阅读说明：本技术 包括扩展柔性印刷电路板天线模块的电子装置 (Electronic device including extended flexible printed circuit board antenna module ) 是由 金润珠 琴琼朝 金昊钟 于 2020-03-27 设计创作，主要内容包括：一种电子装置,包括：外壳,配置为形成内部空间；辐射片,配置为设置在内部空间中；至少一个电子部件,配置为设置在内部空间中并与辐射片接触。配置为设置在辐射片上的FPCB天线模块包括导电图案和被配置为围绕导电图案的非导电层,其中非导电层可以在辐射片上延伸到电子部件位于其中的区域。(An electronic device, comprising: a housing configured to form an interior space; a radiation sheet configured to be disposed in the internal space; at least one electronic component configured to be disposed in the internal space and to be in contact with the radiation sheet. The FPCB antenna module configured to be disposed on the radiation sheet includes a conductive pattern and a non-conductive layer configured to surround the conductive pattern, wherein the non-conductive layer may extend on the radiation sheet to a region where the electronic component is located.)

1. An electronic device, comprising:

a housing configured to form an interior space;

a radiation sheet configured to be disposed in the inner space;

at least one electronic component configured to be disposed in the inner space and connected to the radiation sheet; and

an FPCB antenna module configured to be disposed on the radiation sheet and including an antenna pattern and a non-conductive layer configured to surround the antenna pattern,

wherein the non-conductive layer extends to a region in which the electronic component is located.

2. The electronic device of claim 1, further comprising:

a shielding member configured to be stacked between the radiation sheet and the FPCB antenna module.

3. The electronic device of claim 1, further comprising:

a bonding member configured to be disposed between the radiation sheet and the electronic component.

4. The electronic device of claim 1, further comprising:

a coupling member configured to be disposed between the FPCB antenna module and the electronic component.

5. The electronic device according to claim 1, wherein the FPCB antenna module further comprises an additional conductive pattern in a portion extending to the electronic component.

6. The electronic device according to claim 5, wherein the additional conductive pattern extends from an area adjacent to the antenna pattern to an area in which the electronic component is located.

7. The electronic device of claim 5, wherein the additional conductive pattern is electrically disconnected from the antenna pattern.

8. The electronic device according to claim 5, wherein the additional conductive pattern is spaced apart from a boundary of the radiation sheet when the FPCB antenna module is viewed from above.

9. The electronic device according to claim 5, wherein the additional conductive pattern is formed along a boundary of a portion of the FPCB antenna module that extends to the electronic component.

10. The electronic device of claim 1, wherein the antenna pattern comprises an antenna operating as at least one of a Near Field Communication (NFC) pattern or a Magnetically Secure Transport (MST) pattern.

11. The electronic device according to claim 1, wherein the FPCB antenna module is provided on a surface of the radiation sheet, and the electronic component is provided on a surface seen in a direction different from a direction of the surface of the radiation sheet.

12. The electronic device of claim 1, wherein the electronic component further comprises a Printed Circuit Board (PCB) or a portion of an electronic component.

13. The electronic device according to claim 1, wherein the radiation sheet includes a step between a portion thereof attached to the antenna pattern and a portion thereof attached to the electronic component.

14. The electronic device of claim 1, further comprising:

a coupling member configured to be disposed between a structure in the housing and an extension portion of the FPCB antenna module.

15. The electronic device according to claim 1, wherein a part of the electronic component is attached to the radiation sheet, and another part of the electronic component is attached to an extension portion of the FPCB antenna module.

Technical Field

Certain embodiments according to the present disclosure relate to an electronic device including an extended Flexible Printed Circuit Board (FPCB) antenna module.

Background

A Flexible Printed Circuit Board (FPCB) is a thin and light board that can be placed in a small space and formed in a specific shape. The FPCB includes a conductive tape, such as a copper tape, and a non-conductive material, such as polyimide, surrounding the conductive tape. The FPCB is an electronic component for overcoming the disadvantages of the existing Printed Circuit Board (PCB) in order to meet the trend of compact and complex electronic products.

As electronic products have been improved in performance and reduced in size, electronic components mounted therein are required to have high performance and high integration, and thus a large amount of heat is generated in the electronic products. The generated heat shortens the life of the product, causes malfunction, or brings about the risk of explosion or fire. Therefore, there is a need for a system that dissipates heat generated inside the product to the outside or a self-cooling system. The heat dissipation plate is generally used for electronic products requiring light weight and slimness.

The above information is provided merely as background information to aid in understanding the present disclosure. No determination is made as to whether any of the above is available as prior art to the present disclosure, nor is an assertion made.

Disclosure of Invention

Solution to the problem

In some embodiments according to the present disclosure, an electronic component is disposed in a housing of an electronic device. When an electronic device is operating, heat may be generated in electronic components (e.g., wireless charging antennas, processors, speakers, etc.). In order to quickly release heat, a heat sink may be attached to the electronic component. When a plurality of electronic components generating heat are attached to one heat sink, the heat sink may be damaged due to relative movement between the plurality of electronic components. When the heat sink is damaged, heat may accumulate in the electronic component, degrading the electronic component.

An electronic device according to some embodiments may include: a housing configured to form an interior space; a radiation sheet configured to be disposed in the inner space; at least one electronic component configured to be disposed in the internal space and to be in contact with the radiation sheet; and an FPCB antenna module configured to be disposed on the radiation sheet and including a conductive pattern and a non-conductive layer configured to surround the conductive pattern, wherein the non-conductive layer may extend on the radiation sheet to a region where the electronic component is located.

An electronic device according to some embodiments may include: a housing configured to form an interior space; a Printed Circuit Board (PCB) configured to be disposed in the inner space; an electronic component configured to be disposed in the inner space and electrically connected to the PCB; a radiation sheet configured to be partially or entirely in contact with the electronic component and the PCB; and an FPCB antenna module configured to include a conductive pattern electromagnetically operated in relation to an external device of the electronic device and electrically connected to the PCB, and a non-conductive layer configured to surround the conductive pattern and disposed on the radiation sheet, wherein the non-conductive layer may extend on the radiation sheet to the PCB or the electronic component.

An electronic device according to various embodiments may include a non-conductive layer that extends over the radiating patch to an area where the electronic component is located, thereby enhancing the strength of the radiating patch.

Before proceeding with the following detailed description, it may be advantageous to set forth definitions of certain words and phrases used throughout this patent document: the terms "include" and "comprise," as well as derivatives thereof, mean inclusion without limitation; the term "or" is inclusive, meaning and/or; the phrases "associated with … …" and "associated therewith" and derivatives thereof may mean to include, be included within … …, interconnect with … …, contain, be contained within … …, be connected to or with … …, be coupled to or with … …, be communicable with … …, cooperate with … …, interleave, juxtapose, be proximate to, be coupled to or with … …, have the characteristics of … …, or the like; and the term "controller" means any device, system or component thereof that controls at least one operation, such a device may be implemented in hardware, firmware or software, or some combination of at least two of the same. It should be noted that the functionality associated with any particular controller may be centralized or distributed, whether locally or remotely.

Further, the various functions described below may be implemented or supported by one or more computer programs, each formed from computer-readable program code and embodied in a computer-readable medium. The terms "application" and "program" refer to one or more computer programs, software components, sets of instructions, procedures, functions, objects, classes, instances, related data, or a portion thereof adapted for implementation in suitable computer-readable program code. The phrase "computer readable program code" includes any type of computer code, including source code, object code, and executable code. The phrase "computer readable medium" includes any type of medium capable of being accessed by a computer, such as Read Only Memory (ROM), Random Access Memory (RAM), a hard disk drive, a Compact Disc (CD), a digital video disc, or any other type of memory. A "non-transitory" computer-readable medium does not include a wired, wireless, optical, or other communication link that transmits transitory electrical or other signals. Non-transitory computer readable media include media where data can be permanently stored and media where data can be stored and later rewritten, such as rewritable optical disks or erasable memory devices.

Definitions for certain words and phrases are provided throughout this patent document, those of ordinary skill in the art should understand that in many, if not most instances, such definitions apply to prior, as well as future uses of such defined words and phrases.

Drawings

For a more complete understanding of the present disclosure and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, wherein like reference numbers represent like parts:

FIG. 1 illustrates, in block diagram form, an electronic device in a network environment in accordance with various embodiments of the present disclosure;

FIG. 2 illustrates, in block diagram form, a wireless communication module, a power management module, and an antenna module of an electronic device in accordance with some embodiments of the present disclosure;

FIG. 3A illustrates, in perspective view, an example of an electronic device in accordance with certain embodiments;

FIG. 3B illustrates the example electronic device of FIG. 3A from a rear perspective;

FIG. 4 illustrates the example electronic device of FIG. 3A in an exploded perspective view;

fig. 5 illustrates an example of a structure of an FPCB antenna module according to various embodiments of the present disclosure;

fig. 6 illustrates in an exploded view layers forming the FPCB antenna module of fig. 5;

fig. 7 illustrates the FPCB antenna of the example of fig. 5 in a cross-sectional view taken along line a-a' in fig. 5;

fig. 8 illustrates the FPCB antenna of the example of fig. 5 in a cross-sectional view taken along line B-B' in fig. 5;

fig. 9 illustrates the FPCB antenna of the example of fig. 5 in a cross-sectional view taken along line C-C' in fig. 5;

fig. 10 illustrates the FPCB antenna of the example of fig. 5 in a cross-sectional view taken along line D-D' in fig. 5; and

fig. 11 illustrates an example of a modified stacked structure of an FPCB antenna according to some embodiments of the present disclosure.

Detailed Description

Figures 1 through 11, discussed below, and the various embodiments used to describe the principles of the present disclosure in this patent document are by way of illustration only and should not be construed in any way to limit the scope of the disclosure. Those skilled in the art will understand that the principles of the present disclosure may be implemented in any suitably arranged system or device.

Fig. 1 illustrates, in a block diagram, an example of an electronic device 101 in a network environment 100, in accordance with various embodiments. Referring to the non-limiting example of fig. 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with the electronic device 104 or the server 108 via a second network 199 (e.g., a long-range wireless communication network). According to some embodiments, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to some embodiments, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a Subscriber Identity Module (SIM)196, or an antenna module 197. In some embodiments, at least one of the components (e.g., display device 160 or camera module 180) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented to be embedded in the display device 160 (e.g., a display).

The processor 120 may run, for example, software (e.g., the program 140) to control at least one other component (e.g., a hardware component or a software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to some embodiments, the processor 120 may include a main processor 121 (e.g., a Central Processing Unit (CPU) or an Application Processor (AP)) and an auxiliary processor 123 (e.g., a Graphics Processing Unit (GPU), an Image Signal Processor (ISP), a sensor hub processor, or a Communication Processor (CP)) that is operatively independent of or in conjunction with the main processor 121. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or be adapted specifically for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

The auxiliary processor 123 may control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display device 160, the sensor module 176, or the communication module 190) when the main processor 121 is in an inactive (e.g., sleep) state, or the auxiliary processor 123 may control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display device 160, the sensor module 176, or the communication module 190) with the main processor 121 when the main processor 121 is in an active state (e.g., running an application). According to some embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123.

The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., program 140) and input data or output data for commands associated therewith. The memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and the program 140 may include, for example, an Operating System (OS)142, middleware 144, or an application 146.

The input device 150 may receive commands or data from outside of the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101, such as the processor 120. The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen).

The sound output device 155 may output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing a record and the receiver may be used for incoming calls. According to some embodiments, the receiver may be implemented separately from the speaker, or as part of the speaker.

Display device 160 may visually provide information to the exterior of electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to some embodiments, the display device 160 may include touch circuitry adapted to detect a touch or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of a force caused by a touch.

The audio module 170 may convert sound into an electrical signal and vice versa. According to some embodiments, the audio module 170 may obtain sound via the input device 150 or output sound via the sound output device 155 or a headset of an external electronic device (e.g., the electronic device 102) connected directly (e.g., by a physical coupling such as a wire) or wirelessly with the electronic device 101.

The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., state of a user) external to the electronic device 101 and then generate an electrical signal or data value corresponding to the detected state. According to some embodiments, sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an Infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

Interface 177 may support one or more particular protocols that will be used to connect electronic device 101 with an external electronic device (e.g., electronic device 102) either directly (e.g., through a physical coupling, such as a wire) or wirelessly. According to some embodiments, interface 177 may comprise, for example, a high-definition multimedia interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

The connection end 178 may include a connector via which the electronic device 101 may be physically connected with an external electronic device (e.g., the electronic device 102). According to some embodiments, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module 179 may convert the electrical signal into a mechanical stimulus (e.g., vibration or motion) or an electrical stimulus that may be recognized by the user via his sense of touch or kinesthesia. According to some embodiments, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

The camera module 180 may capture still images or moving images. According to some embodiments, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

The power management module 188 may manage power to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of a Power Management Integrated Circuit (PMIC), for example.

The battery 189 may power at least one component of the electronic device 101. According to certain embodiments, the battery 189 may comprise, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108), and performing communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently of the processor 120 (e.g., an Application Processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to some embodiments, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) or a wired communication module 194 (e.g., a Local Area Network (LAN) communication module or a Power Line Communication (PLC) module). A respective one of these communication modules may communicate with external electronic devices via a first network 198 (e.g., a short-range communication network such as bluetooth, wireless fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the internet, or a computer network (e.g., a LAN or Wide Area Network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) that are separate from one another. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information, such as an International Mobile Subscriber Identity (IMSI), stored in the subscriber identity module 196.

The antenna module 197 may transmit signals or power to or receive signals or power from outside of the electronic device 101 (e.g., an external electronic device). According to some embodiments, the antenna module 197 may include an antenna including a radiating element composed of a conductive material or conductive pattern formed in or on a substrate (e.g., a PCB). According to some embodiments, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network, such as the first network 198 or the second network 199, may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). Signals or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to some embodiments, additional components other than the radiating elements, such as a Radio Frequency Integrated Circuit (RFIC), may be additionally formed as part of the antenna module 197.

At least some of the above components may be interconnected and communicate signals (e.g., commands or data) communicatively between them via an inter-peripheral communication scheme (e.g., bus, General Purpose Input Output (GPIO), Serial Peripheral Interface (SPI), or Mobile Industry Processor Interface (MIPI)).

According to some embodiments, commands or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected with the second network 199. Each of the electronic device 102 and the electronic device 104 may be the same type of device as the electronic device 101 or a different type of device from the electronic device 101. According to some embodiments, all or some of the operations to be performed at the electronic device 101 may be performed at one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of or in addition to performing the function or service. The one or more external electronic devices that received the request may perform the requested at least part of the functions or services or perform another function or another service related to the request and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing of the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may comprise, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to certain embodiments of the present disclosure, the electronic devices are not limited to those described above.

It should be understood that various embodiments as described through the present disclosure and terms used therein are not intended to limit technical features set forth herein to specific embodiments, but include various changes, equivalents, or alternatives to the respective embodiments. For the description of the figures, like reference numerals may be used to refer to like or related elements. It will be understood that a noun in the singular corresponding to a term may include one or more things unless the relevant context clearly dictates otherwise. As used herein, each of the phrases such as "a or B," "at least one of a and B," "at least one of a or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B or C" may include any or all possible combinations of the items listed together with the respective one of the plurality of phrases. As used herein, terms such as "1 st" and "2 nd" or "first" and "second" may be used to distinguish one element from another element simply and not to limit the elements in other respects (e.g., importance or order). It will be understood that, if an element (e.g., a first element) is referred to as being "coupled to", "connected to" or "connected to" another element (e.g., a second element), it can be directly connected to the other element (e.g., through a physical connection, such as a wire or bus), wirelessly connected to the other element, or connected to the other element via a third element, where the terms "operatively" or "communicatively" are used or are not used.

As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuitry"). A module may be a single integrated component adapted to perform one or more functions or a minimal unit or portion of the single integrated component. For example, according to some embodiments, the modules may be implemented in the form of Application Specific Integrated Circuits (ASICs).

The various embodiments set forth herein may be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., electronic device 101). For example, under control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to be operable to perform at least one function in accordance with the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code capable of being executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Where the term "non-transitory" simply means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

According to certain embodiments, methods according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be used as a product for conducting a transaction between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed via an application Store (e.g., Play Store)^TM) The computer program product is published (e.g. downloaded or uploaded) online, or may be distributed (e.g. downloaded or uploaded) directly between two user devices (e.g. smartphones). At least part of the computer program product may be temporarily generated if it is published online, or at least part of the computer program product may be at least temporarily stored in a machine readable storage medium, such as a memory of a manufacturer's server, a server of an application store, or a forwarding server.

According to various embodiments, each of the above components (e.g., modules or programs) may comprise a single entity or multiple entities. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as the corresponding one of the plurality of components performed the one or more functions prior to integration. Operations performed by a module, program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be performed in a different order or omitted, or one or more other operations may be added, in accordance with various embodiments.

Fig. 2 illustrates, in a block diagram 200, an example of the wireless communication module 192, the power management module 188, and the antenna module 197 of the electronic device 101, in accordance with various embodiments. Referring to the non-limiting example of fig. 2, the wireless communication module 192 may include a Magnetic Secure Transport (MST) communication module 210 or a Near Field Communication (NFC) module 230, and the power management module 188 may include a wireless charging module 250. In this case, the antenna module 197 may include a plurality of antennas including an MST antenna 297-1 connected to the MST communication module 210, an NFC antenna 297-3 connected to the NFC communication module 230, and a wireless charging antenna 297-5 connected to the wireless charging module 250. For convenience of description, the same components as those described with respect to fig. 1 are briefly described or omitted from the specification.

MST communication module 210 may receive a signal containing control information or payment information (such as card information) from processor 120, generate a magnetic signal corresponding to the received signal, and then transmit the generated magnetic signal to external electronic device 102 (e.g., a point of sale (POS) device) via MST antenna 297-1. To generate the magnetic signal, the MST communication module 210 may include a switching module (not shown) that includes one or more switches connected to the MST antenna 297-1 and that is controlled to change the direction of the voltage or current provided to the MST antenna 297-1 in accordance with the received signal, according to some embodiments. The change in direction of the voltage or current causes a corresponding change in direction of the magnetic signal (e.g., magnetic field) transmitted from MST antenna 297-1. If the external electronic device 102 detects a magnetic signal that has changed direction, the magnetic signal may cause an effect (e.g., a waveform) similar to that of a magnetic field generated when a magnetic card corresponding to card information associated with the received signal is swiped through a card reader of the electronic device 102. According to certain embodiments, the payment-related information and control signals received by the electronic device 102 in the form of magnetic signals, for example, may further be sent to an external server 108 (e.g., a payment server) via the network 199.

The NFC communication module 230 may obtain a signal containing control information or payment information, such as card information, from the processor 120 and transmit the obtained signal to the external electronic device 102 via the NFC antenna 297-3. According to some embodiments, NFC communications module 230 may receive such signals transmitted from external electronic device 102 via NFC antenna 297-3.

Wireless charging module 250 may wirelessly transmit power to external electronic device 102 (e.g., a cellular phone or wearable device) via wireless charging antenna 297-5 or receive power wirelessly from external electronic device 102 (e.g., a wireless charging device). The wireless charging module 250 may support one or more of various wireless charging schemes including, for example, a magnetic resonance scheme or a magnetic induction scheme.

Some of MST antenna 297-1, NFC antenna 297-3, or wireless charging antenna 297-5 may share at least part of their radiators according to some embodiments. For example, the radiator of MST antenna 297-1 may be used as a radiator for NFC antenna 297-3 or wireless charging antenna 297-5, or vice versa. In this case, antenna module 197 may include a switching circuit (not shown) adapted to selectively connect (e.g., close) or disconnect (e.g., open) at least a portion of antennas 297-1, 297-3, or 297-5, for example, under the control of wireless communication module 192 (e.g., MST communication module 210 or NFC communication module 230) or a power management module (e.g., wireless charging module 250). For example, when the electronic device 101 uses the wireless charging function, the NFC communication module 230 or the wireless charging module 250 may control the switching circuit to temporarily disconnect at least a portion of the radiator shared by the NFC antenna 297-3 and the wireless charging antenna 297-5 from the NFC antenna 297-3 and connect the at least a portion of the radiator with the wireless charging antenna 297-5.

According to certain embodiments, at least one function of MST communication module 210, NFC communication module 230, or wireless charging module 250 may be controlled by an external processor (e.g., processor 120). According to some embodiments, at least one designated function (e.g., payment function) of MST communication module 210 or NFC communication module 230 may be performed in a Trusted Execution Environment (TEE). According to some embodiments, a TEE may form an operating environment in which, for example, at least some designated areas of memory 130 are allocated for performing functions requiring a relatively high level of security (e.g., financial transaction functions or personal information related functions). In this case, access to the at least some specified regions of memory 130 may be restrictively granted, for example, depending on the entity accessing memory 130 or the application being run in the TEE.

Fig. 3A illustrates a front side of an example of a mobile electronic device 300 in a perspective view, according to various embodiments of the present disclosure.

Fig. 3B illustrates, in a perspective view, a back side of the example electronic device 300 of fig. 3A, in accordance with various embodiments of the present disclosure.

Referring to the non-limiting example of fig. 3A and 3B, an electronic device 300 according to some embodiments may include a housing 310, the housing 310 including a first side (or front side) 310A, a second side (or back side) 310B, and a lateral side (surface) 310C surrounding a space between the first side 300A and the second side 310B. In certain embodiments (not shown), the housing may refer to a structure that includes portions of the first side 310A, the second side 310B, and the third side 310C of fig. 1. According to some embodiments, the first side 110A may be comprised of an at least partially transparent front plate 302 (or front cover) (e.g., a polymer plate or a glass plate with various coatings).

The second side 110B may be comprised of a back panel 111 (or back cover) that may be opaque. For example, the back plate 111 may be constructed of, for example, but not limited to, coated or tinted glass, ceramic, polymer, metallic material (e.g., aluminum, stainless steel (STS), or magnesium), a combination of at least two of these materials, and the like.

Lateral sides 110C (or side members or side surfaces) may be comprised of lateral border structure 118 (or cross members) that is bonded to front panel 302 and rear panel 111 and includes, for example, but is not limited to, metal and/or polymer. In some embodiments, the back panel 111 and the lateral border structure 118 may be integrally constructed and may comprise the same material (e.g., a metallic material such as aluminum).

According to some embodiments, the electronic device 300 may include at least one of a display 301, audio modules 303, 314, a sensor module, a camera module 305, a key input device 317, and a connector aperture 308.

In some embodiments, the electronic device 300 may omit at least one component (e.g., the key input device 317) or otherwise include other components. For example, the electronic device 300 may include a sensor module (not shown). For example, a sensor such as a proximity sensor or an illuminance sensor may be integrated into the display 301 or may be disposed adjacent to the display 301 within the area provided by the front panel 302. In some embodiments, the electronic device 300 may further include a light emitting device, and the light emitting device may be disposed adjacent to the display 301 within the area provided by the front plate 302. The light emitting device may provide status information of the electronic device 300, for example in the form of light. In another embodiment, the light emitting device may provide a light source that interlocks with the operation of the camera module 305, for example. The light emitting elements may include, for example, LEDs, IR LEDs, and xenon lamps.

The display 301 may be exposed, for example, through a substantial portion of the front plate 302. In some embodiments, the edge of the display 301 may be formed to be substantially the same as the adjacent outer shape (e.g., curved surface) of the front plate 302. In another embodiment (not shown), the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be substantially the same in order to enlarge the area of the display 301 that is exposed. In another embodiment (not shown), a recess or opening may be formed in a portion of the screen display area of the display 301, and the electronic device (300) may include another electronic component (e.g., the camera module 305, the proximity sensor, or the illumination sensor) aligned with the recess or opening.

In another embodiment, at least one of the camera modules 312, 313, fingerprint sensor 316, and flash 306 may be included on a rear surface of the screen display area of the display 301. In another embodiment, the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and/or a digitizer that detects a magnetic field type stylus.

The audio modules 303 and 314 may include a microphone aperture and a speaker aperture. In some embodiments, multiple microphones may be arranged to sense the direction of sound. In some embodiments, the speaker aperture and the microphone aperture may be implemented as one aperture, or may include a speaker without a speaker aperture (e.g., a piezoelectric speaker). The speaker aperture may include an external speaker aperture and a call receiver aperture.

The electronic device 300 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state by including a sensor module. The sensor module may include, for example, a proximity sensor disposed on the first surface 310A of the housing 310, a fingerprint sensor integrated into or adjacent to the display 301, and/or a biometric sensor (e.g., HRM sensor) disposed on the second surface 310B. The electronic device 300 includes a sensor module, such as a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an Infrared (IR) sensor, a biosensor, a temperature sensor. It may further comprise at least one of a humidity sensor or an illumination sensor.

The camera modules 305, 312, 313, and 306 include a first camera device 305 disposed on a first surface 310A of the electronic device 300, a second camera device 312, 313 disposed on a second surface 310B, and/or a flash 306. The camera devices 305, 312, 313 may include one or more lenses, image sensors, and/or image signal processors. Flash lamp 306 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed at one side of the electronic device 300.

The key input device 317 may be disposed on the side 310C of the housing 310. In other embodiments, the electronic device 300 may not include some or all of the key input devices 317 described above, and the key input devices 317 that are not included may be implemented in another form, such as soft keys on the display 301. In some embodiments, the key input device may include at least a portion of the fingerprint sensor 316.

The connector aperture 308 may receive a connector for transmitting and receiving power and/or data with an external electronic device and/or a connector for transmitting and receiving audio signals with an external electronic device. For example, the connector aperture 308 may include a USB connector or a headphone jack.

Fig. 4 illustrates the example electronic device of fig. 3A in an exploded perspective view. Referring to the non-limiting example of fig. 4, the electronic device 400 may include a lateral bezel structure 410, a first support member 411 (e.g., a bracket), a front plate 420, a display 430, a printed circuit board 440, a battery 450, a second support member 460 (e.g., a rear case), an antenna module 470, and a rear plate 480. In some embodiments, at least one of the components (e.g., the first support member 411 or the second support member 460) may be omitted from the electronic device 400, or a different component may be further included in the electronic device 400. At least one of the components of the electronic device 400 may be the same as or similar to at least one of the components of the electronic device 300 of fig. 3A or 3B, and redundant description is omitted hereinafter.

According to various embodiments, the first support member 411 may be disposed in the electronic device 400 and may be connected to the lateral bezel structure 410 or may be integrally formed with the lateral bezel structure 410. The first support member 411 may be formed of, for example, a metallic material and/or a non-metallic material (e.g., a polymer). The first support member 411 may be coupled with the display 430 on one surface thereof and may be coupled with the printed circuit board 440 on the other surface thereof. The processor, memory, and/or interfaces may be mounted on the printed circuit board 440. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communications processor.

The memory may include, for example, volatile memory or nonvolatile memory.

The interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 400 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The battery 450 is a device for supplying power to at least one component of the electronic apparatus 400, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 450 may be disposed in substantially the same plane as, for example, the printed circuit board 440. The battery 450 may be integrally provided in the electronic device 400, or may be detachably provided in the electronic device 400.

The antenna module 470 may be disposed between the rear plate 480 and the battery 450. The antenna module 470 may include, for example, a Near Field Communication (NFC) antenna, a wireless charging antenna, and/or a Magnetic Secure Transport (MST) antenna. The antenna module 470 may, for example, perform short-range communication with an external device, or may wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a portion of the lateral bezel structure 410 and/or the first support member 411, or a combination thereof.

Fig. 5 illustrates an example of an FPCB antenna module and layers attached to the FPCB antenna module, according to some embodiments. Fig. 6 illustrates, in an exploded view, a FPCB antenna module and layers attached to the FPCB antenna module, in accordance with certain embodiments. Referring to the non-limiting examples of fig. 5 and 6, an electronic device 400 according to some embodiments may include a housing 401, an FPCB antenna module 501, a shielding member 502, a radiation sheet 503, a coupling member 504, and a printed circuit board 440.

According to some embodiments, the housing 401 may form an interior space of the electronic device 400. For example, the housing 401 may include side bezel structures 410 that form lateral sides of the electronic device 400. The FPCB antenna module 501, the shielding member 502, the radiation sheet 503, the coupling member 504, and the printed circuit board 440 may be stacked in the inner space of the housing 401.

According to some embodiments, the FPCB antenna module 501 may include an antenna pattern 511 and a non-conductive layer 512 surrounding the antenna pattern 511.

According to some embodiments, the antenna pattern 511 may include a wireless charging pattern 511a, a near field communication pattern 511b, and a magnetic security transmission pattern 511 c. The wireless charging pattern 511a, the near field communication pattern 511b, and the magnetic security transmission pattern 511c may process different signals of respective frequency bands.

According to some embodiments, a current induced by an external charging device may be generated in the wireless charging pattern 511a, and a battery (e.g., the battery 450 of fig. 4) may be charged with the induced current. According to some embodiments, the wireless charging pattern may be patterned with a conductive material on both sides of one base layer. According to some embodiments, the wireless charging pattern 511a may be formed in concentric circles, and may be electrically connected to the printed circuit board.

According to some embodiments, the near field communication pattern 511b may be disposed along a circumference of the wireless charging pattern 511 a. The near field communication pattern 511b may be patterned at both sides or one side of the base layer. The near field communication pattern 511b may be electrically connected to the printed circuit board. The electronic device 400 may transmit and receive signals to and from an external electronic device through the near field communication pattern 511 b.

According to some embodiments, the magnetic security transmission pattern 511c may be disposed in an area adjacent to the wireless charging pattern 511 a. According to some embodiments, the magnetic security transmission pattern 511c may be formed to face one edge of the case from the wireless charging pattern 511 a. According to some embodiments, the magnetic security transmission pattern 511c may be electrically connected to a printed circuit board, and the electronic device 400 may generate a specified magnetic field stored in a memory (e.g., the memory 130 of fig. 1) to transmit a signal to an external device through the magnetic security transmission pattern 511 c.

When a current flows through the antenna pattern 511 according to the antenna operation, heat may be generated due to resistance. When the generated heat is not properly radiated, the heat may be accumulated in the electronic device 400, thereby causing performance deterioration. Further, when the case (e.g., the second side 310B of fig. 3B) of the electronic device 400 is heated by the heat generated by the antenna pattern 511, the user may feel discomfort in using the electronic device 400. In order to release heat generated in the antenna pattern 511, a radiation sheet 503 may be attached to the antenna pattern 511.

According to some embodiments, the non-conductive layer 512 may extend from the third region 523 corresponding to the antenna pattern 511 to the first and fifth regions 521 and 525 in which the electronic component is disposed. The extended portion of the non-conductive layer 512 may be disposed to overlap the radiation patch 503 and/or the electronic component. The extended portion of the non-conductive layer 512 may be attached to a portion of the electronic component by a bonding member 504.

According to one embodiment, the FPCB antenna module 501 may include an additional conductive pattern 513. According to some embodiments, the FPCB antenna module 501 may include an additional conductive pattern 513 in a portion extending to the first region 521 or the fifth region 525. The additional conductive pattern 513 may be disposed in the first, second, fourth, and fifth areas 521, 522, 524, and 525 of the FPCB antenna module 501. The additional conductive pattern 513 may be disposed along an outer boundary of the radiation patch 503.

In some embodiments, the additional conductive pattern 513 may not be used as a conductive line. In another embodiment, the additional conductive pattern 513 may be electrically connected to the printed circuit board 440.

In some embodiments, the shielding member 502 may be attached to one side of the antenna pattern 511. For example, the battery 450, the printed circuit board 440, or the support member 360 may be disposed on one surface of the shielding member 502, and the wireless charging pattern 511a, the near field communication pattern 511b, or the magnetic security transmission pattern 511c may be disposed on the other surface of the shielding member 502.

According to some embodiments, the shielding member 502 may minimize the influence of the electronic component on the antenna pattern 511. Further, the shielding member 502 may concentrate the magnetic field generated by the antenna pattern 511 on one side of the shielding member 502. For example, the shielding member 502 may concentrate a magnetic field generated in the wireless charging pattern 511a on a surface of a rear plate (e.g., the rear plate 480 of fig. 4) where the case is disposed, thereby improving the charging efficiency of the battery. In another example, the shielding member 502 may concentrate a magnetic field generated in the near field communication pattern 511b on the rear plate, thereby enabling the electronic device 400 to effectively perform Near Field Communication (NFC) with an external electronic device (e.g., the electronic device 102 of fig. 1).

According to some embodiments, a plurality of shielding members 502 may be provided to form a layer. The shielding member 502 may have different thicknesses according to the position where the shielding member 502 is disposed, and may be arranged in different forms.

In some embodiments, the shielding member 502 may be formed of a material having a high magnetic permeability and a low loss tangent (loss tangent) in the frequency bands of the near field communication pattern 511b and the wireless charging pattern 511 a. The shielding member 502 may include a microcrystalline material, and may have a high permeability and a low loss tangent in a frequency band of the near field communication pattern 511b and the wireless charging pattern 511a of about 10kHz to 15 MHz. Accordingly, the shielding member 502 may function as a ferromagnetic body in the frequency bands of the near field communication pattern 511b and the wireless charging pattern 511a of about 10kHz to 15 MHz.

According to some embodiments, electronic components may be mounted or assembled on a printed circuit board 440 disposed at the rear of the housing 401. The electronic components may include a processor (e.g., processor 120 of fig. 1), a memory (e.g., memory 130 of fig. 1), Display Driver Integration (DDI) circuitry, and a speaker module mounted on printed circuit board 440.

According to some embodiments, the printed circuit board 440 may extend from the first region 521 to the fifth region 525 along one edge of the housing 401. The electronic components on the printed circuit board 440 may be attached to one surface of the radiation sheet 503 and/or one surface of the FPCB antenna module 501, or may be in contact with one surface of the radiation sheet 503 and/or one surface of the antenna module 501.

According to some embodiments, a portion of the radiation sheet 503 may be attached to one surface of the shielding member 502. In some embodiments, a portion of the radiation sheet 503 may be attached to a portion of the FPCB antenna module 501. In some embodiments, a portion of the radiating patch 503 may be attached to a portion of the electronic component. According to some embodiments, the radiation sheet 503 may extend from the third region 523, where the antenna pattern 511 is disposed, to the first region 521 and/or the fifth region 525, where the electronic device 505 is disposed.

In the illustrated embodiment, the radiation patch 503 is formed of one layer, but is not limited thereto. In another embodiment, the radiation patch 503 may be formed of multiple layers. The plurality of layers forming the radiation patch 503 may have the same thickness, or at least one of the plurality of layers may have different thicknesses.

In some embodiments, the heat sink 503 may include graphite having excellent heat dissipation properties in order to dissipate heat generated in the wireless charging pattern 511a or the battery.

In some embodiments, the bonding member 504 may be disposed between the radiation sheet 503 and the electronic components on the printed circuit board 440. In another embodiment, a portion of the coupling member 504 may be disposed between the FPCB antenna module 501 and the printed circuit board 440, and another portion thereof may be disposed between the printed circuit board 440 and the radiation sheet 503. In still another embodiment, the coupling member 504 may be disposed between the radiation sheet 503 (or the FPCB antenna module 501) and the structure inside the housing 401. Due to the coupling member 504, the FPCB antenna module 501 may be fixed in the housing, thereby preventing the FPCB antenna module 501 from moving in the housing.

Fig. 7 illustrates an example FPCB antenna module 501 in cross-section taken along line a-a' in fig. 5.

According to some embodiments, a portion of the radiation sheet 503 may be attached to the FPCB antenna module 501 (or to the shielding member 502 of the FPCB antenna module 501), and another portion thereof may be attached to the electronic component 505. According to the illustrated embodiment, the radiation sheet may be attached to the shielding member 502 in the third region 523, may be attached to the FPCB antenna module 501 in the second region 522, and may be disposed between the FPCB antenna module 501 and the electronic component 505 in the first region 521. In some embodiments, the bonding member 504 may be disposed between the radiation sheet 503 and the electronic component 505. The coupling member 504 may fix the FPCB antenna module 501 attached to the radiation sheet 503 in the housing.

The heat sink 503 may be disposed across the three regions 521, 522, and 523 to improve the heat dissipation performance of the electronic device 400. For example, the heat generated by the antenna pattern 511 in the third region 523 may be diffused not only to the radiation sheet 503 in the third region 523 but also to the radiation sheets in the first and second regions 521 and 522, thereby being radiated relatively quickly. In another example, heat generated by the electronic components 505 in the first region 521 may be diffused not only in the radiation sheet 503 in the first region 521 but also to the radiation sheets 503 in the second and third regions 522 and 523 to be relatively quickly radiated.

According to some embodiments, a relative movement between the FPCB antenna module 501 and the electronic component 505 may occur due to an external impact applied to the electronic device 400. Due to this movement, stress may be concentrated on the radiation patch 503 in the second region 522. Specifically, when the step d1 is present in the radiation sheet 503 in the second area 522, the radiation sheet 503 may be more susceptible to stress due to relative movement occurring between the FPCB antenna module 501 and the electronic component 505 than in the case where there is no step.

In some embodiments, the non-conductive layer 512 of the FPCB antenna module 501 may extend from the third region 523 to the first region 521 through the second region 522. When the non-conductive layer 512 extends from the third region 523 to the second region 522 and the first region 521, the extended portion of the non-conductive layer 512 may receive stress generated due to relative movement between the first region 521 and the third region 523 together with the radiation sheet 503. Accordingly, damage to the radiation sheet 503 due to relative movement occurring between the FPCB antenna module 501 and the electronic component 505 can be prevented.

According to some embodiments, the FPCB antenna module 501 may include a non-conductive layer 512 and an antenna pattern 511. In some embodiments, the antenna pattern 511 and/or the non-conductive layer 512 may be formed of multiple layers. For example, as shown in the embodiment, the antenna pattern 511 may include two layers.

According to some embodiments, the FPCB antenna module 501 may extend from an area 523 in which the antenna pattern 511 is disposed to an area 521 in which the electronic component 505 as an additional heat generation source is disposed, or to a portion of the area 521. In one embodiment, the extension portion may include only the non-conductive layer 512 without the conductive pattern (e.g., the antenna pattern 511).

According to some embodiments, the shielding member 502 may be disposed on one surface of the FPCB antenna module 501. In some embodiments, the shielding member 502 may be disposed to overlap the antenna pattern 511 of the FPCB antenna module 501. For example, the shielding member 502 may be attached to a region of the FPCB antenna module 501 in which the wireless charging pattern 511a, the near field communication pattern 511b, and the magnetic security transmission pattern 511c are located.

Fig. 8 illustrates a cross-sectional view of an example FPCB antenna module 501 taken along line B-B' of fig. 5.

According to some embodiments, the radiation patch 503 may be disposed in the third region 523, the fourth region 524, and the fifth region 525. For example, a portion of the radiation sheet 503 may be attached to the FPCB antenna module 501, and another portion thereof may be attached to the electronic component 505. According to various embodiments, the radiating patch 503 may be attached to a portion of the electronic component 505.

The heat sink 503 may be disposed across the third to fifth regions 523, 524, and 525, thereby improving the heat dissipation performance of the electronic device 400. For example, the heat generated by the antenna pattern 511 in the third region 523 may be diffused not only in the radiation sheet 503 in the third region 523 but also to the radiation sheets in the fourth and fifth regions 524 and 525 to be relatively quickly radiated. In another example, heat generated by the electronic components 505 in the fifth region 525 may be diffused not only in the radiation patches 503 in the fifth region 525 but also to the radiation patches 503 in the third region 523 and the fourth region 524 to be radiated relatively quickly.

According to some embodiments, the bonding member 504 may be disposed between the radiation sheet 503 and the electronic component 505. The coupling member 504 may fix the FPCB antenna module 501 attached to the radiation sheet 503 in the housing. According to some embodiments, the coupling member 504 may be disposed between the extended FPCB antenna module 501 and the electronic component 505.

In some embodiments, when the non-conductive layer 512 extends to the fifth region 525, the non-conductive layer 512 may be subjected to stress due to relative movement between the third region 523 and the fifth region 525 along with the radiating patch 503. According to some embodiments, the FPCB antenna module 501 may further include an additional conductive pattern 513 in the extension portion. Referring to the non-limiting example of fig. 11, a portion of the radiation patch 503 in the fifth area 525 may be surrounded by the additional conductive pattern 513. The non-conductive layer 512 and the further included additional conductive pattern 513 may together with the radiating patch 503 be subjected to a stress due to a relative movement between the third region 523 and the fifth region 525. Accordingly, damage to the radiation sheet 503 due to relative movement occurring between the FPCB antenna module 501 and the electronic component 505 can be prevented.

According to some embodiments, the FPCB antenna module 501 may include a non-conductive layer 512, an antenna pattern 511, and an additional conductive pattern 513.

In some embodiments, the non-conductive layer 512 of the FPCB antenna module 501 may extend from the third region 523, in which the antenna pattern 511 is formed, to the fifth region 525, in which the electronic component 505 as an additional heat generation source is disposed, or to a portion of the fifth region 525.

In some embodiments, the FPCB antenna module 501 may include an additional conductive pattern 513 in the extension portion. In some embodiments, the additional conductive pattern 513 may be electrically disconnected from the antenna pattern 511 disposed in the third region. In another embodiment, the additional conductive pattern 513 may be electrically connected to the printed circuit board 440 so as to function as an electronic component (e.g., an antenna).

According to some embodiments, the additional conductive pattern 513 may be disposed at a distance from the radiation patch 503. For example, the additional conductive pattern 513 may be spaced apart from an outer boundary of the radiation patch 503.

Fig. 9 illustrates a cross-sectional view of an example FPCB antenna module 501 taken along line C-C' in fig. 5.

According to some embodiments, the FPCB antenna module 501 may include a non-conductive layer 512, an antenna pattern 511, and an additional conductive pattern 513. In some embodiments, the FPCB antenna module 501 may extend from an area 523 in which the antenna pattern 511 is formed to an area 525 in which the electronic component 505 as an additional heat generation source is disposed, or to a portion of the area 525.

According to some embodiments, the FPCB antenna module 501 may include an additional conductive pattern 513 in a portion extending to the fourth and fifth areas 524 and 525. In some embodiments, the additional conductive pattern 513 may be electrically disconnected from the antenna pattern 511 (d 2).

According to some embodiments, the radiation sheet 503 may be disposed to overlap the FPCB antenna module 501. The radiation sheet 503 may be disposed under the shielding member 502, and may receive heat from the FPCB antenna module 501 through the shielding member. The radiation sheet 503 may diffuse the received heat into the radiation sheet 503, thereby preventing the heat from being concentrated in the FPCB antenna module 501.

According to some embodiments, the coupling member 504 may be disposed between the FPCB antenna module 501 and the electronic component 505. Although the FPCB antenna module 501 is attached to the electronic component 505 in the illustrated embodiment, the embodiment is not limited thereto. For example, the FPCB antenna module 501 may be attached to a device inside the housing. The coupling member 504 may fix the FPCB antenna module 501 in the housing. By fixing the FPCB antenna module 501 in the housing, the FPCB antenna module 501 can be prevented from moving in the housing, and thus the FPCB antenna module 501 can normally operate.

Fig. 10 illustrates a cross-sectional view of an example FPCB antenna module 501 taken along line D-D' in fig. 5. The non-limiting example of fig. 10 shows a cross section of the FPCB antenna module 501 extending from the third region 523 to the fifth region 525, taken in a direction perpendicular to the extending direction.

An additional conductive pattern 513 may be disposed in a portion of the non-conductive layer 512. According to some embodiments, the additional conductive pattern 513 may be disposed at a distance from the radiation patch 503. In some embodiments, the radiation sheet 503 and the additional conductive pattern 513 may not overlap when the FPCB antenna module 501 is viewed from above. For example, the radiation sheet 503 may be disposed under a portion 527 of the FPCB antenna module 501 including only the non-conductive layer 512. In some embodiments, the electronic component 505 may be attached to the portion 526 comprising the additional conductive pattern 513 by the bonding member 504.

Since the additional conductive pattern 513 is disposed at a distance from the radiation sheet 503, the thickness of the component in which the radiation sheet 503 and the FPCB antenna module 501 are combined together can be kept relatively constant. By reducing the thickness of the component in which the radiation sheet 503 and the FPCB antenna module 501 are combined together, the internal space of the housing 500 can be effectively utilized.

Further, since the radiation sheet 503 is in direct contact with the electronic component 505 without the bonding member 504, the radiation sheet 503 is less likely to be damaged when the FPCB antenna module 501 is separated from the electronic component 505.

Fig. 11 illustrates an example of a modified stacked structure of an FPCB antenna according to some embodiments. Fig. 11 illustrates some embodiments in which additional conductive patterns are provided to overlap with the radiation patch.

According to some embodiments, the FPCB antenna module 1210 may include a non-conductive layer 1212, an antenna pattern 1211, and an additional conductive pattern 1213. In some embodiments, the FPCB antenna module 1210 may extend from an area in which the conductive pattern 12111 is formed to an area in which the electronic component 1150 as an additional heat generation source is disposed.

According to some embodiments, the shielding member 1120 may be disposed on one surface of the FPCB antenna module 1210. The shield member 1120 may be attached to a region corresponding to the conductive pattern 1111 of the FPCB antenna module 1210.

According to some embodiments, a portion of the radiation sheet 1130 may be attached to the FPCB antenna module 12110, and another portion thereof may be attached to the electronic component 1150. For example, the radiation sheet 1130 may extend from an area in which the conductive pattern 1211 of the FPCB antenna module 1210 is disposed to an area in which the electronic component 1150 is disposed.

By extending the radiation sheet 1130, the heat dissipation performance of the radiation sheet 1130 may be improved. For example, the heat generated by the antenna pattern 1211 may be diffused not only in the radiation sheet 1130 in the region corresponding to the antenna pattern 1211 but also to the radiation sheet 1130 in the region where the electronic component 1150 is disposed, thereby being radiated relatively quickly.

According to some embodiments, the coupling member 1140 may be disposed between the radiation sheet 1130 and the electronic component 1150. The coupling member 1140 may fix the FPCB antenna module 1210 disposed on the radiation sheet 1130 in the case. By fixing the FPCB antenna module 1210 in the housing, the FPCB antenna module 1210 can be prevented from moving in the housing.

The non-conductive layer 1212 of the FPCB antenna module 1210 may extend to an area in which the electronic component 1150 is disposed. According to some embodiments, the FPCB antenna module 1210 may further include an additional conductive pattern 1213 in the extension portion. The additional conductive pattern 1213 may overlap the radiation sheet 1130. The FPCB antenna module 1110 including the non-conductive layer 1212 and the additional conductive pattern 1213 may bear stress caused by relative movement between the FPCB antenna module 1210 and the electronic component 1150 together with the radiation sheet 1130.

An electronic device (e.g., electronic device 101 of fig. 1) according to various embodiments may include: a housing configured to form an internal space (e.g., housing 401 of fig. 5); a radiation patch (e.g., radiation patch 503 of fig. 5) configured to be disposed in the interior space; at least one electronic component (e.g., electronic component 505 of fig. 7) configured to be disposed in the interior space and connected to the radiation sheet; and an FPCB antenna module (e.g., FPCB antenna module 501 of fig. 7) configured to be disposed on the radiation sheet and including an antenna pattern (e.g., antenna pattern 511 of fig. 7) and a non-conductive layer (e.g., non-conductive layer 512 of fig. 7) configured to surround the antenna pattern, wherein the non-conductive layer may extend to an area where the electronic component is located.

According to some embodiments, the electronic device may further include a shielding member (e.g., the shielding member 502 of fig. 6) configured to be stacked between the radiation sheet and the FPCB antenna module.

According to some embodiments, the electronic device may further include a bonding member (e.g., bonding member 504 of fig. 6) configured to be disposed between the radiation sheet and the electronic component.

According to some embodiments, the electronic device may further include a coupling member configured to be disposed between the FPCB antenna module and the electronic component.

According to some embodiments, the FPCB antenna module may further include an additional conductive pattern (e.g., the additional conductive pattern 513 of fig. 5) in a portion extending to the electronic component.

According to some embodiments, the additional conductive pattern may extend from an area adjacent to the antenna pattern to an area in which the electronic component is located.

According to some embodiments, the additional conductive pattern may be electrically disconnected from the antenna pattern.

According to some embodiments, the additional conductive pattern may be spaced apart from a boundary of the radiation sheet when the FPCB antenna module is viewed from above.

According to some embodiments, the electronic device may include a step between a portion of the radiation sheet attached to the antenna pattern and a portion of the radiation sheet attached to the electronic component.

According to some embodiments, the antenna pattern of the electronic device may include an antenna operating as at least one of a wireless charging pattern (e.g., wireless charging pattern 511a of fig. 6), a Near Field Communication (NFC) pattern (e.g., near field communication pattern 511b), or a Magnetic Security Transmission (MST) pattern (e.g., magnetic security transmission pattern 511 c).

According to some embodiments, the FPCB antenna module of the electronic device may face the electronic component with respect to the radiation sheet in an area where the coupling member is located.

According to some embodiments, the electronic component of the electronic device may further comprise a main Printed Circuit Board (PCB) or a portion of the electronic component.

According to some embodiments, an electronic device (e.g., electronic device 400 of fig. 5) may include: a housing (e.g., housing 401 of fig. 5) configured to form an internal space; a printed circuit board (PCB, e.g., printed circuit board 440 of fig. 5) configured to be disposed in the inner space; an electronic component (e.g., electronic component 505 of fig. 6) configured to be disposed in the inner space and electrically connected to the PCB; a radiation sheet (e.g., the radiation sheet 503 of fig. 5) configured to be partially or entirely in contact with the electronic component and the PCB; and an FPCB antenna module (e.g., FPCB antenna module 501 of fig. 5) configured to include an antenna pattern (e.g., antenna pattern 511 of fig. 5) so as to electromagnetically operate in relation to an external device of the electronic device and electrically connected to the PCB; and a non-conductive layer (e.g., non-conductive layer 512 of fig. 5) configured to surround the antenna pattern and disposed on the radiating patch, wherein the non-conductive layer may extend over the radiating patch to the PCB or electronic component.

According to some embodiments, the electronic device may further include a shielding member (e.g., the shielding member 502 of fig. 6) configured to be disposed between the radiation sheet and the FPCB antenna module.

According to some embodiments, the electronic device may further include a bonding member (e.g., bonding member 504 of fig. 6) configured to be disposed between the radiation sheet and the electronic component.

According to some embodiments, the electronic device may further include a coupling member configured to be disposed between the FPCB antenna module and the electronic component.

According to some embodiments, the electronic device may further comprise an additional conductive pattern (e.g., additional conductive pattern 513 of fig. 5) in addition to the non-conductive layer extending to the region in which the electronic component is located.

According to some embodiments, the electronic component may comprise a speaker.

According to some embodiments, the additional conductive pattern of the electronic device may be spaced apart from the radiation sheet and may extend along an edge of the radiation sheet.

According to some embodiments, the additional conductive pattern of the electronic device may be electrically connected to the printed circuit board.

In the embodiments of the present disclosure described above, elements included in the present invention are expressed in the singular or plural according to the illustrated embodiments. However, it should be understood that the singular or plural expressions are appropriately selected according to the present circumstances for convenience of description, and the present disclosure is not limited to the singular or plural constituent elements, and may be composed of a plurality of elements even if they are expressed.

While the present disclosure has been described with various embodiments, various changes and modifications may be suggested to one skilled in the art. The present disclosure is intended to embrace such alterations and modifications as fall within the scope of the appended claims.