阅读说明：本技术 一种全自动覆晶薄膜预压机 (Full-automatic flip chip film prepress ) 是由 张兵波 于 2020-06-24 设计创作，主要内容包括：本发明涉及一种全自动覆晶薄膜预压机,包括：预压机主设备；COF冲切机,安装于预压机主设备一侧；预压机主设备内包括设备机架,配置于设备机架上的八工位吸附转盘机构、ACF贴附机构、上预压机构、TABLE机构,以及控制系统,配置于设备机架上且连接COF冲切机、八工位吸附转盘机构、ACF贴附机构、上预压机构、TABLE机构。本发明提供的全自动覆晶薄膜预压机,在工艺加工过程中,既可以实现对玻璃长边上的COF预压或玻璃短边上的COF预压,兼容传统设备,也可以实现同时对玻璃长边、短边上的COF预压,在同一设备中完成液晶面板四边的压接,避免了传统的不同设备对不同边的压接处理,从而满足不同客户的需要,提升了设备柔性。(The invention relates to a full-automatic chip on film prepress, comprising: prepressing main equipment; the COF punching machine is arranged on one side of the prepressing main device; the prepressing machine main equipment comprises an equipment rack, an eight-station adsorption turntable mechanism, an ACF (anisotropic conductive film) attachment mechanism, an upper prepressing mechanism, a TABLE mechanism and a control system, wherein the eight-station adsorption turntable mechanism, the ACF attachment mechanism, the upper prepressing mechanism and the TABLE mechanism are arranged on the equipment rack, and the control system is arranged on the equipment rack and connected with a COF (chip on film) punching machine, the eight-station adsorption turntable mechanism, the ACF attachment mechanism, the upper prepressing mechanism and the TABLE mechanism. The full-automatic chip on film prepressing machine provided by the invention can realize the COF prepressing on the long edge of the glass or the COF prepressing on the short edge of the glass in the process of processing, is compatible with the traditional equipment, and can also realize the COF prepressing on the long edge and the short edge of the glass simultaneously, and the four edges of the liquid crystal panel are pressed and connected in the same equipment, so that the pressing and connecting treatment of different edges by different traditional equipment is avoided, thereby meeting the requirements of different customers and improving the flexibility of the equipment.)

1. A full-automatic chip on film pre-pressing machine is characterized by comprising:

prepressing main equipment;

the COF punching machine is arranged on one side of the prepressing main device;

the main equipment of the pre-pressing machine comprises an equipment frame, an

The eight-station adsorption turntable mechanism is arranged on the equipment rack on one side of the COF die cutting machine;

the ACF attaching mechanism is configured on the equipment rack on one side of the eight-station adsorption turntable mechanism;

the upper prepressing mechanism is arranged on the equipment rack on one side of the ACF attaching mechanism;

a TABLE mechanism configured on the equipment frame at one side of the upper prepressing mechanism;

and the control system is configured on an equipment rack and is connected with the COF punching machine, the eight-station adsorption turntable mechanism, the ACF attaching mechanism, the upper pre-pressing mechanism and the TABLE mechanism.

2. The fully automatic pre-press machine for chip on film according to claim 1, wherein the COF cutting press comprises a first frame, a tape feeding mechanism, a tape guide wheel, a tape reel changing detector, a front ratchet wheel, a rear ratchet wheel, a vacuum puncher, a COF detector, a tape collecting mechanism and a tape recycling tension wheel, wherein,

the material placing belt mechanism is arranged above the first rack;

the material belt guide wheel is arranged on the first rack on one side of the material belt placing mechanism;

the material belt reel change detector is configured on the material belt guide wheel;

the front ratchet wheel and the rear ratchet wheel are arranged on two sides of a COF punching position on the first frame;

the vacuum puncher is arranged at a COF punching position between the front ratchet wheel and the rear ratchet wheel;

the COF detector is arranged on the COF output side of the vacuum puncher;

the material receiving belt mechanism is arranged below the first rack corresponding to the material discharging belt mechanism;

the recovery material belt tensioning wheel is arranged on the first rack on one side of the material belt receiving mechanism.

3. The fully automatic pre-press for chip on film according to claim 2, wherein the front ratchet and the rear ratchet are designed with 3 rows of ratchet tooth structures, and each row of ratchet tooth structure is suitable for three different standard widths of COF tape.

4. The fully automatic pre-press machine for chip on film as claimed in claim 1, wherein the eight-station rotary absorbing mechanism comprises a base and a COF feeding station, a COF aligning station, an ACF attaching detection station, a COF discharging station and a COF NG collecting station, which are disposed on the base in sequence in a counterclockwise direction.

5. The pre-press machine for full-automatic chip on film according to claim 1, wherein the ACF attaching mechanism comprises a second frame, an ACF supplying mechanism, an ACF cutter mechanism, an ACF attaching device, an ACF attaching detection mechanism and an ACF recycling mechanism, wherein,

the ACF supply mechanism is arranged on the second frame;

the ACF cutter mechanism is arranged on the second frame at one side of the ACF supply mechanism;

the ACF attaching device is arranged on the second machine frame at one side of the ACF cutter mechanism;

the ACF attaching detection mechanism is arranged on the second machine frame at one side of the ACF attaching device;

the ACF recovery mechanism is arranged on the second machine frame below the ACF attaching device.

6. The pre-pressing machine of claim 1, wherein the upper pre-pressing mechanism comprises a third frame, a first upper pre-pressing head, a second upper pre-pressing head, a first X-axis module, a first Y-axis module, a first Z-axis module, a first theta-axis module, an upper pre-pressing head adsorption system and an upper pre-pressing head heating system,

the first upper pre-pressing head and the second upper pre-pressing head are arranged on a third rack;

the first X-axis module is transversely arranged on the third rack;

the first Y-axis module is arranged on a third rack perpendicular to the first X-axis module;

the first Z-axis module is arranged on a third rack which is vertical to the first Y-axis module;

the first theta axis module is configured on the third rack at the bottom end of the first Z axis module;

the upper prepressing head heating system is arranged on a third rack below the first theta axis module;

the upper pre-pressing head adsorption system is arranged on a third rack which is arranged below the first theta axis module and adjacent to the upper pre-pressing head heating system.

7. The pre-press machine for fully automatic chip on film as claimed in claim 6, wherein the ACF attached COF sizes absorbed by the first and second upper pre-press heads are the same.

8. The pre-press machine for fully automatic chip on film as claimed in claim 6, wherein the ACF attached COF sizes absorbed by the first and second upper pre-press heads are different.

9. The fully automatic COF pre-press of claim 1, wherein the TABLE mechanism comprises a fifth frame, a TABLE vacuum chuck TABLE, a second X-axis module, a second Y-axis module, a second Z-axis module, and a second theta-axis module, wherein,

the TABLE vacuum chuck platform is configured on the fifth rack and comprises a TABLE vacuum chuck expansion platform and a TABLE vacuum chuck basic platform which are connected, and the TABLE vacuum chuck expansion platform and the TABLE vacuum chuck basic platform respectively bear glass with different sizes;

the second X-axis module is transversely arranged on the fifth rack;

the second Y-axis module is arranged on a fifth rack vertical to the second X-axis module;

the second Z-axis module is arranged on a fifth rack which is vertical to the second Y-axis module;

and the second theta axis module is configured on a fifth rack at the bottom end of the TABLE vacuum chuck platform.

Technical Field

The invention belongs to the technical field of chip on film prepressing, and particularly relates to a full-automatic chip on film prepressing machine.

Background

A Chip On Film (COF for short) prepressing machine is a high-precision prepressing device for accurately pressing and connecting a COF with glass at a liquid crystal panel Bonding production process end.

Initially, the common COF and glass crimping method was: after an Anisotropic Conductive Film (ACF for short) is attached to the glass, a worker attaches a COF to the surface of the glass, which increases the chip breaking rate and the overall line length, and brings about a large amount of work and low efficiency. Therefore, a semi-automatic and full-automatic COF prepress is also provided at present, an ACF attachment mechanism and a prepress mechanism in the semi-automatic and full-automatic COF prepress can respectively and automatically complete attachment of the ACF to the COF and attachment of the COF to the glass, the degree of automation is high, labor can be saved, product quality and product specification consistency are improved, working efficiency is high, and meanwhile, the space for reasonably utilizing the sheet breaking rate and the whole line length is also reduced.

However, in the conventional semi-automatic or fully-automatic COF prepresses, COF prepresses are only performed on the long side or the short side of glass, so that at least 2 COF prepresses are required to be arranged in the liquid crystal panel Bonding production process flow, and are used for respectively processing the COF prepressing on the long side of glass and the COF prepressing on the short side of glass.

Disclosure of Invention

In order to solve the defects in the prior art, the invention provides a full-automatic chip on film prepressing machine, which comprises:

prepressing main equipment;

the COF punching machine is arranged on one side of the prepressing main device;

the main equipment of the pre-pressing machine comprises an equipment frame, an

The eight-station adsorption turntable mechanism is arranged on the equipment rack on one side of the COF die cutting machine;

the ACF attaching mechanism is configured on the equipment rack on one side of the eight-station adsorption turntable mechanism;

the upper prepressing mechanism is arranged on the equipment rack on one side of the ACF attaching mechanism;

a TABLE mechanism configured on the equipment frame at one side of the upper prepressing mechanism;

and the control system is configured on an equipment rack and is connected with the COF punching machine, the eight-station adsorption turntable mechanism, the ACF attaching mechanism, the upper pre-pressing mechanism and the TABLE mechanism.

In one embodiment of the invention, the COF punching machine comprises a first frame, a material belt placing mechanism, a material belt guide wheel, a material belt reel changing detector, a front ratchet wheel, a rear ratchet wheel, a vacuum puncher, a COF detector, a material belt collecting mechanism and a material belt recycling tensioning wheel, wherein,

the material placing belt mechanism is arranged above the first rack;

the material belt guide wheel is arranged on the first rack on one side of the material belt placing mechanism;

the material belt reel change detector is configured on the material belt guide wheel;

the front ratchet wheel and the rear ratchet wheel are arranged on two sides of a COF punching position on the first frame;

the vacuum puncher is arranged at a COF punching position between the front ratchet wheel and the rear ratchet wheel;

the COF detector is arranged on the COF output side of the vacuum puncher;

the material receiving belt mechanism is arranged below the first rack corresponding to the material discharging belt mechanism;

the recovery material belt tensioning wheel is arranged on the first rack on one side of the material belt receiving mechanism.

In one embodiment of the invention, the front ratchet wheel and the rear ratchet wheel are respectively designed in a 3-row ratchet wheel tooth structure, and each row of ratchet wheel tooth structure is suitable for three different standard COF material belt widths.

In an embodiment of the invention, the eight-station adsorption turntable mechanism comprises a base, and a COF feeding station, a COF aligning station, an ACF attaching station, an ACF attachment detection station, a COF discharging station and a COF NG collecting station which are arranged on the base in a counterclockwise sequence.

In one embodiment of the present invention, the ACF attachment mechanism includes a second chassis, an ACF supply mechanism, an ACF cutter mechanism, an ACF attachment device, an ACF attachment detection mechanism, and an ACF recovery mechanism, wherein,

the ACF supply mechanism is arranged on the second frame;

the ACF cutter mechanism is arranged on the second frame at one side of the ACF supply mechanism;

the ACF attaching device is arranged on the second machine frame at one side of the ACF cutter mechanism;

the ACF attaching detection mechanism is arranged on the second machine frame at one side of the ACF attaching device;

the ACF recovery mechanism is arranged on the second machine frame below the ACF attaching device.

In one embodiment of the present invention, the upper prepressing mechanism includes a third frame, a first upper prepressing head, a second upper prepressing head, a first X-axis module, a first Y-axis module, a first Z-axis module, a first θ -axis module, an upper prepressing head adsorption system, and an upper prepressing head heating system,

the first upper pre-pressing head and the second upper pre-pressing head are arranged on a third rack;

the first X-axis module is transversely arranged on the third rack;

the first Y-axis module is arranged on a third rack perpendicular to the first X-axis module;

the first Z-axis module is arranged on a third rack which is vertical to the first Y-axis module;

the first theta axis module is configured on the third rack at the bottom end of the first Z axis module;

the upper prepressing head heating system is arranged on a third rack below the first theta axis module;

the upper pre-pressing head adsorption system is arranged on a third rack which is arranged below the first theta axis module and adjacent to the upper pre-pressing head heating system.

In one embodiment of the present invention, the COF to which the ACFs are attached, which are adsorbed by the first upper pre-pressing head and the second upper pre-pressing head, have the same size.

In an embodiment of the present invention, the COF to which the ACFs are attached, which are adsorbed by the first upper pre-pressing head and the second upper pre-pressing head, are different in size.

In one embodiment of the present invention, the TABLE mechanism includes a fifth gantry, a TABLE vacuum chuck TABLE, a second X-axis module, a second Y-axis module, a second Z-axis module, and a second theta-axis module, wherein,

the TABLE vacuum chuck platform is configured on the fifth rack and comprises a TABLE vacuum chuck expansion platform and a TABLE vacuum chuck basic platform which are connected, and the TABLE vacuum chuck expansion platform and the TABLE vacuum chuck basic platform respectively bear glass with different sizes;

the second X-axis module is transversely arranged on the fifth rack;

the second Y-axis module is arranged on a fifth rack vertical to the second X-axis module;

the second Z-axis module is arranged on a fifth rack which is vertical to the second Y-axis module;

and the second theta axis module is configured on a fifth rack at the bottom end of the TABLE vacuum chuck platform.

Compared with the prior art, the invention has the beneficial effects that:

the full-automatic chip on film prepress provided by the invention can realize the COF prepressing on the long edge of the glass or the COF prepressing on the short edge of the glass in the process of processing, is compatible with the traditional equipment, and can also realize the COF prepressing on the long edge and the short edge of the glass simultaneously, and the four edges of the liquid crystal panel are crimped in the same equipment, so that the crimping treatment of different edges by different traditional equipment is avoided, thereby meeting the requirements of different customers and improving the flexibility of the equipment; simultaneously, the upper prepressing mechanism and the TABLE mechanism are subjected to alignment compensation in the crimping process, so that high-quality production of liquid crystal panel products is ensured, and the crimping reaches micron-level high precision.

Drawings

Fig. 1a is a schematic structural diagram of a full-automatic chip on film pre-press according to an embodiment of the present invention;

fig. 1b is a schematic structural diagram of another fully-automatic chip on film pre-press according to an embodiment of the present invention;

fig. 1c is a schematic structural diagram of an example of a full-automatic chip on film pre-press according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an example of the inside of a COF cutting press in a full-automatic chip on film pre-press according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an example of a front ratchet and a rear ratchet in a COF die cutter in a full-automatic chip on film pre-press according to an embodiment of the present invention;

fig. 4a is a schematic structural diagram of an example of an eight-station adsorption turntable mechanism in a full-automatic chip on film pre-press according to an embodiment of the present invention;

fig. 4b is a schematic structural diagram of a partial example of an eight-station adsorption turntable mechanism in a full-automatic chip on film pre-press according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of an example of an ACF attachment mechanism in a full-automatic pre-press for flip chips according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of an example of an upper pre-pressing mechanism in a full-automatic chip on film pre-press according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of an example of a TABLE mechanism in a full-automatic chip on film pre-press according to an embodiment of the present invention.

Description of reference numerals:

1-prepressing main equipment; 2-COF die cutting machine; 101-an equipment rack; 102-eight station adsorption turntable mechanism; 103-ACF attaching mechanism; 104-an upper pre-pressing mechanism; 105-a lower pre-press mechanism; 106-TABLE mechanism; 201-a material belt placing mechanism; 202-material belt guide wheel; 203-strip roll change detector; 204-front ratchet wheel; 205-rear ratchet wheel; 206-vacuum puncher; 207-COF detector; 208-a material receiving belt mechanism; 209-recovering the belt tensioning wheel; 1021-a base; 1022-COF feeding station; 1023-COF alignment station; 1024-ACF attaching station; 1025-ACF attachment detection station; 1026-COF blanking station; 1027-COF NG collection station; 1031-ACF supply mechanism; 1032-an ACF cutter mechanism; 1033-ACF attachment device; 1034-ACF attachment detection mechanism; 1035-ACF reclamation mechanism; 1041-a first upper prepressing head; 1042 — a second upper pre-press head; 1043-a first X-axis module; 1044-a first Y-axis module; 1045-a first Z-axis module; 1046 — a first theta axis module 1046; 1047-upper prepressing head heating system; 1048-an upper prepressing head adsorption system; 1061-TABLE vacuum chuck expansion platform; 1062-TABLE vacuum chuck base platform; 1063-a second X-axis module; 1064-second Y-axis module; 1065-a second Z-axis module; 1066-second theta axis module.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.

Example one

The embodiment relates to a full-automatic chip on film prepress. Referring to fig. 1a, 1b and 1c, fig. 1a is a schematic structural diagram of a full-automatic chip on film pre-press according to an embodiment of the present invention, fig. 1b is a schematic structural diagram of another full-automatic chip on film pre-press according to an embodiment of the present invention, and fig. 1c is a schematic structural diagram of an example of a full-automatic chip on film pre-press according to an embodiment of the present invention. Specifically, referring to fig. 1a and fig. 1c again, the fully automatic chip on film pre-press provided in this embodiment includes:

prepressing main equipment 1; the COF punching machine 2 is arranged on one side of the prepressing main device 1 and is used for continuously punching the COF material belt; the prepressing main apparatus 1 includes therein an apparatus frame 101, and

an eight-station adsorption turntable mechanism 102, which is arranged on the equipment rack 101 on one side of the COF punching machine 2 and is used for carrying out alignment treatment on the COF punched by the COF punching machine 2; an ACF attachment mechanism 103 disposed on the equipment rack 101 on the side of the eight-station adsorption turntable mechanism 102, for attaching an ACF to a designated position of each COF; an upper prepressing mechanism 104 disposed on the apparatus frame 101 on the ACF attachment mechanism 103 side, for performing a precision compensation pressure bonding process on the COF to which the ACF is attached; a TABLE mechanism 106 disposed on the apparatus frame 101 on the side of the upper pre-pressing mechanism 104, for performing correction compensation processing on the glass; the control system is configured on the equipment rack 101 and connected with the COF punching machine 2, the eight-station adsorption turntable mechanism 102, the ACF attachment mechanism 103, the upper prepressing mechanism 104 and the TABLE mechanism 106, and the control system generally controls COF punching, COF and ACF alignment, ACF attachment, COF and glass compression and glass compensation and correction, so that the COF attached with the ACF is accurately attached to the glass by the upper prepressing mechanism 104. The control system is not limited to be disposed on the equipment rack 101 in the prepressing machine main equipment 1, and may be disposed in a control room on one side of the prepressing machine main equipment 1, and electrically connected to the COF punching machine 2, the eight-station suction turntable mechanism 102, the ACF attachment mechanism 103, the upper prepressing mechanism 104, and the TABLE mechanism 106, thereby controlling the operation of the whole prepressing machine.

Referring to fig. 1b and fig. 1c, the main apparatus 1 of the pre-pressing machine of the present embodiment further includes a lower pre-pressing mechanism 105 disposed on the apparatus rack 101 on the side of the upper pre-pressing mechanism 104 (at this time, the TABLE mechanism 106 is disposed on the apparatus rack 101 on the side of the lower pre-pressing mechanism 105), and the control system is connected to the lower pre-pressing mechanism 105 and configured to acquire MARK information of the COF with the ACF attached thereto and MARK information of the glass, and the acquisition of the COF and the MARK information of the glass is controlled by the control system and the acquired COF and MARK information of the glass are sent to the control system, and the control system calculates MARK correction data between the COF and the glass and controls the MARK of the MARK and the MARK of the COF of the glass to perform alignment correction according to the MARK correction data, and after the alignment correction, the upper pre-pressing mechanism 104 can finally attach the COF with the ACF attached thereto more accurately to the glass.

Further, referring to fig. 2, fig. 2 is a schematic view of an example structure inside a COF punching machine in a full-automatic flip-chip film pre-press according to an embodiment of the present invention, where the COF punching machine 2 according to the embodiment of the present invention includes a first frame, a feeding belt mechanism 201, a material belt guide wheel 202, a material belt reel change detector 203, a front ratchet 204, a rear ratchet 205, a vacuum puncher206, a COF detector 207, a material belt receiving mechanism 208, and a recovery material belt tensioning wheel 209.

Specifically, the tape feeding mechanism 201 of the present embodiment is disposed on the first frame, and is configured to feed the COF tape; the tape guide wheel 202 is disposed on the first frame on one side of the tape placing mechanism 201, and is used for driving the COF tape to move to the COF punching position; the tape change detector 203 is disposed on the tape guide wheel 202, and is configured to detect whether a COF tape exists in the tape release mechanism 201; the front ratchet wheel 204 and the rear ratchet wheel 205 are arranged on two sides of a COF punching position on the first frame and are used for determining the COF punching position of the COF material belt; the vacuum puncher206 is arranged at a COF punching position between the front ratchet 204 and the rear ratchet 205 and is used for continuously punching the COF material belt; the COF detector 207 is disposed on the COF output side of the vacuum puncher206, and is configured to detect whether the output COF is qualified; the material receiving belt mechanism 208 is arranged below the first rack corresponding to the material discharging belt mechanism 201 and used for recovering unqualified COFs; the recycling tape tensioning wheel 209 is disposed on the first frame at one side of the recycling tape mechanism 208, and is used for ensuring that an unqualified COF is normally recycled.

Referring to fig. 3, fig. 3 is a schematic view of an example structure of a front ratchet and a rear ratchet in a COF die cutter in a full-automatic flip-chip film pre-press according to an embodiment of the present invention, and a left drawing and a right drawing in fig. 3 are schematic views of the front ratchet and the rear ratchet at different angles, respectively, it can be seen that the front ratchet 204 and the rear ratchet 205 in this embodiment are designed for 3 rows of ratchet tooth structures, each row of ratchet tooth structure is suitable for three different standard COF tape widths, that is, the row of ratchet tooth structure in this embodiment 3 is suitable for 3 standard COF tape widths on the market, and the ratchet is not required to be frequently replaced in the process, and only different heights of the front ratchet 204 and the rear ratchet 205 need to be adjusted to adapt to 3 common COF tape widths on the market, thereby greatly reducing the tedious operation of manually replacing the ratchet; the front ratchet 204 and the rear ratchet 205 can also respectively comprise a servo motor tape reducer, so as to ensure the precision of supplying the COF tape and control the width change corresponding to different COF tapes.

In the COF die cutting machine 2 provided by this embodiment, intelligent supply and recovery of the COF tape are automatically maintained through the discharging tape mechanism 201, the receiving tape mechanism 208, the tape guide wheel 202 and the recovery tape tensioning wheel 209; when feeding, the front ratchet wheel 204 and the rear ratchet wheel 205 act at the same speed simultaneously and synchronously, so that the feeding precision of the COF material belt is ensured; when the COF material belt is punched by the vacuum punch 206, the rear ratchet wheel 205 rotates reversely for a certain length of the COF material belt to ensure that the COF material belt between the front ratchet wheel 204 and the rear ratchet wheel 205 is not too tight to be punched and cut, after COFs are punched and cut from the COF material belt, the COFs are vacuum absorbed by the vacuum punch 206, other conveying mechanisms are waited to control orderly to carry out according to a certain program without manual conveying, the pollution problem caused by manual operation is reduced, after punching is finished, the rear ratchet wheel 205 returns to the original position and then synchronously moves the next COF material belt at the same speed with the front ratchet wheel 204 for punching step length, and thus, the COF material belt is repeatedly punched; the tape change detector 203 is configured in the embodiment, and can automatically alarm after the COF tape is used up, so as to remind a worker to change the COF tape; the present embodiment is configured with a COF detector 207, when detecting that there is a COF of the BAD IC on the COF tape, the COF punching position of the vacuum punch 206 is directly skipped without punching, so as to avoid the problem that the COF of the BAD IC flows into the subsequent process of the device manufacturing process, which causes the outflow of the BAD product.

Further, referring to fig. 4a to 4b, fig. 4a is a schematic structural diagram of an example of an eight-station adsorption turntable mechanism in a full-automatic chip on film pre-press according to an embodiment of the present invention, and fig. 4b is a schematic structural diagram of a part of an example of an eight-station adsorption turntable mechanism in a full-automatic chip on film pre-press according to an embodiment of the present invention, where the eight-station adsorption turntable mechanism 102 in the embodiment includes a base 1021 and a COF feeding station 1022, a COF aligning station 1023, an ACF attaching station 1024, an ACF attachment detection station 1025, a COF discharging station 1026, and a COF NG collection station 1027 that are sequentially disposed on the base 1021.

Specifically, the eight-station absorption turntable mechanism 102 of the embodiment includes six stations, i.e., a COF feeding station 1022, a COF alignment station 1023, an ACF attachment station 1024, an ACF attachment detection station 1025, a COF discharging station 1026 and a COF NG collection station 1027, which are sequentially disposed on the base 1021 in a counterclockwise direction, and specifically, the COF transplanting ARM transfers the COF obtained by the COF cutting press 2 to the COF feeding station 1022 in the eight-station absorption turntable mechanism 102, where the COF is sucked by vacuum, the turntable rotates counterclockwise to the COF alignment station 1023, where the COF attachment position is ensured to be consistent, the turntable rotates counterclockwise to the COF attachment station 1024, where the COF is attached, the turntable rotates counterclockwise to the ACF attachment ACF detection station 1025, where the attachment condition is detected, and when the attachment detection station detects an unqualified COF, the turntable rotates counterclockwise to the COF collection station 1027, the station collects unqualified COFs to a collection box for unified processing, the turntable rotates clockwise to a COF discharging station 1026, the station does not use a vacuum COF adsorption mode, the COF lower transplanting ARM transplants the COFs to the upper prepressing mechanism 104, when the ACF attaching detection station 1025 does not detect the unqualified COFs, the turntable directly rotates anticlockwise to the COF discharging station 1026, the station does not use the vacuum COFs adsorption mode, and the COF lower transplanting ARM transplants the COFs to the upper prepressing mechanism 104. In this embodiment, the eight-station adsorption turntable mechanism 102 controls the COF to perform corresponding processing at six stations, so that the process flow can be automatically realized, the process processing efficiency is improved, and the operation is simple. The other two stations of the eight-station adsorption turntable mechanism 102 are not used temporarily, and can be configured correspondingly according to actual needs.

Further, referring to fig. 5, fig. 5 is a schematic structural diagram of an example of an ACF attachment mechanism in a full-automatic flip-chip film prepress according to an embodiment of the present invention, where the ACF attachment mechanism 103 of the present embodiment includes a second frame, an ACF supply mechanism 1031, an ACF cutter mechanism 1032, an ACF attachment device 1033, an ACF attachment detection mechanism 1034, and an ACF recovery mechanism 1035.

Specifically, the ACF supply mechanism 1031 of the present embodiment is disposed on the second frame and is configured to supply the ACF tape; the ACF cutter mechanism 1032 is disposed on the second frame on the side of the ACF supply mechanism 1031, and is configured to continuously cut the ACF tape at the ACF cutting position, and the ACF cutter mechanism 1032 may include an ACF tape tensioning mechanism, which is configured to ensure that the ACF tape is in a proper tensioning state at the ACF cutting position, so as to ensure normal cutting of the ACF tape; the ACF attachment device 1033 is disposed on the second frame on the side of the ACF cutter mechanism 1032 and configured to attach the punched ACF to a designated position of the COF; an ACF attachment detection mechanism 1034 disposed on the second frame on the side of the ACF attachment device 1033 and configured to detect whether the ACF attached to the COF designated location is qualified; the ACF recycling mechanism 1035 is disposed on the second frame below the ACF attachment device 1033 and is configured to recycle the unqualified ACFs. The ACF cutter mechanism 1032 of this embodiment automatically calculates and adjusts the ACF punching position according to the preset ACF attachment length of the system, and selects an appropriate ACF punching position to punch the ACF tape supplied by the ACF supply mechanism 1031. The ACF cutter mechanism 1032 of this embodiment may further include a servo motor control system, and according to the preset ACF attachment length, the ACF cutter mechanism 1032 automatically drives the ACF material to take the preset ACF attachment length, so as to achieve the purpose of precise supply and precise attachment of the ACF.

It should be noted that the preset ACF attachment length in this embodiment is related to the COF size punched by the COF punching machine 2, and this embodiment supports 3 COF tape widths in general use in the market, and different ACF attachment lengths need to be preset for different COF tape widths.

Further, referring to fig. 6, fig. 6 is a schematic structural diagram of an example of an upper prepressing mechanism in a full-automatic chip on film prepress according to an embodiment of the present invention, where the upper prepressing mechanism 104 in this embodiment includes a third frame, a first upper prepressing head 1041, a second upper prepressing head 1042, a first X-axis module 1043, a first Y-axis module 1044, a first Z-axis module 1045, a first θ -axis module 1046, an upper prepressing head heating system 1047, and an upper prepressing head adsorbing system 1048.

Specifically, in the present embodiment, the first upper prepressing head 1041 and the second upper prepressing head 1042 are disposed on the third frame and are used for adsorbing the COF with the ACF attached thereto; the first X-axis module 1043 is transversely disposed on the third frame, and is used for performing X-direction alignment on the COF to which the ACF is attached by adsorption; a first Y-axis module 1044 disposed on a third frame perpendicular to the first X-axis module 1043 and configured to perform Y-direction alignment correction on the COF with the ACF attached thereon; a first Z-axis module 1045, disposed on a third frame vertically perpendicular to the first Y-axis module 1044, for performing a Z-direction alignment correction on the COF with the ACF attached thereon; a first θ axis module 1046, disposed on the third frame at the bottom of the first Z axis module 1045, for performing rotation correction and alignment on the COF with ACF attached thereon; an upper pre-pressing head heating system 1047, disposed on the third frame below the first θ -axis module 1046, for performing heating processing on the first upper pre-pressing head 1041 and the second upper pre-pressing head 1042; an upper pre-pressing head adsorption system 1048, disposed on a third frame below the first θ -axis module 1046 and adjacent to the upper pre-pressing head heating system 1047, for controlling the first upper pre-pressing head 1041 and the second upper pre-pressing head 1042 to adsorb the COF with ACFs attached thereto. In this embodiment, the COF attached with ACFs adsorbed by the first upper prepressing head 1041 and the second upper prepressing head 1042 may be the same or different. The first X-axis module 1043 may include an X-axis motor, an X-axis lead screw, and an X-axis slider slidably mounted at a front end of the X-axis lead screw, and the X-axis motor drives the X-axis slider to move linearly back and forth through the X-axis lead screw; the first Y-axis module 1044 can include a Y-axis motor, a Y-axis lead screw and a Y-axis slider slidably mounted at the front end of the Y-axis lead screw, and the Y-axis motor drives the Y-axis slider to move linearly left and right through the Y-axis lead screw; the first Z-axis module 1045 may include a Z-axis motor, an X-axis lead screw, and a Z-axis slider slidably mounted at the front end of the Z-axis lead screw, and the Z-axis motor drives the Z-axis slider to move linearly up and down through the Z-axis lead screw; the first θ -axis module 1046 may include a rotary motor, and a vacuum adsorption plate connected to a bottom end of the rotary motor through a hinge rod, and the vacuum adsorption plate is driven by the rotary motor to rotate horizontally through the hinge rod.

The upper pre-pressing mechanism 104 provided in this embodiment can attach a COF to the first upper pre-pressing head 1041 and the second upper pre-pressing head 1042, so as to perform compression joint and alignment on the COF and the glass, the upper pre-pressing mechanism 104 has an X/Y/Z/θ four-axis device for accurately controlling the movement, so as to meet the rotation requirement and the accurate alignment and correction requirement of COF processing, and meanwhile, the COF compression joints with different sizes can be realized by replacing the first upper pre-pressing head 1041 and the second upper pre-pressing head 1042 with different widths; in this embodiment, the upper pre-pressing head heating system 1047 has a pre-pressing head heating function, and the tool bit heating can preheat expansion with heat and contraction with cold of the COF material; the upper prepressing head adsorption system 1048 has a vacuum COF adsorption function, and can control the absorption and abandonment of COF, and when the first upper prepressing head 1041 and the second upper prepressing head 1042 with different widths are replaced, the corresponding vacuum adsorption plates in the upper prepressing head adsorption system 1048 are replaced at the same time.

Further, the lower pre-pressing mechanism 105 of the present embodiment includes a fourth frame, a glass supporting and screen absorbing mechanism, a first CCD vision positioning system, and a second CCD vision positioning system.

Specifically, the glass supporting and screen absorbing mechanism of the present embodiment is configured on the fourth rack, and is used for supporting the glass to realize MARK alignment between the glass and the COF attached with the ACF; the first CCD visual positioning system and the second CCD visual positioning system are located on the same horizontal line, and the first CCD visual positioning system and the second CCD visual positioning system are arranged on the glass supporting screen absorbing mechanism at a preset distance and are used for acquiring MARK information of a COF (chip on film) attached with an ACF (anisotropic conductive film) and acquiring MARK signals of glass so as to acquire alignment compensation information between the MARK of the COF and the MARK of the glass. Specifically, in the present embodiment, the glass supporting and screen absorbing mechanism moves to the position of the glass terminal, the first CCD vision positioning system and the second CCD vision positioning system acquire MARK information at two ends of the glass, meanwhile, the first upper prepressing head 1041 and the second upper prepressing head 1042 are moved to the position where the glass supporting and screen absorbing mechanism is located, acquiring MARK information at two ends of COF by a first CCD visual positioning system and a second CCD visual positioning system, sending the acquired MARK information at two ends of glass and MARK information at two ends of COF to a control system by the first CCD visual positioning system and the second CCD visual positioning system, calculating MARK correction data between COF and glass by the control system, and controlling the MARK of the glass and the MARK of the COF to carry out alignment correction according to the MARK alignment correction data, after the alignment correction, the first upper prepressing head 1041 and the second prepressing head 1042 perform a pressing operation of the glass terminal and the COF terminal, and press-bond the terminal of the COF to the terminal of the glass. At this time, in order to avoid the problem that the glass is crushed due to the existence of gaps between the first upper prepressing head 1041 and the second prepressing head 1042 and the glass to be pressed, in the present embodiment, in the pressing process, the glass supporting and shielding mechanism jacks up the glass, and then the first upper prepressing head 1041 and the second prepressing head 1042 in the upper prepressing mechanism 104 perform the pressing operation between the glass terminal and the COF terminal.

Further, referring to fig. 7, fig. 7 is a schematic structural diagram of an example of a TABLE mechanism in a full-automatic chip on film pre-press according to an embodiment of the present invention, where the TABLE mechanism 106 in the embodiment includes a fifth frame, a TABLE vacuum chuck platform, a second X-axis module 1063, a second Y-axis module 1064, a second Z-axis module 1065, and a second θ -axis module 1066.

Specifically, in this embodiment, the TABLE vacuum chuck platform is configured on the fifth rack, and the TABLE vacuum chuck platform includes a TABLE vacuum chuck expansion platform 1061 and a TABLE vacuum chuck base platform 1062 that are connected to each other, and the TABLE vacuum chuck expansion platform 1061 and the TABLE vacuum chuck base platform 1062 respectively bear glasses with different sizes; the second X-axis module 1063 is transversely arranged on the fifth rack and used for performing X-direction correction and alignment on the glass loaded by the TABLE vacuum chuck platform; the second Y-axis module 1064 is disposed on a fifth rack perpendicular to the second X-axis module 1063, and is configured to perform Y-direction alignment on the glass carried by the TABLE vacuum chuck platform; the second Z-axis module 1065 is disposed on a fifth rack vertical to the second Y-axis module 1064, and configured to perform Z-direction alignment on the glass carried by the TABLE vacuum chuck platform; the second θ axis module 1066 is disposed on the fifth frame at the bottom end of the TABLE vacuum chuck platform, and is configured to perform rotation correction alignment on the glass carried by the TABLE vacuum chuck platform. The second X-axis module 1063, the second Y-axis module 1064, the second Z-axis module 1065, and the second θ -axis module 1066 are respectively the same as the first X-axis module 1043, the first Y-axis module 1044, the first Z-axis module 1045, and the first θ -axis module 1046 in the upper prepressing mechanism 104, and are not described herein again.

The TABLE mechanism 106 provided in this embodiment adopts the independent control of the "suction cup base platform" and the "suction cup extension platform", can bear glass of different sizes, and flexibly meets the processing and production requirements of liquid crystal panels of different sizes and shapes; the TABLE mechanism 106 of this embodiment has a device for precisely controlling the position of the moving object by four axes of X/Y/Z/theta, which can meet the requirements of rotation and precise alignment correction of four edges of a product, and the rotation of the TABLE vacuum chuck platform makes the glass carried by the TABLE vacuum chuck platform turn to the pre-pressing edge, the pre-pressing edge of the glass comprises a long edge G of the glass and a short edge S of the glass, and the terminal of the COF attached with the ACF is attached to the terminal of the pre-pressing edge of the glass, so that the COF is finally pressed on the G/S edge of the glass simultaneously on one COF pre-pressing machine, thereby greatly improving the flexibility of the processing technology of the device.

On the basis of the above-mentioned full-automatic pre-pressing machine for chip on film, the embodiment further provides a construction process of the full-automatic pre-pressing machine for chip on film, which includes:

obtaining a COF through a COF cutting press 2, wherein the COF comprises 3 standard COF sizes;

transplanting the obtained COF to an eight-station adsorption turntable mechanism 102 for alignment through a COF (chip on film) transplanting ARM (advanced RISC machine), and attaching the ACF to the COF when the ACF is aligned to an ACF attaching mechanism 103;

the upper pre-pressing mechanism 104 realizes accurate compression joint of the COF attached with the ACF according to MARK information of the COF and the glass acquired by the lower pre-pressing mechanism 105 and compensation and correction of the TABLE mechanism 106 on the glass carried by the TABLE mechanism 106, so as to complete compression joint of the COF and the glass once, and the above steps are repeated to realize compression joint of all the COFs and the glass.

It should be noted that, in the embodiment, after the ACF is attached to the COF by the ACF attachment mechanism 103, the COF to be mentioned later is the COF to which the ACF is attached; the equipment rack 101 of this embodiment includes a first rack, a second rack, a third rack, a fourth rack, and a fifth rack, which are all schematic diagrams in the drawings, and in this embodiment, the first rack, the second rack, the third rack, the fourth rack, and the fifth rack are a sum of racks that bear all corresponding mechanisms.

In summary, the fully-automatic chip on film pre-press machine provided in this embodiment supports 3 standard widths of COF tapes on the market, customizes the ratchet according to the width of the COF tapes on the market, can be compatible with 47-86 inch (16: 9) full-size liquid crystal panel process, and specifically can be compatible with the sizes of three conventional liquid crystal panel: 47-60 inches, 55-75 inches and 75-86 inches, only the vacuum chuck platform in the TABLE mechanism 106, and the widths of the upper prepressing heads (such as the first upper prepressing head 1041 and the second upper prepressing head 1042) and the glass supporting and screen sucking mechanism need to be changed, the automatic COF prepressing machine provided by the embodiment can simultaneously complete the automatic processing of the liquid crystal panels with three sizes, and in the processing process, the four sides of the liquid crystal panels can be pressed and connected in the same equipment, i.e. the prepressing machine equipment of the embodiment solves the problem that only S-side prepressing or only G-side prepressing is performed in the traditional COF prepressing, the prepressing machine equipment of the embodiment can perform S-side prepressing, and after the S-side prepressing, the TABLE mechanism 106 is rotated to the G-side, the prepressing to the G-side can be compatible, the traditional pressing and processing to different sides by different equipment is avoided, the process production flow is simplified, and the production line cost is reduced, the flexible manufacturing performance of the pre-pressing equipment is greatly improved; in this embodiment, the upper pre-pressing mechanism 104, the lower pre-pressing mechanism 105, and the TABLE mechanism 106 perform alignment compensation during the crimping process, so as to ensure high-quality production of the liquid crystal panel product and high precision of the crimping reaching micron level.

It should be noted that the full-automatic pre-pressing machine for chip on film in this embodiment is not limited to the above structural design, and may further include, for example, an ARM mechanism, a glass primary alignment CCD mechanism, a direct drive control system, a servo control system, a pneumatic system control, an electrostatic elimination system, a dust filtering system, etc. so that the full-automatic pre-pressing machine for chip on film works in a high standard environment, and finally ensures high-quality production of products of the full-automatic COF pre-pressing machine for Bonding equipment, and the pre-pressing reaches a high precision of micron order.

It should be noted that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the specification, reference to the description of the term "one embodiment", "some embodiments", "an example", "a specific example", or "some examples", etc., means that a particular feature or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

While the invention has been described in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a review of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.