阅读说明：本技术 一种高导热低膨胀超薄片金刚石-金属基复合材料及其制备方法和应用 (High-thermal-conductivity low-expansion ultrathin diamond-metal-based composite material and preparation method and application thereof ) 是由 魏秋平 周科朝 马莉 黄开塘 李俊 于 2021-09-15 设计创作，主要内容包括：本发明公开了一种高导热低膨胀超薄片金刚石-金属基复合材料及其制备方法和应用,所述一种高导热金刚石/金属基复合材料包含核壳结构掺杂金刚石、金属基材料,所述核壳结构掺杂金刚石包含金刚石、金刚石表面改性层,所述金刚石表面改性层从内至外依次包括金刚石过渡层,掺杂金刚石外壳层；所述金刚石-金属基复合材料的厚度在0.1mm～1mm。其制备方法是采用气体压力辅助熔渗工艺技术,以高纯气体为压力源,作用在熔融液态金属基表面,实现金刚石与金属基材料高密度复合；本发明能够有效地克服渗透过程中的毛细管力,实现高压渗流成型,使材料导热系数高,热膨胀系数可调,均匀性更好,可靠性更高。(The invention discloses a high-thermal-conductivity low-expansion ultrathin diamond-metal-based composite material and a preparation method and application thereof, wherein the high-thermal-conductivity diamond/metal-based composite material comprises a core-shell structure doped diamond and a metal-based material, the core-shell structure doped diamond comprises a diamond and a diamond surface modification layer, and the diamond surface modification layer sequentially comprises a diamond transition layer and a doped diamond outer shell layer from inside to outside; the thickness of the diamond-metal matrix composite material is 0.1 mm-1 mm. The preparation method adopts a gas pressure auxiliary infiltration process technology, takes high-purity gas as a pressure source and acts on the surface of a molten liquid metal base to realize high-density compounding of the diamond and the metal base material; the invention can effectively overcome the capillary force in the permeation process, realize high-pressure seepage forming, and ensure that the material has high heat conductivity coefficient, adjustable thermal expansion coefficient, better uniformity and higher reliability.)