阅读说明：本技术 一种芯片检测分选设备 (Chip detecting and sorting equipment ) 是由 欧志荣 刘旭海 温志刚 唐政 高云峰 于 2021-05-31 设计创作，主要内容包括：本发明涉及生产自动化设备技术领域,公开一种芯片检测分选设备。该设备包括：吸取检测组件,包括运动平台、设置在运动平台上的检测模块和吸附件；芯片料盘放置包括用于放置芯片的芯片料盘；滚轮流道组件用于承接芯片载具,并使芯片夹具与所述芯片载具相分离,待芯片被吸取后芯片夹具复位；相机模组用于检测吸附件的位置和角度信息；所述检测模块用于对芯片进行检测,在检测符合要求后进行等级识别,并确定芯片和芯片料盘的位置信息；根据所述位置和角度信息,驱动所述吸附件平移吸取芯片,并将芯片放置在对应级别的所述芯片料盘上。本发明能够实现对芯片进行自动检测分选,大大提高设备的自动化程度,也提高了设备的工作效率。(The invention relates to the technical field of production automation equipment, and discloses chip detection and sorting equipment. The apparatus comprises: the absorption detection assembly comprises a motion platform, a detection module and an absorption piece, wherein the detection module and the absorption piece are arranged on the motion platform; the chip tray placement comprises a chip tray for placing chips; the roller runner assembly is used for bearing the chip carrier, separating the chip clamp from the chip carrier and resetting the chip clamp after the chip is sucked; the camera module is used for detecting the position and angle information of the adsorption piece; the detection module is used for detecting the chip, performing grade recognition after the detection meets the requirement, and determining the position information of the chip and a chip tray; and driving the adsorption part to horizontally move to suck the chip according to the position and angle information, and placing the chip on the chip tray at the corresponding level. The invention can realize automatic detection and sorting of the chips, greatly improve the automation degree of the equipment and also improve the working efficiency of the equipment.)

1. The utility model provides a chip detects sorting facilities for detect the chip that bears on the chip anchor clamps and select separately, the chip anchor clamps bear on the chip carrier, its characterized in that: this chip detects sorting facilities includes: the device comprises a suction detection assembly, a roller runner assembly, a chip tray placing assembly and a camera module; the absorption detection assembly comprises a motion platform, a detection module and an adsorption piece, wherein the detection module and the adsorption piece are arranged on the motion platform; the chip tray placing component comprises a chip tray for placing a chip;

the roller runner assembly is used for bearing the chip carrier, separating the chip clamp from the chip carrier and resetting the chip clamp after the chip is sucked;

the camera module is used for detecting the position and angle information of the adsorption piece;

the detection module is used for detecting the chip, performing grade recognition after the detection meets the requirement, and determining the position information of the chip and a chip tray;

and driving the adsorption part to horizontally move and absorb the chip by the motion platform according to the position and angle information of the adsorption part and the position information of the chip and the chip tray, and placing the chip on the chip tray at the corresponding level.

2. The chip detecting and sorting apparatus according to claim 1, wherein: the detection module is in including setting up motion platform's AOI detection camera and location detection camera, AOI detection camera is used for carrying out AOI detection to the chip, location detection camera is used for carrying out grade identification to the chip to confirm the positional information of chip and chip charging tray.

3. The chip detecting and sorting apparatus according to claim 1, wherein: the roller runner assembly comprises a sorting conveying line, and a carrier positioning module, a carrier blocking module and a carrier pushing module which are arranged on the sorting conveying line; the carrier positioning module is used for positioning the chip carrier and resetting the chip clamp and the chip carrier after being separated; the carrier blocking module is used for blocking the chip carrier; the carrier pushing module is used for pushing the chip carriers after the chips are separated out of the sorting conveying line.

4. The chip detecting and sorting apparatus according to claim 3, wherein: the carrier push-out module comprises a push-out cylinder, a connecting wire gauge sliding block and a push-out seat, wherein the connecting wire gauge sliding block is arranged on the push-out cylinder, the push-out seat is arranged on the wire gauge sliding block, and the push-out seat is provided with a push plate and a push plate lifting cylinder which drives the push plate to move up and down.

5. The chip detecting and sorting apparatus according to claim 1, wherein: the chip tray placing assembly also comprises a support frame, and the chip tray is positioned on the support frame; the support frame is also provided with a quick coupling module corresponding to the chip tray and a manual valve connected with the quick coupling module.

6. The chip detecting and sorting apparatus according to claim 1, wherein: the camera module comprises a visual mounting plate, a camera, a lens and an annular light source, wherein the camera, the lens and the annular light source are coaxially arranged on the visual mounting plate, the lens is located between the camera and the annular light source, and the camera corresponds to the chip in position.

7. The chip detecting and sorting apparatus according to claim 1, wherein: the chip detection and sorting equipment further comprises a blanking lifting assembly used for loading a chip carrier, wherein the blanking lifting assembly comprises a lifting module and a fixture tool arranged on the lifting module; the fixture tool is connected with the lifting module through an installation supporting plate, and a translation module in sliding fit with the fixture tool is arranged on the installation supporting plate; and a drag chain is also arranged between the clamp tool and the lifting module.

8. The chip detecting and sorting apparatus according to claim 1, wherein: chip detects sorting facilities still including being used for right the suction nozzle grinding component that adsorbs the piece and polish, suction nozzle grinding component is in including the board of polishing, setting the platform of polishing on the board of polishing, polish bench be provided with be used for the dust absorption of dust absorption ring and with the corresponding quick-operation joint in dust absorption ring position.

9. The chip detecting and sorting apparatus according to claim 1, wherein: the chip detection and sorting equipment further comprises suction nozzle placing frames for placing suction nozzles of different models, wherein each suction nozzle placing frame comprises a suction nozzle bottom plate, a support rod arranged on the suction nozzle bottom plate and a material placing plate connected with the support rod; the material placing plate is used for placing the suction nozzle, and an adjusting plate is arranged between the material placing plate and the supporting rod.

10. The chip detecting and sorting apparatus according to claim 1, wherein: chip detects sorting facilities still includes the suction nozzle pressure detection subassembly that is used for detecting suction nozzle pressure, suction nozzle pressure detection subassembly is including weighing the bottom plate, setting up the sensor mounting panel on weighing the bottom plate, be provided with pressure sensor on the sensor mounting panel, the last pressing piece that is connected with of pressure sensor.

Technical Field

The invention relates to the technical field of production automation equipment, in particular to chip detection and sorting equipment.

Background

The quality grade and performance of each chip need to be determined before the chip is used, and thus, the chip needs to be tested for many times. Each detection may cause new problems, such as bruising, scratching, etc. Therefore, AOI detection and code scanning identification are carried out on the chips, and the test performance and quality grade conditions of the chips in the previous process are identified, so that the chips with the same quality grade are placed in the same material tray, and the chips are convenient to use in the next process. In the prior art, the procedures of detecting and identifying the chip, placing the chip on a material tray and the like are respectively completed on different devices, namely the existing devices have single function, and the multifunctional requirement and multi-product compatibility cannot be realized.

Disclosure of Invention

The invention aims to provide chip detection and sorting equipment aiming at the technical problems in the prior art, which can detect and sort chips, has simple integral structure and reliable function, is easy to realize and improves the production efficiency and the automation degree.

In order to solve the problems proposed above, the technical scheme adopted by the invention is as follows:

the utility model provides a chip detects sorting facilities for detect the chip of bearing on chip anchor clamps and select separately, chip anchor clamps bear on the chip carrier, and this chip detects sorting facilities includes: the device comprises a suction detection assembly, a roller runner assembly, a chip tray placing assembly and a camera module; the absorption detection assembly comprises a motion platform, a detection module and an adsorption piece, wherein the detection module and the adsorption piece are arranged on the motion platform; the chip tray placing component comprises a chip tray for placing a chip;

the roller runner assembly is used for bearing the chip carrier, separating the chip clamp from the chip carrier and resetting the chip clamp after the chip is sucked;

the camera module is used for detecting the position and angle information of the adsorption piece;

the detection module is used for detecting the chip, performing grade recognition after the detection meets the requirement, and determining the position information of the chip and a chip tray;

and driving the adsorption part to horizontally move and absorb the chip by the motion platform according to the position and angle information of the adsorption part and the position information of the chip and the chip tray, and placing the chip on the chip tray at the corresponding level.

Furthermore, the detection module is in including setting up motion platform's AOI detection camera and location detection camera, AOI detection camera is used for carrying out AOI detection to the chip, location detection camera is used for carrying out grade recognition to the chip to confirm the positional information of chip and chip charging tray.

Further, the roller runner assembly comprises a sorting conveying line, and a carrier positioning module, a carrier blocking module and a carrier pushing module which are arranged on the sorting conveying line; the carrier positioning module is used for positioning the chip carrier and resetting the chip clamp and the chip carrier after being separated; the carrier blocking module is used for blocking the chip carrier; the carrier pushing module is used for pushing the chip carriers after the chips are separated out of the sorting conveying line.

Furthermore, the carrier push-out module comprises a push-out cylinder, a connecting wire gauge sliding block and a push-out seat, wherein the connecting wire gauge sliding block is arranged on the push-out cylinder, the push-out seat is arranged on the wire gauge sliding block, and the push-out seat is provided with a push plate and a push plate lifting cylinder which drives the push plate to move up and down.

Furthermore, the chip tray placing assembly also comprises a support frame, and the chip tray is positioned on the support frame; the support frame is also provided with a quick coupling module corresponding to the chip tray and a manual valve connected with the quick coupling module.

Furthermore, the camera module comprises a visual mounting plate, a camera coaxially arranged on the visual mounting plate, a lens and an annular light source, wherein the lens is positioned between the camera and the annular light source, and the camera corresponds to the chip.

Further, the chip detection and sorting equipment further comprises a blanking lifting assembly used for loading a chip carrier, wherein the blanking lifting assembly comprises a lifting module and a fixture tool arranged on the lifting module; the fixture tool is connected with the lifting module through an installation supporting plate, and a translation module in sliding fit with the fixture tool is arranged on the installation supporting plate; and a drag chain is also arranged between the clamp tool and the lifting module.

Further, chip detects sorting facilities still including being used for right the suction nozzle subassembly of polishing that adsorbs the piece and polish, the suction nozzle subassembly of polishing is in including polishing the board, setting polishing bench on the board, polishing bench be provided with be used for the dust absorption ring of dust absorption and with the corresponding quick-operation joint in dust absorption ring position.

Furthermore, the chip detection and sorting equipment also comprises suction nozzle placing racks for placing suction nozzles of different models, wherein each suction nozzle placing rack comprises a suction nozzle bottom plate, a support rod arranged on the suction nozzle bottom plate and a material placing plate connected with the support rod; the material placing plate is used for placing the suction nozzle, and an adjusting plate is arranged between the material placing plate and the supporting rod.

Further, chip detects sorting facilities still includes the suction nozzle pressure detection subassembly that is used for detecting suction nozzle pressure, suction nozzle pressure detection subassembly includes the bottom plate of weighing, sets up the sensor mounting panel on the bottom plate of weighing, be provided with pressure sensor on the sensor mounting panel, the last pressing piece that is connected with of pressure sensor.

Compared with the prior art, the invention has the beneficial effects that:

the chip detecting and sorting equipment provided by the invention carries and conveys the chip carrier through the roller runner component, the chip can be automatically subjected to AOI detection and automatic detection and identification by absorbing the detection component, and the position information of the chip and a chip tray can also be detected, the movement platform drives the adsorption piece to move and absorb the chip by combining the position and angle information of the suction nozzle detected by the camera module, the chip is placed on the chip tray of the corresponding grade, the chip can be automatically sorted, the problems of multifunction and multi-product compatibility are solved, the automation degree of the equipment is greatly improved, the error of manually sorting the chip is effectively reduced, the working efficiency of the equipment is also improved, and the quality of the chip product is improved, the automatic control system is simple in overall structure, reliable in function and easy to realize, reduces labor force and cost, and provides a solution for realizing full-automatic production.

Drawings

In order to illustrate the solution of the invention more clearly, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are some embodiments of the invention, and that other drawings may be derived from these drawings by a person skilled in the art without inventive effort. Wherein:

FIG. 1 is an isometric view of a chip inspection and sorting apparatus according to an embodiment of the present invention.

FIG. 2 is a partial isometric view of a chip inspection and sorting apparatus according to an embodiment of the present invention.

FIG. 3 is a top view of a chip inspection and sorting apparatus according to an embodiment of the present invention.

Fig. 4 is a front view of an aspiration test assembly in accordance with an embodiment of the present invention.

Fig. 5 is a top view of a suction test assembly according to an embodiment of the present invention.

FIG. 6 is a front view of a Z-axis motion stage according to an embodiment of the invention.

FIG. 7 is a top view of a Z-axis motion stage according to an embodiment of the invention.

Fig. 8 is a schematic structural diagram of a roller runner assembly according to an embodiment of the invention.

Fig. 9 is a top view of a roller runner assembly in accordance with an embodiment of the present invention.

Fig. 10 is a schematic structural diagram of a carrier ejecting module according to an embodiment of the invention.

Fig. 11 is a schematic structural diagram of a chip tray placing assembly according to an embodiment of the invention.

Fig. 12 is a schematic structural diagram of a camera module according to an embodiment of the invention.

Fig. 13 is a schematic structural diagram of a blanking lifting assembly according to an embodiment of the present invention.

Fig. 14 is a schematic structural view of a nozzle grinding assembly according to an embodiment of the present invention.

Fig. 15 is a schematic structural view of a nozzle holder according to an embodiment of the present invention.

Fig. 16 is a schematic structural diagram of a nozzle pressure detecting assembly according to an embodiment of the present invention.

The reference numerals are explained below: 1-a frame, 2-a camera module, 3-a suction detection component, 4-a roller runner component, 5-a chip tray placing component, 6-a blanking lifting component, 7-a suction nozzle polishing component, 8-a suction nozzle placing rack, 9-a suction nozzle pressure detection component and 10-a marble platform; 21-camera, 22-lens, 23-annular light source, 24-camera mounting plate, 26-light source mounting plate, 27-first connecting plate, 28-visual mounting plate, 29-lens fixing block and 210-second connecting plate; 31-a portal frame, 32-Y-axis guide rails, 33-X-axis guide rails, 34-a detection module, 341-Z-axis moving platforms, 342-AOI detection cameras, 343-a connecting block, 344-suction nozzles, 345-a positioning detection camera, 346-a power batch and 347-a batch head; 410-carrier positioning module, 411-carrier blocking module, 412-carrier pushing module, 401-first sorting conveying line, 402-second sorting conveying line, 41-conveying mounting plate, 42-roller assembly, 43-conveying belt, 44-conveying motor, 421-transmission wheel set, 422-conveying wheel set, 45-supporting plate, 46-moving plate, 47-slideway and 48-reinforcing rib plate; 413-a push-out cylinder, 414-a wire gauge slide block, 415-a push plate, 416-a push seat and 417-a push plate lifting cylinder; 51-support frame, 52-transfer plate, 53-slide block support plate, 54-fixed mounting block, 55-quick joint, 56-positioning pin, 57-material tray component, 58-pressure switch seat, 59-vacuum pressure gauge, 510-quick joint, 511-manual valve, 512-valve mounting bracket and 513-convergence plate component; 61-platform installation supporting plates, 62-drag chains, 63-fixing seats, 64-drag chain supports, 65-clamp tools, 66-lifting modules and 67-translation modules; 71-a polishing bottom plate, 72-a supporting column, 73-a polishing plate, 74-a polishing table, 75-a dust suction ring, 76-a quick joint, 81-a suction nozzle bottom plate, 82-a supporting rod, 83-a material discharging plate, 84-an adjusting plate, 91-a sensor mounting plate, 92-a pressure sensor, 93-a supporting upright post, 94-a weighing bottom plate, 95-a sensor protective cover and 96-a pressing sheet.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention, e.g., the terms "length," "width," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc., refer to an orientation or position based on that shown in the drawings, are for convenience of description only and are not to be construed as limiting of the present disclosure.

The terms "including" and "having," and any variations thereof, in the description and claims of this invention and the description of the above figures are intended to cover non-exclusive inclusions; the terms "first," "second," and the like in the description and in the claims, or in the drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential order. In the description and claims of the present invention and in the description of the above figures, when an element is referred to as being "fixed" or "mounted" or "disposed" or "connected" to another element, it may be directly or indirectly located on the other element. For example, when an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.

Furthermore, reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.

It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1 to 3, an embodiment of the present invention provides a chip detecting and sorting apparatus, which is used for receiving and conveying a chip carrier, separating a chip clamp carried on the chip carrier from the chip carrier during a conveying process, detecting a chip on the chip clamp, and placing the detected chip on a corresponding chip tray, so as to detect and sort the chip.

Chip detects sorting facilities including absorbing detection component 3, gyro wheel runner subassembly 4, chip charging tray and placing subassembly 5 and camera module 2. The absorption detection assembly 3 comprises a motion platform, a detection module 34 and an adsorption piece, wherein the detection module 34 and the adsorption piece are arranged on the motion platform, and the motion platform drives the detection module 34 and the adsorption piece to translate; the chip tray assembly 5 comprises a chip tray for placing chips.

The roller runner assembly 4 is used for receiving and conveying the chip carrier, separating the chip clamp from the chip carrier, and resetting the chip clamp after the chip is sucked.

The camera module 2 is used for detecting the position and angle information of the adsorption piece.

The detection module 34 is used for detecting the chip, performing grade identification after the detection meets the requirement, and determining the position information of the chip and the position information of the chip tray. Specifically, the detection module 34 detects the quality of the chip (if there is a scratch or not), and performs level identification after the quality meets the requirement, so that the chip is conveniently placed on the corresponding level of the chip tray.

According to the position and angle information, the adsorption piece horizontally moves to absorb the chips and places the chips on the corresponding levels of the chip trays, so that the chips are detected and sorted.

In this embodiment, the arrow in fig. 3 shows the direction of delivery of gyro wheel runner assembly 4 is the flow direction of chip carrier promptly, chip detects sorting facilities is still including the frame 1 that is used for installing each subassembly, set up respectively in the frame 1 absorb detecting element 3, gyro wheel runner assembly 4, chip charging tray and place subassembly 5 and camera module 2, the motion platform that absorbs detecting element 3 is located one side of gyro wheel runner assembly 4, detecting module 34 and absorption piece and camera module 2 is located the top of gyro wheel runner assembly 4, chip charging tray assembly 5 is located the opposite side of gyro wheel runner assembly 4 is convenient for install like this and also makes whole equipment compact structure.

In other embodiments of the present invention, the positional relationship between the suction detection assembly 3, the chip tray placement assembly 5, and the camera module 2 and the roller runner assembly 4 can be adjusted as needed, as long as the suction detection assembly 3 can detect and sort the chips on the roller runner assembly 4, the chip tray placement assembly 5 can facilitate the suction detection assembly 3 to place the chips on the chip tray, and the camera module 2 can facilitate the detection of the position and angle information of the suction member.

In the embodiment of the invention, the roller runner component 4 is used for conveying the chip carrier, the detection module 34 of the absorption detection component 3 is used for detecting the quality of the chip and identifying the grade, the position information of the chip and the position information of a chip tray can be determined, the camera module 2 is used for detecting the position and angle information of the absorption piece, and the motion platform can drive the absorption piece to horizontally move to absorb the chip and place the chip on the chip tray according to the detected position information of the chip and the absorption piece.

Referring to fig. 4 and 5, the moving platform of the absorption detection assembly 3 adopts a gantry double-drive XYZ-axis moving guide rail, the moving platform includes a gantry 31 disposed on the rack 1, a Y-axis guide rail 32 disposed on the gantry 31, an X-axis guide rail 33 disposed on the Y-axis guide rail 32, and a Z-axis moving platform 341 disposed on the X-axis guide rail 33, and the detection module 34 and the absorption member are located on the Z-axis moving platform 341. Specifically, the suction nozzle 344 is adopted as the suction member, so that the chip can be sucked reliably and simply. Through the action of the Y-axis guide rail 32, the X-axis guide rail 33 and the Z-axis moving platform 341, the detection module 34 and the suction nozzle 344 can be driven to translate in three directions, namely, the X-axis direction, the Y-axis direction and the Z-axis direction.

Referring to fig. 6 and 7, the detection module 34 includes an AOI detection camera 342 and a positioning detection camera 345 disposed on the motion platform, where the AOI detection camera 342 is used to perform AOI detection on the chip, and detect whether the performance and quality of the chip meet the requirements, that is, determine whether there is a scratch or other problem. The positioning detection camera 345 is used for performing grade recognition on the chip and determining the position information of the chip and the position information of the chip tray.

Specifically, the AOI detection camera 342, the positioning detection camera 345 and the suction nozzle 344 are located on the Z-axis moving platform 341, the positions of the three can be adjusted according to the requirement, and the AOI detection camera 342 and the positioning detection camera 345 can be located on both sides of the suction nozzle 344 or on the same side of the suction nozzle 344. The Z-axis moving platform 341 is further provided with a connecting block 343, and the suction nozzle 344 is located on the connecting block 343, so that the installation and connection are convenient.

Further, the motion platform is further provided with an electric screwdriver 346 and a screwdriver head 347 for loosening the screws of the chip clamp, specifically, the electric screwdriver 346 and the screwdriver head 347 are located on the Z-axis moving platform 341, and the positions of the electric screwdriver 346 and the screwdriver head 347 can be adjusted according to the position of the screws between the chip and the chip clamp in practice, so that the chip and the chip clamp can be conveniently separated, and the suction nozzle 344 can reliably suck the chip.

In the embodiment of the present invention, the Y-axis guide rail 32 and the X-axis guide rail 33 are respectively driven by linear motors, and the Z-axis moving platform 341 is driven by a servo motor, so that the working reliability of the Z-axis moving platform can be ensured. Can drive AOI detection camera 342 and location detection camera 345 through X axle guide rail 33, Y axle guide rail 32 and Z axle moving platform 341 and carry out the translation, conveniently detect the chip, can also drive suction nozzle 344 and carry out the translation, the suction nozzle 344 of being convenient for absorb the chip and place the chip on the subassembly 5 is placed to the chip charging tray.

Referring to fig. 8 and 9, the roller runner assembly 4 includes a sorting conveyor line disposed on the frame 1, a carrier positioning module 410, a carrier blocking module 411, and a carrier pushing module 412 disposed on the sorting conveyor line; the carrier positioning module 410 is used for positioning the chip carrier, and resetting the chip clamp and the chip carrier after being separated; the carrier blocking module 411 is used for blocking a chip carrier, so that the carrier positioning module 410 can conveniently position the chip carrier; the carrier pushing module 412 is used for pushing the chip carriers after the chips are separated out of the sorting conveying line.

Specifically, the sorting conveyor line comprises a first sorting conveyor line 401 and a second sorting conveyor line 402 which are arranged oppositely, both the first sorting conveyor line and the second sorting conveyor line comprise a conveying mounting plate 41 and a roller assembly 42 arranged on the conveying mounting plate 41, and a conveying belt 43 is arranged on the roller assembly 42. The conveying mounting plate 41 is further provided with a conveying motor 44, the conveying motor 44 is connected with a driving roller shaft of the roller assembly 42, the conveying belt 43 on the roller assembly 42 is driven to convey, and the roller assembly 42 is driven to convey the chip carrier. Further, roller assembly 42 includes that relative setting is in the drive pulley group 421 and the defeated material wheelset 422 of carrying on mounting panel 41, be provided with conveyer belt 43 on the drive pulley group 421, defeated material wheelset 422 on first letter sorting transfer chain 401 and the second letter sorting transfer chain 402 is relative to be set up for carry the chip carrier.

Specifically, the conveying installation plate 41 is disposed on the frame 1 through a support plate 45. A moving plate 46 and a slide way 47 which are in sliding fit are further arranged between the supporting plate 45 and the rack 1, and a reinforcing rib plate 48 is further arranged between the moving plate 46 and the supporting plate 45, so that the mounting stability of the whole roller runner assembly 4 can be ensured. In the embodiment of the present invention, the distance between the first sorting line 401 and the second sorting line 402 can be adjusted by sliding the moving plate 46 and the slide rail 47, i.e. the distance can be adjusted adaptively according to the size of the chip carrier, so as to meet the requirements of various chip carriers. The moving plate 46 and the slide way 47 can be arranged in one group or more than one group according to actual needs, so that the working stability and reliability of the whole mechanism can be ensured.

Further, the carrier positioning module 410 includes a cylinder seat disposed on the conveying installation plate 41, and a positioning cylinder disposed on the cylinder seat, wherein a top plate is disposed on the positioning cylinder, and a positioning pin for positioning the chip clamp is disposed on the top plate.

Further, the carrier blocking module 411 includes a blocking cylinder seat disposed on the conveying installation plate 41, and a blocking cylinder disposed on the blocking cylinder seat, wherein a stopper for blocking the chip carrier is disposed on the blocking cylinder.

Further, referring to fig. 10, the carrier push-out module 412 includes a push-out cylinder 413, a wire gauge slide block 414, a push plate 415, a push seat 416, and a push plate lifting cylinder 417, where the push-out cylinder 413 is disposed on the conveying mounting plate 41, the push-out cylinder 413 is connected to the wire gauge slide block 414, the wire gauge slide block 414 is provided with the push seat 416, and the push seat 416 is provided with a push plate 415 and a push plate lifting cylinder 417 for driving the push plate 415 to move up and down. After the chip carrier is conveyed to the proper position, the push plate lifting cylinder 417 works to lift the push plate 415, the push-out cylinder 413 pushes the push seat 416 and drives the push plate 415 to push the chip carrier out of the conveying line, then the push plate lifting cylinder 417 retracts the push plate 415, and the push-out cylinder 413 retracts the push seat 416, and the process is repeated (at this time, the chip in the chip clamp on the chip carrier is taken away).

In the embodiment of the present invention, the conveying motor 44 operates to drive the transmission wheel set 421 and the conveying belt 43 to drive the conveying wheel set 422 to rotate, so as to convey the chip clamp and the chip carrier containing the chip. When the chip carrier is conveyed to a positioning position, after the carrier blocking module 411 works to block the chip carrier, the carrier positioning module 410 works to position the chip clamp and lift the chip clamp to separate the chip clamp from the chip carrier. After the chip on the chip clamp is sucked away, the empty chip clamp falls back into the chip carrier again, and the chip clamp and the chip carrier are conveyed continuously. When the chip carrier is conveyed to the outflow position, the carrier push-out module 412 works to push out the chip clamp and the chip carrier from the sorting assembly line.

Referring to fig. 11, the chip tray placing assembly 5 further includes a support frame 51 disposed on the rack 1, and a tray assembly 57 disposed on the support frame 51, where the tray assembly 57 is provided with a chip tray, i.e., a placing position, for placing a chip. The support frame 51 is provided with a quick connector module connected with an external air circuit, and the quick connector module corresponds to the material tray assembly 57 in position and is used for generating vacuum and adsorbing a chip material tray. Specifically, since the plurality of chip trays are arranged according to different levels, in order to facilitate installation, the plurality of chip trays are installed as the integrated tray assembly 57.

Further, a vacuum pressure gauge 59 is further arranged on the support frame 51 and used for monitoring the vacuum generation amount generated by the quick connector, so that sufficient vacuum is guaranteed to suck the chip tray, and otherwise, an alarm is given.

Furthermore, the support frame 51 is further provided with a manual valve 511 connected with the quick connector module, and the manual valve 511 is used for manually taking away the chip tray after the chip tray is full of chips, and at this time, the corresponding quick connector of the chip tray needs to be closed through the corresponding manual valve 511 to close the vacuum, so that the chip tray is taken away, other chip trays cannot be affected, and the integrity of the chips is ensured.

Specifically, the support frame 51 includes a slider support plate 53 and a pressure switch base 58 connected to the slider support plate 53, and the slider support plate 53 is disposed on the frame 1 through a fixing block 54. Further, the quick coupling includes a first quick coupling 55 disposed on the pressure switch base 58 and a second quick coupling 510 disposed on the slider support plate 53, a junction plate assembly 513 connected to the second quick coupling 510 is further disposed on the slider support plate 53, and a tap on the junction plate assembly 513 is connected to a lower connection of the manual valve 511. In the embodiment of the invention, as the manual valve 511 and the first quick connector 55 can be provided with a plurality of groups and respectively correspond to one chip tray, a plurality of taps are arranged in the collecting plate assembly 513 and are connected with the corresponding manual valves 511, the second quick connector 510 is used as a main connector to be connected with an external air pipe, and then the taps are connected with the first quick connector 55 to act on the chip trays, so that the installation is convenient, each chip tray can be ensured to be vacuum-adsorbed without moving, and the reliability of the vacuum-adsorbed chip tray can also be ensured.

Further, for convenience in installation and operation, the tray assembly 57 is arranged on the support frame 51 through the transfer plate 52, and the support frame 51 is further provided with a positioning pin 56 for positioning the transfer plate 52, so that the tray can be replaced conveniently. Specifically, the tray assembly 57 is provided with a plurality of sets of chip trays according to the chip level, and the number of the chip trays can be increased or decreased according to actual needs.

Referring to fig. 12, the camera module 2 is used for detecting the position and angle information of the suction nozzle 344, and includes a vision mounting plate 28 disposed on the frame 1, a camera 21 coaxially disposed on the vision mounting plate 28, and a lens 22, where the camera 21 corresponds to the chip position. An annular light source 23 is arranged on the visual mounting plate 28 and is coaxial with the lens 22, and the lens 22 is positioned between the camera 21 and the annular light source 23. Specifically, the camera 21 and the lens 22 are located at the bottom of the sorting conveyor line and the suction nozzle 344, so that the suction nozzle 344 can be detected conveniently. In other embodiments of the present invention, both the camera 21 and the lens 22 may be disposed at one side of the suction nozzle 344, as long as the detection of the suction nozzle 344 is realized.

Specifically, the opposite sides of the vision mounting plate 28 are respectively provided with a first connecting plate 27 and a second connecting plate 210, and the second connecting plate 210 is provided with the camera mounting plate 24 and the camera 21. The first connecting plate 27 is provided with a lens fixing block 29 for connecting the lens 22, and the annular light source 23 is arranged on the first connecting plate 27 through the light source mounting plate 26 and corresponds to the position of the lens 22.

In the embodiment of the present invention, the camera module 2 provides a light source through the annular light source 23, visually detects the position and angle information of the chip sucked by the suction nozzle 344 and the suction nozzle 344 through the camera 21 and the lens 22, and drives the suction nozzle 344 to reliably suck the chip by combining the chip position information detected by the positioning detection camera 345, and places the chip in the chip tray of the corresponding level, thereby ensuring the reliability and effectiveness of the sorting device.

Referring to fig. 13, the chip detecting and sorting apparatus further includes a discharging lifting assembly 6, the discharging lifting assembly 6 includes a lifting module 66 disposed on the frame 1, the lifting module 66 is connected to a fixture 65 for placing a chip carrier, and drives the fixture 65 to perform lifting movement.

Further, the lifting module 66 is connected with an installation support plate 61, and the installation support plate 61 is provided with the fixture tool 65 and a translation module 67 in sliding fit with the fixture tool 65. The fixture tool 65 is further connected with a drag chain 62, one end of the drag chain 63 is arranged on the fixture tool 65 through a fixed seat 63, and the other end of the drag chain 63 is arranged on a lifting module 66 through a drag chain support 64.

In the embodiment of the invention, a plurality of clamp tools 65 can be arranged as required to place chip carriers, the corresponding positions of different clamp tools 65 and the sorting conveying lines on the roller runner assembly 4 are adjusted by arranging the translation module 67, the lifting module 66 can drive the clamp tools 65 to lift up and down by the distance of one chip carrier, in order to ensure that the clamp tools 65 can translate on the translation module 67 in the lifting process, the drag chain 63 is arranged for connection, the movement reliability of the clamp tools 65 is ensured, electric wires, communication signal wires, air pipes and the like in the blanking lifting assembly 6 can be protected, the electric wires, the communication signal wires, the air pipes and the like can move forwards and backwards along with the drag chain 63 without being broken or damaged, and the working reliability of equipment is ensured.

Referring to fig. 14, the chip inspecting and sorting apparatus further includes a nozzle grinding assembly 7 for grinding the nozzles 344, so that the nozzles 344 can more reliably suck the chips. The suction nozzle polishing assembly 7 comprises a polishing plate 73 arranged on the machine frame 1, a polishing table 74 is arranged on the polishing plate 73, a dust suction ring 75 used for sucking dust is arranged on the polishing table 74, a quick connector 76 corresponding to the position of the dust suction ring 75 is further arranged on the polishing table 74 and used for connecting an external vacuum air path, and dust after polishing is pumped away through vacuum.

Specifically, the polishing plate 73 is relatively provided with a polishing bottom plate 71, the polishing bottom plate 71 and the polishing bottom plate are connected through a support pillar 72, the polishing bottom plate 71 is arranged on the machine frame 1, and the quick coupling 76 and the polishing bottom plate 71 are located on the opposite side of the polishing table 74.

Referring to fig. 15, the chip detecting and sorting apparatus further includes a suction nozzle placing frame 8 for placing suction nozzles 344 of different models, so that the apparatus can replace the suction nozzles according to the grades of the chips. The suction nozzle placing frame 8 comprises a suction nozzle bottom plate 81 and a discharging plate 83 which are arranged oppositely and connected through a supporting rod 82, and the suction nozzle bottom plate 81 is arranged on the rack 1. The material discharging plate 83 is used for placing the suction nozzle, and an adjusting plate 84 is arranged between the material discharging plate 83 and the supporting rod 82 for adjusting.

Referring to fig. 16, the chip inspecting and sorting apparatus further includes a nozzle pressure detecting assembly 9 for detecting the pressure of the nozzle, so as to detect the nozzle pressure according to the kind of the chip. The suction nozzle pressure detection assembly 9 comprises a sensor mounting plate 91 and a weighing bottom plate 94 which are oppositely arranged, a supporting upright post 93 is arranged between the sensor mounting plate 91 and the weighing bottom plate 94, the weighing bottom plate 94 is arranged on the rack 1, a pressure sensor 92 is arranged on the sensor mounting plate 91, and a pressing sheet 96 is connected to the pressure sensor 92. In order to protect the pressure sensor 92, a sensor protection cover 95 is provided on the sensor mounting plate 91 and outside the pressure sensor 92.

In the embodiment of the invention, before chips are sorted, the equipment is ready to work, the suction nozzle 344 on the motion platform moves downwards and presses the pressing sheet 96, the pressure of the pressing is displayed by the pressure sensor 92, and the external system calculates and controls the suction pressure of the suction nozzle 344 to the chips when the suction nozzle 344 sucks the chips according to the displacement distance of the suction nozzle 344 and the relationship between the displacement and the pressure, so as to ensure that the suction nozzle 344 does not damage the chips due to overlarge suction pressure.

In the embodiment of the present invention, as shown in fig. 2 and fig. 3, a marble platform 10 is disposed on the frame 1, and other components are mounted on the marble platform 10, so that the reliability of the installation of the whole equipment is ensured by disposing the marble platform 10, thereby ensuring the reliability of the operation of the whole equipment. The suction nozzle polishing assembly 7, the suction nozzle placing frame 8 and the suction nozzle pressure detecting assembly 9 are arranged between the chip tray placing assembly 5 and the roller runner assembly 4, so that the operation is convenient, the structure of the equipment is compact, the positions of the assemblies can be adjusted according to actual requirements, and the purpose of the embodiment of the invention is not influenced.

The chip detecting and sorting equipment provided by the embodiment of the invention has the working process as follows:

because the chip is loaded in the chip clamp, and the chip clamp is loaded in the chip carrier, the detection and sorting equipment conveys the chip by conveying the chip carrier and the chip clamp. The sorting conveying line of the roller runner assembly 4 conveys the chip clamp and the chip carrier which flow into the chip, the carrier blocking module 411 is used for positioning the chip clamp by the carrier positioning module 410 after blocking the chip carrier, and the chip clamp is jacked to separate the chip clamp from the chip carrier.

The suction detection assembly 3 starts to work, and drives the detection module and the suction nozzle 344 to translate through the X-axis guide rail 33, the Y-axis guide rail 32 and the Z-axis moving platform 341 of the moving platform, so as to adjust the positions of the detection module and the suction nozzle 344 and the chip on the chip carrier. The AOI inspection camera 342 inspects the chip to determine if there is a scratch or the like. If the problem exists, alarming to prompt blanking; if the requirements are met, the position detection camera 345 identifies the chip and determines the quality level of the chip, the electric screwdriver 346 and the screwdriver head 347 work to loosen the screws between the chip clamp and the chip, and the chip waits to be sucked away.

The position detection camera 345 further visually detects the position of the chip on the chip holder, drives the suction nozzle 344 to move above the camera module 2 through the moving platform, and visually detects the position and angle at which the suction nozzle 344 and the suction nozzle 344 are to suck the chip through the camera module 2. Based on the detected chip position information and the position and angle information of the suction nozzle 344, the motion platform drives the suction nozzle 344 to move and suck the chip from the chip holder. When the chip is sucked up from the chip holder, the suction nozzle 344 drives the sucked-up chip to move to above the camera module 2, and the camera module 2 detects the position and angle of the chip again (the chip is sucked up by the suction nozzle 344 and is ready to be placed in the tray assembly 57 of the chip tray placing assembly 5).

The moving platform continues to drive the positioning detection camera 345 to move, so as to detect the position and the angle of the chip tray on the tray assembly 57, and in combination with the chip position information detected by the camera module 2 and the chip tray position information detected by the positioning detection camera 345, the moving platform drives the suction nozzle 344 and the chip adsorbed by the suction nozzle 344 to move, and puts the chip into the chip tray of the corresponding grade.

The carrier positioning module 410 is reset to drop the empty chip clamp back into the chip carrier, and the carrier blocking module 411 is also reset to continue to convey the chip carrier and the chip clamp to the push-out position. The carrier pushing module 412 works to push the empty chip carriers and the chip clamps into the clamp tool 65 of the blanking lifting assembly 6, and the clamp tool 65 is driven to ascend or descend by the distance of one chip carrier through the lifting module 66 until the clamp tool 65 is full, so that the chip detection and sorting process is completed.

Before chip detection and sorting are carried out on the equipment, the embodiment of the invention carries out pressure detection on the suction nozzle 344 through the suction nozzle pressure detection assembly 9, adjusts the relation between the pressure and the displacement distance of the suction nozzle 344, and can control the moving distance of the downward pressing of the suction nozzle 344 in the actual operation. When the suction nozzle 344 can not suck the chip, the moving platform drives the suction nozzle 344 to move to the suction nozzle polishing assembly 7 for back and forth friction for several times, so as to ensure that the suction surface of the suction nozzle 344 is smooth, thereby ensuring that the suction nozzle 344 can reliably suck the chip and completing the chip detection and sorting work.

The chip detection and sorting equipment provided by the embodiment of the invention can solve the problems of multifunctional realization and multi-product compatibility, namely, the AOI detection camera 342 can realize automatic AOI detection on the chip, the positioning detection camera 345 and the camera module can carry out automatic detection and identification, namely, the positions of the chip, the suction nozzle and a chip tray are automatically identified, the pressure of the suction nozzle is automatically detected by the suction nozzle pressure detection component 9, the multifunctional requirement is met, the suction nozzle placing frame 8 can be arranged according to the requirement to automatically replace the suction nozzle to adapt to different chip products, the same equipment can detect and sort various chips, the multi-product compatibility requirement is met, the automation degree of the whole equipment is greatly improved, and the working efficiency of the equipment is also improved.

The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.