of the dynamic media layout of the area (e.g., 211).

Block set table 307 may have multiple entries. Each entry in block set table 307 identifies a number/count 371 of integrated circuit dies (e.g., 205 and 207) in which to store data for a region (e.g., 211). For each integrated circuit die (e.g., 205 and 207) for a region (e.g., 211), the entries of block set table 307 have a die identifier 373, a block identifier 375, a page mapping entry identifier 377, and so on.

Die identifier 373 identifies the particular integrated circuit die (e.g., 205 or 207) in media 203 of memory subsystem 110 on which subsequent data for a zone (e.g., 211) may be stored.

The block identifier 375 identifies a particular block (e.g., 231 or 233) of memory (e.g., NAND flash memory) within the integrated circuit die (e.g., 205 or 207) identified using the die identifier 373 in which subsequent data for a zone (e.g., 211) can be stored (e.g., 231 or 233).

Page map entry identifier 337 identifies an entry in page map 305 that identifies a page (e.g., 241 or 241) that can be used to store subsequent data for a band (e.g., 211).

Fig. 5 shows a method of input/output size control. The method of fig. 5 may be performed by processing logic that may comprise hardware (e.g., processing device, circuitry, dedicated logic, programmable logic, microcode, hardware of a device, integrated circuits, etc.), software (e.g., instructions run or executed on a processing device), or a combination thereof. In some embodiments, the method of fig. 5 is performed at least in part by the input/output size manager 113 of fig. 1 or 2. Although shown in a particular sequence or order, the order of the processes may be modified unless otherwise specified. Thus, it is to be understood that the illustrated embodiments are examples only, and that the illustrated processes can be performed in a different order, and that some processes can be performed in parallel. In addition, one or more processes may be omitted in various embodiments. Thus, not all processes are required in every embodiment. Other process flows are also possible.

At block 401, the memory subsystem 110 receives a write command from the host system 120. For example, write commands may be received in multiple write streams. For example, each respective stream of the plurality of streams is configured to sequentially write data in a logical address space in one embodiment; and in another embodiment, the streams of the plurality of streams are configured to write data in a logical address space pseudo-sequentially or randomly in one embodiment. Each write stream includes a set of commands marked to write, trim, rewrite the data sets together as a group. In the group, data may be written sequentially, randomly, or pseudo-sequentially in the logical space. Preferably, the data in the group is written into a set of erase blocks, where the memory cells in the set of erase blocks store the data of the stream, but not the data from the other streams. The set of erase blocks may be erased to remove data of the stream without erasing data of other streams.

For example, write commands may be provided in multiple write streams. Each of the write streams is permitted to write sequentially at LBA addresses in a zone (e.g., 211) in an allocated namespace (e.g., 201) on media 203 of memory subsystem 110, but data is prohibited from being written out of order in the LBA address space.

At block 403, the memory subsystem 110 dynamically identifies a portion of the media layout 130 that maps from the logical address identified by the write command in the logical address space to a physical address of a memory cell in the media units 109A-109N in response to selecting the write command for execution in the media units 109A-109N of the memory subsystem 110. For example, portions of the media layout 130 may be dynamically identified in one embodiment, which may cause non-uniformity in page size for atomic data programming. In other embodiments, non-uniformity may be caused by structures and/or data programming schemes and/or sequences in the integrated circuit die.

At block 405, the input/output size manager 113 identifies a first input/output size (e.g., 143) for a next write command (e.g., 123) from the host system 120 based on the media physical layout (e.g., page map 305), wherein the first input/output size corresponds to an atomic unit of data programming in the media unit.

At block 407, the memory subsystem 110 transmits a response (e.g., 131) configured to identify at least a first input/output size (e.g., 143) to the host system 120. The host system 120 is configured to generate a next write command (e.g., 123) based on the first input/output size (e.g., 143) identified in the response.

At block 409, the memory subsystem 110 receives a next write command (e.g., 123) configured to instruct the memory subsystem to write an amount of data into the memory subsystem according to a first input/output size (e.g., 143) provided in a response (e.g., 131).

For example, the response (e.g., 131) is configured to include the state of a first write command (e.g., 121) processed in the memory subsystem 110. If the input/output size manager 113 determines that the first write command (e.g., 121) has a second input/output size (e.g., 143) that is different from the first input/output size. The input/output size manager 113 may be configured to respond (e.g., 131) to indicate that the second input/output size (e.g., 121) is incorrect, which may cause the host system 120 to transmit a next write command (e.g., 123) to replace the first write command (e.g., 121). Optionally, memory subsystem 110 may execute the first write command (e.g., 121) in a non-optimal manner, and send a response (e.g., 131) to indicate completion of execution of the first write command (e.g., 121), and provide a preferred size (e.g., 143) in the response (e.g., 131) to cause host system 120 to set the size of the write command (e.g., 123) for subsequent data according to the preferred size (e.g., 143).

A preferred input/output size (e.g., 143) may be determined based on the media layout 130 as the size of data that may be written into one of the media units 109A-109N in an atomic write operation. When memory cells cannot be programmed individually, groups of memory cells can be programmed atomically. For example, when a memory cell in a page of memory cells (e.g., 241) is programmed in an atomic write operation, the atomic write operation programs all memory cells in the page (e.g., 241). Thus, the preferred size of the input/output is the size of the data that can be stored into the entire set of atomically programmable memory cells in a page (e.g., 241). When a write command has an input/output size less than the preferred size, the storage capacity of the entire set of atomically programmable memory cells in a page (e.g., 241) is not fully used for the write operation. When the write command has an input/output size greater than the preferred size, the data of the write command will be programmed via a plurality of atomic write operations. Thus, some data of the write command may have to be buffered for a longer period of time in order to wait for the next atomic write operation.

In some cases, a page of memory cells (e.g., 241) is a multi-plane page that can be programmed in different modes using a multi-pass programming technique. For example, when in Single Level Cell (SLC) mode, each memory cell in a page is programmed to store a single bit of data; when in a multi-level cell (MLC) mode, each memory cell in a page is programmed to store two bits of data; when in a Three Level Cell (TLC) mode, each memory cell in a page is programmed to store three bits of data; and when in a four-level cell (QLC) mode, each memory cell in the page is programmed to store four bits of data. Thus, the next available multi-plane page may have different capacities to accept/store data for the programming mode. The input/output size manager 113 may determine a preferred size from the programming mode information (e.g., 353) in the page map 305 illustrated in FIG. 4.

In some cases, different memory cells may each have a page available. Different available pages in different memory cells can have different programming modes, and thus different sizes. The input/output size manager 113 may select the minimum size of the next available memory page as the preferred size (e.g., 143 or 145) communicated to the host system 120. The reduced preferred size provides the host system 120 with the opportunity to construct a write stream in the smallest possible size.

For example, in scheduling a first command for execution, a second command may be executed in a subset of memory units of the media of memory subsystem 110. Thus, the subset of memory cells used to execute the second command is not available for the first command. After scheduling the first command and determining a portion of the media layout for the logical address used in the first command, the first command may be executed concurrently in a plurality of media units and/or concurrently with the execution progress of the second command in the remaining media units of the memory subsystem 110.

For example, after identifying a plurality of memory units (e.g., integrated circuit dies) that are available to execute the next command, the input/output size manager 113 may identify a physical address from the block set table 307 that is available to store data for the next command. The physical address may be used to update a corresponding entry in logical-to-physical block mapping 303 for the LBA address used in the next command.

For example, when an integrated circuit die (e.g., 205) does not contain write data, the input/output size manager 113 may determine a command that may be written/programmed to a region in memory cells in the integrated circuit die (e.g., 205). According to the block set table 307, the input/output size manager 113 locates entries for a region (e.g., 205), locates a block identifier 375 and a page map entry identifier 377 associated with an identifier 373 of an integrated circuit die (e.g., 205), and uses the die identifier 373, the block identifier 375, and the page map entry identifier 377 for updating corresponding fields of entries in the logical-to-physical block map 303 for LBA addresses 331 used in commands for the region (e.g., 211). Thus, for LBA address 331, the command for a region (e.g., 211) can be performed without a media access conflict.

In some implementations, the communication channel between processing device 118 and memory subsystem 110 includes a computer network, such as a local area network, a wireless personal area network, a cellular communication network, a broadband high-speed always-on wireless communication connection (e.g., a current or future generation mobile network link); and the processing device 118 and memory subsystem may be configured to communicate with each other using data storage management and using commands similar to those in the NVMe protocol.

Memory subsystem 110 may typically have non-volatile storage media. Examples of non-volatile storage media include memory cells formed in integrated circuits and magnetic materials coated on hard disks. Non-volatile storage media can maintain data/information stored therein without consuming power. The memory cells may be implemented using various memory/storage technologies, such as NAND logic gates, "nor" logic gates, Phase Change Memories (PCMs), Magnetic Random Access Memories (MRAMs), resistive random access memories, cross-point storage devices, and memory devices (e.g., 3D XPoint memories). Cross-point memory devices use transistor-less memory elements, each of which has memory cells and selectors stacked together in columns. Columns of memory elements are connected via two vertical wire layers, with one layer above the columns of memory elements and the other layer below the columns of memory elements. Each memory element may be individually selected at the intersection of one line on each of the two layers. Cross-point memory devices are fast and non-volatile, and can be used as a general memory pool for processing and storage.

A controller (e.g., 115) of a memory subsystem (e.g., 110) may run firmware to perform operations in response to communications from processing device 118. Generally, firmware is a type of computer program that provides for the control, monitoring, and data manipulation of engineered computing devices.

Some embodiments relating to the operation of the controller 115 may be implemented using computer instructions executed by the controller 115 (e.g., firmware of the controller 115). In some cases, hardware circuitry may be used to implement at least some of the functions. The firmware may be initially stored in a non-volatile storage medium or another non-volatile device and loaded into volatile DRAM and/or in-processor cache memory for execution by the controller 115.

Non-transitory computer storage media may be used for instructions of firmware of a memory subsystem (e.g., 110). When executed by the controller 115 and/or the processing device 117, the instructions cause the controller 115 and/or the processing device 117 to perform the methods discussed above.

Fig. 6 illustrates an example machine of a computer system 500 within which a set of instructions for causing the machine to perform any one or more of the methodologies discussed herein may be executed. In some embodiments, the computer system 500 may correspond to a host system (e.g., the host system 120 of fig. 1) that includes, is coupled to, or uses a memory subsystem (e.g., the memory subsystem 110 of fig. 1) or may be used to perform operations of the input/output size manager 113 (e.g., execute instructions to perform operations corresponding to the input/output size manager 113 described with reference to fig. 1-5). In alternative embodiments, the machine may be connected (e.g., networked) to other machines in a LAN, an intranet, an extranet, and/or the internet. The machine may operate in the capacity of a server or a client machine in a client-server network environment, as a peer machine in a peer-to-peer (or distributed) network environment, or as a server or client machine in a cloud computing infrastructure or environment.

The machine may be a Personal Computer (PC), a tablet PC, a set-top box (STB), a Personal Digital Assistant (PDA), a cellular telephone, a web appliance, a server, a network router, switch or bridge, or any machine capable of executing a set of instructions (sequential or otherwise) that specify actions to be taken by that machine. Additionally, while a single machine is illustrated, the term "machine" shall also be taken to include any collection of machines that individually or jointly execute a set (or multiple sets) of instructions to perform any one or more of the methodologies discussed herein.

Example computer system 500 includes a processing device 502, a main memory 504 (e.g., Read Only Memory (ROM), flash memory, Dynamic Random Access Memory (DRAM) (e.g., synchronous DRAM (sdram) or Rambus DRAM (RDRAM)), etc.), Static Random Access Memory (SRAM), etc.), and a data storage system 518, which communicate with each other via a bus 530, which may include multiple buses.

Processing device 502 represents one or more general-purpose processing devices such as a microprocessor, central processing unit, or the like. More particularly, the processing device may be a Complex Instruction Set Computing (CISC) microprocessor, Reduced Instruction Set Computing (RISC) microprocessor, Very Long Instruction Word (VLIW) microprocessor, or processor implementing other instruction sets, or processors implementing a combination of instruction sets. The processing device 502 may also be one or more special-purpose processing devices such as an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA), a Digital Signal Processor (DSP), a network processor, or the like. The processing device 502 is configured to execute the instructions 526 for performing the operations and steps discussed herein. The computer system 500 may further include a network interface device 508 to communicate over a network 520.

The data storage system 518 may include a machine-readable storage medium 524 (also referred to as a computer-readable medium) on which is stored one or more sets of instructions 526 or software embodying any one or more of the methodologies or functions described herein. The instructions 526 may also reside, completely or at least partially, within the main memory 504 and/or within the processing device 502 during execution thereof by the computer system 500, the main memory 504 and the processing device 502 also constituting machine-readable storage media. The machine-readable storage media 524, data storage system 518, and/or main memory 504 may correspond to memory subsystem 110 of fig. 1.

In one embodiment, the instructions 526 include instructions to implement functions corresponding to the input/output size manager 113 (e.g., the input/output size manager 113 described with reference to fig. 1-5). While the machine-readable storage medium 524 is shown in an example embodiment to be a single medium, the term "machine-readable storage medium" should be taken to include a single medium or multiple media that store the one or more sets of instructions. The term "machine-readable storage medium" shall also be taken to include any medium that is capable of storing or encoding a set of instructions for execution by the machine and that cause the machine to perform any one or more of the methodologies of the present disclosure. The term "machine-readable storage medium" shall be taken to include, but not be limited to, solid-state memories, optical media, and magnetic media.

Some portions of the preceding detailed descriptions have been presented in terms of algorithms and symbolic representations of operations on data bits within a computer memory. These algorithmic descriptions and representations are the means used by those skilled in the data processing arts to most effectively convey the substance of their work to others skilled in the art. An algorithm is here, and generally, conceived to be a self-consistent sequence of operations leading to a desired result. The operations are those requiring physical manipulations of physical quantities. Usually, though not necessarily, these quantities take the form of electrical or magnetic signals capable of being stored, combined, compared, and otherwise manipulated. It has proven convenient at times, principally for reasons of common usage, to refer to these signals as bits, values, elements, symbols, characters, terms, numbers, or the like.

It should be borne in mind, however, that all of these and similar terms are to be associated with the appropriate physical quantities and are merely convenient labels applied to these quantities. The present disclosure may refer to the action and processes of a computer system, or similar electronic computing device, that manipulates and transforms data represented as physical (electronic) quantities within the computer system's registers and memories into other data similarly represented as physical quantities within the computer system memories or registers or other such information storage systems.

The present disclosure also relates to apparatus for performing the operations herein. This apparatus may be specially constructed for the required purposes, or it may comprise a general-purpose computer selectively activated or reconfigured by a computer program stored in the computer. Such a computer program may be stored in a computer readable storage medium, such as, but is not limited to, any type of disk including floppy disks, optical disks, CD-ROMs, and magnetic-optical disks, read-only memories (ROMs), Random Access Memories (RAMs), EPROMs, EEPROMs, magnetic or optical cards, or any type of media suitable for storing electronic instructions, and each coupled to a computer system bus.

The algorithms and displays presented herein are not inherently related to any particular computer or other apparatus. Various general-purpose systems may be used with programs in accordance with the teachings herein, or it may prove convenient to construct a more specialized apparatus to perform the method. The structure for a variety of these systems will be presented as set forth in the description below. In addition, the present disclosure is not described with reference to any particular programming language. It will be appreciated that a variety of programming languages may be used to implement the teachings of the disclosure as described herein.

The present disclosure may be provided as a computer program product or software which may include a machine-readable medium having stored thereon instructions which may be used to program a computer system (or other electronic devices) to perform a process according to the present disclosure. A machine-readable medium includes any mechanism for storing information in a form readable by a machine (e.g., a computer). In some embodiments, a machine-readable (e.g., computer-readable) medium includes a machine (e.g., computer) -readable storage medium, such as a read only memory ("ROM"), a random access memory ("RAM"), a magnetic disk storage medium, an optical storage medium, a flash memory device, and so forth.

In this specification, various functions and operations are described as being performed by or caused by computer instructions to simplify description. However, those skilled in the art will recognize that the intent of such expressions is that the functions result from execution of computer instructions by one or more controllers or processors (e.g., microprocessors). Alternatively or in combination, the functions and operations may be implemented using special purpose circuits, with or without software instructions, such as an Application Specific Integrated Circuit (ASIC) or a Field Programmable Gate Array (FPGA). Embodiments may be implemented using hardwired circuitry without software instructions or in combination with software instructions. Thus, the techniques are not limited to any specific combination of hardware circuitry and software, nor to any particular source for the instructions executed by the data processing system.

In the foregoing specification, embodiments of the disclosure have been described with reference to specific example embodiments thereof. It will be evident that various modifications may be made thereto without departing from the broader spirit and scope of embodiments of the disclosure as set forth in the following claims. The specification and drawings are, accordingly, to be regarded in an illustrative sense rather than a restrictive sense.