阅读说明：本技术 内存装置 (Memory device ) 是由 萧志成 于 2016-06-28 设计创作，主要内容包括：本发明公开一种内存装置,其包含多条沿一第一方向延伸的字符线,及至少一内存单元。至少一内存单元包含沿相异于第一方向的一第二方向排列的多个内存组件群组,每一内存组件群组包含多个内存组件；及至少一条位元线沿第二方向延伸；及至少一条列字符线沿第二方向延伸；及沿第一方向延伸的多条行字符线；及多个列开关,每一列开关具有耦接于至少一条列字符线的一控制端,耦接于多个内存组件群组其中之一的一第一端,及耦接于至少一条位元线的一第二端；及多个行开关,每一行开关具有耦接于一相对应行字符线的一控制端,每一行开关和一相对应列开关串连耦接于多个内存组件群组其中之一及至少一条位元线之间。本发明提供的内存装置可以减少功率消耗。(The invention discloses a memory device, which comprises a plurality of character lines extending along a first direction and at least one memory unit. The at least one memory unit comprises a plurality of memory component groups which are arranged along a second direction different from the first direction, and each memory component group comprises a plurality of memory components; and at least one bit line extending in a second direction; and at least one column word line extending in a second direction; and a plurality of row wordlines extending in a first direction; and a plurality of row switches, each row switch having a control terminal coupled to at least one row word line, a first terminal coupled to one of the plurality of memory element groups, and a second terminal coupled to at least one bit line; and a plurality of column switches, each column switch having a control terminal coupled to a corresponding column word line, each column switch and a corresponding row switch coupled in series between one of the plurality of memory element groups and at least one bit line. The memory device provided by the invention can reduce power consumption.)

1. A memory device, comprising:

a plurality of word lines extending in a first direction; and

at least one memory cell comprising:

a plurality of memory device groups arranged along a second direction different from the first direction, each of the memory device groups including a plurality of memory devices;

at least one bit line extending along the second direction and used for transmitting data of a selected memory component;

at least one column word line extending in the second direction; and

a plurality of row switches, each row switch having a control terminal coupled to the at least one row word line, a first terminal coupled to one of the plurality of memory element groups, and a second terminal coupled to the at least one bit line.

2. The memory device of claim 1, wherein the memory device comprises a plurality of memory cells arranged along the first direction, a plurality of memory cells forming a memory block, the row wordlines of the plurality of memory cells being grouped to control row switches of the corresponding memory block, respectively.

3. The memory device of claim 1, wherein the plurality of column switches are transistors.

4. A memory device, comprising:

a plurality of word lines extending in a first direction; and

at least one memory cell comprising:

a plurality of memory device groups arranged along a second direction different from the first direction, each of the memory device groups including a plurality of memory devices;

at least one bit line extending along the second direction and used for transmitting data of a selected memory component;

at least one column word line extending in the second direction; and

a plurality of row word lines extending in the first direction;

a plurality of row switches, each row switch having a control terminal coupled to the at least one row word line,

a plurality of column switches, each column switch having a control terminal coupled to a corresponding column word line;

wherein each of the column switches and a corresponding row switch are coupled in series between one of the plurality of memory element groups and the at least one bit line.

5. The memory device according to claim 4, wherein the memory device comprises a plurality of memory cells arranged along the first direction, a plurality of memory cells forming a memory block, the row wordlines of the plurality of memory cells being grouped to control row switches of the corresponding memory block, respectively.

Technical Field

The present invention relates to a memory device, and more particularly, to a memory device with low power consumption.

Background

Referring to fig. 1, fig. 1 is a schematic diagram of a conventional memory device. As shown in FIG. 1, memory device 100 includes a plurality of memory elements MC, a plurality of word lines WL0-WL255, and a plurality of bit lines BL0-BL 255. The memory components MC are arranged in an array. For example, a plurality of memory elements MC may be arranged in an array having 256 rows and 256 columns. A plurality of word lines WL0-WL255 extend in a first direction A. Each word line WL0-WL255 is used to select a corresponding row of memory elements MC for a read or write operation. A plurality of bit lines BL0-BL255 are disposed along a second direction B different from the first direction A, and each bit line BL0-BL255 is used for transmitting data of a corresponding row of memory cells MC.

Referring to FIG. 2, FIG. 2 is a diagram of a conventional memory device 200 having a first bit line configuration. As shown in fig. 2, the plurality of memory devices MC are divided into a predetermined number (e.g., 8) of memory banks bk0-bk7, and each of the memory banks bk0-bk7 includes 32 rows of memory devices MC. Furthermore, in addition to memory cell MC, word lines WL0-WL255, and bit lines (bit0_ bk 0-bit 31_ bk7), memory device 200 further includes a plurality of multiplexers MUX0-MUX 7. Each multiplexer MUX0-MUX7 is coupled to the bitlines (bit0_ bk 0-bit 31_ bk7) of the 32 rows of memory elements MC of a corresponding memory block bk0-bk 7. For example, multiplexer MUX0 is coupled to the bit lines (bit0_ bk 0-bit 31_ bk0) of the 32 rows of memory elements MC of memory block bk0, multiplexer MUX7 is coupled to the bit lines (bit0_ bk 7-bit 31_ bk7) of the 32 rows of memory elements MC of memory block bk7, and so on.

Referring to FIG. 3, FIG. 3 is a diagram of a conventional memory device 300 having a second bit line configuration. As shown in FIG. 3, in addition to memory element MC, word lines WL0-WL255, and bit lines (bit0_ bk 0-bit 31_ bk7), memory device 300 with the second bit line configuration further includes a plurality of multiplexers MUX0-MUX 31. In addition, the bit lines (bit0_ bk 0-bit 31_ bk7) corresponding to each memory block bk0-bk7 are sequentially distributed. For example, multiplexer MUX0 is coupled to bit lines (bit0_ bk 0-bit 0_ bk7) of row 1 memory elements MC of memory blocks bk0-bk7, multiplexer MUX31 is coupled to bit lines (bit31_ bk 0-bit 31_ bk7) of row 32 memory elements MC of memory blocks bk0-bk7, and so on. The second bitline configuration of FIG. 3 simplifies the wiring compared to the first bitline configuration of FIG. 2.

In the conventional memory devices 100, 200, 300, when one of the word lines WL0-WL255 selects a corresponding column of memory cells MC, all bit lines (BL0-BL255, bit0_ bk 0-bit 31_ bk7) are coupled to the selected corresponding memory cell MC for read or write operations. However, some bit lines do not need to transmit data during read or write operations. The idle bit lines consume power during read or write operations, and thus the conventional memory devices 100, 200, 300 have higher power consumption.

Disclosure of Invention

The present invention is directed to a memory device with low power consumption to solve the problems of the prior art.

The invention also provides a memory device, which comprises a plurality of word lines extending along a first direction and at least one memory unit. The at least one memory cell includes a plurality of memory element groups, at least one bit line, at least one row word line, a plurality of column word lines, and a plurality of row switches and column switches. The plurality of memory element groups are arranged along a second direction different from the first direction, and each memory element group comprises a plurality of memory elements. The at least one bit line extends along the second direction and is configured to transmit data of a selected memory element. The at least one column word line extends along the second direction. The plurality of row word lines extend in a first direction. The plurality of row switches are arranged along the second direction, each row switch has a control end coupled to the at least one row word line, a first end coupled to one of the plurality of memory element groups, and a second end coupled to the at least one bit line. The column switches are arranged along the second direction, and each column switch is provided with a control end coupled to a corresponding column character line; wherein each of the column switches and a corresponding row switch are coupled in series between one of the plurality of memory element groups and the at least one bit line.

The present invention further provides a memory device, comprising: a plurality of word lines extending in a first direction; and a plurality of memory cells arranged along the first direction, the memory cells comprising: a plurality of memory device groups arranged along a second direction different from the first direction, each of the memory device groups including a plurality of memory devices; at least one bit line extending along the second direction and used for transmitting data of a selected memory component; at least one column word line extending in the second direction; and a plurality of row switches arranged along the second direction, each row switch having a control terminal coupled to the at least one row word line, a first terminal coupled to one of the plurality of memory element groups, and a second terminal coupled to the at least one bit line; a predetermined number of memory cells form a memory block, and the row wordlines of the plurality of memory cells are grouped to control row switches of the corresponding memory block, respectively.

Drawings

Fig. 1 is a schematic diagram of a conventional memory device.

FIG. 2 is a diagram of a conventional memory device having a first bit line configuration.

FIG. 3 is a diagram of a conventional memory device having a second bit line configuration.

FIG. 4 is a schematic diagram of a memory cell having a first word line configuration according to the present invention.

FIG. 5 is a schematic diagram of a memory device of the present invention having a first word line configuration and a first bit line configuration.

FIG. 6 is a diagram of a memory device 500a having a first word line configuration and a second bit line configuration according to the present invention.

FIG. 7 is a diagram of a memory cell having a second word line configuration according to a first embodiment of the present invention.

FIG. 8 is a diagram of a memory cell having a second word line configuration according to a second embodiment of the present invention.

FIG. 9 is a schematic diagram of a memory cell having a third word line configuration according to the first embodiment of the present invention.

FIG. 10 is a schematic diagram of a memory cell having a second embodiment of a third word line configuration according to the present invention.

FIG. 11 is a schematic diagram of a memory device having a third word line configuration and a first bit line configuration according to the present invention.

FIG. 12 is a partial schematic diagram of the memory device of FIG. 11.

FIG. 13 is a schematic diagram of a memory device of the present invention having a third word line configuration and a second bit line configuration.

FIG. 14 is a partial schematic diagram of the memory device of FIG. 13.

FIG. 15 is a schematic diagram of a memory cell having a fourth word line configuration according to the first embodiment of the present invention.

FIG. 16 is a schematic diagram of a memory cell having a fourth word line configuration according to a second embodiment of the present invention.

FIG. 17 is a schematic diagram of a memory device of the present invention having a fourth word line configuration and a first bit line configuration.

FIG. 18 is a schematic diagram of a memory device of the present invention having a fourth word line configuration and a second bit line configuration.

FIG. 19 is a diagram of a switch of a memory device according to an embodiment of the present invention.

Fig. 20 to 22 are schematic diagrams illustrating the operation of the memory device in the byte enable mode according to the present invention.

In the figure:

100. 200, 300 existing memory devices;

400a, 400b, 400c, 500a, 500b, 500a memory device of the present invention;

a a first direction;

b, a second direction;

bk0 to bk7 memory blocks;

CWL0 through CWL7 column word lines;

CWL0_ byte0 through CWL0_ byte3 column word lines;

an MC memory component;

MUX, MUX0-MUX7 multiplexer;

WL0 to WL255 wordlines;

BL0 to BL255 bit lines;

bit lines from bit0_ bk0 to bit31_ bk 7;

RWL0_ bk 0-RWL 31_ bk7 rows of word lines;

RWL0_ bk0_ byte0 through RWL0_ bk7_ byte3 row word lines;

an SW switch;

SW1 column switches;

SW2 row switches.

Detailed Description

The present invention is further described with reference to the following drawings and specific examples so that those skilled in the art can better understand the present invention and can practice the present invention, but the examples are not intended to limit the present invention.

Please refer to fig. 4 and fig. 5. FIG. 4 is a schematic diagram of a memory cell having a first word line configuration according to the present invention. FIG. 5 is a diagram of a memory device 400a having a first word line configuration and a first bit line configuration according to the present invention. For ease of illustration, each memory cell in fig. 5 is used to represent a row of memory cells MC and associated signal lines and switches. As shown, the memory elements MC, word lines WL0-WL255, bit lines (bit0_ bk 0-bit 31_ bk7), and multiplexers MUX0-MUX7 of memory device 400a are all configured similarly to memory device 200 of FIG. 2. Memory device 400a further includes a plurality of row word lines CWL0-CWL7 extending along second direction B and a plurality of switches SW. Each switch SW has a control terminal coupled to a corresponding row word line CWL0-CWL7, a first terminal coupled to a memory element MC, and a second terminal coupled to a corresponding bit line (bit0_ bk 0-bit 31_ bk 7). Each row word line CWL0-CWL7 is used to control the on and off states of a switch SW of a corresponding memory block bk0-bk 7. For example, row word line CWL0 is coupled to the control terminals of 256 switches SW for each row of memory devices MC of memory block bk0, row word line CWL7 is coupled to the control terminals of 256 switches SW for each row of memory devices MC of memory block bk7, and so on. Thus, each row word line CWL0-CWL7 may be used to simultaneously control the on and off states of all switches SW of a corresponding memory block bk0-bk7, and the switches SW of different memory blocks bk0-bk7 may be individually controlled.

According to the above arrangement, row word lines CWL0-CWL7 may be further used to select memory elements MC of a particular memory block bk0-bk7 for read or write operations when one of word lines WL0-WL255 selects a corresponding column of memory elements MC for read or write operations. For example, when the row word line CWL0 transmits a control signal to the control terminal of the switch SW of the memory block bk0, only the switch SW of the memory block bk0 is turned on to couple the memory elements MC of the memory block bk0 to the corresponding bit lines (bit0_ bk0 to bit31_ bk0), thereby allowing the bit lines (bit0_ bk0 to bit31_ bk0) to transmit data. On the other hand, the other bitlines corresponding to memory blocks bk1-bk7 are not driven to transfer data. The power consumption of the memory device 400a can be reduced.

In addition, one memory component MC may correspond to a plurality of bit lines. For example, when the memory device is a memory device of an SRAM, the memory device may be selected to be coupled to two bit lines. Thus, two or more column wordlines may be provided to control the electrical connection between the memory element and the two bitlines.

Please refer to fig. 4 and fig. 6. FIG. 6 is a diagram of a memory device 500a having a first word line configuration and a second bit line configuration according to the present invention. For ease of illustration, each memory cell in fig. 6 is used to represent a column of memory cells MC and associated signal lines and switches. As shown, the memory elements MC, word lines WL0-WL255, bit lines (bit0_ bk 0-bit 31_ bk7), and multiplexers MUX0-MUX31 of memory device 500a are all configured similarly to memory device 300 of FIG. 3. Although the bit lines (bit0_ bk 0-bit 31_ bk7) corresponding to each memory block bk0-bk7 are sequentially distributed, each row word line CWL0-CWL7 is still used to control the on and off states of the switch SW of a corresponding memory block bk0-bk 7. For example, row word line CWL0 is coupled to the control terminals of 256 switches SW for each row of memory devices MC in memory block bk0, row word line CWL7 is coupled to the control terminals of 256 switches SW for each row of memory devices MC in memory block bk7, and so on. Thus, each row word line CWL0-CWL7 may be used to simultaneously control the on and off states of all switches SW of a corresponding memory block bk0-bk7, and the switches SW of different memory blocks bk0-bk7 may be individually controlled.

Similarly, row word lines CWL0-CWL7 may be further used to select memory elements MC of a particular memory block bk0-bk7 for read or write operations when one of word lines WL0-WL255 selects a corresponding row of memory elements MC for read or write operations. For example, when the row word line CWL0 transmits a control signal to the control terminal of the switch SW of the memory block bk0, only the switch SW of the memory block bk0 is turned on to couple the memory elements MC of the memory block bk0 to the corresponding bit lines (bit0_ bk0 to bit31_ bk0), thereby allowing the bit lines (bit0_ bk0 to bit31_ bk0) to transmit data. On the other hand, the other bitlines corresponding to memory blocks bk1-bk7 are not driven to transfer data. The power consumption of the memory device 500a can be reduced.

Please refer to fig. 7. FIG. 7 is a diagram of a memory cell having a second word line configuration according to a first embodiment of the present invention. As shown in fig. 7, a row of memory devices MC is divided into a predetermined number (e.g., 32) of memory device groups, and each memory device group includes 8 memory devices MC. The memory cell of the present invention further includes a plurality of local bit lines, each local bit line coupled to a corresponding group of memory devices. The switch SW is coupled between one of the 32 memory element groups and a corresponding bit line, wherein a first end of the switch SW is coupled to the corresponding memory element group through the local bit line. The row word line is used to simultaneously turn on or off 32 switches SW corresponding to each row of memory components MC of a corresponding memory block.

The second word line configuration of FIG. 7 can also be applied to the memory device 400a of FIG. 5 and the memory device 500a of FIG. 6. For example, row word line CWL0 may be coupled to control terminals of 32 switches SW for each row of memory devices MC of memory block bk0, row word line CWL7 may be coupled to control terminals of 32 switches SW for each row of memory devices MC of memory block bk7, and so on. Thus, each row word line CWL0-CWL7 may be used to simultaneously control the on and off states of all switches SW of a corresponding memory block bk0-bk 7.

Please refer to fig. 8. FIG. 8 is a diagram of a memory cell having a second word line configuration according to a second embodiment of the present invention. Unlike the embodiment of fig. 7, memory devices MC of each memory device group of fig. 8 are connected in series with each other (e.g., memory devices of a flash memory device). The row word line is used to simultaneously turn on or off 32 switches SW corresponding to each row of memory components MC of a corresponding memory block. Similarly, the second word line configuration of FIG. 8 can also be applied to the memory device 400a of FIG. 5 and the memory device 500a of FIG. 6.

In the embodiments of fig. 7 and 8, each memory device group includes 8 memory devices MC, but the invention is not limited to the above embodiments. In other embodiments of the present invention, each memory device group may include other numbers of memory devices MC according to design requirements.

The second word line configuration of fig. 7 and 8 has fewer switches than the first word line configuration of fig. 4, thereby reducing the overall area of the memory device.

Please refer to fig. 9, fig. 11 and fig. 12 simultaneously. FIG. 9 is a schematic diagram of a memory cell having a third word line configuration according to the first embodiment of the present invention. FIG. 11 is a diagram of a memory device 400b having a third word line configuration and a first bit line configuration according to the present invention. Fig. 12 is a partial schematic diagram of the memory device 400b in fig. 11. For convenience of description, each memory cell in fig. 11 is used to represent a row of memory cells MC and associated signal lines and switches, and the word lines are omitted in fig. 11 and 12. As shown, a row of memory devices MC is divided into a predetermined number (e.g., 32) of memory device groups, and each memory device group includes 8 memory devices MC. The switch SW is coupled between one of the 32 memory device groups and a corresponding bit line. The memory device 400b further includes a plurality of row wordlines (RWL0_ bk 0-RWL 31_ bk7) extending along the first direction a. Each column word line (RWL0_ bk 0-RWL 31_ bk7) is used to turn on or off one of 32 switches SW corresponding to each row of memory cells MC of a corresponding memory block. For example, the column word line RWL0_ bk0 is coupled to the control terminal of the switch SW corresponding to the 1 st memory cell group of each row of memory cells MC of the memory block bk0, the column word line RWL31_ bk0 is coupled to the control terminal of the switch SW corresponding to the 32 nd memory cell group of each row of memory cells MC of the memory block bk0, and so on. Thus, each column word line (RWL0_ bk 0-RWL 31_ bk7) can be used to further select a specific group of memory cells of each row of memory cells MC of a corresponding memory block for transferring data.

Please refer to fig. 9, fig. 13 and fig. 14 simultaneously. FIG. 13 is a schematic diagram of a memory device 500b having a third word line configuration and a second bit line configuration according to the present invention. Fig. 14 is a partial schematic diagram of the memory device 500b in fig. 13. For convenience of description, each memory cell in fig. 13 is used to represent a row of memory cells MC and associated signal lines and switches, and the word lines are omitted in fig. 13 and 14. Although the bit lines (bit0_ bk0 to bit31_ bk7) corresponding to each memory block bk0-bk7 are sequentially distributed, each of the column word lines (RWL0_ bk0 to RWL31_ bk7) in fig. 13 and 14 is still used to turn on or off one of the 32 switches SW corresponding to each row of memory cells MC of a corresponding memory block. For example, the column word line RWL0_ bk0 is coupled to the control terminal of the switch SW corresponding to the 1 st memory cell group of each row of memory cells MC of the memory block bk0, the column word line RWL31_ bk0 is coupled to the control terminal of the switch SW corresponding to the 32 nd memory cell group of each row of memory cells MC of the memory block bk0, and so on. Thus, each column word line (RWL0_ bk 0-RWL 31_ bk7) can be used to further select a specific group of memory cells of each row of memory cells MC of a corresponding memory block for transferring data.

Please refer to fig. 10. FIG. 10 is a schematic diagram of a memory cell having a second embodiment of a third word line configuration according to the present invention. Unlike the embodiment of fig. 9, memory devices MC of each memory device group of fig. 10 are connected in series with each other (e.g., memory devices of a flash memory device). The column word line is used to turn on or off one of the 32 switches SW corresponding to each row of memory components MC of a corresponding memory block. Similarly, the third word line configuration of FIG. 10 can also be applied to the memory device 400b of FIG. 11 and the memory device 500b of FIG. 13.

In contrast to the first and second word line configurations, the third word line configuration requires only one switch SW of each row of memory cells MC to be turned on for data transmission. The third wordline configuration may further reduce power consumption of the memory device. However, the number of row word lines (RWL0_ bk 0-RWL 31_ bk7) is a multiple of the number of column word lines CWL0-CWL 7. The third word line configuration requires that a plurality of row word lines be formed on different metal layers, while the first and second word line configurations allow a plurality of column word lines to be formed on the same metal layer. For example, when each memory element group includes 4 memory elements and the memory device includes 32 memory blocks, a total of 32 column wordlines need to pass through the routing area of the 4 memory elements. So 32 row wordlines must be formed on different metal layers. As for the first and second word line configurations, only one row word line needs to pass through the routing area of the memory device, so that the row word lines can be formed on the same metal layer.

Please refer to fig. 15 and fig. 17 simultaneously. FIG. 15 is a schematic diagram of a memory cell having a fourth word line configuration according to the first embodiment of the present invention. FIG. 17 is a schematic diagram of a memory device 400c having a fourth word line configuration and a first bit line configuration according to the present invention. For convenience of description, each memory cell in fig. 17 is used to represent a row of memory cells MC and associated signal lines and switches, and the word lines are omitted from fig. 17. As shown, memory device 400c includes a plurality of row switches SW1 and a plurality of column switches SW 2. The column switches SW1 are controlled by corresponding column word lines CWL0-CWL 7. The row switches SW2 are controlled by corresponding row word lines (RWL0_ bk 0-RWL 31_ bk 7). The operation of the column switch SW1 of FIG. 15 is similar to the operation of the switch SW of FIG. 7, and the operation of the row switch SW2 of FIG. 15 is similar to the operation of the switch SW of FIG. 9. The electrical connections of the row wordlines (RWL0_ bk 0-RWL 31_ bk7) of FIG. 17 are similar to those of FIG. 12. The row switch SW1 and the column switch SW2 are connected in series between a group of memory devices and a corresponding bit line (bit0_ bk 0-bit 31_ bk 7). Memory elements MC are selected by corresponding word lines, column word lines CWL0-CWL7, and column word lines RWL0_ bk 0-RWL 31_ bk 7.

According to the above configuration, the memory device 400c of the present invention can reduce power consumption. Further, memory device 400c may operate in two modes. For example, memory device 400c may operate as memory device 400b when the row word line asserts that all of row switches SW1 are open; when the branch lines extending from the row word line to the memory devices of each memory block are further grouped into 4 groups to individually control the operation of the 8 rows of memory devices, the memory device 400c may operate in the byte enable mode to output the data in the byte format.

When the third word line configuration of FIG. 11 is used to operate in the byte enable mode, the number of column word lines in a block needs to be increased by a factor of 4 to control the individual operation of each 8 rows of memory elements. For example, as shown in fig. 20, each column word line (RWL0_ bk0_ byte 0-RWL 0_ bk0_ byte3) of memory block bk0 is used to control the individual operation of each 8 rows of memory cells of the 1 st group of memory cells. In other words, a total of 32 row wordlines need to pass through the routing regions of 8 memory elements of a group of memory elements, while a fourth wordline configuration requires only 8 row wordlines to pass through the routing regions of 8 memory elements of a group of memory elements. Thus, the third word line configuration entails 32 row word lines formed on a different metal layer, while the fourth word line configuration enables 8 row word lines formed on the same metal layer. For example, as shown in fig. 21, to control the 1 st group of memory cells of the 8 memory blocks of the third word line arrangement to operate in the byte enable mode, the column word lines (RWL0_ bk0_ byte 0-RWL 0_ bk7_ byte3) corresponding to the 1 st group of memory cells of the 8 memory blocks pass through the 1 st group of memory cells of each memory block. However, as shown in fig. 22, the branch lines of the column word lines of the memory block bk0 are grouped into 4 column word lines (CWL0_ byte0 to CWL0_ byte3) to control the operation of each 8 columns of memory devices in the byte enable mode, respectively, and the number of row word lines (RWL0_ bk0 to RWL31_ bk7) of the fourth word line configuration remains unchanged. As described above, the fourth word line configuration of memory device 400c may operate as the third word line configuration of memory device 400b, and thus the power consumption of memory device 400c and memory device 400b are approximately the same. The fourth word line configuration has the advantages of both the first/second word line configuration and the third word line configuration.

Please refer to fig. 15 and fig. 18 simultaneously. FIG. 18 is a schematic diagram of a memory device 500c having a fourth word line configuration and a second bit line configuration according to the present invention. For convenience of description, each memory cell in fig. 18 is used to represent a row of memory cells MC and associated signal lines and switches, and the word lines are omitted from fig. 18. The electrical connections of the column wordlines (RWL0_ bk 0-RWL 31_ bk7) of FIG. 18 are similar to those of FIG. 14. Although the bit lines (bit0_ bk 0-bit 31_ bk7) corresponding to each memory block bk0-bk7 are sequentially distributed, the operation of the column word lines CWL0-CWL7, the row word lines (RWL0_ bk 0-RWL 31_ bk7), the column switch SW1 and the row switch SW2 in FIG. 18 are the same as that in FIG. 17, and therefore, the description thereof is omitted.

Please refer to fig. 16. FIG. 16 is a schematic diagram of a memory cell having a fourth word line configuration according to a second embodiment of the present invention. Unlike the embodiment of fig. 15, memory devices MC of each memory device group of fig. 16 are connected in series with each other (e.g., memory devices of a flash memory device). Similarly, the fourth word line configuration of FIG. 16 can also be applied to the memory device 400c of FIG. 17 and the memory device 500c of FIG. 18.

Please refer to fig. 19. FIG. 19 is a diagram of a switch of a memory device according to an embodiment of the present invention. As shown, the switches SW, SW1, SW2 may be transistors, but the invention is not limited thereto. The switches SW, SW1, SW2 may be other types of switch elements for controlling the electrical connection between the memory element and the bit line.

In the above embodiment, the memory devices MC are arranged in an array having 256 columns and 256 rows, the memory devices MC are divided into 8 memory blocks bk0-bk7, each memory block bk0-bk7 contains 32 rows of memory devices MC, and each memory device group contains 8 memory devices MC. However, the present invention is not limited to the above-described embodiments. In other embodiments of the present invention, the number of rows and columns of the array, the number of memory blocks, the number of rows of memory devices in the memory blocks, and the number of memory devices in the memory device group may be different from the above numbers, and may be determined according to design requirements.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.