阅读说明：本技术 一种蚀刻线路超小一体成型电感的制备方法及电感 (Preparation method of etched circuit ultra-small integrally-formed inductor and inductor ) 是由 徐可心 郭庆文 林涛 王伟 王博 孙洪波 吴长和 王劲 于 2021-09-30 设计创作，主要内容包括：本发明提供一种蚀刻线路超小一体成型电感的制备方法及电感,涉及电感制备技术领域,包括：步骤S1,制备得到一磁芯座体；步骤S2,于磁芯座体的上表面蚀刻出一电路路径；步骤S3,于磁芯座体的上表面沿电路路径植入铜线；步骤S4,于磁芯座体的上表面涂覆磁粉并热压；步骤S5,对热压后的磁芯座体依次进行滚喷、镭射和电镀,以制备得到一蚀刻线路超小一体成型电感。有益效果是有效避免了绕组膨胀断裂以及短路风险,同时无需另外制备磁芯,使得制备得到一体成型电感的总体积更小,极大提高空间利用率。(The invention provides a preparation method of an ultra-small integrally-formed inductor of an etched circuit and the inductor, which relate to the technical field of inductor preparation and comprise the following steps: step S1, preparing a magnetic core seat body; step S2, etching a circuit path on the upper surface of the magnetic core seat; step S3, implanting copper wires on the upper surface of the magnetic core seat along the circuit path; step S4, coating magnetic powder on the upper surface of the magnetic core base and hot-pressing; and step S5, carrying out rolling spraying, laser and electroplating on the magnetic core base body after hot pressing in sequence to prepare the etched circuit ultra-small integrally-formed inductor. The inductor has the beneficial effects that the expansion fracture and short circuit risks of the winding are effectively avoided, and the magnetic core is not required to be additionally prepared, so that the total volume of the integrally formed inductor is smaller, and the space utilization rate is greatly improved.)

1. A preparation method of an ultra-small integrally-formed inductor of an etched circuit is characterized by comprising the following steps:

step S1, preparing a magnetic core seat body;

step S2, etching a circuit path on the upper surface of the magnetic core base;

step S3, implanting a copper wire on the upper surface of the magnetic core base along the circuit path;

step S4, coating magnetic powder on the upper surface of the magnetic core base body and hot-pressing;

and step S5, performing roll spraying, laser and electroplating on the magnetic core base body after hot pressing in sequence to prepare the etched circuit ultra-small integrally-formed inductor.

2. The method as claimed in claim 1, wherein in step S2, a slot is etched on an upper surface of the core housing to form the circuit path.

3. The method as claimed in claim 2, wherein in step S3, an automatic implanter is used to implant the copper wire into the wire slot.

4. The method for preparing the copper wire, according to claim 3, wherein during the process of implanting the copper wire, an implanting head of the automatic implanter heats the copper wire in a pulse heating mode, so that the copper wire is bonded in the wire slot.

5. The production method according to claim 3 or 4, wherein in the step S3, the copper wire is a flat copper wire.

6. The method of claim 1, wherein the circuit path includes a first path and a second path, a first start end of the first path is formed by extending from a first end to an edge of the core housing after looping back in a zigzag manner, and a second start end of the second path is formed by extending from a second end to an edge of the core housing after passing straight through the first path that loops back in a zigzag manner with the first start end as a starting point.

7. The method as claimed in claim 1, wherein in step S1, step S1, the magnetic core housing is prepared by a baking process after die casting.

8. An etched line ultra-small integrated inductor, which is prepared by the preparation method according to any one of claims 1 to 7, and comprises:

the magnetic core seat body is etched with a circuit path, and a copper wire is implanted in the circuit path.

9. The etched line ultra-small integrated inductor according to claim 8, wherein the copper wire is a flat copper wire.

10. The ultra-small integrated inductor as claimed in claim 8, wherein the circuit path includes a first path and a second path, a first start end is surrounded in a zigzag shape and then extends from a first terminal to an edge of the core housing to form the first path, and a second start end is formed by directly passing through the first path surrounded in a zigzag shape with the first start end as a starting point and then extending from a second terminal to an edge of the core housing to form the second path.

Technical Field

The invention relates to the technical field of inductor preparation, in particular to a preparation method of an ultra-small integrally-formed inductor of an etched circuit and the inductor.

Background

The integrated inductor is called an integrated inductor, a powder alloy inductor and a die-pressing inductor, the integrated inductor comprises a seat body and a winding, and the seat body is formed by embedding the winding into metal magnetic powder and die-casting. Compare in traditional inductance, integrated into one piece inductance has following advantage: the magnetic shielding structure has a closed magnetic circuit, is strong in electromagnetic interference resistance, has ultralow buzzer and can be installed at high density; low-loss alloy powder is adopted for die casting, so that the impedance is low; the structure is integrally formed, so that the product is firm and firm, and is accurate and durable in rust prevention; the integrated inductor has the advantages that the size is small, the current is high, excellent temperature rise current and saturation current characteristics can be kept at high temperature, and the market puts higher requirements on miniaturization of the integrated inductor along with wide application of the integrated inductor.

Among the present integrated into one piece inductance, the winding is the copper line coiling, has the bulging deformation phenomenon at the die-casting in-process, has copper line fracture and short circuit risk, and need prepare the magnetic core when the inductance is prepared, and the magnetic core possesses certain height usually to the further miniaturization of the total volume of integrated into one piece inductance has been restricted.

Disclosure of Invention

Aiming at the problems in the prior art, the invention provides a preparation method of an ultra-small integrally-formed inductor of an etched circuit, which comprises the following steps:

step S1, preparing a magnetic core seat body;

step S2, etching a circuit path on the upper surface of the magnetic core base;

step S3, implanting a copper wire on the upper surface of the magnetic core base along the circuit path;

step S4, coating magnetic powder on the upper surface of the magnetic core base body and hot-pressing;

and step S5, performing roll spraying, laser and electroplating on the magnetic core base body after hot pressing in sequence to prepare the etched circuit ultra-small integrally-formed inductor.

Preferably, in step S2, a wire groove is etched on the upper surface of the core housing to form the circuit path.

Preferably, in step S3, an automatic implanter is used to implant the copper wire into the wire slot.

Preferably, in the process of implanting the copper wire, the implanting head of the automatic implanting machine heats the copper wire in a pulse heating mode, so that the copper wire is bonded in the wire slot.

Preferably, in step S3, the copper wire is a flat copper wire.

Preferably, the circuit path includes a first path and a second path, a first start end surrounds the first path in a zigzag manner and extends from a first lead-out end to the edge of the magnetic core base body to form the first path, and a second start end passes through the first path surrounding in a zigzag manner with the first start end as a start point and extends from a second lead-out end to the edge of the magnetic core base body to form the second path.

Preferably, in step S1, the magnetic core base is prepared by a baking process after die casting.

The invention also provides an etched circuit ultra-small integrally-formed inductor which is prepared by the preparation method and comprises the following steps:

the magnetic core seat body is etched with a circuit path, and a copper wire is implanted in the circuit path.

Preferably, the copper wire is a flat copper wire.

Preferably, the circuit path includes a first path and a second path, a first start end surrounds the first path in a zigzag manner and extends from a first lead-out end to the edge of the magnetic core base body to form the first path, and a second start end passes through the first path surrounding in a zigzag manner with the first start end as a start point and extends from a second lead-out end to the edge of the magnetic core base body to form the second path.

The technical scheme has the following advantages or beneficial effects: through the mode of etching circuit path and implanting the copper line on the magnetic core pedestal body, replace the winding die-casting and form, effectively avoided winding expansion fracture and short circuit risk, need not to prepare the magnetic core in addition simultaneously for the total volume that the preparation obtained integrated into one piece inductance is littleer, greatly improves space utilization.

Drawings

FIG. 1 is a schematic flow chart of a method for fabricating a super small integrated inductor with etched lines according to a preferred embodiment of the present invention;

FIG. 2 is a schematic structural diagram of an outlet slot etched on the upper surface of the magnetic core base according to the preferred embodiment of the present invention;

FIG. 3 is a schematic diagram of a structure of a super small integrated inductor with etched lines according to a preferred embodiment of the present invention.

Detailed Description

The invention is described in detail below with reference to the figures and specific embodiments. The present invention is not limited to the embodiment, and other embodiments may be included in the scope of the present invention as long as the gist of the present invention is satisfied.

In a preferred embodiment of the present invention, based on the above problems in the prior art, a method for manufacturing an ultra-small integrated inductor with etched lines is provided, as shown in fig. 1, including:

step S1, preparing a magnetic core seat body;

step S2, etching a circuit path on the upper surface of the magnetic core seat;

step S3, implanting copper wires on the upper surface of the magnetic core seat along the circuit path;

step S4, coating magnetic powder on the upper surface of the magnetic core base and hot-pressing;

and step S5, carrying out rolling spraying, laser and electroplating on the magnetic core base body after hot pressing in sequence to prepare the etched circuit ultra-small integrally-formed inductor.

Specifically, in this embodiment, the magnetic core base body is first prepared by die-casting and then baking, as shown in fig. 2, preferably, the cross section of the magnetic core base body 1 is overall rectangular, and one side of the rectangle is provided with a groove, and two sides of the groove are used as outlets of copper wires. Because this magnetic core pedestal is the magnetic powder hot pressing, its self can regard as the magnetic core of implanting the circuit route that the copper line formed, consequently, need not to prepare in addition the protrusion in the magnetic core of magnetic core pedestal 1, and then the volume of the super little integrated into one piece inductance of etching circuit that makes the preparation obtain is miniaturized as far as possible, greatly improves space utilization when using.

Further, etching is to remove the portion of the material not covered by the photoresist (photosensitive film) by etching with a suitable chemical solution to a certain depth of engraving. The etching process changes the mode of machining metal parts, and can machine small parts which are large in area and small enough to be hardly distinguished by eyes, wherein the small parts are large in area and are used by equipment in the traditional industry; the production process has no external force impact, no deformation and good flatness; the production period is short, the strain is fast, and the design and the manufacture of a die are not needed; the product has no burr and no bulge, and both surfaces of the product are as smooth and as flat; processing a metal material product with a plane concave-convex shape according to the figure red, such as: text, numbers and complex patterns; various precision through-hole parts with arbitrary shapes are manufactured. Based on this, this technical scheme adopts the etching mode to form the circuit route, need not to prepare the mould to different circuit routes, when saving the cost, has guaranteed accuracy and production efficiency.

In the preferred embodiment of the present invention, in step S2, as shown in fig. 2, a wire groove 11 is etched on the upper surface of the magnetic core base 1 to form a circuit path.

Specifically, in this embodiment, fig. 2 only shows a partial wiring manner of the wire chase 1, and is not limited thereto.

In the preferred embodiment of the present invention, in step S3, an automatic implanter is used to implant the copper wire into the wire slot 11.

In the preferred embodiment of the present invention, during the process of implanting the copper wire, the implanting head of the automatic implanter heats the copper wire in a pulse heating manner, so that the copper wire is adhered in the wire slot 11.

In the preferred embodiment of the present invention, in step S3, the copper wire is a flat copper wire.

Specifically, in this embodiment, because the wire casing 11 that etches out is the rectangle, the copper line adopts flat copper line can further increase its and the wire casing 11 between area of contact, and then makes the copper line more easily and firmly bond in wire casing 11.

In the preferred embodiment of the present invention, as shown in fig. 3, the circuit path 2 includes a first path 21 and a second path 22, a first start end 211 surrounds in a zigzag manner and extends from a first lead-out end 212 to the edge of the core holder body 1 to form the first path 21, and a second start end 221 extends from a second lead-out end 222 to the edge of the core holder body 1 to form the second path 22 after passing through the first start end 211 as a start point and extending through the first path 21 surrounded in a zigzag manner.

In a preferred embodiment of the present invention, in step S1, the magnetic core base is prepared by a baking process after die casting.

The invention also provides an etched circuit ultra-small integrally-formed inductor, which is prepared by the preparation method, and as shown in fig. 3, the etched circuit ultra-small integrally-formed inductor comprises the following components:

the magnetic core seat body 1 is provided with a circuit path 2 etched on the magnetic core seat body 1, and a copper wire is implanted in the circuit path 2.

Specifically, in this embodiment, as shown in fig. 2, preferably, the cross section of the magnetic core base 1 is rectangular as a whole, and a groove is formed on one side of the rectangle, and two sides of the groove are used as outlets of copper wires. Because this magnetic core pedestal is the magnetic powder hot pressing, its self can regard as the magnetic core of implanting the circuit route that the copper line formed, consequently, need not to prepare in addition the protrusion in the magnetic core of magnetic core pedestal 1, and then the volume of the super little integrated into one piece inductance of etching circuit that makes the preparation obtain is miniaturized as far as possible, greatly improves space utilization when using.

In a preferred embodiment of the present invention, the copper wire is a flat copper wire.

Specifically, in this embodiment, because the wire casing 11 that etches out is the rectangle, the copper line adopts flat copper line can further increase its and the wire casing 11 between area of contact, and then makes the copper line more easily and firmly bond in wire casing 11.

In the preferred embodiment of the present invention, as shown in fig. 3, the circuit path 2 includes a first path 21 and a second path 22, a first start end 211 surrounds in a zigzag manner and extends from a first lead-out end 212 to the edge of the core holder body 1 to form the first path 21, and a second start end 221 extends from a second lead-out end 222 to the edge of the core holder body 1 to form the second path 22 after passing through the first start end 211 as a start point and extending through the first path 21 surrounded in a zigzag manner.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.