阅读说明：本技术 应用于超低温环境的压力传感器 (Pressure sensor applied to ultralow temperature environment ) 是由 万飞 白煜 王敏锐 张敏 葛政 高亚楠 李世定 刘帅 于 2021-11-02 设计创作，主要内容包括：本申请涉及一种应用于超低温环境的压力传感器,属于压力检测装置的封装技术领域,包括：基座；检测组件,至少部分检测组件与基座对接安装,以对目标物进行检测；壳体组件,与基座连接,且套设在检测组件的外侧；其中,壳体组件包括隔温件及设置在隔温件外侧的金属外壳,隔温件用以将金属外壳的温度延缓传递至检测组件。通过上述方式,可在低温环境下减缓低温对于检测组件的冲击,从而提升压力传感器的低温可靠性和使用寿命；隔温件的材料具有极低的热导率从而明显增加压力传感器处于低温时温度自外界环境传递至隔温件内部的时间,同时使得隔温件在超低温环境中,仍然能够保持较好的机械性能。(The application relates to a be applied to ultra-low temperature environment's pressure sensor belongs to pressure measurement device's encapsulation technical field, include: a base; the detection assembly, at least some detection assemblies and base are mounted in butt joint, in order to detect the target object; the shell assembly is connected with the base and sleeved outside the detection assembly; wherein, the casing subassembly includes the piece that insulates against temperature and sets up the metal casing in the piece outside that insulates against temperature, and the piece that insulates against temperature is used for postponing the temperature of metal casing and transmits to detection components. Through the mode, the impact of low temperature on the detection assembly can be relieved in a low-temperature environment, so that the low-temperature reliability and the service life of the pressure sensor are improved; the material of the thermal insulation piece has extremely low thermal conductivity, so that the time for transferring the temperature from the external environment to the inside of the thermal insulation piece when the pressure sensor is at low temperature is obviously increased, and meanwhile, the thermal insulation piece can still keep better mechanical performance in the ultralow temperature environment.)

1. A pressure sensor for use in ultra-low temperature environments, comprising:

a base;

the detection assembly, at least some said detection assemblies and said base are mounted in butt joint, in order to detect the target object;

the shell assembly is connected with the base and sleeved outside the detection assembly;

the shell assembly comprises a heat insulation piece and a metal shell arranged on the outer side of the heat insulation piece, and the heat insulation piece is used for delaying and transmitting the temperature of the metal shell to the detection assembly.

2. The pressure sensor for application in ultra-low temperature environments of claim 1, wherein the material of the thermal barrier is polyimide or polyamide-imide.

3. The pressure sensor applied to an ultra-low temperature environment according to claim 1, wherein the base has a through hole, the sensing assembly includes a sensing core connected to the base and communicating with the through hole, a circuit board member connected to the sensing core, and a connection conductor connected to the circuit board member;

the thermal insulation piece is provided with an accommodating cavity, and the circuit board component and at least part of the connecting conductor are arranged in the accommodating cavity.

4. The pressure sensor applied to ultra-low temperature environment of claim 3, wherein the receiving cavity is vacuum-set.

5. The pressure sensor applied to an ultra-low temperature environment of claim 4, wherein the circuit board member includes a conditioning circuit board, the thermal barrier further including a thermal barrier disposed against the conditioning circuit board and on a side of the conditioning circuit board away from the base.

6. The pressure sensor applied to ultra-low temperature environment as claimed in claim 3, wherein a first sealing member is provided at a junction of the connection conductor and the temperature insulating member.

7. The pressure sensor applied to ultra-low temperature environment as claimed in claim 1, wherein the thermal insulation member comprises at least two connected mounting bodies, each mounting body is provided with a connecting cavity, and two adjacent connecting cavities are communicated with each other to form the accommodating cavity.

8. The pressure sensor applied to ultra-low temperature environment as claimed in claim 7, wherein at least two of the mounting bodies are provided with a groove on one and a projection engaged with the groove on the other; and/or, at least two of the mounting bodies are connected by screw thread.

9. The pressure sensor applied to the ultra-low temperature environment of claim 8, further comprising a second sealing member disposed between each adjacent two of the mounting bodies.

10. The pressure sensor for application in an ultra-low temperature environment of claim 9, wherein said second seal is gel;

each mounting body is provided with a butt joint surface, and the colloid is coated on the butt joint surface.

[ technical field ] A method for producing a semiconductor device

The application relates to a pressure sensor applied to an ultralow temperature environment, and belongs to the technical field of packaging of pressure detection devices.

[ background of the invention ]

One of the key technologies that a pressure sensor can stably work in an ultralow temperature environment is a packaging technology, and a traditional packaging method adopts a stainless steel shell to protect a circuit board and a core body of the pressure sensor, so that the pressure sensor can play roles in water resistance, corrosion resistance, vibration resistance and the like.

However, when the pressure sensor is applied to an ultra-low temperature environment, when the ambient temperature is rapidly reduced from the room temperature to the ultra-low temperature or rapidly increased from the ultra-low temperature to the room temperature, the high thermal conductivity of the stainless steel shell can rapidly transmit the ambient temperature to the inside of the pressure sensor, the internal temperature is reduced from the room temperature to the ultra-low temperature or increased from the ultra-low temperature to the room temperature in an extremely short time, the temperature shock brings a difficult-to-predict reliability problem to the conditioning circuit board, and one of the main reasons for the failure of the pressure sensor in the ultra-low temperature environment is the failure of the conditioning circuit board.

Accordingly, there is a need for improvements in the art that overcome the deficiencies in the prior art.

[ summary of the invention ]

An object of this application is to provide a be applied to ultra-low temperature environment's pressure sensor, it can improve low temperature reliability and life, convenient and fast.

The purpose of the application is realized by the following technical scheme: a pressure sensor for application in ultra-low temperature environments, comprising:

a base;

the detection assembly, at least some said detection assemblies and said base are mounted in butt joint, in order to detect the target object;

the shell assembly is connected with the base and sleeved outside the detection assembly;

the shell assembly comprises a heat insulation piece and a metal shell arranged on the outer side of the heat insulation piece, and the heat insulation piece is used for delaying and transmitting the temperature of the metal shell to the detection assembly.

In one embodiment, the material of the thermal barrier is polyimide or polyamide-imide.

In one embodiment, the base has a through hole, and the detection assembly includes a detection core connected to the base and communicating with the through hole, a circuit board member connected to the detection core, and a connection conductor connecting the detection core and the circuit board member and connecting a part of the circuit board member with an external device;

the thermal insulation piece is provided with an accommodating cavity, and the circuit board component and at least part of the connecting conductor are arranged in the accommodating cavity.

In one embodiment, the accommodating cavity is vacuum-arranged.

In one embodiment, the circuit board member includes a conditioning circuit board, and the thermal insulation member further includes a thermal insulation body disposed against the conditioning circuit board and on a side of the conditioning circuit board away from the base.

In one embodiment, a first sealing member is arranged at the joint of the connecting conductor and the temperature insulating member.

In one embodiment, the thermal insulation member includes at least two connected mounting bodies, each mounting body is provided with a connecting cavity, and two adjacent connecting cavities are communicated with each other to form the accommodating cavity.

In one embodiment, one of the at least two mounting bodies is provided with a groove, and the other mounting body is provided with a lug which is clamped with the groove; and/or, at least two of the mounting bodies are connected by screw thread.

In one embodiment, the pressure sensor applied to an ultra-low temperature environment further includes a second sealing member disposed between each adjacent two of the mounting bodies.

In one embodiment, the second sealing element is a gel;

each mounting body is provided with a butt joint surface, and the colloid is coated on the butt joint surface.

Compared with the prior art, the method has the following beneficial effects: the metal shell and the detection assembly are provided with the heat insulation pieces, the heat insulation pieces can delay and transmit the temperature of the metal shell to the detection assembly, and the impact of low temperature on the detection assembly can be relieved in a low-temperature environment, so that the low-temperature reliability and the service life of the pressure sensor are improved;

the material of the thermal insulation piece is polyimide or polyamide-imide, and the thermal insulation piece has extremely low thermal conductivity, so that the time for transferring the temperature from the external environment to the inside of the thermal insulation piece when the pressure sensor is at low temperature is obviously increased, and meanwhile, the thermal insulation piece can still keep good mechanical performance in an ultralow temperature environment.

[ description of the drawings ]

Fig. 1 is a schematic structural diagram of a pressure sensor applied to an ultra-low temperature environment according to the present application.

[ detailed description ] embodiments

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "comprising" and "having," as well as any variations thereof, in this application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1, a pressure sensor applied to an ultra-low temperature environment in a preferred embodiment of the present invention can be applied to the technical fields of water conservancy and hydropower, railway transportation, intelligent construction, automatic production control, aerospace, military industry, petrochemical industry, oil wells, electric power, ships, machine tools, pipelines, etc., and the application is not particularly limited to the application field of the pressure sensor applied to the ultra-low temperature environment.

The pressure sensor applied to the ultralow temperature environment comprises a base 1, a detection assembly 2 and a shell assembly 3, wherein at least part of the detection assembly 2 is in butt joint with the base 1, the shell assembly 3 is connected with the base 1 and sleeved on the outer side of the detection assembly 2, and the base 1 is in butt joint with a target object. In the embodiment, the base 1 is provided with threads, and is in threaded connection with the target object to realize installation. In other embodiments, the base 1 and the target object may be mounted by inserting, engaging, or the like, and is not limited specifically herein.

Be provided with the through-hole on the base 1, pressure medium passes through the through-hole and transmits to detection component 2, and then obtains the testing data. The base 1 is made of stainless steel, and has extremely high rigidity and corrosion resistance, so that the base can be applied to various environments.

In order to facilitate the butt joint installation of the base 1 and the detection assembly 2, a positioning member 11 is further arranged on the base 1, and a communication hole is arranged on the positioning member 11 and is communicated with the through hole on the base 1 so as to transmit the pressure medium to the detection assembly 2.

Specifically, the detection unit 2 includes a detection core 21 connected to the base 1 and communicating with the through hole, a circuit board member 22 connected to the detection core 21, and a connection conductor 23 connected to the circuit board member 22. In the present embodiment, the detecting core 21 is a pressure sensitive core, and the detected data is accurate and fast. The connecting conductor 23 may be a metal pin or a connecting wire. In the present embodiment, the connection conductor 23 is specifically described as a metal pin.

The detection core body 21 is further provided with a butt joint cavity, and the butt joint cavity is installed in butt joint with the positioning piece 11, so that the detection core body 21 and the base 1 are installed. That is, the detection core 21 communicates with the through hole through the communication hole. After the detection core body 21 and the base 1 are installed, the positioning member 11 is just accommodated in the docking chamber, and the communication hole of the positioning member 11 is communicated with the docking chamber. At this time, the pressure medium is transmitted to the detection core body 21, and the detection core body 21 is transmitted to an external device through the circuit board member 22 and the metal pin 23, which is convenient and fast. Moreover, the detection core body 21 and the base 1 are connected by welding, so that the connection stability of the detection core body 21 and the base 1 is enhanced. In other embodiments, the connection manner of the detection core 21 and the base 1 may be other, for example, the connection manner is through a fastener, etc., and is not limited in detail herein, depending on the actual situation.

The circuit board member 22 includes a wiring board 221 connected to the detection core 21 and a conditioning circuit board 222 connected to the wiring board 221 through metal pins 23, and the conditioning circuit board 222 is used to convert analog signals into digital signals for data acquisition, control process, performing calculation display reading, or other purposes, so that the conditioning circuit board 222 is particularly important in the pressure sensor as a whole applied to an ultra-low temperature environment.

The housing assembly 3 includes a metal shell 31, and the metal shell 31 is made of stainless steel. In the prior art, when the application environment temperature of the pressure sensor is rapidly reduced from room temperature to an ultralow temperature environment (below-100 ℃), the high thermal conductivity of stainless steel can rapidly transfer low temperature and keep consistent with the environment temperature, water in air near the stainless steel shell is liquefied or desublimed when meeting cold heat absorption and temperature reduction, and air at other positions in the stainless steel shell is subjected to convection exchange, so that the low temperature is rapidly transferred to the conditioning circuit board 222, the conditioning circuit board 222 is disabled, and the pressure sensor is integrally disabled.

In order to prevent this phenomenon from occurring, so that the pressure sensor can still remain effective at the time of temperature shock (change of room temperature to ultra-low temperature), the case assembly 3 in the present application further includes a thermal insulator 32, and the metal shell 31 is provided outside the thermal insulator 32. That is, in the present embodiment, the thermal insulator 32 is disposed between the metal shell 31 and the detection module 2 to delay the temperature of the metal shell 31 from being transmitted to the detection module 2, so that the time for transmitting the low temperature to the detection module 2 can be extended.

In order to further ensure the reliability of the operation of the conditioning circuit board 222 in the low temperature environment and the service life of the pressure sensor, in this embodiment, the material of the thermal insulation member 32 is polyimide or polyamide-imide. The thermal conductivity of the polyimide/polyamide-imide is only 0.2W/m "K-0.3W/m" K, and the conditioning circuit board 222 of the pressure sensor is isolated from the external environment by using a polyimide or polyamide-imide plastic structural member. When the ambient temperature is rapidly reduced from the room temperature to the ultralow temperature or is rapidly increased from the ultralow temperature to the room temperature, compared with stainless steel, the extremely low thermal conductivity of polyimide or polyamide-imide can obviously prolong the time for transmitting the low temperature from the external environment to the interior of the plastic structural member, so that the impact of the low temperature is relieved.

Moreover, the long-term use temperature range of the polyimide is-200-300 ℃, the long-term use temperature range of the polyamide-imide is-195-230 ℃, and the polyimide still can keep better mechanical property and cannot be brittle under the ultralow temperature environment.

Meanwhile, the difference between the thermal expansion coefficient of the polyimide/polyamide-imide and the thermal expansion coefficient of the metal is small, and the difference is 1.0-2.0 multiplied by 10^-5The temperature change between the two is small, and the long-term reliability is high.

The thermal barrier 32 has a housing cavity 323, and the circuit board member 22 is disposed in the housing cavity 323. In order to improve the low-temperature reliability and the service life of the pressure sensor, the accommodating cavity 323 is arranged in a vacuum manner. The purpose of this is to: the vacuum arrangement can greatly reduce the occurrence of air convection, thereby increasing the time for low temperatures to transfer from the thermal barrier 32 to the conditioning circuit board 222, again slowing the impact of the low temperatures. In this embodiment, the vacuum setting is defined as: the air pressure in the accommodating chamber 323 is kept below 1 Pa.

As described above, the circuit board member 22 includes the wiring board 221 and the conditioning circuit board 222, which are connected to each other by the metal pins 23. The conditioning circuit board 222 is connected to an external device through the metal pins 23, that is, after the connection between the wiring board 221 and the conditioning circuit board 222 is made through the metal pins 23, the conditioning circuit board 222 is connected to the external device through another metal pin 23. Therefore, in the present embodiment, at least a portion of the metal pin 23 is disposed in the receiving cavity 323, and one end of the metal pin 23 passes through the thermal insulator 32. In order to ensure the vacuum degree in the accommodating cavity 323, a first sealing element is arranged at the joint of the metal insertion pin 23 and the thermal insulation element 32.

Specifically, a hole is formed in the thermal insulation member 32, one end of the metal pin 23, which is far away from the base 1, penetrates through the hole, and the first sealing member is arranged at the hole. And, in order to ensure that the first sealing member remains effective at low temperatures, in this embodiment, the first sealing member is a low temperature glue, which is easy to apply and effective in sealing. In other embodiments, the first sealing member may also be other, such as a silicone sealing ring, etc., which is not specifically limited herein, depending on the actual situation.

The thermal insulation member 32 may be a unitary body, or include at least two connecting mounting bodies 321. When the thermal insulation member 32 is integrally formed, the production process is simple and assembly is not required; when the thermal insulator 32 comprises at least two connected mounting bodies 321, it is convenient to arrange the detection assembly 2 in the receiving cavity 323 therein.

Taking the example that the thermal insulation member 32 includes at least two connected mounting bodies 321, each mounting body 321 is provided with a connecting cavity, and two adjacent connecting cavities are communicated to form the accommodating cavity 323. One of the at least two mounting bodies 321 is provided with a groove, and the other mounting body is provided with a projection engaged with the groove, and the groove and the projection are engaged to enable the two adjacent mounting bodies 321 to be mounted therebetween. Alternatively, at least two mounting bodies 321 are connected by screw threads. Or, at least two mounting bodies 321 are not only provided with a groove and a protrusion for snap connection, but also provided with a thread for screw connection. Alternatively, the at least two mounting bodies 321 may be connected by a fastener, which is not limited herein, according to the actual situation.

The pressure sensor applied to the ultra-low temperature environment further includes a second sealing member disposed between each adjacent two of the mounting bodies 321. In this embodiment, the second sealing element is a glue, specifically the same as the first sealing element, and is a low temperature glue. Each mounting body 321 has an abutment surface on which the glue is applied.

In the present embodiment, the number of the mounting bodies 321 is 3, and for the sake of illustration, the mounting bodies 321 connected in sequence from one end close to the base 1 to one end far from the base 1 are referred to as a first mounting body 324, a second mounting body 325, and a third mounting body 326, respectively. The abutting surface of the contact surface of the first mounting body 324 and the base 1 in the axial direction (indicated by arrow a) of the base 1 is fixed by screw threads, and the abutting surface in the direction perpendicular to the axial direction (indicated by arrow b) is provided with a second sealing member.

A groove is provided on a side of the first mounting body 324 away from the base 1, the wiring board 221 is placed in the groove, and the wiring board 221 and the detection core body 21 are connected by a metal wire.

A protrusion is disposed on one side of the second mounting body 325 close to the first mounting body 324, and the protrusion is engaged with the groove. Similarly, the first structural member and the second structural member are screwed to each other at the abutting surface in the axial direction (indicated by arrow a) of the base 1, and a second seal is provided at the abutting surface in the direction (indicated by arrow b) perpendicular to the axial direction.

Alternatively, a groove is formed on one side of the second mounting body 325 close to the first mounting body 324, and a protrusion is formed on one side of the first mounting body 324 close to the second mounting body 325, and the protrusion is engaged with the groove. Alternatively, the second mounting body 325 and the first mounting body 324 may not be provided with a protrusion, a groove and a thread, and the connection may be directly performed by using the second sealing member, which is not specifically limited herein, depending on the actual situation.

A side of the second mounting body 325 away from the first mounting body 324 is provided with a groove in which the conditioning circuit board 222 is disposed. The thermal insulation member 32 further includes a thermal insulation body 322, and the thermal insulation body 322 is disposed in the groove, so that the thermal insulation body 322 is disposed adjacent to the conditioning circuit board 222 and is located on a side of the conditioning circuit board 222 away from the base 1, and further reduces the speed of transmitting the external temperature to the conditioning circuit board 222.

A protrusion is provided on the third mounting body 326 to be coupled with the second mounting body 325, and a hole is provided on the third mounting body 326 to allow the metal pin 23 to pass through.

In summary, the following steps: through arranging the heat insulating piece 32 on the metal shell 31 and the detection assembly 2, the heat insulating piece 32 can delay and transmit the temperature of the metal shell 31 to the detection assembly 2, and can slow down the impact of low temperature on the detection assembly 2 in a low-temperature environment, so that the low-temperature reliability and the service life of the pressure sensor are improved;

the material of the thermal insulation member 32 is polyimide or polyamide-imide heat, which has extremely low thermal conductivity, so that the time for transferring the temperature from the external environment to the inside of the thermal insulation member 32 when the pressure sensor is at a low temperature is obviously increased, and meanwhile, the thermal insulation member 32 can still keep good mechanical performance in an ultralow temperature environment.

The above is only one specific embodiment of the present application, and any other modifications based on the concept of the present application are considered as the protection scope of the present application.