阅读说明：本技术 感应开关 (Induction switch ) 是由 周添铭 于 2020-05-07 设计创作，主要内容包括：一种感应开关,包含基体单元、导通单元,及导电件。所述基体单元由数个陶瓷生胚层堆叠后烧结制成,并包括底层组、沿延伸轴线与所述底层组间隔设置的顶层组,及环绕层组。所述底层组、所述顶层组,及所述环绕层组界定出容室。所述环绕层组具有内环绕面。所述底层组、所述顶层组及所述环绕层组的其中一者具有第一安装面部。所述导通单元包括数个导通件。每一个导通件具有第一感应段,及导通段。所述第一感应段绕所述延伸轴线间隔设置于所述内环绕面。所述导电件由金属材质制成且可自由滚动地设置于所述容室。通过将数个所述陶瓷生胚层烧结制成所述基体单元,能缩小所述感应开关的体积,使所述感应开关能应用在体积更小的产品。(An inductive switch comprises a base unit, a conduction unit and a conductive piece. The base body unit is formed by stacking and sintering a plurality of ceramic green body layers and comprises a bottom layer group, a top layer group and a surrounding layer group, wherein the top layer group and the surrounding layer group are arranged at intervals along an extension axis. The bottom layer set, the top layer set and the surrounding layer set define a chamber. The surrounding layer group is provided with an inner surrounding surface. One of the bottom layer group, the top layer group, and the surrounding layer group has a first mounting surface portion. The conducting unit comprises a plurality of conducting pieces. Each conducting piece is provided with a first induction section and a conducting section. The first induction section is arranged on the inner surrounding surface at intervals around the extending axis. The conductive piece is made of metal materials and can be freely arranged in the accommodating chamber in a rolling mode. By sintering a plurality of ceramic raw germ layers to form the base unit, the volume of the induction switch can be reduced, so that the induction switch can be applied to products with smaller volumes.)

1. An inductive switch comprising a base unit, characterized in that: the induction switch also comprises a conduction unit and a conductive piece, wherein the base body unit is formed by stacking and sintering a plurality of ceramic green layers and comprises a bottom layer group, a top layer group arranged at intervals along an extension axis and the bottom layer group, and a surrounding layer group arranged between the bottom layer group and the top layer group and around the extension axis, the bottom layer group, the top layer group and the surrounding layer group define a containing chamber, the surrounding layer group is provided with an inner surrounding surface surrounding the containing chamber, one of the bottom layer group, the top layer group and the surrounding layer group is provided with a first installation surface part which is relatively far away from the containing chamber and is positioned on the outer side, the conduction unit is arranged on the base body unit and is made of metal materials and comprises a plurality of conduction pieces, each conduction piece is provided with a first induction section and a conduction section which is connected with the first induction section and is partially positioned on the first installation surface part, the first induction sections are arranged on the inner surrounding surface at intervals around the extension axis, the conductive piece is made of metal materials and can be freely arranged in the accommodating chamber in a rolling mode, and the conductive piece can be simultaneously contacted with two adjacent first induction sections.

2. The inductive switch of claim 1, wherein: the inner surrounding surface of the base body unit is provided with a plurality of grooves arranged around the extending axis at intervals, and the first induction sections are respectively arranged between the two adjacent grooves.

3. The inductive switch of claim 1, wherein: the inner surrounding surface of the base body unit is provided with a plurality of protruding blocks arranged around the extending axis at intervals, and the first induction sections of the conduction units are respectively arranged on the protruding blocks.

4. The inductive switch of claim 1, wherein: the bottom layer group of the base unit is provided with a bottom surrounding surface surrounding the accommodating chamber, the top layer group is provided with a top surrounding surface surrounding the accommodating chamber, each conducting piece of the conducting unit is further provided with a second induction section connected to the respective first induction section, and the second induction sections are sequentially arranged on the top surrounding surface and the bottom surrounding surface in a staggered mode around the extending axis.

5. The inductive switch of claim 4, wherein: the chamber of the base unit is provided with a bottom end area defined by the bottom surrounding surface, a top end area defined by the top surrounding surface and a surrounding area defined by the inner surrounding surface, and the diameter of the conductive piece is larger than the diameters of the top end area and the bottom end area and smaller than the diameters of the surrounding areas.

6. The inductive switch of claim 1, wherein: the bottom layer group of the base unit is provided with the first installation surface part, the top layer group is provided with a second installation surface part which is relatively far away from the accommodating chamber and is positioned on the outer side, and the conduction section part of each conduction piece is positioned on the second installation surface part.

7. The inductive switch of claim 6, wherein: the bottom group of base member unit still has the connection the end of encircleing the bed group is connected the face, the top group of layers still has the connection the top of encircleing the bed group is connected the face, each of the section that switches on the unit has and locates the bottom group of layers is followed by respective first response section the end is connected the face and is extended to first installation face's first conduction portion, and locates the top group of layers is followed by respective first response section the top is connected the face and is extended to second installation face's second conduction portion.

8. The inductive switch of claim 1, wherein: the bottom layer group of the base unit is provided with a bottom surrounding surface surrounding the accommodating chamber, the top layer group is provided with a top surrounding surface surrounding the accommodating chamber, the accommodating chamber is provided with a bottom end region defined by the bottom surrounding surface, a top end region defined by the top surrounding surface and a surrounding region defined by the inner surrounding surface, the diameter of the conductive piece is smaller than the pore diameters of the top end region, the bottom end region and the surrounding region, and each first induction section extends downwards from the inner surrounding surface to the bottom surrounding surface and extends upwards to the top surrounding surface.

9. The inductive switch of claim 1, wherein: the bottom group has around the bottom surrounding surface that holds the room, the top group has around the top surrounding surface that holds the room, hold the room and have by the bottom area that the bottom surrounding surface was defined out, and by the top district that the top surrounding surface was defined out, the unit that switches on still includes guide down, and goes up the guide, guide has down to locate the lower guide basal portion in bottom area, and connect guide basal portion down and part be located the lower guide connecting portion of first installation face portion, go up the guide have locate the upper guide basal portion in top district, and connect guide basal portion and part locate the upper guide connecting portion of first installation face portion.

10. The inductive switch of claim 9, wherein: the lower guide base has a lower base wall intersecting the extension axis, and a lower surrounding wall extending from a periphery of the lower base wall toward the upper guide and in a direction away from the extension axis, the upper guide base has an upper base wall intersecting the extension axis, and an upper surrounding wall extending from a periphery of the upper base wall toward the lower guide and in a direction away from the extension axis.

Technical Field

The present invention relates to a switch device, and more particularly, to an inductive switch.

Background

The smart phone usually has a sensor switch to detect the tilt angle change of the smart phone, so as to achieve the functions of turning the screen or turning over the screen to be silent.

The conventional inductive switch generally includes two corresponding housings made of plastic materials, an accommodating space defined by the housings, a plurality of inductive elements made of metal materials and disposed in the accommodating space, and a ball capable of rolling freely and disposed in the accommodating space. The conventional inductive switch judges the change of the inclination angle by the conduction relation between the ball and the inductive element.

However, the conventional inductive switch is bulky, and thus the size of the smart phone is limited. In addition, the conventional inductive switch requires a complicated process of assembling wiring during manufacturing, and thus, needs to be improved.

Disclosure of Invention

It is an object of the present invention to provide an inductive switch that addresses at least one of the disadvantages of the prior art.

The inductive switch of the invention comprises a base unit. The inductive switch also comprises a conduction unit and a conductive piece. The base body unit is formed by stacking and sintering a plurality of ceramic green body layers and comprises a bottom layer group, a top layer group arranged at intervals along an extension axis and the bottom layer group, and a surrounding layer group which surrounds the extension axis and is arranged between the bottom layer group and the top layer group. The bottom layer set, the top layer set and the surrounding layer set define a chamber. The surrounding layer set is provided with an inner surrounding surface surrounding the accommodating chamber. One of the bottom layer group, the top layer group and the surrounding layer group is provided with a first mounting surface portion which is relatively far away from the accommodating chamber and positioned on the outer side. The conduction unit is arranged on the base body unit, is made of metal materials and comprises a plurality of conduction pieces. Each conducting piece is provided with a first induction section and a conducting section which is connected with the first induction section and is partially positioned on the first mounting surface part. The first induction section is arranged on the inner surrounding surface at intervals around the extending axis. The conductive piece is made of metal materials and can be freely arranged in the accommodating chamber in a rolling mode. The conductive piece can contact two adjacent first induction sections simultaneously.

In the inductive switch, a plurality of grooves are formed on the inner surrounding surface of the base body unit and are arranged at intervals around the extending axis. The first induction sections are respectively arranged between two adjacent grooves.

In the inductive switch of the invention, a plurality of convex blocks which are arranged around the extension axis at intervals are formed on the inner surrounding surface of the base body unit. The first induction sections of the conduction units are respectively arranged on the convex blocks.

In the inductive switch of the present invention, the bottom layer group of the base unit has a bottom surrounding surface surrounding the accommodation chamber. The top set has a top surrounding surface surrounding the chamber. Each conducting piece of the conducting unit is also provided with a second induction section connected with the corresponding first induction section. The second induction sections are sequentially arranged on the top surrounding surface and the bottom surrounding surface in a staggered mode around the extension axis.

In the inductive switch of the present invention, the chamber of the base unit has a bottom region defined by the bottom surrounding surface, a top region defined by the top surrounding surface, and a surrounding region defined by the inner surrounding surface. The diameter of the conductive piece is larger than the aperture of the top end area and the bottom end area and smaller than the aperture of the surrounding area.

In the inductive switch of the present invention, the bottom group of the base unit has the first mounting surface portion. The top layer group is provided with a second mounting surface portion which is relatively far away from the accommodating chamber and is positioned on the outer side. The conducting section part of each conducting piece is positioned on the second mounting surface part.

In the inductive switch, the bottom layer group of the base body unit is also provided with a bottom connecting surface connected with the surrounding layer group. The top tier group also has a top connection face connecting the surrounding tier group. Each conducting section of the conducting unit is provided with a first conducting part which is arranged on the bottom layer group and extends to the first installation surface part from the respective first induction section along the bottom connection surface, and a second conducting part which is arranged on the top layer group and extends to the second installation surface part from the respective first induction section along the top connection surface.

In the inductive switch of the present invention, the bottom layer group of the base unit has a bottom surrounding surface surrounding the accommodation chamber. The top set has a top surrounding surface surrounding the chamber. The chamber is provided with a bottom end area defined by the bottom surrounding surface, a top end area defined by the top surrounding surface and a surrounding area defined by the inner surrounding surface. The diameter of the conductive piece is smaller than the diameters of the top end area, the bottom end area and the surrounding area. Each first induction section extends downwards from the inner surrounding surface to the bottom surrounding surface and extends upwards to the top surrounding surface.

In the inductive switch of the invention, the bottom layer group has a bottom surrounding surface surrounding the accommodating chamber. The top set has a top surrounding surface surrounding the chamber. The chamber has a bottom end region defined by the bottom surrounding surface and a top end region defined by the top surrounding surface. The conduction unit further comprises a lower guide piece and an upper guide piece. The lower guide piece is provided with a lower guide base part arranged on the bottom end area and a lower guide connecting part which is connected with the lower guide base part and is partially positioned on the first mounting surface part. The upper guide piece is provided with an upper guide base part arranged on the top end area and an upper guide connecting part which is connected with the upper guide base part and is partially arranged on the first mounting surface part.

In the inductive switch of the present invention, the lower guide base has a lower base wall intersecting the extension axis, and a lower surrounding wall extending from a periphery of the lower base wall toward the upper guide and away from the extension axis. The upper guide base has an upper base wall intersecting the extension axis, and an upper surrounding wall extending from a periphery of the upper base wall toward the lower guide and in a direction away from the extension axis.

The invention has the beneficial effects that: by sintering a plurality of ceramic raw germ layers to form the base unit, the volume of the induction switch can be reduced, so that the induction switch can be applied to products with smaller volumes.

Drawings

FIG. 1 is a perspective assembly view of a first embodiment of an inductive switch of the present invention;

FIG. 2 is an exploded perspective view of a base unit and a conducting unit of the first embodiment;

fig. 3 is a schematic top view of a bottom layer group, a surrounding layer group, the conducting unit and a conducting member of the first embodiment;

FIG. 4 is a schematic cross-sectional view taken along line IV-IV of FIG. 1;

FIG. 5 is a schematic cross-sectional view taken along line V-V of FIG. 1;

FIG. 6 is an exploded perspective view of a base unit and a conducting unit of a second embodiment of the inductive switch of the present invention;

fig. 7 is a schematic top view of a bottom layer set, a surrounding layer set, the conducting unit and a conducting member of the second embodiment;

FIG. 8 is a perspective assembly view of a third embodiment of the inductive switch of the present invention;

FIG. 9 is an exploded perspective view of a base unit, and a conduction unit of the third embodiment;

FIG. 10 is a schematic cross-sectional view taken along line X-X of FIG. 8;

fig. 11 is a perspective assembly view of a fourth embodiment of the inductive switch of the present invention;

FIG. 12 is an exploded perspective view of a base unit, and a conduction unit of the fourth embodiment;

fig. 13 is a schematic sectional view taken along line XIII-XIII of fig. 11.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and examples.

Before the present invention is described in detail, it should be noted that in the following description, similar components are denoted by the same reference numerals.

Referring to fig. 1, 2 and 3, a first embodiment of the inductive switch of the present invention is adapted to be connected to a circuit board (not shown). The inductive switch comprises a base unit 2, a conducting unit 3, and a conducting member 4.

The base unit 2 is formed by stacking and sintering a plurality of ceramic raw germ layers 200, and includes a bottom layer group 21, a top layer group 22 arranged at an interval with the bottom layer group 21 along an extension axis L, and a surrounding layer group 23 arranged between the bottom layer group 21 and the top layer group 22 around the extension axis L. The bottom tier 21, the top tier 22, and the surrounding tier 23 define a chamber 24.

Referring to fig. 2, 3 and 4, the bottom layer set 21 has a bottom surrounding surface 211 relatively adjacent to and surrounding the accommodating chamber 24, a bottom connecting surface 212 connected to the surrounding layer set 23, a first free surface 213 relatively far away from the accommodating chamber 24 and located on the outer side, and a bottom peripheral surface 214 connected between the bottom connecting surface 212 and the periphery of the first free surface 213.

The top group 22 has a top circumferential surface 221 relatively adjacent to and surrounding the chamber 24, a top connection surface 222 connecting the circumferential group 23, a second free surface 223 relatively far from the chamber 24 and located on the outer side, and a top peripheral surface 224 connecting the top connection surface 222 and the periphery of the second free surface 223.

The surrounding layer set 23 has an inner surrounding surface 231 relatively adjacent to and surrounding the chamber 24, and an outer surrounding surface 232 opposite to the inner surrounding surface 231. The inner circumferential surface 231 is formed with a plurality of grooves 233 arranged at intervals around the extension axis L. In this embodiment, the number of the grooves 233 is four, and the width of each groove 233 is smaller than the diameter of the conductive member 4.

One of the first free surface 213, the second free surface 223 and the outer surrounding surface 232 has one first mounting surface portion 5, and the other of the first free surface 213, the second free surface 223 and the outer surrounding surface 232 has one second mounting surface portion 6. In the present embodiment, the first free surface 213 has the first mounting surface portion 5, and the second free surface 223 has the second mounting surface portion 6.

In the layered structure, the bottom layer group 21, the top layer group 22, and the surrounding layer group 23 are composed of a plurality of ceramic raw germ layers 200. In the present embodiment, the layered structure of the bottom layer group 21 is composed of two ceramic raw germ layers 200, the layered structure of the top layer group 22 is composed of two ceramic raw germ layers 200, the layered structure of the surrounding layer group 23 is composed of seven ceramic raw germ layers 200, but the present invention is not limited thereto, and the ceramic raw germ layers 200 are made of inorganic ceramics.

It should be noted that the corresponding ceramic raw germ layers 200 are integrated after sintering, however, for clarity, the layered structure of the bottom layer group 21, the top layer group 22, and the surrounding layer group 23 is disclosed, and therefore the outline of each ceramic raw germ layer 200 is shown in the drawings of the present invention.

The chamber 24 has a bottom end portion 241 defined by the bottom surrounding surface 211, a top end portion 242 defined by the top surrounding surface 221, and a surrounding portion 243 defined by the inner surrounding surface 231.

Referring to fig. 2, 4 and 5, the conducting unit 3 is made of a metal material and is disposed on the base unit 2, and includes four conducting elements 31 and a positioning element 32.

Each conducting member 31 has a first sensing segment 311, a second sensing segment 312 connected to the first sensing segment 311, and a conducting segment 313 connected to the first sensing segment 311 and partially located on the first mounting surface 5. The first sensing segments 311 are disposed around the extension axis L at intervals on the inner surrounding surface 231 and between two adjacent grooves 233 respectively. The second sensing segments 312 are sequentially disposed on the top surrounding surface 221 and the bottom surrounding surface 211 in a staggered manner around the extending axis L.

Each conducting section 313 includes a first conducting portion 314 disposed on the bottom group 21 and extending from the respective first sensing section 311 to the first mounting surface portion 5 along the bottom connecting surface 212, and a second conducting portion 315 disposed on the top group 22 and extending from the respective first sensing section 311 to the second mounting surface portion 6 along the top connecting surface 222. Each first conduction part 314 has a first connection region 316 disposed on the bottom connection surface 212 and connected to the first sensing section 311, and a first mounting region 317 connected to the first connection region 316 and disposed on the bottom outer peripheral surface 214 and the first mounting surface part 5. Each second conduction part 315 has a second connection region 318 disposed on the top connection surface 222 and connected to the first sensing section 311, and a second mounting region 319 connected to the second connection region 318 and disposed on the top peripheral surface 224 and the second mounting surface portion 6.

In this embodiment, the positioning element 32 is disposed on the outer circumferential surface 232 of the circumferential layer group 23 and connected between one of the first mounting regions 317 and the corresponding second mounting region 319, so as to determine the extending direction of the accommodating chamber 24 when being disposed on the circuit board.

The conductive member 4 is made of a metal material and is freely rollably disposed in the chamber 24. The diameter of the conductive member 4 is larger than the diameters of the top end region 242 and the bottom end region 241, and smaller than the diameter of the surrounding region 243. When the conductive device 4 is located in the surrounding area 243, the conductive device 4 can contact two adjacent first induction sections 311 at the same time. In this embodiment, the conductive member 4 is a spherical ball.

The manufacturing process of the inductive switch is described as follows:

step one, corresponding holes are formed in the corresponding ceramic green sheets 200 in a machining mode.

Step two, a metal material (e.g., silver, copper, gold, etc.) is disposed on the ceramic raw germ layer 200 at a position corresponding to the first sensing section 311, the second sensing section 312, the first connection region 316, and the second connection region 318. The technique of disposing the metal material on the ceramic raw germ layer 200 can be achieved by using a conductive adhesive in a form of a screen, a steel plate, ink jet, or the like, or in a form of electroplating, chemical plating, sputtering, or the like, or at least two of the above forms.

And thirdly, stacking the corresponding ceramic raw rubber layers 200, and tightly compacting the ceramic raw rubber layers 200 in a pressure equalizing manner.

And step four, cutting the tightly compacted ceramic green sheets 200 into preset sizes.

Step five, plating, spraying or coating a metal material (such as gold, alloy, etc.) on the surfaces of the first sensing segment 311, the second sensing segment 312, the first connection region 316, and the second connection region 318 as required.

And step six, raising the ambient temperature by using a slow temperature raising rate to burn off and crack the high molecular additives added in the ceramic raw germ layers 200 during pulping, then raising the temperature to densify the ceramic raw germ layers 200 to remove pores, sintering the corresponding ceramic raw germ layers 200 into a whole to form the bottom layer group 21, the top layer group 22 and the surrounding layer group 23, and connecting the metal materials arranged in the step two to form the first induction section 311, the second induction section 312, the first connection region 316 and the second connection region 318.

Step seven, after the conductive member 4 is placed in the accommodating chamber 24, an adhesive material (such as resin, glass, etc.) is coated on the connection between the top layer group 22 and the surrounding layer group 23 and the connection between the surrounding layer group 23 and the bottom layer group 21, the ambient temperature is raised, and the bottom layer group 21, the top layer group 22 and the surrounding layer group 23 are pressed and bonded into a whole to form the base unit 2.

Eighthly, a metal material (such as silver, copper, gold, and the like) is plated, sprayed, or coated on a corresponding position of the base unit 2 to form the first mounting area 317, the second mounting area 319, and the positioning element 32, and the first mounting area 317, the second mounting area 319, and the positioning element 32 are densified, so that the first mounting area 317, the second mounting area 319, and a side of the positioning element 32 connected to the base unit 2 (i.e., a side connected to the first connection area 316 and the second connection area 318) and a side opposite to the base unit 2 (i.e., a side connected to the circuit board) have good electrical conductivity.

The inductive switch can be completed through one to eight steps.

In use, a user (not shown) can place the circuit board on the first mounting surface portion 5 or the second mounting surface portion 6 of the inductive switch and electrically connect the first mounting region 317 or the second mounting region 319 to the circuit board.

Referring to fig. 3, 4 and 5, since the conductive member 4 is freely rollably disposed in the accommodating chamber 24, when the inductive switch is tilted, the conductive member 4 rolls to a position corresponding to a different conductive member 31 under the action of gravity. For example, when the inductive switch is horizontal and the bottom end portion 241 faces downward, the conductive member 4 rolls to the bottom end portion 241 and contacts and conducts the two second inductive sections 312 disposed on the bottom surrounding surface 211 (see the positions of the conductive member 4 marked by solid lines in fig. 4 and 5); when the inductive switch is rotated to make the top end region 242 face downward, the conductive element 4 rolls to the top end region 242 to conduct the two second inductive sections 312 disposed on the top surrounding surface 221 (see the positions of the conductive element 4 marked by the imaginary lines in fig. 4 and 5); when the inductive switch is tilted, the conductive member 4 rolls in the surrounding area 243 to contact and conduct the different first inductive section 311 (see the position of the conductive member 4 marked by the imaginary line in fig. 3).

Referring to fig. 2, 3 and 4, since the first sensing segments 311 are disposed at intervals on the inner surrounding surface 231 around the extending axis L, and the second sensing segments 312 are disposed at the top surrounding surface 221 and the bottom surrounding surface 211 in a staggered manner, when the conductive member 4 conducts two adjacent conductive members 31, it can be determined that the conductive member 4 is located in the surrounding area 243 and the inclination direction of the sensing switch is determined, and when the conductive member 4 rolls to conduct two spaced conductive members 31 and does not contact the conductive member 31 located between the spaced conductive members 31, it can be determined that the conductive member 4 is located on the top surrounding surface 221 or the bottom surrounding surface 211, so that the sensing switch can be used as a six-sided vibrating switch.

In this way, the sensing switch is formed by sintering a plurality of ceramic raw layers 200 to form the base unit 2, and the first sensing section 311, the second sensing section 312, the first connection area 316, and the second connection area 318 are formed by a screen, a steel plate, ink jet, electroplating, chemical plating, or sputtering, so that the volume of the sensing switch can be effectively reduced, the sensing switch can be applied to a product with a smaller volume, and the steps of assembling and wiring can be simplified.

It should be noted that, in the present embodiment, since the diameter of the conductive device 4 is larger than the diameters of the top end region 242 and the bottom end region 241 and smaller than the diameters of the surrounding regions 243, the conductive device 4 can freely roll in the surrounding regions 243, and when the conductive device 4 rolls to correspond to the top end region 242 or the bottom end region 241 (see the positions of the conductive device 4 marked by the imaginary lines and the solid lines in fig. 4), the bottom surrounding surface 211 or the top surrounding surface 221 can provide the force that the conductive device 4 helps to stay at the top end region 242 or the bottom end region 241, but the force is not enough to prevent the conductive device 4 from further rolling.

In addition, the inductive switch can be used as an angle switch by only adjusting the ratio of the diameters of the bottom end portion 241, the top end portion 242 and the conductive member 4, and when the inductive switch is used as an angle switch, each conductive member 31 does not need to be provided with the second inductive section 312 on the top surrounding surface 221 and the bottom surrounding surface 211.

It should be noted that, in this embodiment, the width of each of the grooves 233 is smaller than the diameter of the conductive member 4, so that the conductive member 4 can be prevented from being engaged with any one of the grooves 233, and when the conductive member 4 is rolled to the corresponding one of the grooves 233 (for example, the position of the conductive member 4 shown by the imaginary line in fig. 3) by providing the grooves 233, the inner surrounding surface 231 can provide a force to the conductive member 4, which helps the conductive member 4 stay at the position of the corresponding one of the grooves 233, but at the same time, the inner surrounding surface is not so large as to engage the conductive member 4 with the corresponding one of the grooves 233, so that the conductive member 4 cannot roll any further. In this embodiment, when the conductive member 4 stays in the corresponding one of the grooves 233, the conductive member 4 is separated from the groove 233 by rotating the inductive switch about the extension axis L by 3 degrees.

It should be noted that, in the present embodiment, the circuit board can be disposed on the first mounting surface portion 5 or the second mounting surface portion 6 by disposing the first conduction portion 314 and the second conduction portion 315, so that the present invention can be applied to articles (not shown) with different sizes and shapes, however, in other implementation forms, only the first conduction portion 314 may be disposed and the circuit board may be disposed on the first mounting surface portion 5 for use.

Referring to fig. 6 and 7, a second embodiment of the inductive switch of the present invention is similar to the first embodiment, and the difference is:

the inner circumferential surface 231 is formed with a plurality of projections 234 spaced about the extension axis L. The first sensing segments 311 of the conducting unit 3 are respectively disposed on the bumps 234.

In the embodiment, the number of the protruding blocks 234 is four, and the distance between two adjacent protruding blocks 234 is smaller than the diameter of the conductive device 4, so that the conductive device 4 can be prevented from being clamped between two adjacent protruding blocks 234, and by providing the protruding blocks 234, when the conductive device 4 rolls to a position between two adjacent protruding blocks 234 (for example, the position of the conductive device 4 shown by the imaginary line in fig. 7), the inner surrounding surface 231 can provide a force to the conductive device 4, which helps to stay at the position between two adjacent protruding blocks 234, but at the same time, the conductive device 4 is not clamped between two adjacent protruding blocks 234 and cannot roll further. In this embodiment, when the conductive device 4 stays between two corresponding adjacent protrusions 234, the conductive device 4 can be separated from between two corresponding adjacent protrusions 234 by rotating the inductive switch about the extension axis L by 3 degrees.

Thus, the second embodiment can achieve the same purpose and effect as the first embodiment.

Referring to fig. 8, 9 and 10, a third embodiment of the inductive switch of the present invention is similar to the second embodiment, and the difference is:

the surrounding layer group 23 has a bottom portion 26 adjacent to the bottom layer group 21 and a top portion 27 adjacent to the top layer group 22.

In the present embodiment, the layered structure of the bottom contact portion 26 is formed by two ceramic raw germinal layers 200, and the layered structure of the top contact portion 27 is formed by three ceramic raw germinal layers 200, but is not limited thereto.

The bottom connector 26 has a first inner circumferential surface 261 surrounding the chamber 24, a first outer circumferential surface 262 opposite to the first inner circumferential surface 261, and a first connecting surface 263 connected to the top connector 27.

The top portion 27 has a second inner circumferential surface 271 surrounding the chamber 24, a second outer circumferential surface 272 opposite to the second inner circumferential surface 271, and a second connecting surface 273 connecting with the bottom portion 26.

The first inner peripheral surface 261 and the second inner peripheral surface 271 constitute the inner circumferential surface 231. The first outer circumferential surface 262 and the second outer circumferential surface 272 form the outer circumferential surface 232.

The diameter of the conductive member 4 is smaller than the diameters of the top end region 242, the bottom end region 241 and the surrounding region 243.

Each conducting element 31 has the first sensing segment 311 and the conducting segment 313. Each first sensing segment 311 extends from the inner surrounding surface 231 downward to the bottom surrounding surface 211 and upward to the top surrounding surface 221.

The first conduction part 314 of the conduction part 31 connected to the positioning part 32 only has the first mounting region 317, and the second conduction part 315 only has the second mounting region 319. The conducting section 313 of the conducting element 31 connected to the positioning element 32 further has a third connecting area 310 connected between the first sensing section 311 and the positioning element 32 and disposed between the first connecting surface 263 and the second connecting surface 273. The manufacturing process of the third connection region 310 is similar to that of the first connection region 316 and will not be described again.

Since the third connecting region 310 is connected between the corresponding first sensing segment 311 and the positioning element 32, and the positioning element 32 is connected between the corresponding first mounting region 317 and the corresponding second mounting region 319, current can flow through the corresponding first sensing segment 311, the corresponding first mounting region 317 and the corresponding second mounting region 319 via the third connecting region 310 and the positioning element 32, so that the conducting element 31 connected to the positioning element 32 does not need to be provided with the first connecting region 316 (see the second connecting region 316 corresponding to the positioning element 32 in fig. 6) and the second connecting region 318 (see the second connecting region 318 corresponding to the positioning element 32 in fig. 6) as in the second embodiment, and can achieve the effect of conducting current.

In this way, by providing the first sensing section 311, when the conductive member 4 conducts two adjacent conductive members 31, the inclination direction of the sensing switch can be determined accordingly, so that the sensing switch can be used as a four-sided sensing switch.

In addition, in the embodiment, the third connection region 310 is disposed on one of the first connection surface 263 and the second connection surface 273, however, the third connection region 310 is not limited thereto, and the third connection region 310 may be disposed on any ceramic raw germ layer 200, so long as the third connection region 310 is connected between the corresponding first sensing segment 311 and the positioning element 32, the same effect can be achieved.

In addition, in other embodiments, four positioning elements 32 respectively connected to the conductive elements 31 may be provided, so that the first connection region 316 and the second connection region 318 need not be provided only by providing one third connection region 310 on the conductive segment 313 of each conductive element 31.

Thus, the third embodiment can achieve the same purpose and effect as the second embodiment.

Referring to fig. 11, 12 and 13, a fourth embodiment of the inductive switch of the present invention is similar to the second embodiment, and the difference is:

the second free surface 223 has the first mounting surface portion 5.

Each conducting element 31 has the first sensing segment 311 and the conducting segment 313.

Each conducting section 313 has the first conducting part 314.

The first conduction part 314 extends from between two adjacent ceramic raw rubber layers 200 of the surrounding layer group 23 to the first mounting surface part 5, the first connection region 316 of the first conduction part 314 is disposed between two adjacent ceramic raw rubber layers 200 of the surrounding layer group 23 and connected to the first induction section 311, and the first mounting region 317 of the first conduction part 314 is disposed on the outer surrounding surface 232, the top outer peripheral surface 224 and the first mounting surface part 5.

The conducting unit 3 further includes a lower guide 33 and an upper guide 34.

The lower guide member 33 has a lower guide base 331 disposed on the bottom end portion 241, and a lower guide connecting portion 332 connected to the lower guide base 331 and extending to the first mounting surface portion 5.

The lower guide base 331 has a lower base wall 333 intersecting the extension axis L, a lower surrounding wall 334 extending from the periphery of the lower base wall 333 toward the upper guide 34 and away from the extension axis L, and a lower extension wall 335 extending outward from an end of the lower surrounding wall 334 opposite to the lower base wall 333 away from the extension axis L. In the present embodiment, the angle between the lower surrounding wall 334 and the lower base wall 333 is 45 degrees, but is not limited thereto.

The lower guide connecting portion 332 has a lower guide connecting region 336 disposed on the bottom connecting surface 212 and connected to the lower extending wall 335, and a lower guide mounting region 337 connected to the lower guide connecting region 336 and extending from the bottom peripheral surface 214, the outer surrounding surface 232, and the top peripheral surface 224 to the first mounting surface portion 5.

The upper guide member 34 has an upper guide base 341 disposed at the tip end region 242, and an upper guide connecting portion 342 connected to the upper guide base 341 and extending to the first mounting surface portion 5.

The upper guide base 341 has an upper base wall 343 intersecting the extension axis L, an upper surrounding wall 344 extending from the periphery of the upper base wall 343 toward the lower guide 33 and away from the extension axis L, and an upper extension wall 345 extending outward from an end of the upper surrounding wall 344 opposite to the upper base wall 343 and away from the extension axis L. In the present embodiment, the angle between the upper surrounding wall 344 and the upper base wall 343 is 45 degrees, but is not limited thereto.

The upper guide connecting portion 342 has an upper guide connecting portion 346 provided on the top connecting surface 222 and connected to the upper extension wall 345, and an upper guide mounting portion 347 connected to the upper guide connecting portion 346 and provided on the top outer peripheral surface 224 and the first mounting surface portion 5.

When the circuit board is disposed on the first mounting surface part 5, the circuit board electrically connects the first mounting region 317, the lower guide mounting region 337, and the upper guide mounting region 347, so that it is possible to determine the position of the conductive member 4 by determining whether the conductive member 4 conducts the first mounting region 317, the lower guide base 331, or the upper guide base 341, and further determine the inclination direction of the induction switch. For example, when the inductive switch is horizontal and the bottom end portion 241 faces downward, the conductive member 4 only contacts the lower guiding base 331 (see the position indicated by the solid line in fig. 13) to open the circuit; when the inductive switch is tilted to the right side and the paper feeding direction in fig. 13, the conductive member 4 rolls to contact and conduct the first inductive section 311 and the lower guide base 331 on the right side in fig. 13 (see the position marked by the imaginary line in fig. 13).

In addition, by providing the lower guide base 331 and the upper guide base 341, when the conductive device 4 rolls to the corresponding lower base wall 333 or the corresponding upper base wall 343, the lower surrounding wall 334 or the upper surrounding wall 344 can provide a force to the conductive device 4 to help to stay on the lower base wall 333 or the upper base wall 343, but at the same time, the conductive device 4 cannot roll any more because it is engaged with the lower base wall 333 or the upper base wall 343. In this embodiment, when the conductive device 4 corresponds to the lower base wall 333 or the upper base wall 343, the conductive device 4 can be separated from the lower base wall 333 or the upper base wall 343 by rotating the inductive switch about the extension axis L by 45 degrees.

It should be noted that, in the present embodiment, the lower guiding connection region 336 is disposed on the bottom connection surface 212 and connected to the lower extension wall 335, however, without being limited thereto, the lower guiding connection region 336 may be connected to the lower base wall 333 or the lower surrounding wall 334, and extend along between two adjacent ceramic green sheets 200 of the bottom layer group 21 and connected to the lower guiding installation region 337.

Similarly, the upper guide connection region 346 may also connect the upper base wall 343 or the upper surrounding wall 344 and connect to the upper guide mounting region 347 along the extension between two adjacent ceramic green sheets 200 of the top layer group 22.

Thus, the fourth embodiment can achieve the same purpose and effect as the second embodiment.

In summary, the inductive switch of the present invention can effectively reduce the volume of the inductive switch by sintering the plurality of ceramic raw layers 200 into the base unit 2, so that the inductive switch can be applied to a product with a smaller volume, thereby achieving the object of the present invention.

It should be understood that the above description is only exemplary of the present invention, and that the scope of the present invention should not be limited thereby, and that the invention is intended to cover all modifications and equivalents of the claims and their equivalents.