阅读说明：本技术 一种高平整度托盘 (High-flatness tray ) 是由 吴强 唐甜甜 陈国华 于 2021-04-08 设计创作，主要内容包括：一种高平整度托盘,包含有托盘本体和设置在托盘上的数个缺口,所述缺口分布在所述托盘本体的四周侧壁上。通过在托盘本体的四周设置缺口,使托盘在注塑脱模时将应力释放,达到保证托盘表面的平整度和确保电子元器件安放及运输的安全的目的。(The utility model provides a high roughness tray, includes tray body and the several breach of setting on the tray, the breach distributes on tray body's the lateral wall all around. Through set up the breach around at tray body, make the tray with stress release when the drawing of patterns of moulding plastics, reach the purpose of guaranteeing the roughness on tray surface and guaranteeing that electronic components lays and the safety of transportation.)

1. The utility model provides a high roughness tray, its characterized in that includes tray body and the several breach of setting on the tray, the breach distributes on tray body's lateral wall all around.

2. A high flatness tray according to claim 1 wherein the upper and lower edges of said tray body are each provided with two said notches, and the left and right sides of said tray body are each provided with one said notch.

3. A high flatness tray according to claim 1, wherein a frame is provided around the tray body, the notch is provided on the surface of the frame, and the notch does not penetrate through the frame.

4. A high flatness tray according to claim 1 wherein the width of the gap is no greater than 1/3 of the width of the tray body.

Technical Field

The invention relates to a production and manufacturing process of a tray, in particular to a high-flatness tray.

Background

As is well known, an electronic chip is a small-sized electronic component, and a tray is required to be used in transportation and production processes. In the prior art, the production of the tray is generally made by adopting an injection molding process, the surface flatness of the tray after injection molding is often not up to the requirement, and the electronic components are abraded in the transportation and placement process due to the fact that the flatness of the tray does not meet the requirement when the tray is used for bearing the electronic components, so that the use of the electronic components is influenced.

The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.

Disclosure of Invention

In order to solve the technical problems, the invention provides a high-flatness tray, which aims to ensure the flatness of the surface of the tray and the safety of the placement and transportation of electronic components.

In order to achieve the purpose, the technical scheme of the invention is as follows:

the utility model provides a high roughness tray, includes tray body and the several breach of setting on the tray, the breach distributes on tray body's the lateral wall all around.

The tray body is provided with the notches at the periphery, so that the stress of the tray is released when the tray is subjected to injection molding and demolding, and the purposes of ensuring the flatness of the surface of the tray and ensuring the safety of the placement and transportation of electronic components are achieved.

Preferably, the upper edge and the lower edge of the tray body are both provided with two notches, and the left side and the right side of the tray body are both provided with one notch.

Preferably, a frame is arranged around the tray body, the notch is arranged on the surface of the frame, and the notch does not penetrate through the frame.

Preferably, the width of the notch is no greater than 1/3 of the width of the tray body.

The invention has the following advantages:

1. the tray body is provided with the notches at the periphery, so that the stress of the tray is released when the tray is subjected to injection molding and demolding, and the purposes of ensuring the flatness of the surface of the tray and ensuring the safety of the placement and transportation of electronic components are achieved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.

FIG. 1 is a schematic top view of a high flatness tray according to an embodiment of the present invention;

the corresponding part names indicated by the numbers and letters in the drawings:

1. the tray body 2, the frame 3, the breach.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

The invention provides a high-flatness tray, which has the working principle that the periphery of a tray body is provided with notches, so that the stress of the tray is released when the tray is subjected to injection molding and demolding, and the purposes of ensuring the flatness of the surface of the tray and ensuring the safety of the placement and transportation of electronic components are achieved.

The present invention will be described in further detail with reference to examples and specific embodiments.

As shown in fig. 1, a high-flatness tray comprises a tray body 1, a frame 2 arranged around the tray body, and a plurality of notches 3 arranged on the tray.

Wherein:

the upper edge and the lower edge of the tray body are both provided with two notches, and the left side and the right side of the tray body are both provided with one notch; and the notch does not penetrate through the frame.

The tray body is connected with the frame through a reinforcing rib (not shown).

Wherein, in practical application process, when the inside product size of holding in the tray is at 10 ~ 30mm, the breach can suitably reduce, but should not be greater than the 1/3 width of peripheral size.

After the high-flatness tray provided by the invention is demoulded in the injection molding process, stress can be released due to the existence of the notch 3, so that the flatness of the surface of the tray is ensured, and the purpose of safety of placing and transporting electronic components is also improved.

While the above description discloses only the preferred embodiment of the high flatness tray, it should be understood that various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the invention.