阅读说明：本技术 一种通讯接口电路模块及制作方法 (Communication interface circuit module and manufacturing method ) 是由 衣男 黄桂龙 唐艺菁 刘星 赵亚玲 于 2021-07-27 设计创作，主要内容包括：本发明提供一种通讯接口电路模块及制作方法,本发明所述的通讯接口电路模块,将用于实现通讯功能所需的所有芯片及标准封装器件集成在一个PCB板上,使用时,将整个通讯接口电路模块安装在印制板上,相对与现有的将芯片和封装器件各自独立的设置在印制板上使用,本发明占用板面积更小,在减小板面积的同时还能腾出更多空间来发挥其他组件的功能,并且对控制系统实现小型化、轻质化有重要意义。(The invention provides a communication interface circuit module and a manufacturing method thereof, wherein the communication interface circuit module integrates all chips and standard packaging devices required for realizing a communication function on a PCB, and when the communication interface circuit module is used, the whole communication interface circuit module is arranged on the PCB.)

1. A communication interface circuit module, comprising: the PCB board is provided with a plurality of bare chips and standard packaging devices for realizing the communication function.

2. The communication interface circuit module of claim 1, wherein the communication function is a 1-way CAN and a 4-way RS422 communication function.

3. The communication interface circuit module of claim 2, wherein the die comprises SM1050 die, GL1201 die, and SM490 die, and the standard package device comprises protection diode PESD5V0S2 BT.

4. The communication interface circuit module of claim 3, wherein the PCB board comprises a first substrate and a second substrate, the first substrate is provided with 6 GL1201 bare chips, 2 SM490 bare chips, 1 SM1050 bare chip, 4 protection diodes PESD5V0S2BT and a plurality of resistors and capacitors, wherein the 4 GL1201 bare chips, the 2 SM490 bare chips, the 4 protection diodes PESD5V0S2BT and the plurality of capacitors and resistors together realize the 2-way RS422 communication function; 2 GL1201 bare chips, 1 SM1050 bare chip, a plurality of capacitors and resistors realize a 1-path CAN communication function together;

the second substrate is provided with 4 GL1201 bare chips, 2 SM490 bare chips, 4 protection diodes PESD5V0S2BT, a plurality of capacitors and resistors, and is used for realizing the 2-path RS422 communication function.

5. A method for manufacturing a circuit module of a communication interface according to any one of claims 1 to 3, wherein the bare chips are bonded to the printed board by using an insulating adhesive, the bare chips are encapsulated by using a corresponding bare chip dam encapsulation technique, and bonding between the bare chips is performed on the printed board.

6. The method of claim 5, wherein the bare chip is encapsulated with FP4450 epoxy.

7. The method of claim 5, wherein a distance between a highest point of the bonding wire and an upper surface of the die is less than or equal to 300um during bonding.

8. The method of claim 4, wherein the GL1201 bare chip, the SM490 bare chip, the SM1050 bare chip, and the protection diode PESD5V0S2BT are attached to the first substrate, the bare chips are encapsulated by a corresponding bare chip dam encapsulation technique, and the bare chips are bonded to each other; adhering GL1201 bare chips, SM490 bare chips and a protection diode PESD5V0S2BT on a second substrate, encapsulating the bare chips by adopting a corresponding bare chip cofferdam encapsulation technology, and bonding the bare chips; and vertically stacking the first substrate and the second substrate which are qualified in the test, dehumidifying, encapsulating, cutting and scribing to form a finished product module.

Technical Field

The invention relates to the field of microelectronics, in particular to a communication interface circuit module and a manufacturing method thereof.

Background

The existing communication circuit is designed by adopting a principle of discrete devices, namely, each bare chip is packaged into a finished device respectively, and each finished device is welded on a printed board, so that the mode can occupy larger area of the printed board and is not beneficial to performance exertion of other components. Moreover, such an implementation is not conducive to miniaturization and weight reduction of the integrated product.

Disclosure of Invention

Aiming at the problems in the prior art, the invention provides a communication interface circuit module and a manufacturing method thereof, which can greatly reduce the occupied space of the communication interface circuit, are beneficial to other components to exert the performance, and utilize the miniaturization and the light weight of products.

The invention is realized by the following technical scheme:

a communication interface circuit module, comprising: the PCB board is provided with a plurality of bare chips and standard packaging devices for realizing the communication function.

Preferably, the communication function is a 1-channel CAN and 4-channel RS422 communication function.

Further, the die includes SM1050 die, GL1201 die, and SM490 die, and the standard package device includes a protection diode PESD5V0S2 BT.

Further, the PCB comprises a first substrate and a second substrate, wherein the first substrate is provided with 6 GL1201 bare chips, 2 SM490 bare chips, 1 SM1050 bare chip, 4 protection diodes PESD5V0S2BT, and a plurality of resistors and capacitors, wherein the 2-channel RS422 communication function is realized by the 4 GL1201 bare chips, the 2 SM490 bare chips, the 4 protection diodes PESD5V0S2BT, the plurality of capacitors and the resistors; 2 GL1201 bare chips, 1 SM1050 bare chip, a plurality of capacitors and resistors realize a 1-path CAN communication function together;

the second substrate is provided with 4 GL1201 bare chips, 2 SM490 bare chips, 4 protection diodes PESD5V0S2BT, a plurality of capacitors and resistors, and is used for realizing the 2-path RS422 communication function.

The manufacturing method of the communication interface circuit module comprises the steps of adhering the bare chips on the printed board by adopting insulating glue, encapsulating the bare chips by adopting a corresponding bare chip cofferdam encapsulation technology, and bonding the bare chips on the printed board.

Preferably, the epoxy glue used for encapsulating the bare chip is FP 4450.

Preferably, when bonding, the distance from the highest point of the bonding wire to the upper surface of the bare chip is less than or equal to 300 um.

The manufacturing method of the communication interface circuit module comprises the steps of sticking GL1201 bare chips, SM490 bare chips, SM1050 bare chips and a protection diode PESD5V0S2BT on a first substrate, encapsulating the bare chips by adopting a corresponding bare chip cofferdam encapsulation technology, and bonding the bare chips; adhering GL1201 bare chips, SM490 bare chips and a protection diode PESD5V0S2BT on a second substrate, encapsulating the bare chips by adopting a corresponding bare chip cofferdam encapsulation technology, and bonding the bare chips; and vertically stacking the first substrate and the second substrate which are qualified in the test, dehumidifying, encapsulating, cutting and scribing to form a finished product module.

Compared with the prior art, the invention has the following beneficial technical effects:

the communication interface circuit module integrates all chips and standard packaging devices required for realizing the communication function on one PCB, and when in use, the whole communication interface circuit module is arranged on the printed board.

The invention directly pastes and bonds the bare chip on the PCB, and breaks through the bonding on the PCB and the encapsulation protection technology of the bare chip.

Furthermore, the invention stacks the bare chip and the standard packaging device, and further extends the technology of homogeneous stacking, thereby realizing the heterogeneous three-dimensional integration of the bare chip and the standard packaging device.

Drawings

FIG. 1 is a communication interface circuit module implementation;

FIG. 2 is a block diagram of the schematic design of a communication interface circuit module;

FIG. 3 is a schematic diagram of a PCB design of a communication interface circuit module;

FIG. 4 is a schematic view of the communication interface circuit module assembled and bonded on a substrate;

fig. 5 is a schematic diagram of the communication interface circuit product module compared with a one-dimensional coin size.

Detailed Description

The present invention will now be described in further detail with reference to specific examples, which are intended to be illustrative, but not limiting, of the invention.

The invention is based On Chip On Board (COB) technology to directly bond bare chips On the PCB, and breaks through the bonding On the PCB and the encapsulation protection technology of the bare chips. Meanwhile, the method further extends on the basis of homogeneous stacking, breaks through heterogeneous three-dimensional PoP technology, stacks the bare chip and the standard packaging device, and realizes heterogeneous three-dimensional integration of the bare chip and the standard packaging device, so that a plurality of bare chips and the standard packaging device are packaged together, and the communication interface circuit module is designed and manufactured. The packaging technology of the invention combines COB and 3D assembly technology. The method has important significance for realizing the aims of miniaturization, light weight, standardization and low cost of products, and has a promoting effect for realizing the updating, transformation and upgrading of the products.

The invention relates to a communication interface circuit module based on COB and heterogeneous three-dimensional integration technology and a manufacturing method thereof, which mainly comprises the following aspects: selecting the type of the bare chip and the standard packaging device; designing a hardware principle of a communication interface circuit; designing a communication interface circuit layout; the cofferdam encapsulation protection technology of the bare chip on the printed board; and the communication interface circuit module is realized by the process.

The invention is described by taking a 1-part communication interface circuit module (hereinafter referred to as a transceiver module) integrating the 1-part CAN + 4-part RS422 functions as an example.

The invention combines the realization process of a communication interface circuit based on COB and heterogeneous three-dimensional integration technology, and the whole realization process is shown in figure 1 from the initial principle design to the final process realization.

Selecting the type of the components: in order to realize the purposes of light weight and miniaturization of the transceiver module, all key devices are realized by adopting bare chips, including an SM1050 bare chip, an GL1201 bare chip and an SM490 bare chip. The protection diode is a standard packaging device, namely a protection diode PESD5V0S2 BT.

Designing a hardware principle: the transceiver module takes the protection effect on core components into consideration during the design of a hardware principle, and adopts a dual-channel digital isolator to realize the function of isolating the outside. The dual-channel digital isolator is realized by adopting a GL1201 bare chip, an RS422 interface chip is realized by adopting an SM490 bare chip, and the CAN interface chip is realized by adopting an SM1050 bare chip. The principle design of the transceiver module is shown in fig. 2.

And (3) transceiver module layout and structure design: in combination with a PoP three-dimensional assembly process, a flying wire substrate process is adopted during layout design, as shown in fig. 3(a), the structural layout of a first substrate (referred to as a-1 board) is that GL1201 bare chips 6, SM490 bare chips 2, SM1050 bare chips 1, protection diodes PESD5V0S2BT4, and a plurality of resistors and capacitors realize a 1-way CAN + 2-way RS422 communication function. Each signal wire leads to the periphery of the substrate through the golden flying wire, so that the subsequent middle measurement is facilitated. As shown in fig. 3(b), the structural layout of the second substrate (referred to as a "2 board" for short) is 4 GL1201 bare chips, 2 SM490 bare chips, 4 protection diodes PESD5V0S2BT, and multiple resistors and capacitors, so as to implement two-way RS422 communication function. Each signal wire leads to the periphery of the substrate through the golden flying wire, so that the subsequent middle measurement is facilitated. In order to make the final finished module smaller and lighter, the leg board (called-B board for short) adopts the BGA package form.

The transceiver module process is realized as follows: the first substrate and the second substrate are made of FR-4, and belong to one type of printed boards. The bare chip is bonded by using insulating glue when being assembled on a printed board, so that COB (chip on Board) is realized. The GL1201 bare chip is bonded by using insulating glue 84-3J, and the SM1050 bare chip and the SM490 bare chip are bonded by using the insulating glue 84-3J. On the other hand, the bare chip is not suitable to be exposed in the air for a long time, so that after the bare chip is assembled on the printed board, the bare chip is protected by adopting a corresponding bare chip cofferdam encapsulation technology, and the epoxy glue for encapsulating the bare chip adopts FP 4450. In addition, in order to maintain the integrity of signal lines among the chips, bare chip bonding needs to be realized on a printed board, the bonding mode is phi 25um gold wire ultrasonic, and the distance from the highest point of a bonding wire to the upper surface of the chip is less than or equal to 300 um. And the standard packaging device is welded on the printed board.

Heterogeneous three-dimensional integration of the transceiver module: and carrying out vertical stacking, dehumidification, encapsulation, cutting, line scribing and other processes on the first substrate, the second substrate and the leg plate which are qualified in the test, and finally forming a finished product module. The module further extends on the basis of homogeneous stacking, and realizes heterogeneous three-dimensional integration of a bare chip and a standard packaging device. A schematic diagram of the finished module is shown in fig. 5.

Through the process, the finally obtained communication interface circuit module comprises a first substrate, a second substrate and a leg plate, wherein the first substrate is positioned between the second substrate and the leg plate, 6 GL1201 bare chips, 2 SM490 bare chips, 1 SM1050 bare chip, 4 protection diodes PESD5V0S2BT, a plurality of resistors and a plurality of capacitors are adhered on the first substrate. The system comprises a power supply, a power supply module and a power supply module, wherein 2 GL1201 bare chips are used as a dual-channel digital isolator, and the power supply module, together with 1 SM490 bare chip (used as an RS422 interface chip), 2 protection diodes PESD5V0S2BT, a plurality of capacitors and resistors, realizes a RS422 communication function; in addition, 2 GL1201 bare chips are used as a dual-channel digital isolator, and the dual-channel digital isolator, 1 SM490 bare chip (used as an RS422 interface chip), 2 protection diodes PESD5V0S2BT, a plurality of capacitors and resistors are used together to realize the function of RS422 communication. And finally, taking 2 GL1201 bare chips as a dual-channel digital isolator, and realizing a 1-path CAN communication function together with 1 SM1050 bare chip (as a CAN interface chip) and a plurality of capacitors and resistors. Therefore, the first substrate CAN realize the 1-path CAN + 2-path RS422 communication function.

The second substrate is attached with 4 GL1201 bare chips, 2 SM490 bare chips, 4 protection diodes PESD5V0S2BT, a plurality of capacitors and resistors. The two-way RS422 communication function is realized by using 2 GL1201 bare chips as a dual-channel digital isolator, 1 SM490 bare chip (as an RS422 interface chip), 2 protection diodes PESD5V0S2BT, a plurality of capacitors and resistors, and the two-way RS422 communication function is realized by the second substrate.

The specific layout is shown in fig. 4. As shown in fig. 4(a), which is a schematic diagram of the first substrate, U2 is an SM1050 bare chip as a CAN interface chip, U1-2 and U1-2 are GL1201 bare chips (as a dual-channel digital isolator, which together with U2 implements another path of CAN communication function); u2-1 is SM490 bare chip (as RS422 interface chip), U1-1-1, U1-1-2 is GL1201 bare chip (as dual channel digital isolator and U2-1 together implement another RS422 communication function); u2-2 is SM490 bare chip (as RS422 interface chip), U1-2-1, U1-2-2 are GL1201 bare chips (as dual channel digital isolator and U2-2 together implement another RS422 communication function); v1-1, V1-2, V2-1 and V2-1 are protection diodes PESD5V0S2 BT. Fig. 4(b) is a schematic diagram of the second substrate, where U2-3 and U2-4 are both SM490 bare chips (as RS422 interface chips), U1-3-1 and U1-3-2 are GL1201 bare chips (as dual-channel digital isolators to implement another RS422 communication function together with U2-3), and U1-4-1 and U1-4-2 are GL1201 bare chips (as dual-channel digital isolators to implement another RS422 communication function together with U2-4).