阅读说明：本技术 电路板用切割装置 (Cutting device for circuit board ) 是由 张钧诚 张家榕 陆萍 孙宇 蒋乔光 邬锡峰 于 2021-11-17 设计创作，主要内容包括：本发明属于电路板切割设备技术领域,具体涉及一种电路板用切割装置,本电路板用切割装置包括：安装架、输送机构、第一切割机构、第一打磨机构、第二切割机构和第二打磨机构；其中第一切割机构对线路板进行切割,以使第二切割机构对线路板的板面上引脚进行切除,且第二打磨机构对第二切割机构进行打磨；以及分别翻转、移动第一切割机构、第二切割机构；第一打磨机构对第一切割机构进行打磨；本发明通过输送机构、第一切割机构、第二切割机构能够在一套设备上快速完成线路板切割、切除引脚的两道工序,并且线路板切割、切除引脚能够同时进行,并且通过设置第一打磨机构、第二切割机构能够间隔性打磨第一切割机构、第二切割机构,能够保证切割品质。(The invention belongs to the technical field of circuit board cutting equipment, and particularly relates to a cutting device for a circuit board, which comprises: the device comprises a mounting frame, a conveying mechanism, a first cutting mechanism, a first polishing mechanism, a second cutting mechanism and a second polishing mechanism; the first cutting mechanism cuts the circuit board so that the second cutting mechanism cuts pins on the board surface of the circuit board, and the second polishing mechanism polishes the second cutting mechanism; the first cutting mechanism and the second cutting mechanism are respectively turned over and moved; the first grinding mechanism is used for grinding the first cutting mechanism; according to the invention, two processes of cutting and cutting off the pins of the circuit board can be rapidly completed on one set of equipment through the conveying mechanism, the first cutting mechanism and the second cutting mechanism, the cutting and cutting off of the pins of the circuit board can be simultaneously performed, and the first cutting mechanism and the second cutting mechanism can be polished at intervals through the arrangement of the first polishing mechanism and the second cutting mechanism, so that the cutting quality can be ensured.)

1. A cutting device for a circuit board, comprising:

the device comprises a mounting frame, a conveying mechanism, a first cutting mechanism, a first polishing mechanism, a second cutting mechanism and a second polishing mechanism; wherein

The conveying mechanism is mounted on the mounting frame, the first cutting mechanism and the second cutting mechanism are respectively located on two sides of the conveying mechanism, the first polishing mechanism is located on the mounting frame below the side, corresponding to the first cutting mechanism, of the conveying mechanism, and the second polishing mechanism is located on the mounting frame below the side, corresponding to the second cutting mechanism, of the conveying mechanism;

a first material port and a second material port are respectively arranged on the conveying mechanism corresponding to the two sides of the first cutting mechanism and the second cutting mechanism;

when the conveying mechanism advances towards the second cutting mechanism along the first cutting mechanism, the circuit board enters the first material port from the direction perpendicular to the conveying direction of the conveying mechanism, so that the first cutting mechanism cuts the circuit board, the conveying mechanism conveys the cut circuit board to the second material port, so that the second cutting mechanism cuts pins on the board surface of the circuit board, and the second polishing mechanism polishes the second cutting mechanism; and

when conveying mechanism advances along second cutting mechanism towards first cutting mechanism, overturn respectively, remove first cutting mechanism, second cutting mechanism, the circuit board from with conveying mechanism's direction of delivery looks vertically gets into the second material mouth, so that second cutting mechanism cuts the circuit board, conveying mechanism carries the circuit board after the cutting to first material mouth department, so that first cutting mechanism excises the pin on the face of circuit board, just first grinding mechanism polishes first cutting mechanism.

2. The cutting device for circuit board according to claim 1,

the first cutting mechanism is the same as the second cutting mechanism in structure, and the first cutting mechanism includes:

the cutting machine comprises a first rotating motor, a first cutting disk and a second cutting disk;

the first cutting disk and the second cutting disk are coaxially arranged, and the movable part of the first rotating motor is connected with the first cutting disk and the second cutting disk;

when the first cutting circular disc is perpendicular to the conveying mechanism, the first rotating motor drives the first cutting circular disc to cut the circuit board moving towards the first material opening;

when the second cutting disk is arranged in parallel with the conveying mechanism, the first rotating motor drives the second cutting disk to cut off pins on the board surface of the circuit board moving outwards from the first material opening.

3. The cutting device for circuit board according to claim 2,

the first rotating motor is fixed on the first driving part, and the first driving part drives the first rotating motor to turn over and move so as to drive the first cutting disk and the second cutting disk which are movably connected with the first rotating motor to turn over and move, namely

When the conveying mechanism advances towards the second cutting mechanism along the first cutting mechanism, the first driving part drives the first rotating motor to turn and move so that the first cutting circular disc is perpendicular to the conveying mechanism;

when the conveying mechanism advances towards the first cutting mechanism along the second cutting mechanism, the first driving part drives the first rotating motor to turn and move so that the second cutting disk is parallel to the conveying mechanism.

4. The cutting device for circuit board according to claim 3,

the second cutting mechanism includes: a second rotating motor, a third cutting disk and a fourth cutting disk;

the second rotating motor is fixed on the second driving part, and the second driving part drives the second rotating motor to turn over and move so as to drive the third cutting disk and the fourth cutting disk which are movably connected with the second rotating motor to turn over and move, namely

When the conveying mechanism advances towards the second cutting mechanism along the first cutting mechanism, the second driving part drives the second rotating motor to turn and move so that the fourth cutting disk is parallel to the conveying mechanism;

when the conveying mechanism advances towards the first cutting mechanism along the second cutting mechanism, the second driving part drives the second rotating motor to turn and move, so that the third cutting disk is perpendicular to the conveying mechanism.

5. The cutting device for circuit board according to claim 3,

a sleeve box is arranged between the first rotating motor and the second cutting disk;

the second cutting disc is provided with two through holes, and the two through holes are symmetrical about the circle center of the second cutting disc;

the sleeve box is hinged with two cleaning blocks, and the two cleaning blocks are suitable for rotating in the two through holes respectively;

two springs are arranged in the sleeve box, one end of each spring is fixed in the sleeve box through a corresponding connecting piece, and the other end of each spring props against one end of a corresponding cleaning block;

a U-shaped push plate is arranged between the inner wall of the sleeve box and the first rotating motor, a pushing cylinder is arranged on the first rotating motor, the movable part of the pushing cylinder is connected with the U-shaped push plate, and two sides of the U-shaped push plate are respectively arranged towards the other ends of the two cleaning blocks;

when the pushing cylinder drives the U-shaped push plate to move forwards, so that two sides of the U-shaped push plate respectively abut against the two cleaning blocks to move forwards, the two cleaning blocks extrude the corresponding springs and rotate around the corresponding through holes until the U-shaped push plate respectively abuts against and pushes the two cleaning blocks to contact with the cutting circumference of the second cutting disk, namely

And the cutting circumference of the second cutting disk is cleaned and polished by two cleaning blocks.

6. The cutting device for circuit board according to claim 5,

each cleaning block is provided with a cutting edge;

when the springs are in the initial state and abut against the cleaning block, the cutting edges of the cleaning block are exposed out of the corresponding through holes, and the first driving part is also suitable for driving the first rotating motor to turn and move so that the first material opening is positioned between the first cutting disk and the second cutting disk, namely the first material opening is positioned between the first cutting disk and the second cutting disk

The first rotating motor drives the second cutting disk to rotate and is matched with the first driving part to press downwards, so that the corresponding cutting edge of each cleaning block performs semicircular cutting along the edge of the circuit board.

7. The cutting device for circuit board according to claim 1,

the side edges of the first material port and the second material port are respectively provided with a first feeding component and a second feeding component;

the first feeding assembly and the second feeding assembly are identical in structure, and the first feeding assembly comprises:

a feeding cylinder and a feeding plate;

the movable part of the feeding cylinder is connected with a feeding plate, and the feeding cylinder pushes the feeding plate to enable the circuit board to enter a first material port along a direction perpendicular to the conveying direction of the conveying mechanism, so that the first cutting mechanism cuts the circuit board;

when the first cutting mechanism cuts off pins on the board surface of the circuit board, the feeding air cylinder pushes the feeding board to push the circuit board out from the first material opening along the direction vertical to the conveying direction of the conveying mechanism.

8. The cutting device for circuit board according to claim 1,

the conveying mechanism includes: an endless conveyor belt;

the annular conveyer belt conveys the circuit board entering from the first material opening to the second material opening, or

And the annular conveying belt conveys the circuit board entering from the second material port to the first material port.

9. The cutting device for circuit board according to claim 4,

the first grinding mechanism includes: the first sanding block is positioned on the mounting frame below the corresponding side of the conveying mechanism and the first cutting mechanism;

the second grinding mechanism includes: the second grinding block is positioned on the mounting rack below the corresponding side of the conveying mechanism and the second cutting mechanism;

when the first driving part drives the first rotating motor to overturn and move so that the second cutting disk is parallel to the conveying mechanism, the cutting circumference of the first cutting disk contacts the first polishing block, so that the first polishing block polishes the cutting circumference of the rotating first cutting disk;

when the second driving part drives the second rotating motor to overturn and move to enable the fourth cutting disk to be parallel to the conveying mechanism, the cutting circumference of the third cutting disk contacts the first polishing block, so that the second polishing block polishes the cutting circumference of the rotating third cutting disk.

10. The cutting device for circuit board according to claim 9,

and the first polishing block and the second polishing block are both provided with polishing grooves, and the polishing grooves are V-shaped, so that the cutting circumferences of the first cutting disc and the third cutting disc are embedded into and contact with the polishing grooves.

Technical Field

The invention belongs to the technical field of circuit board cutting equipment, and particularly relates to a cutting device for a circuit board.

Background

The integrated circuit boards are produced in batches, pins of the integrated circuit boards need to be cut and cut off, the existing circuit board cutting equipment can only cut the circuit boards, the pins of the circuit boards need to be cut off by additional equipment, and two procedures cannot be processed simultaneously.

Meanwhile, after the existing circuit board cutting equipment is used for a long time, the cutting tool is easy to become dull or the cutting edge is turned over, so that the cutting quality is influenced.

Therefore, it is desirable to develop a new cutting device for circuit board to solve the above problems.

Disclosure of Invention

The invention aims to provide a cutting device for a circuit board.

In order to solve the above technical problem, the present invention provides a cutting device for a circuit board, comprising: the device comprises a mounting frame, a conveying mechanism, a first cutting mechanism, a first polishing mechanism, a second cutting mechanism and a second polishing mechanism; the conveying mechanism is mounted on the mounting frame, the first cutting mechanism and the second cutting mechanism are respectively located on two sides of the conveying mechanism, the first grinding mechanism is located on the mounting frame below the corresponding side of the conveying mechanism and the first cutting mechanism, and the second grinding mechanism is located on the mounting frame below the corresponding side of the conveying mechanism and the second cutting mechanism; a first material port and a second material port are respectively arranged on the conveying mechanism corresponding to the two sides of the first cutting mechanism and the second cutting mechanism; when the conveying mechanism advances towards the second cutting mechanism along the first cutting mechanism, the circuit board enters the first material port from the direction perpendicular to the conveying direction of the conveying mechanism, so that the first cutting mechanism cuts the circuit board, the conveying mechanism conveys the cut circuit board to the second material port, so that the second cutting mechanism cuts pins on the board surface of the circuit board, and the second polishing mechanism polishes the second cutting mechanism; and when the conveying mechanism advances towards the first cutting mechanism along the second cutting mechanism, the first cutting mechanism and the second cutting mechanism are respectively overturned and moved, the circuit board enters the second material port from the direction vertical to the conveying direction of the conveying mechanism, so that the second cutting mechanism cuts the circuit board, the conveying mechanism conveys the cut circuit board to the first material port, so that the first cutting mechanism cuts the pins on the board surface of the circuit board, and the first grinding mechanism polishes the first cutting mechanism.

Further, the first cutting mechanism and the second cutting mechanism have the same structure, and the first cutting mechanism includes: the cutting machine comprises a first rotating motor, a first cutting disk and a second cutting disk; the first cutting disk and the second cutting disk are coaxially arranged, and the movable part of the first rotating motor is connected with the first cutting disk and the second cutting disk; when the first cutting circular disc is perpendicular to the conveying mechanism, the first rotating motor drives the first cutting circular disc to cut the circuit board moving towards the first material opening; when the second cutting disk is arranged in parallel with the conveying mechanism, the first rotating motor drives the second cutting disk to cut off pins on the board surface of the circuit board moving outwards from the first material opening.

Further, the first rotating motor is fixed on the first driving part, the first driving part drives the first rotating motor to turn and move so as to drive the first cutting disk and the second cutting disk which are movably connected with the first rotating motor to turn and move, namely when the conveying mechanism advances towards the second cutting mechanism along the first cutting mechanism, the first driving part drives the first rotating motor to turn and move so as to enable the first cutting disk to be perpendicular to the conveying mechanism; when the conveying mechanism advances towards the first cutting mechanism along the second cutting mechanism, the first driving part drives the first rotating motor to turn and move so that the second cutting disk is parallel to the conveying mechanism.

Further, the second cutting mechanism includes: a second rotating motor, a third cutting disk and a fourth cutting disk; the second rotating motor is fixed on the second driving part, the second driving part drives the second rotating motor to turn and move so as to drive the third cutting disk and the fourth cutting disk which are movably connected with the second rotating motor to turn and move, namely when the conveying mechanism advances towards the second cutting mechanism along the first cutting mechanism, the second driving part drives the second rotating motor to turn and move so as to enable the fourth cutting disk to be parallel to the conveying mechanism; when the conveying mechanism advances towards the first cutting mechanism along the second cutting mechanism, the second driving part drives the second rotating motor to turn and move, so that the third cutting disk is perpendicular to the conveying mechanism.

Further, a sleeve box is arranged between the first rotating motor and the second cutting disk; the second cutting disc is provided with two through holes, and the two through holes are symmetrical about the circle center of the second cutting disc; the sleeve box is hinged with two cleaning blocks, and the two cleaning blocks are suitable for rotating in the two through holes respectively; two springs are arranged in the sleeve box, one end of each spring is fixed in the sleeve box through a corresponding connecting piece, and the other end of each spring props against one end of a corresponding cleaning block; a U-shaped push plate is arranged between the inner wall of the sleeve box and the first rotating motor, a pushing cylinder is arranged on the first rotating motor, the movable part of the pushing cylinder is connected with the U-shaped push plate, and two sides of the U-shaped push plate are respectively arranged towards the other ends of the two cleaning blocks; when the pushing cylinder drives the U-shaped push plate to move forwards, two sides of the U-shaped push plate respectively abut against the two cleaning blocks to move forwards, so that the two cleaning blocks extrude the corresponding springs and rotate around the corresponding through holes, until the U-shaped push plate respectively abuts against and pushes the two cleaning blocks to contact with the cutting circumference of the second cutting disk, namely the cutting circumference of the second cutting disk is cleaned and polished by the two cleaning blocks.

Furthermore, each cleaning block is provided with a cutting edge; when the springs are in an initial state and abut against the cleaning blocks, the cutting edges of the cleaning blocks are exposed out of the corresponding through holes, the first driving portion is further suitable for driving the first rotating motor to turn and move, so that the first material opening is located between the first cutting disk and the second cutting disk, namely the first rotating motor drives the second cutting disk to rotate and is matched with the first driving portion to press downwards, and the corresponding cutting edges of the cleaning blocks are subjected to semicircular cutting along the edge of the circuit board.

Furthermore, the side edges of the first material port and the second material port are respectively provided with a first feeding component and a second feeding component; the first feeding assembly and the second feeding assembly are identical in structure, and the first feeding assembly comprises: a feeding cylinder and a feeding plate; the movable part of the feeding cylinder is connected with a feeding plate, and the feeding cylinder pushes the feeding plate to enable the circuit board to enter a first material port along a direction perpendicular to the conveying direction of the conveying mechanism, so that the first cutting mechanism cuts the circuit board; when the first cutting mechanism cuts off pins on the board surface of the circuit board, the feeding air cylinder pushes the feeding board to push the circuit board out from the first material opening along the direction vertical to the conveying direction of the conveying mechanism.

Further, the conveying mechanism includes: an endless conveyor belt; the circuit board that the annular conveyer belt will get into from first material mouth is carried to the second material mouth, perhaps the annular conveyer belt carries the circuit board that gets into from the second material mouth to first material mouth.

Further, the first grinding mechanism includes: the first sanding block is positioned on the mounting frame below the corresponding side of the conveying mechanism and the first cutting mechanism; the second grinding mechanism includes: the second grinding block is positioned on the mounting rack below the corresponding side of the conveying mechanism and the second cutting mechanism; when the first driving part drives the first rotating motor to overturn and move so that the second cutting disk is parallel to the conveying mechanism, the cutting circumference of the first cutting disk contacts the first polishing block, so that the first polishing block polishes the cutting circumference of the rotating first cutting disk; when the second driving part drives the second rotating motor to overturn and move to enable the fourth cutting disk to be parallel to the conveying mechanism, the cutting circumference of the third cutting disk contacts the first polishing block, so that the second polishing block polishes the cutting circumference of the rotating third cutting disk.

Furthermore, all be provided with the recess of polishing on first sanding block, the second sanding block, just the recess of polishing is the V-arrangement, so that the cutting circumference of first cutting disc, the cutting circumference embedding of third cutting disc and contact the recess of polishing.

The circuit board cutting and pin cutting device has the advantages that two processes of cutting and pin cutting of a circuit board can be rapidly completed on one set of equipment through the conveying mechanism, the first cutting mechanism and the second cutting mechanism, the cutting and the pin cutting of the circuit board can be simultaneously performed, the first cutting mechanism and the second cutting mechanism can be polished at intervals through the first polishing mechanism and the second polishing mechanism, the cutting quality can be guaranteed, and the cutting efficiency can be improved.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a structural view of a cutting apparatus for a circuit board of the present invention;

fig. 2 is an isometric view of a cutting device for a circuit board of the present invention;

FIG. 3 is a partial view of a first cutting mechanism of the present invention;

FIG. 4 is a block diagram of a first cutting mechanism of the present invention;

FIG. 5 is a block diagram of the U-shaped pusher plate of the present invention;

fig. 6 is a structural view of the first grinding mechanism of the present invention.

In the figure:

a mounting frame 1;

the device comprises a conveying mechanism 2, a first material opening 200, a second material opening 210 and an annular conveying belt 220;

the cutting device comprises a first cutting mechanism 3, a first rotating motor 300, a first cutting disc 310, a first cutting knife 311, a second cutting disc 320, a through hole 321, a second cutting knife 322, a sleeve box 330, a cleaning block 340, a spring 350, a U-shaped push plate 360 and a pushing cylinder 370;

the first grinding mechanism 4, the first grinding block 400 and the grinding groove 401;

a second cutting mechanism 5, a second rotating motor 500, a third cutting disk 510, a fourth cutting disk 520;

a second grinding mechanism 6, a second grinding block 600;

a first drive unit 7;

a second drive section 8;

the first feeding assembly 9, the feeding cylinder 900 and the feeding plate 910;

a second feed assembly 10.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

In this embodiment, as shown in fig. 1 to 6, the present embodiment provides a cutting device for a circuit board, including: the device comprises a mounting frame 1, a conveying mechanism 2, a first cutting mechanism 3, a first polishing mechanism 4, a second cutting mechanism 5 and a second polishing mechanism 6; the conveying mechanism 2 is mounted on the mounting frame 1, the first cutting mechanism 3 and the second cutting mechanism 5 are respectively located on two sides of the conveying mechanism 2, the first polishing mechanism 4 is located on the mounting frame 1 below the side, corresponding to the first cutting mechanism 3, of the conveying mechanism 2, and the second polishing mechanism 6 is located on the mounting frame 1 below the side, corresponding to the second cutting mechanism 5, of the conveying mechanism 2; a first material opening 200 and a second material opening 210 are respectively arranged on the conveying mechanism 2 corresponding to the two sides of the first cutting mechanism 3 and the second cutting mechanism 5; when the conveying mechanism 2 advances towards the second cutting mechanism 5 along the first cutting mechanism 3, the circuit board enters the first material port 200 from a direction perpendicular to the conveying direction of the conveying mechanism 2, so that the circuit board is cut by the first cutting mechanism 3, the conveying mechanism 2 conveys the cut circuit board to the second material port 210, so that pins on the board surface of the circuit board are cut by the second cutting mechanism 5, and the second grinding mechanism 6 grinds the second cutting mechanism 5; and when conveying mechanism 2 advances towards first cutting mechanism 3 along second cutting mechanism 5, overturns respectively, removes first cutting mechanism 3, second cutting mechanism 5, the circuit board from with conveying mechanism 2's direction of delivery looks vertically gets into second material mouth 210, so that second cutting mechanism 5 cuts the circuit board, conveying mechanism 2 carries the circuit board after cutting to first material mouth 200 department, so that first cutting mechanism 3 excises the pin on the face of circuit board, just first grinding mechanism 4 polishes first cutting mechanism 3.

In this embodiment, this embodiment can accomplish the twice process of circuit board cutting, excision pin fast on a set of equipment through conveying mechanism 2, first cutting mechanism 3, second cutting mechanism 5 to circuit board cutting, excision pin can go on simultaneously, and can interval nature polish first cutting mechanism 3, second cutting mechanism 5 through setting up first grinding mechanism 4, second grinding mechanism 6, can guarantee the cutting quality, improve cutting efficiency.

Mounting frame 1

The mounting frame 1 mainly plays a role in mounting and can be used for mounting the conveying mechanism 2, the first grinding mechanism 4 and the second grinding mechanism 6.

Conveying mechanism 2

The conveying mechanism 2 mainly plays a conveying role, when the conveying mechanism 2 advances towards the second cutting mechanism 5 along the first cutting mechanism 3, the first cutting mechanism 3 at the first material port 200 realizes the function of cutting the circuit board, and the second cutting mechanism 5 at the second material port 210 realizes the function of cutting the pins on the circuit board; when the conveying mechanism 2 advances towards the first cutting mechanism 3 along the second cutting mechanism 5, the second cutting mechanism 5 at the second material port 210 realizes the function of cutting the circuit board, and the first cutting mechanism 3 at the first material port 200 realizes the function of cutting off the pins on the circuit board.

First cutting mechanism 3

The first cutting mechanism 3 mainly plays a role in cutting the circuit board and cutting pins on the circuit board, and different functions are realized by turning and moving the first cutting mechanism 3.

First grinding mechanism 4

The first grinding mechanism 4 can play a role in grinding the first cutting mechanism 3, and the first cutting mechanism 3 is guaranteed to normally work.

Second cutting mechanism 5

The second cutting mechanism 5 mainly plays a role in cutting the circuit board and cutting off pins on the circuit board, and different functions are realized by turning over and moving the second cutting mechanism 5.

Second grinding mechanism 6

The second grinding mechanism 6 can play a role in grinding the second cutting mechanism 5, and the second cutting mechanism 5 is guaranteed to normally work.

In the present embodiment, the first cutting mechanism 3 and the second cutting mechanism 5 have the same structure, and the first cutting mechanism 3 includes: a first rotating motor 300, a first cutting disk 310, a second cutting disk 320; the first cutting disk 310 and the second cutting disk 320 are coaxially arranged, and the movable part of the first rotating motor 300 is connected with the first cutting disk 310 and the second cutting disk 320; when the first cutting disk 310 is arranged perpendicular to the conveying mechanism 2, the first rotating motor 300 drives the first cutting disk 310 to cut the circuit board moving towards the first material opening 200; when the second cutting disk 320 is arranged parallel to the conveying mechanism 2, the first rotating motor 300 drives the second cutting disk 320 to cut off the pins on the board surface of the circuit board moving outwards from the first material opening 200.

In this embodiment, the diameter of the second cutting disk 320 is not larger than that of the first cutting disk 310, that is, the diameter of the second cutting disk 320 is smaller than that of the first cutting disk 310, so that when the first cutting mechanism 3 performs a cutting function, only the first cutting disk 310 cuts the circuit board, so that the circuit board pieces cut from the whole circuit board pieces enter the conveying mechanism 2 from the first material opening 200.

In this embodiment, the cutting circumference of the first cutting disk 310 and the cutting circumference of the second cutting disk 320 are cutting tools, respectively, so as to cut the circuit board and cut off the pins on the circuit board.

In this embodiment, when the second cutting disk 320 is disposed parallel to the conveying mechanism 2, the surface of the circuit board is flush with the second cutting disk 320, so as to cut off the pins on the circuit board.

In this embodiment, the first rotating motor 300 is fixed on the first driving portion 7, the first driving portion 7 drives the first rotating motor 300 to turn and move, so as to drive the first cutting disk 310 and the second cutting disk 320 movably connected to the first rotating motor 300 to turn and move, that is, when the conveying mechanism 2 travels along the first cutting mechanism 3 toward the second cutting mechanism 5, the first driving portion 7 drives the first rotating motor 300 to turn and move, so as to make the first cutting disk 310 perpendicular to the conveying mechanism 2; when the conveying mechanism 2 advances toward the first cutting mechanism 3 along the second cutting mechanism 5, the first driving unit 7 drives the first rotating motor 300 to turn and move so that the second cutting disk 320 is parallel to the conveying mechanism 2.

In the present embodiment, the first drive portion 7 includes: the turnover mechanism comprises a longitudinal moving guide rail, a transverse moving guide rail movably arranged on the longitudinal moving guide rail and a turnover motor movably arranged on the transverse moving guide rail; the driving shaft of the turnover motor is connected with the first rotating motor 300, namely, the transverse moving guide rail is suitable for moving on the longitudinal moving guide rail, the turnover motor is suitable for moving on the transverse moving guide rail, and the turnover motor is suitable for driving the first rotating motor 300 to turn over; the first driving part 7 can drive the first rotating motor 300 to rotate and translate, so as to change the positions of the first cutting disk 310 and the second cutting disk 320.

In the present embodiment, the second cutting mechanism 5 includes: a second rotary motor 500, a third cutting disk 510, a fourth cutting disk 520; the second rotating motor 500 is fixed on the second driving part 8, the second driving part 8 drives the second rotating motor 500 to turn and move so as to drive the third cutting disk 510 and the fourth cutting disk 520 which are movably connected with the second rotating motor 500 to turn and move, that is, when the conveying mechanism 2 advances along the first cutting mechanism 3 towards the second cutting mechanism 5, the second driving part 8 drives the second rotating motor 500 to turn and move so as to make the fourth cutting disk 520 parallel to the conveying mechanism 2; when the conveying mechanism 2 advances toward the first cutting mechanism 3 along the second cutting mechanism 5, the second driving part 8 drives the second rotating motor 500 to turn and move, so that the third cutting disk 510 is perpendicular to the conveying mechanism 2.

In this embodiment, the second driving portion 8 realizes the turning and translation of the second rotating motor 500 through the corresponding guide rail, motor and cylinder, so as to drive the third cutting disk 510 and the fourth cutting disk 520 to change their positions.

In the present embodiment, a cartridge 330 is disposed between the first rotating motor 300 and the second cutting disk 320; the second cutting disk 320 is provided with two through holes 321, and the two through holes 321 are symmetrical with respect to the center of the second cutting disk 320; two cleaning blocks 340 are hinged on the sleeve 330, and the two cleaning blocks 340 are suitable for rotating in the two through holes 321 respectively; two springs 350 are arranged in the sleeve 330, one end of each spring 350 is fixed in the sleeve 330 through a corresponding connecting piece, and the other end of each spring 350 is propped against one end of a corresponding cleaning block 340; a U-shaped push plate 360 is arranged between the inner wall of the sleeve 330 and the first rotating motor 300, a push cylinder 370 is arranged on the first rotating motor 300, the movable part of the push cylinder 370 is connected with the U-shaped push plate 360, and two sides of the U-shaped push plate 360 are respectively arranged towards the other ends of the two cleaning blocks 340; when the pushing cylinder 370 drives the U-shaped pushing plate 360 to move forward, two sides of the U-shaped pushing plate 360 respectively abut against the two cleaning blocks 340 to move forward, so that the two cleaning blocks 340 press the corresponding springs 350 and rotate around the corresponding through holes 321, until the U-shaped pushing plate 360 respectively abuts against and pushes the two cleaning blocks 340 to contact with the cutting circumference of the second cutting disk 320, that is, the cutting circumference of the second cutting disk 320 is cleaned and polished by the two cleaning blocks 340.

In this embodiment, the cleaning blocks 340 are hinged to the sleeve 330, and the contact point of the U-shaped push plate 360 and the cleaning block 340 on any cleaning block and the contact point of the spring 350 and the cleaning block 340 on any cleaning block are respectively located at two sides of the hinge point of the cleaning block 340 and the sleeve 330, and in an initial state, the spring 350 and the cleaning block 340 are balanced, and when the U-shaped push plate 360 moves forward, the two cleaning blocks 340 are driven to move forward, so that the cleaning block 340 rotates around the hinge point until contacting the cutting circumference of the second cutting disk 320.

In this embodiment, the cleaning block 340 plays a role in cleaning and polishing the cutting circumference of the second cutting disk 320, so as to ensure the sharpness and cleanliness of the cutting circumference of the second cutting disk 320, and reduce the possibility of cracking when cutting the pins on the circuit board, so that the cut is smooth and the cutting quality is high.

In the embodiment, the sleeve 330 is used for installation, the cleaning block 340 is hinged with the sleeve 330 through the cleaning block 340, and the spring 350 is used for changing the position of the cleaning block 340, so that the cleaning block 340 can clean and grind the second cutting disk 320.

In this embodiment, each cleaning block 340 has a cutting edge; when the springs 350 are in the initial state and abut against the cleaning blocks 340, the cutting edges of the cleaning blocks 340 are exposed from the corresponding through holes 321, and the first driving part 7 is further adapted to drive the first rotating motor 300 to turn and move, so that the first material opening 200 is located between the first cutting disk 310 and the second cutting disk 320, that is, the first rotating motor 300 drives the second cutting disk 320 to rotate and cooperates with the first driving part 7 to press downwards, so that the corresponding cutting edges of the cleaning blocks 340 perform semicircular cutting along the edge of the circuit board.

In this embodiment, the cleaning block 340 and its connected components are driven by another rotating motor, when the cleaning block 340 polishes the cut circumference of the second cutting disk 320, the rotating motor does not operate, the first rotating motor drives the second cutting disk 320 to operate, so as to realize the polishing of the cut circumference of the second cutting disk 320 by the cleaning block 340; the rotating motor is rotated in synchronization with the first rotating motor when the cutting edges of the cleaning blocks 340 are exposed from the corresponding through-holes 321, so that the corresponding cutting edges of the respective cleaning blocks 340 perform semicircular cutting along the edge of the circuit board.

The cutting device comprises a first cutting mechanism 3, a first rotating motor 300, a first cutting disc 310, a first cutting knife 311, a second cutting disc 320, a through hole 321, a second cutting knife 322, a sleeve box 330, a cleaning block 340, a spring 350, a U-shaped push plate 360 and a pushing cylinder 370;

in this embodiment, cleaning block 340 can realize cutting the semicircular cut, improves the cutting variety for processing is more nimble.

In this embodiment, the side edges of the first material opening 200 and the second material opening 210 are respectively provided with a first feeding component 9 and a second feeding component 10; the first feeding assembly 9 and the second feeding assembly 10 have the same structure, and the first feeding assembly 9 comprises: a feed cylinder 900 and a feed plate 910; the movable part of the feeding cylinder 900 is connected with the feeding plate 910, and the feeding cylinder 900 pushes the feeding plate 910 to feed the circuit board into the first material port 200 along the direction perpendicular to the conveying direction of the conveying mechanism 2, so that the first cutting mechanism 3 cuts the circuit board; after the first cutting mechanism 3 cuts off the pins on the board surface of the circuit board, the feeding cylinder 900 pushes the feeding board 910 to push the circuit board out from the first material opening 200 along the direction perpendicular to the conveying direction of the conveying mechanism 2.

In this embodiment, the first feeding assembly 9 and the second feeding assembly 10 are arranged to realize processing automation, so that the safety risk of manual feeding and discharging is overcome.

In the present embodiment, the conveying mechanism 2 includes: an endless conveyor belt 220; the endless conveyor belt 220 conveys the circuit board entering from the first material opening 200 to the second material opening 210, or the endless conveyor belt 220 conveys the circuit board entering from the second material opening 210 to the first material opening 200.

In this embodiment, the endless conveyor belt 220 functions as an automated transport.

In the present embodiment, the first grinding mechanism 4 includes: a first sanding block 400 positioned on the mounting frame 1 below the side of the conveying mechanism 2 corresponding to the first cutting mechanism 3; the second grinding mechanism 6 includes: the second grinding block 600 is positioned on the mounting frame 1 below the corresponding side of the conveying mechanism 2 and the second cutting mechanism 5; when the first driving part 7 drives the first rotating motor 300 to turn and move so that the second cutting disk 320 is parallel to the conveying mechanism 2, the cutting circumference of the first cutting disk 310 contacts the first polishing block 400, so that the first polishing block 400 polishes the cutting circumference of the rotating first cutting disk 310; when the second driving part 8 drives the second rotating motor 500 to turn and move so that the fourth cutting disk 520 is parallel to the conveying mechanism 2, the cutting circumference of the third cutting disk 510 contacts the first sanding block 400, so that the second sanding block 600 sands the cutting circumference of the rotating third cutting disk 510.

In this embodiment, the first and second polishing blocks 400 and 600 are provided with polishing grooves 401, and the polishing grooves 401 are V-shaped, so that the cutting circumferences of the first and third cutting disks 310 and 510 are inserted into and contact with the polishing grooves 401.

In this embodiment, the cutting circumference of the first cutting disk 310 is the first cutting knife 311, and the cutting circumference of the third cutting disk 510 is the second cutting knife 322.

In this embodiment, the grinding grooves 401 are V-shaped, so that the cutting circumferences of the first cutting disk 310 and the third cutting disk 510 are matched, and the grinding effect is improved.

In summary, the present invention can rapidly complete two steps of cutting and cutting off the pins of the circuit board on one set of equipment through the conveying mechanism, the first cutting mechanism and the second cutting mechanism, and the cutting and cutting off of the pins of the circuit board can be simultaneously performed, and the first cutting mechanism and the second cutting mechanism can be polished at intervals through the first polishing mechanism and the second polishing mechanism, so as to ensure the cutting quality and improve the cutting efficiency.

The components selected for use in the present application (components not illustrated for specific structures) are all common standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experimentation.

In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.

In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.