阅读说明：本技术 一种散热结构及具有该结构的压力传感器及其制备方法 (Heat dissipation structure, pressure sensor with heat dissipation structure and preparation method of pressure sensor ) 是由 周文海 于 2021-09-17 设计创作，主要内容包括：本申请公开了一种散热结构及具有该结构的压力变送传感器及其制备方法,涉及传感技术领域。所述散热结构设置在压力传感器的接头和传感器芯片模块之间,所述散热结构包括：套筒,所述套筒设置在所述接头和所述传感器芯片模块之间,所述套筒的两端与所述接头和所述传感器芯片模块焊接连接；导压管,所述导压管设置在所述套筒的中心,所述导压管内填充有导压介质；其中,所述套筒和所述导压管之间填充有导热胶。本申请通过在套筒内填充导热胶,将传统使用温度120℃提升至180℃,提高了压力传感器的耐温性能,进而提高了压力传感器的检测精度。(The application discloses a heat dissipation structure, a pressure transmitting sensor with the heat dissipation structure and a manufacturing method of the pressure transmitting sensor, and relates to the technical field of sensing. The heat radiation structure is arranged between the joint of the pressure sensor and the sensor chip module, and comprises: the sleeve is arranged between the joint and the sensor chip module, and two ends of the sleeve are connected with the joint and the sensor chip module in a welding mode; the pressure guide pipe is arranged in the center of the sleeve and filled with a pressure guide medium; and heat-conducting glue is filled between the sleeve and the pressure guide pipe. This application promotes traditional use temperature 120 ℃ to 180 ℃ through filling heat-conducting glue in the sleeve, has improved pressure sensor's temperature resistance, and then has improved pressure sensor's detection precision.)

1. A heat radiation structure is characterized in that: the heat radiation structure is arranged between the joint of the pressure sensor and the sensor chip module, and comprises:

the sleeve is arranged between the joint and the sensor chip module, and two ends of the sleeve are connected with the joint and the sensor chip module in a welding mode;

the pressure guide pipe is arranged in the center of the sleeve and filled with a pressure guide medium;

and heat-conducting glue is filled between the sleeve and the pressure guide pipe.

2. The heat dissipating structure of claim 1, wherein the thermally conductive adhesive is a high temperature thermally conductive silicone.

3. The heat dissipating structure of claim 1, wherein the thermal conductive paste has a thermal dissipation coefficient of 0.8-1.2W/m x K.

4. The heat dissipating structure of claim 1, wherein the thermally conductive adhesive has a thickness of 23.5 mm.

5. The heat dissipating structure of claim 1, wherein the bottom of the joint is provided with corrugated fins, and the joint is provided with pressure sensing fins.

6. A heat radiation structure is characterized in that: the heat radiation structure is arranged between the joint of the pressure sensor and the sensor chip module, and comprises:

the pressure guide column is arranged between the joint and the sensor chip module, and a pressure guide channel is arranged in the pressure guide column;

the radiating fins are arranged on the periphery of the pressure guide column, gaps are formed among the radiating fins, and heat-conducting glue is filled in the gaps.

7. The heat dissipating structure of claim 6, wherein the thermally conductive adhesive is a high temperature thermally conductive silicone.

8. The heat dissipating structure of claim 6, wherein the heat dissipating coefficient of the thermally conductive adhesive is 0.8-1.2W/m x K.

9. A pressure sensor having a heat dissipating structure as claimed in any one of claims 1 to 8.

10. A method of manufacturing a pressure sensor, comprising the steps of:

welding the sleeve and the joint;

connecting the pressure guide pipe and the temperature sensing diaphragm;

filling heat-conducting glue in the sleeve;

and welding the sensor chip module.

Technical Field

The application relates to the technical field of pressure sensors, in particular to a heat dissipation structure, a pressure transmitting sensor with the heat dissipation structure and a preparation method of the pressure transmitting sensor.

Background

A pressure sensor is a meter that converts fluid pressure into a standard output signal that can be transmitted, and is commonly used in the production of medical health, pharmacy, food, beverage, wine, etc. for measuring and controlling the pressure parameter of liquid flow, and is an important meter device.

When the pressure sensor contacts a high-temperature medium, the high temperature can cause the failure or damage of a sensitive element and a circuit chip in the traditional pressure sensor, so that heat dissipation needs to be carried out through a heat dissipation structure. As shown in fig. 1, a conventional heat dissipation structure of a pressure sensor includes: the pressure sensor comprises a joint 1, a pressure guiding column 2 and a sensor chip module 4, wherein a corrugated sheet is arranged at the bottom of the joint 1 and is used for contacting with a fluid medium to be detected and transmitting pressure to the sensor chip module 4 through a pressure guiding medium (generally silicon oil) in the pressure guiding column 2. In order to achieve the purpose of heat dissipation, the periphery of the pressure guiding column 2 is provided with heat dissipation fins 3 at intervals.

However, the service temperature of the conventional pressure sensor is generally 120 ℃, and the gaps between the heat dissipation fins 3 are easy to store dirt and scale, and an aseptic and high-temperature sealing environment of more than 150 ℃ is often required in medical health, food, medicine and wine brewing applications, i.e., the conventional pressure sensor cannot meet the actual heat dissipation requirement and the sanitary requirement, and further the detection accuracy of the pressure sensor is affected, and improvement is urgently needed.

Disclosure of Invention

The application aims at providing a heat radiation structure for pressure sensor solves current pressure sensor and can not satisfy actual heat dissipation demand and sanitary requirement, and then influences pressure sensor's the problem of detection precision.

In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions: a heat dissipation structure disposed between a connector of a pressure sensor and a sensor chip module, the heat dissipation structure comprising: the sleeve is arranged between the joint and the sensor chip module, and two ends of the sleeve are connected with the joint and the sensor chip module in a welding mode; the pressure guide pipe is arranged in the center of the sleeve and filled with a pressure guide medium; and heat-conducting glue is filled between the sleeve and the pressure guide pipe.

In the technical scheme, the heat-conducting glue is filled in the sleeve, the traditional use temperature of 120 ℃ is increased to 180 ℃, the temperature resistance of the pressure sensor is improved, and the detection precision of the pressure sensor is further improved. Meanwhile, the heat dissipation structure has no gap, so that dust is not accumulated, and the heat dissipation structure is safer and more sanitary than the traditional pressure sensor and better meets the requirements of the industries such as medical health, food, medicine, wine brewing and the like. Finally, the material price of the heat-conducting glue is far lower than that of the radiating fin, so that the manufacturing cost of the pressure sensor is reduced.

Further, according to the embodiment of the present application, wherein the heat conducting glue is a high temperature heat conducting silica gel.

Further, according to the embodiment of the application, the heat dissipation coefficient of the heat conductive adhesive is 0.8-1.2W/m × K.

Further, according to the embodiment of the application, the thickness of the heat conducting glue is 23.5 mm.

Further, according to this application embodiment, wherein, the joint bottom sets up corrugated piece, be provided with the pressure sensing diaphragm in the joint.

In order to achieve the above object, an embodiment of the present application further discloses a heat dissipation structure, where the heat dissipation structure is disposed between the joint of the pressure sensor and the sensor chip module, and the heat dissipation structure includes: the pressure guide column is arranged between the joint and the sensor chip module, and a pressure guide channel is arranged in the pressure guide column; the radiating fins are arranged on the periphery of the pressure guide column, gaps are formed among the radiating fins, and heat-conducting glue is filled in the gaps.

Further, according to the embodiment of the present application, wherein the heat conducting glue is a high temperature heat conducting silica gel.

Further, according to the embodiment of the application, the heat dissipation coefficient of the heat conductive adhesive is 0.8-1.2W/m × K.

In order to achieve the above object, an embodiment of the present application further discloses a pressure sensor, where the pressure sensor has a heat dissipation structure as described above.

In order to achieve the above object, an embodiment of the present application further discloses a manufacturing method of a pressure sensor, including the following steps:

welding the sleeve and the joint;

connecting the pressure guide pipe and the temperature sensing diaphragm;

filling heat-conducting glue in the sleeve;

and welding the sensor chip module.

Compared with the prior art, the method has the following beneficial effects: this application promotes traditional use temperature 120 ℃ to 180 ℃ through filling heat-conducting glue in the sleeve, has improved pressure sensor's temperature resistance, and then has improved pressure sensor's detection precision. Meanwhile, the heat dissipation structure has no gap, so that dust is not accumulated, and the heat dissipation structure is safer and more sanitary than the traditional pressure sensor and better meets the requirements of the industries such as medical health, food, medicine, wine brewing and the like. Finally, the material price of the heat-conducting glue is far lower than that of the radiating fin, so that the manufacturing cost of the pressure sensor is reduced.

Drawings

The present application is further described below with reference to the drawings and examples.

Fig. 1 is a schematic diagram of a heat dissipation structure of a pressure sensor in the prior art.

Fig. 2 is a schematic diagram of a heat dissipation structure of a pressure sensor according to an embodiment of the present application.

Fig. 3 is a schematic diagram of a heat dissipation structure of a pressure sensor according to another embodiment of the present application.

In the attached drawings

1. Connector 2, pressure guiding column 3 and radiating fin

4. Sensor chip module 5, pressure leading pipe 6 and sleeve

7. Heat-conducting glue

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clear and fully described, embodiments of the present invention are further described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of some embodiments of the invention and are not limiting of the invention, and that all other embodiments obtained by those of ordinary skill in the art without the exercise of inventive faculty are within the scope of the invention.

In the description of the present invention, it should be noted that the terms "center", "middle", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "a," "an," "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

For the purposes of simplicity and explanation, the principles of the embodiments are described by referring mainly to examples. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. It will be apparent, however, to one skilled in the art that the embodiments may be practiced without these specific details. In some instances, well-known methods and structures have not been described in detail so as not to unnecessarily obscure the embodiments. In addition, all embodiments may be used in combination with each other.

[ example 1 ]

Fig. 2 shows a schematic diagram of a heat dissipation structure in an embodiment of the present application. As shown in fig. 2, the heat dissipation structure is disposed between the joint 1 and the sensor chip module 4, the bottom of the joint 1 is provided with a corrugated sheet for contacting with a fluid medium to be measured, and the joint 1 is provided with a pressure sensing film. Be provided with sleeve 6 between joint 1 and sensor chip module 4, sleeve 6 with connect 1 and sensor chip module 4 and pass through welded connection, the center of sleeve 6 is provided with pressure pipe 5, pressure sensing diaphragm and sensor chip module 4 are connected at pressure pipe 5's both ends, and pressure pipe 5 intussuseption is filled with the pressure medium, gives sensor chip module 4 with pressure transmission. The heat-conducting glue is filled between the pressure guide pipe 5 and the sleeve 6 to replace a radiating fin in the traditional pressure sensor, so that the heat-radiating performance of the pressure sensor is improved, the working temperature of the pressure sensor is improved to 180 ℃, and the pressure sensor is more suitable for working environments of industries such as medical sanitation, food, medicines, wine brewing and the like.

Further, the heat conducting glue is high-temperature heat conducting silica gel. The heat-conducting silica gel is a single-component room-temperature curing organosilicon sealant, and is convenient to use.

Furthermore, the heat dissipation coefficient of the heat-conducting glue is 0.8-1.2W/m.

Further, the thickness of the heat-conducting glue is 23.5 mm.

In above-mentioned technical scheme, this application promotes traditional use temperature 120 ℃ to 180 ℃ through filling heat-conducting glue in sleeve 6, has improved pressure sensor's temperature resistance, and then has improved pressure sensor's detection precision. Meanwhile, the heat dissipation structure has no gap, so that dust is not accumulated, and the heat dissipation structure is safer and more sanitary than the traditional pressure sensor and better meets the requirements of the industries such as medical health, food, medicine, wine brewing and the like. Finally, the material price of the heat-conducting glue is far lower than that of the radiating fin, so that the manufacturing cost of the pressure sensor is reduced.

The differences between the present application and the prior art are presented below in table 1.

TABLE 1

	This application	Prior Art
			Temperature of contactable medium	Up to 180 DEG C	Up to 120 deg.C
Accuracy of measurement	0.05-0.075％FS	0.2-0.5％FS

[ example 2 ]

The application also discloses a pressure sensor which adopts the heat dissipation structure as in embodiment 1.

[ example 3 ]

The application also discloses a manufacturing method of the pressure sensor, which comprises the following steps:

welding the sleeve 6 and the joint 1;

connecting the pressure guide pipe 5 and the temperature sensing diaphragm;

heat-conducting glue is filled in the sleeve 6;

the sensor chip module 4 is soldered.

[ example 4 ]

Fig. 3 is a schematic diagram illustrating a heat dissipation structure according to another embodiment of the present application. As shown in fig. 3, the heat dissipation structure is disposed between the joint 1 and the sensor chip module 4, the bottom of the joint 1 is provided with a corrugated sheet for contacting with a fluid medium to be measured, and the joint 1 is provided with a pressure sensing film. Be provided with between joint 1 and sensor chip module 4 and lead pressure post 2, lead and be provided with in the pressure post 2 and lead the pressure passageway, lead the pressure passageway and communicate pressure sensing diaphragm and sensor chip module 4, lead and press the passageway intussuseption and be filled with and lead the pressure medium, give sensor chip module 4 with pressure transmission. The periphery of the pressure guide column 2 is provided with the radiating fins 3, gaps are arranged among the radiating fins 3, and heat-conducting glue 7 is filled in the gaps to improve the heat radiating performance of the pressure guide column, so that the working temperature of the pressure sensor is improved to be more than 180 ℃, and the pressure guide column is more suitable for working environments of industries such as medical sanitation, food, medicines and wine brewing.

Further, the heat conductive adhesive 6 is a high temperature heat conductive silica gel. The heat-conducting silica gel is a single-component room-temperature curing organosilicon sealant, and is convenient to use.

Further, the heat dissipation coefficient of the heat conductive adhesive 6 is 0.8-1.2W/m × K.

Although the illustrative embodiments of the present application have been described above to enable those skilled in the art to understand the present application, the present application is not limited to the scope of the embodiments, and various modifications within the spirit and scope of the present application defined and determined by the appended claims will be apparent to those skilled in the art from this disclosure.